CN103094656A - SIW bridge - Google Patents

SIW bridge Download PDF

Info

Publication number
CN103094656A
CN103094656A CN2012105907092A CN201210590709A CN103094656A CN 103094656 A CN103094656 A CN 103094656A CN 2012105907092 A CN2012105907092 A CN 2012105907092A CN 201210590709 A CN201210590709 A CN 201210590709A CN 103094656 A CN103094656 A CN 103094656A
Authority
CN
China
Prior art keywords
port
upper wall
lower wall
wall
symmetry axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012105907092A
Other languages
Chinese (zh)
Inventor
汪晓光
郭田田
陈良
邓龙江
谢建良
梁迪飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Electronic Science and Technology of China
Original Assignee
University of Electronic Science and Technology of China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Electronic Science and Technology of China filed Critical University of Electronic Science and Technology of China
Priority to CN2012105907092A priority Critical patent/CN103094656A/en
Publication of CN103094656A publication Critical patent/CN103094656A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Waveguides (AREA)

Abstract

SIW bridge relates to microwave device. The invention is composed of a medium substrate and metal through holes on the medium substrate, and comprises a first port, a second port and a third port, wherein an isolation belt is used as the lower wall of the second port and the upper wall of the third port, the upper wall of the first port and the upper wall of the second port are connected by a first bevel edge, the lower wall of the first port and the lower wall of the third port are connected by a second bevel edge, the three ports are axisymmetric, the isolation belt is positioned on a symmetry axis, the included angle between the first bevel edge 51 and the symmetry axis is 45 degrees, the included angle between the second bevel edge and the symmetry axis is 45 degrees, each wall of each port is formed by arranging metal through holes, and the upper wall of the first port, the lower wall of the first port, the upper wall of the second port and the lower wall of the third port are. The bridge of the invention has high isolation performance in a microwave frequency band (40 GHz-56 GHz), low insertion loss and port standing waves.

