CN103109586B - 电子纺织品和制造电子纺织品的方法 - Google Patents
电子纺织品和制造电子纺织品的方法 Download PDFInfo
- Publication number
- CN103109586B CN103109586B CN201180045519.6A CN201180045519A CN103109586B CN 103109586 B CN103109586 B CN 103109586B CN 201180045519 A CN201180045519 A CN 201180045519A CN 103109586 B CN103109586 B CN 103109586B
- Authority
- CN
- China
- Prior art keywords
- textile
- connection gasket
- textile carrier
- electronic
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Treatment Of Fiber Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Woven Fabrics (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10177985 | 2010-09-21 | ||
EP10177985.8 | 2010-09-21 | ||
PCT/IB2011/053890 WO2012038849A1 (en) | 2010-09-21 | 2011-09-06 | Electronic textile and method of manufacturing an electronic textile |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103109586A CN103109586A (zh) | 2013-05-15 |
CN103109586B true CN103109586B (zh) | 2017-02-15 |
Family
ID=44735988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180045519.6A Expired - Fee Related CN103109586B (zh) | 2010-09-21 | 2011-09-06 | 电子纺织品和制造电子纺织品的方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US9148949B2 (zh) |
EP (1) | EP2620042A1 (zh) |
JP (1) | JP5867877B2 (zh) |
CN (1) | CN103109586B (zh) |
TW (1) | TW201213632A (zh) |
WO (1) | WO2012038849A1 (zh) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2545542B1 (en) * | 2010-03-09 | 2014-01-08 | Koninklijke Philips N.V. | Light-emitting electronic textile with light-diffusing member |
FR2962593B1 (fr) * | 2010-07-06 | 2014-03-28 | Commissariat Energie Atomique | Procede d'assemblage d'une puce dans un substrat souple. |
US9588582B2 (en) | 2013-09-17 | 2017-03-07 | Medibotics Llc | Motion recognition clothing (TM) with two different sets of tubes spanning a body joint |
US9582072B2 (en) | 2013-09-17 | 2017-02-28 | Medibotics Llc | Motion recognition clothing [TM] with flexible electromagnetic, light, or sonic energy pathways |
DE102013015015A1 (de) | 2013-09-07 | 2015-03-26 | Textilforschungsinstitut Thüringen-Vogtland e.V. | Verfahren und Vorrichtung an einer Bandwebmaschine zum Weben und Fixieren von Bändern aus Mischmaterialien |
CN105830541B (zh) * | 2013-11-05 | 2019-04-23 | 飞利浦灯具控股公司 | 导电纺织品设备 |
DE102014200041A1 (de) * | 2014-01-07 | 2015-07-09 | Osram Gmbh | Textile Lichtdecke und Verfahren zum Herstellen einer textilen Lichtdecke |
RU2683960C2 (ru) * | 2014-01-20 | 2019-04-03 | Филипс Лайтинг Холдинг Б.В. | Световое устройство и способ изготовления такого устройства |
US9575560B2 (en) | 2014-06-03 | 2017-02-21 | Google Inc. | Radar-based gesture-recognition through a wearable device |
US9921660B2 (en) | 2014-08-07 | 2018-03-20 | Google Llc | Radar-based gesture recognition |
US9811164B2 (en) | 2014-08-07 | 2017-11-07 | Google Inc. | Radar-based gesture sensing and data transmission |
US10268321B2 (en) | 2014-08-15 | 2019-04-23 | Google Llc | Interactive textiles within hard objects |
US9588625B2 (en) | 2014-08-15 | 2017-03-07 | Google Inc. | Interactive textiles |
US11169988B2 (en) | 2014-08-22 | 2021-11-09 | Google Llc | Radar recognition-aided search |
US9778749B2 (en) | 2014-08-22 | 2017-10-03 | Google Inc. | Occluded gesture recognition |
US9600080B2 (en) | 2014-10-02 | 2017-03-21 | Google Inc. | Non-line-of-sight radar-based gesture recognition |
US10016162B1 (en) | 2015-03-23 | 2018-07-10 | Google Llc | In-ear health monitoring |
US9983747B2 (en) | 2015-03-26 | 2018-05-29 | Google Llc | Two-layer interactive textiles |
JP6427279B2 (ja) | 2015-04-30 | 2018-11-21 | グーグル エルエルシー | ジェスチャの追跡および認識のための、rfに基づいた微細動作追跡 |
KR102011992B1 (ko) | 2015-04-30 | 2019-08-19 | 구글 엘엘씨 | 타입-애그노스틱 rf 신호 표현들 |
CN107430443B (zh) | 2015-04-30 | 2020-07-10 | 谷歌有限责任公司 | 基于宽场雷达的手势识别 |
US9693592B2 (en) * | 2015-05-27 | 2017-07-04 | Google Inc. | Attaching electronic components to interactive textiles |
US10088908B1 (en) | 2015-05-27 | 2018-10-02 | Google Llc | Gesture detection and interactions |
