CN105680137A - Substrate integrated waveguide based hybrid-structure miniaturized multi-layered power distributor - Google Patents

Abstract

The invention provides a substrate integrated waveguide based hybrid-structure miniaturized multi-layered power distributor. The power distributor is characterized by comprising a bottom layer input circuit board (1), a middle layer coupling pore plate (2) and a top layer output circuit board (3), wherein the bottom layer input circuit board comprises a T-shaped junction power division structure (1-1), a corner structure (1-2) and an Y-shaped power division structure (1-3) that are connected mutually.

Description

A kind of mixed structure miniaturization multilayer power divider based on substrate integration wave-guide

Technical field

The invention belongs to RF and microwave power combing field.

Background technology

Along with the development of microwave technology, the situation that power carries out multichannel allocation process is needed day by day to increase, in order to reach than power directly being inputted the better effect of individual devices, need power input is carried out power division, obtain the poower flow of the phases such as multichannel constant amplitude, device corresponding to the power of every road is exported. At microwave power pipe output facet, it is possible to by after energy distribution, each single tube is exported, again synthesize. Can also as the feed network to antenna, it is possible to carry out the distribution to power, Zai Jiangge road power supply antenna.

Existing being generally Wilkinson form, its shortcoming is that volume is big, to take space big, and power capacity is relatively little, constrains the miniaturization of radar and communication system to a certain extent.

Summary of the invention

The size existed for prior art takies excessive problem, and the power splitter that the present invention adopts determinants direction size less goes the distribution realizing Ka wave band 8 road power, in the scope that index can accept, reduces overall dimensions.

The present invention provides the mixed structure miniaturization multilayer power divider based on substrate integration wave-guide, it is characterized in that comprising bottom input circuit plate (1), middle layer coupling orifice plate (2), top layer output circuit plate (3), wherein in bottom input circuit plate, comprise interconnective T-shaped knot merit separation structure (1-1), corner structure (1-2), Y shape merit separation structure (1-3). Adopt this merit separation structure, reduced the volume of power splitter by multilayer circuit board, overcome the problem of the multi-direction transmission of traditional power splitter.

Further, middle layer coupling orifice plate (2) is provided with rectangle coupling window (2-1).

Accompanying drawing explanation

Fig. 1 is bottom input circuit plate (1) of merit separation structure;

Fig. 2 is middle layer coupling orifice plate (2) of merit separation structure;

Fig. 3 is top layer output circuit plate (3) of merit separation structure;

Fig. 4 is knot merit separation structure of the T-shaped in bottom input circuit plate (1-1);

Fig. 5 is the corner structure (1-2) in bottom input circuit plate;

Fig. 6 is Y shape merit separation structure (1-3) in bottom input circuit plate;

Fig. 7 is 8 tunnel merit separation structure power splitting/synthesis network calculation result;

Fig. 8 is 8 tunnel merit separation structure return loss calculation result.

Embodiment

Below in conjunction with Figure of description, the present invention is described in further detail.

The present invention provides a kind of mixed structure miniaturization multilayer power divider based on substrate integration wave-guide, it is characterized in that comprising bottom input circuit plate 1, middle layer coupling orifice plate 2, top layer output circuit plate 3, wherein in bottom input circuit plate, comprise interconnective T-shaped knot merit separation structure 1-1, corner structure 1-2, Y shape merit separation structure 1-3.

For Ka wave band 8 road power splitter, as shown in Fig. 1, Fig. 2, Fig. 3. On bottom input circuit plate in FIG, first it is two-way by a T-shaped merit separation structure 1-1 by energy in part, it is four tunnels by each self-corresponding next stage T-shaped merit separation structure 1-1 and corner structure 1-2 by energy in part again, then it is divided into 8 tunnels through 4 Y shape merit separation structure 1-3. The hole cover plate 2 that is coupled in middle layer is positioned over the top of bottom input circuit plate 1, then top layer output circuit plate 3 is positioned over the top of middle layer coupling orifice plate.

Further, energy is coupled to top layer output circuit plate 3 by eight rectangles coupling window 2-1 that 8 road signals on bottom input circuit plate 1 are coupled on orifice plate 2 by middle layer, thus achieves 8 road power divider structures.

The size in the hole that is coupled in knot merit separation structure 1-1, corner structure 1-2, Y shape merit separation structure 1-3 of the T-shaped in bottom input circuit plate and middle layer coupling orifice plate is calculated through computer optimization, the calculation result drawing power division as shown in Figure 7, Figure 8, meets the requirement of 8 tunnel power division.

Claims (2)

1. the mixed structure miniaturization multilayer power divider based on substrate integration wave-guide, it is characterized in that, comprise bottom input circuit plate (1), middle layer coupling orifice plate (2), top layer output circuit plate (3), in bottom input circuit plate, comprises interconnective T-shaped knot merit separation structure (1-1), corner structure (1-2), Y shape merit separation structure (1-3).

2. the mixed structure miniaturization multilayer power divider based on substrate integration wave-guide according to claim 1, it is characterised in that, middle layer coupling orifice plate (2) is provided with rectangle coupling window (2-1).