Description

The SIW electric bridge
Technical field
The present invention relates to microwave device.
Background technology
Along with the high speed development of modern microwave millimetre-wave circuit system, its function becomes increasingly complex, electrical performance indexes is more and more higher, and its volume is more and more less simultaneously, weight is more and more lighter; Whole system is rapidly to miniaturization, lightweight, high reliability, multifunctionality and low-cost future development.The microwave and millimeter wave technology of low cost, high-performance, high finished product rate is very crucial for the business-like low-cost microwave and millimeter wave broadband system of exploitation.Therefore, in the urgent need to developing new microwave and millimeter wave integrated technology.Substrate integration wave-guide (SubstrateIntegrated Waveguide, slW) technology is that proposed in recent years a kind of can be integrated in and have the new guided wave structure formed of the characteristics such as filter with low insertion loss, low radiation, high power capacity in dielectric substrate, it can realize passive and active integrated effectively, make the miniaturization of microwave and millimeter wave system, even can be produced on whole microwave and millimeter wave system in an encapsulation; And its propagation characteristic and the rectangular metal waveguide similar, even submillimeter wave parts and subsystem have high Q value, high power capacity, easily and the advantages such as other planar circuit and integrated chip so by its microwave and millimeter wave that consists of, the plated-through hole array that is entirely on dielectric substrate due to total simultaneously consists of, so this structure can be utilized common PCB technique, LTCC technique, even thin film circuit technique accurately realizes.Compare with the processing cost of traditional waveguide form microwave and millimeter wave device, the processing cost of substrate integration wave-guide microwave and millimeter wave device is very cheap, does not need anything post debugging work, is fit to very much Integrated design and in enormous quantities making of microwave and millimeter wave circuit.SIW takes into account the advantage of conventional waveguide and microstrip transmission line, can realize high performance microwave millimeter-wave planar circuit.
Summary of the invention
Technical problem to be solved by this invention is, provide a kind of volume little, be easy to integrated SIW-3dB electric bridge.
the technical scheme that the present invention solve the technical problem employing is, the SIW electric bridge, it is characterized in that, consisted of by the metal throuth hole on medium substrate and medium substrate, comprise the first port, the second port and the 3rd port, the isolation strip is as the lower wall of the second port and the upper wall of the 3rd port, the first port upper wall is connected by the first hypotenuse with the second port upper wall, the first port lower wall is connected by the second hypotenuse with the 3rd port lower wall, three ports are axial symmetry, the isolation strip is on symmetry axis, the first hypotenuse 51 is 45 ° with the symmetry axis angle, the second hypotenuse and symmetry axis angle are 45 °, each wall of each port is all arranged by metal throuth hole and is consisted of, the first port upper wall, the first port lower wall, the second port upper wall and the 3rd port lower wall are parallel to symmetry axis.
Further, dielectric substrate thickness is 0.254mm, and electric bridge length is 12mm, and each port width is 4mm, and the metal aperture radius of arranging formation the first port upper wall and lower wall, the second port upper wall, the 3rd port lower wall is 0.15mm, is spaced apart 0.5mm; The radius that consists of the metal aperture of isolation strip is 0.1mm, is spaced apart 0.4mm.
The invention has the beneficial effects as follows, overcome existing power splitter and be difficult for processing, volume deficiency very much not easy of integration, can be widely used in microwave﹠millimeter-wave IC, it is a kind of novel integrated guided wave structure formed device of high Q value, low-loss, and can facilitate the integrated of the planar transmission lines such as realization and microstrip line, co-planar waveguide, and be easy to design and processing.Electric bridge of the present invention has microwave band (high isolation performance, low insertion loss and port standing wave in 40GHz~56GHz).
Description of drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the test curve figure of frequency 42GHz~54GHz, and visible S11 minimum is isolated into :-15dB.
Fig. 3 is frequency 42GHz~54GHz, and visible maximum allocated loss is: 3.31.
Fig. 4 is at frequency 42GHz~54GHz, and visible maximum standing wave is: 2.58.
Embodiment
Referring to Fig. 1~4.SIW electric bridge of the present invention, consisted of by the metal throuth hole on medium substrate and medium substrate, comprise the first port A1, the second port A2 and the 3rd port A3, isolation strip A4 is as the lower wall of the second port A2 and the upper wall of the 3rd port A3, the first port upper wall A11 is connected by the first hypotenuse A51 with the second port upper wall A21, the first port lower wall A12 is connected by the second hypotenuse A52 with the 3rd port lower wall A22, three ports are axial symmetry, isolation strip A4 is on symmetry axis, the first hypotenuse A51 and symmetry axis angle are 45 °, the angle of the second hypotenuse A52 and symmetry axis is 45 °, each wall of each port is all arranged by metal throuth hole and is consisted of, the first port upper wall, the first port lower wall, the second port upper wall and the 3rd port lower wall are parallel to symmetry axis.
Dielectric substrate thickness is 0.254mm, and electric bridge length is 12mm, and each port width is 4mm, and the metal aperture radius of arranging formation the first port upper wall and lower wall, the second port upper wall, the 3rd port lower wall is 0.15mm, is spaced apart 0.5mm; The upper wall of the first port, lower wall length are 4mm(0.5 * 8), the lower wall length of the upper wall of the second port and the 3rd port is 6.5mm(0.5 * 13).The radius that consists of the metal aperture of isolation strip is 0.1mm, is spaced apart 0.4mm, and isolation strip length is 5.2mm(0.4 * 13).Two hypotenuse length are 2mm(0.5 * 4).The spacing of above metal aperture be all distance of center circle from.

Claims (2)

1.SIW electric bridge, it is characterized in that, consisted of by the metal throuth hole on medium substrate and medium substrate, comprise the first port [A1], the second port [A2] and the 3rd port [A3], isolation strip [A4] is as the lower wall of the second port [A2] and the upper wall of the 3rd port [A3], the first port upper wall [A11] is connected by the first hypotenuse [A51] with the second port upper wall [A21], the first port lower wall [A12] is connected by the second hypotenuse [A52] with the 3rd port lower wall [A22], three ports are axial symmetry, [A4] is on symmetry axis in the isolation strip, the first hypotenuse [A51] is 45 ° with the symmetry axis angle, the second hypotenuse [A52] is 45 ° with the symmetry axis angle, each wall of each port is all arranged by metal throuth hole and is consisted of, the first port upper wall, the first port lower wall, the second port upper wall and the 3rd port lower wall are parallel to symmetry axis.
2. SIW electric bridge as claimed in claim 1, is characterized in that, dielectric substrate thickness is 0.254mm, and electric bridge length is 12mm, and each port width is 4mm,
The metal aperture radius of arranging formation the first port upper wall and lower wall, the second port upper wall, the 3rd port lower wall is 0.15mm, is spaced apart 0.5mm;
The radius that consists of the metal aperture of isolation strip is 0.1mm, is spaced apart 0.4mm.
CN2012105907092A 2012-09-13 2012-12-31 SIW bridge Pending CN103094656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012105907092A CN103094656A (en) 2012-09-13 2012-12-31 SIW bridge