FR3038919B1 (fr) * | 2015-07-13 | 2018-11-09 | Ets A. Deschamps Et Fils | Procede et machine de fabrication d'une structure tissee |
US10535278B2 (en) * | 2015-08-05 | 2020-01-14 | Myant, Inc. | Garment with stretch sensors |
US10051898B2 (en) * | 2015-09-24 | 2018-08-21 | Loomia Technologies, Inc. | Smart soft good product, circuitry layer, and methods |
US10817065B1 (en) | 2015-10-06 | 2020-10-27 | Google Llc | Gesture recognition using multiple antenna |
WO2017079484A1 (en) * | 2015-11-04 | 2017-05-11 | Google Inc. | Connectors for connecting electronics embedded in garments to external devices |
CN107105571B (zh) * | 2016-02-23 | 2020-08-18 | 深圳富泰宏精密工业有限公司 | 柔性电路板及其制造方法及具有该柔性电路板的电子装置 |
US10993635B1 (en) | 2016-03-22 | 2021-05-04 | Flextronics Ap, Llc | Integrating biosensor to compression shirt textile and interconnect method |
US10492302B2 (en) | 2016-05-03 | 2019-11-26 | Google Llc | Connecting an electronic component to an interactive textile |
US10297575B2 (en) * | 2016-05-06 | 2019-05-21 | Amkor Technology, Inc. | Semiconductor device utilizing an adhesive to attach an upper package to a lower die |
WO2017200570A1 (en) | 2016-05-16 | 2017-11-23 | Google Llc | Interactive object with multiple electronics modules |
US10579150B2 (en) | 2016-12-05 | 2020-03-03 | Google Llc | Concurrent detection of absolute distance and relative movement for sensing action gestures |
US10236089B1 (en) | 2017-09-11 | 2019-03-19 | International Business Machines Corporation | Reducing environmental radon |
US20190137091A1 (en) * | 2017-11-08 | 2019-05-09 | Rubelli S.P.A. | Fabric panel illuminated with optical fiber |
US10426029B1 (en) | 2018-01-18 | 2019-09-24 | Flex Ltd. | Micro-pad array to thread flexible attachment |
US10687421B1 (en) * | 2018-04-04 | 2020-06-16 | Flex Ltd. | Fabric with woven wire braid |
US10772197B2 (en) * | 2018-04-24 | 2020-09-08 | Microsoft Technology Licensing, Llc | Electronically functional yarn |
KR102009346B1 (ko) * | 2018-08-14 | 2019-08-12 | (주)현대포멕스 | 접을 수 있는 회로선과 led가 구비된 조명장치 및 이의 제조방법 |
US10985484B1 (en) * | 2018-10-01 | 2021-04-20 | Flex Ltd. | Electronic conductive interconnection for bridging across irregular areas in a textile product |
JP7329525B2 (ja) * | 2018-10-22 | 2023-08-18 | グーグル エルエルシー | 刺繍されたパターンに等角なカスタム配置を有する導電性の繊維 |
WO2021034209A1 (en) * | 2019-08-22 | 2021-02-25 | Têxteis Penedo Sa | Device for attaching a lighting component onto a textile structure,operating method and uses thereof |
EP4079113A4 (en) * | 2019-12-18 | 2024-03-06 | Myant Inc. | METHOD FOR MANUFACTURING TEXTILE WITH CONDUCTIVE WIRES AND INTEGRATED ELECTRONICS |
US11337312B2 (en) * | 2020-09-08 | 2022-05-17 | Palo Alto Research Center Incorporated | Systems and methods for bonding electronic components on substrates with rough surfaces |
US11952087B2 (en) | 2020-12-11 | 2024-04-09 | Alessandra E. Myslinski | Smart apparel and backpack system |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001052856A (ja) | 1999-08-09 | 2001-02-23 | Kawaguchiko Seimitsu Co Ltd | エレクトロルミネッセンス |
DE10161527A1 (de) * | 2001-12-14 | 2003-07-03 | Infineon Technologies Ag | Aufbau- und Verbindungstechnik in textilen Strukturen |
US7144830B2 (en) * | 2002-05-10 | 2006-12-05 | Sarnoff Corporation | Plural layer woven electronic textile, article and method |
US7592276B2 (en) * | 2002-05-10 | 2009-09-22 | Sarnoff Corporation | Woven electronic textile, yarn and article |
GB2396252A (en) * | 2002-10-01 | 2004-06-16 | Steven Leftly | Textile light system |
JP2004228353A (ja) * | 2003-01-23 | 2004-08-12 | Seiko Epson Corp | 配線基板及びその製造方法、積層配線基板、半導体装置、回路基板並びに電子機器 |
DE10307505B4 (de) * | 2003-02-21 | 2005-03-03 | Infineon Technologies Ag | Textilgewebestruktur, Flächenverkleidungsstruktur und Verfahren zum Bestimmen eines Abstands von Mikroelektronikelementen der Textilgewebestruktur zu mindestens einer Referenzposition |
DE10325883A1 (de) * | 2003-06-06 | 2004-12-30 | Infineon Technologies Ag | Verfahren zur Kontaktierung von leitfähigen Fasern |
