CN103107193A - 一种沟槽型绝缘栅场效应管 - Google Patents
一种沟槽型绝缘栅场效应管 Download PDFInfo
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- CN103107193A CN103107193A CN2011103579031A CN201110357903A CN103107193A CN 103107193 A CN103107193 A CN 103107193A CN 2011103579031 A CN2011103579031 A CN 2011103579031A CN 201110357903 A CN201110357903 A CN 201110357903A CN 103107193 A CN103107193 A CN 103107193A
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CN2011103579031A CN103107193A (zh) | 2011-11-11 | 2011-11-11 | 一种沟槽型绝缘栅场效应管 |
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CN2011103579031A CN103107193A (zh) | 2011-11-11 | 2011-11-11 | 一种沟槽型绝缘栅场效应管 |
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CN103107193A true CN103107193A (zh) | 2013-05-15 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109244137A (zh) * | 2018-09-19 | 2019-01-18 | 电子科技大学 | 一种高可靠性SiC MOSFET器件 |
CN113809179A (zh) * | 2021-10-20 | 2021-12-17 | 无锡橙芯微电子科技有限公司 | 一种sic dmos器件结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0345380A2 (en) * | 1988-06-08 | 1989-12-13 | Mitsubishi Denki Kabushiki Kaisha | Manufacture of a semiconductor device |
JPH0582792A (ja) * | 1991-09-25 | 1993-04-02 | Toshiba Corp | 半導体装置の製造方法 |
CN1348220A (zh) * | 2000-09-22 | 2002-05-08 | 通用半导体公司 | 沟道金属氧化物半导体器件和端子结构 |
US6570185B1 (en) * | 1997-02-07 | 2003-05-27 | Purdue Research Foundation | Structure to reduce the on-resistance of power transistors |
US20100285646A1 (en) * | 2009-05-08 | 2010-11-11 | Wei-Chieh Lin | Method of fabricating power semiconductor device |
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2011
- 2011-11-11 CN CN2011103579031A patent/CN103107193A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0345380A2 (en) * | 1988-06-08 | 1989-12-13 | Mitsubishi Denki Kabushiki Kaisha | Manufacture of a semiconductor device |
JPH0582792A (ja) * | 1991-09-25 | 1993-04-02 | Toshiba Corp | 半導体装置の製造方法 |
US6570185B1 (en) * | 1997-02-07 | 2003-05-27 | Purdue Research Foundation | Structure to reduce the on-resistance of power transistors |
CN1348220A (zh) * | 2000-09-22 | 2002-05-08 | 通用半导体公司 | 沟道金属氧化物半导体器件和端子结构 |
US20100285646A1 (en) * | 2009-05-08 | 2010-11-11 | Wei-Chieh Lin | Method of fabricating power semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109244137A (zh) * | 2018-09-19 | 2019-01-18 | 电子科技大学 | 一种高可靠性SiC MOSFET器件 |
CN113809179A (zh) * | 2021-10-20 | 2021-12-17 | 无锡橙芯微电子科技有限公司 | 一种sic dmos器件结构 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140107 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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TA01 | Transfer of patent application right |
Effective date of registration: 20140107 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130515 |