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201210337903.X 2012-09-13
CN201210337903 2012-09-13
CN2012105907092A CN103094656A (en) 2012-09-13 2012-12-31 SIW bridge

Publications (1)

Publication Number Publication Date
CN103094656A true CN103094656A (en) 2013-05-08

Family

ID=48206969

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012105907092A Pending CN103094656A (en) 2012-09-13 2012-12-31 SIW bridge

Country Status (1)

Country Link
CN (1) CN103094656A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105680137A (en) * 2014-11-20 2016-06-15 中国航空工业集团公司雷华电子技术研究所 Substrate integrated waveguide based hybrid-structure miniaturized multi-layered power distributor
CN106953153A (en) * 2017-04-13 2017-07-14 南京邮电大学 The integrated non-radiative chevron shaped power splitter of Medium Wave Guide of substrate
CN106953152A (en) * 2017-04-13 2017-07-14 南京邮电大学 The stepped power splitter of the integrated non-radiative Medium Wave Guide of substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1949590A (en) * 2006-10-27 2007-04-18 东南大学 Substrate integrated waveguide comb-shaped power distributor
US20090066597A1 (en) * 2007-09-07 2009-03-12 Songnan Yang Substrate Integrated Waveguide Antenna Array

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1949590A (en) * 2006-10-27 2007-04-18 东南大学 Substrate integrated waveguide comb-shaped power distributor
US20090066597A1 (en) * 2007-09-07 2009-03-12 Songnan Yang Substrate Integrated Waveguide Antenna Array

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
WU LI NAN,ZHANG XU CHUN: "A New Substrate Integrated Waveguide Six-port Circuit", 《MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT), 2010 INTERNATIONAL CONFERENCE ON 》 *
X ZOU,C M TONG,D W YU: "Y-junction power divider based on substrate integrated waveguide", 《ELECTRONICS LETTERS》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105680137A (en) * 2014-11-20 2016-06-15 中国航空工业集团公司雷华电子技术研究所 Substrate integrated waveguide based hybrid-structure miniaturized multi-layered power distributor
CN106953153A (en) * 2017-04-13 2017-07-14 南京邮电大学 The integrated non-radiative chevron shaped power splitter of Medium Wave Guide of substrate
CN106953152A (en) * 2017-04-13 2017-07-14 南京邮电大学 The stepped power splitter of the integrated non-radiative Medium Wave Guide of substrate

Similar Documents

Publication Publication Date Title
CN103441340B (en) Variable and half-module substrate integrated waveguide leaky-wave antenna frequency scanning polarizes
CN102800906B (en) Multilayer ceramic substrate integrated waveguide filter
CN104092028A (en) Balance feed differential slot antenna for restraining common-mode noise
CN103390784B (en) Miniaturized substrate integration waveguide duplexer
CN104091990A (en) Multiple-substrate integrated waveguide filtering power divider
CN104466317A (en) Gallium arsenide dual-mode band-pass filter and manufacturing method thereof
Deng et al. A compact planar bandpass filter with wide out‐of‐band rejection implemented by substrate‐integrated waveguide and complementary split‐ring resonator
CN102856617A (en) Broadband substrate integrated waveguide circulator
KR101812490B1 (en) Designs and methods to implement surface mounting structures of SIW
CN105977598A (en) Coupling wire power divider capable of higher harmonic inhibition and broadband bandpass filtering
CN105990630A (en) High-selectivity Balun band pass filter based on substrate integrated waveguide
CN105789802A (en) Ultra-wideband Balun based on new interconnection structure
CN103094656A (en) SIW bridge
CN203339280U (en) Miniaturized substrate integrated waveguide duplexer
CN106856260B (en) Miniaturized broadband dual-polarized antenna feed network
CN205355223U (en) Piece formula stromatolite directional coupler
CN204391233U (en) A kind of ultra wide band balun based on novel interconnect architecture
CN104577353A (en) X-band substrate integrated waveguide four-element array antenna
CN203674352U (en) Broadband difference band pass filter based on cross-shaped resonator
CN110911789B (en) Substrate integrated waveguide band-pass filter
CN202259650U (en) Highly miniaturized substrate integrated waveguide resonator
Zou et al. Design of an X-band symmetrical window bandpass filter based on substrate integrated waveguide
Liu et al. A substrate integrated waveguide to substrate integrated coaxial line transition
CN103337678B (en) There is the cross-couplings substrate integral wave guide filter of steep side band characteristic
CN113113753B (en) Directional coupler based on through silicon via technology

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130508