WO2006038496A1 (ja) | 2004-10-01 | 2006-04-13 | Toray Industries, Inc. | 長尺フィルム回路基板、その製造方法およびその製造装置 |
EP1727408A1 (de) * | 2005-05-13 | 2006-11-29 | Eidgenössische Technische Hochschule Zürich | Textil mit einem Leiterbahnsystem und Verfahren zu dessen Herstellung |
CN101479779A (zh) | 2006-06-29 | 2009-07-08 | 皇家飞利浦电子股份有限公司 | 像素化电致发光织物 |
EP2020831A1 (de) * | 2007-07-31 | 2009-02-04 | Sefar AG | Verfahren zum Herstellen eines Elektroniktextils und Textilsubstrat |
CN102017814A (zh) * | 2008-04-29 | 2011-04-13 | 皇家飞利浦电子股份有限公司 | 电子纺织物 |
US9758907B2 (en) | 2008-09-22 | 2017-09-12 | Intel Corporation | Method and apparatus for attaching chip to a textile |
TWM365363U (en) * | 2009-04-08 | 2009-09-21 | Fu-Biau Hsu | Illuminating textile article |
US20110073353A1 (en) * | 2009-09-29 | 2011-03-31 | Tex-Ray Industrial Co., Ltd. | Conductive fabric and method for forming the same |
FR2955972B1 (fr) * | 2010-02-03 | 2012-03-09 | Commissariat Energie Atomique | Procede d'assemblage d'au moins une puce avec un tissu incluant un dispositif a puce |
-
2011
- 2011-09-06 WO PCT/IB2011/053890 patent/WO2012038849A1/en active Application Filing
- 2011-09-06 US US13/822,642 patent/US9148949B2/en not_active Expired - Fee Related
- 2011-09-06 EP EP11764320.5A patent/EP2620042A1/en not_active Withdrawn
- 2011-09-06 JP JP2013528799A patent/JP5867877B2/ja not_active Expired - Fee Related
- 2011-09-06 CN CN201180045519.6A patent/CN103109586B/zh not_active Expired - Fee Related
- 2011-09-19 TW TW100133652A patent/TW201213632A/zh unknown
-
2015
- 2015-09-18 US US14/857,907 patent/US9706648B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US9148949B2 (en) | 2015-09-29 |
JP2013537370A (ja) | 2013-09-30 |
US20160014890A1 (en) | 2016-01-14 |
CN103109586A (zh) | 2013-05-15 |
US9706648B2 (en) | 2017-07-11 |
JP5867877B2 (ja) | 2016-02-24 |
TW201213632A (en) | 2012-04-01 |
RU2013118262A (ru) | 2014-10-27 |
WO2012038849A1 (en) | 2012-03-29 |
US20130176737A1 (en) | 2013-07-11 |
EP2620042A1 (en) | 2013-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103109586B (zh) | 电子纺织品和制造电子纺织品的方法 | |
US6855623B2 (en) | Recessed tape and method for forming a BGA assembly | |
EP2749153B1 (en) | Electronic textile with means for facilitating waste sorting | |
CN114335261A (zh) | 对部件进行表面安装的方法 | |
US8961725B2 (en) | Component placement on flexible and/or stretchable substrates | |
WO2010058360A1 (en) | Textile electronic arrangement | |
EP2289291A1 (en) | Electronic textile | |
KR100839219B1 (ko) | 연성회로기판용 보강판 가접장치 및 그를 이용한 보강판가접방법 | |
KR101199483B1 (ko) | 직물형 전자소자 패키지 및 그 제조 방법과 직물형 전자소자 패키지의 실장 방법 | |
US20090001576A1 (en) | Interconnect using liquid metal | |
US20150041201A1 (en) | Submount, assembly including submount, method of assembling and assembling device | |
CN103188882A (zh) | 一种电路板及其制作方法 | |
US9577169B2 (en) | LED lead frame for laminated LED circuits | |
US8551277B2 (en) | Method for producing light emitting diode device | |
WO2017213086A1 (ja) | 多層配線板の製造方法 | |
CN1575108A (zh) | 安装板的制造方法 | |
CN102419936A (zh) | 小点间距led点阵块及其制备方法 | |
US10985484B1 (en) | Electronic conductive interconnection for bridging across irregular areas in a textile product | |
CN102006720A (zh) | 一种印制电路板 | |
CN215636663U (zh) | 一种易于多向转弯安装的led灯带 | |
CN214708146U (zh) | 基于单面pcb板的传感弹簧焊接贴放结构 | |
KR101382152B1 (ko) | 교체가 가능한 체결 구조를 갖는 칩 온 보드 모듈 | |
CN115419849A (zh) | 一种易于多向转弯安装的led灯带 | |
JPH09246714A (ja) | 半導体製造方法および装置ならびにそれを用いて製造した半導体集積回路装置 | |
CN103811478A (zh) | 印刷式led集成cob封装 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Holland Ian Deho Finn Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: Koninklijke Philips Electronics N.V. |
|
CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170322 Address after: Eindhoven Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: KONINKLIJKE PHILIPS N.V. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170215 Termination date: 20170906 |
|
CF01 | Termination of patent right due to non-payment of annual fee |