CN104577353A - X-band substrate integrated waveguide four-element array antenna - Google Patents
X-band substrate integrated waveguide four-element array antenna Download PDFInfo
- Publication number
- CN104577353A CN104577353A CN201510020498.2A CN201510020498A CN104577353A CN 104577353 A CN104577353 A CN 104577353A CN 201510020498 A CN201510020498 A CN 201510020498A CN 104577353 A CN104577353 A CN 104577353A
- Authority
- CN
- China
- Prior art keywords
- antenna
- metallization
- antenna element
- slab
- via hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention belongs to the field of antenna communications, and relates to an array antenna, in particular to an X-band substrate integrated waveguide four-element array antenna. The X-band substrate integrated waveguide four-element array antenna solves the problems that a traditional microwave planar transmission line feed array antenna is large in insertion loss and a Q-value is small. The X-band substrate integrated waveguide four-element array antenna comprises a dielectric slab, a Y-shaped structure, a first antenna unit, a second antenna unit, a third antenna unit and a fourth antenna unit. The dielectric slab is formed by sequentially connecting an upper rectangular slab, a middle rectangular slab and a lower rectangular slab from top to bottom. The upper end of the Y-shaped structure is connected with the middle of the bottom edge of the dielectric slab. The first antenna unit, the second antenna unit, the third antenna unit and the fourth antenna unit are arranged from left to right at equal intervals in the length direction of the top edge of the dielectric slab.
Description
Technical field
The present invention relates to a kind of array antenna, be specifically related to a kind of X-band substrate integration wave-guide four-element array antenna, belong to wireless communication field.
Background technology
Traditional microwave planar transmission line (as microstrip line, co-planar waveguide, complanar line etc.) makes by PCB technology, and precision is high and cost is low, and integrated very easy with active technique.But most traditional microwave planar transmission line is all semi-open structure, in the application of microwave high-frequency section, electromagnetic radiation and leakage phenomenon very serious.Therefore, the array antenna of conventional transmission line feed is used to have the shortcomings such as Insertion Loss is large, Q value is low.
Summary of the invention
The present invention be the array antenna solving traditional microwave planar transmission line feed have Insertion Loss comparatively large, the problem that Q value is lower, and then propose a kind of X-band substrate integration wave-guide four-element array antenna.
The present invention is the technical scheme taked that solves the problem: the present invention includes dielectric-slab, Y-shaped structure, first antenna element, second antenna element, third antenna unit and the 4th antenna element, dielectric-slab is by upper rectangular slab, middle rectangular slab, lower rectangular slab from top to bottom connects to form successively, the upper end of Y-shaped structure is connected with the middle part on dielectric-slab base, first antenna element, second antenna element, third antenna unit and the 4th antenna element are along the length direction spaced set from left to right of dielectric-slab top margin, first antenna element, second antenna element, the front of third antenna unit and the 4th antenna element is all printed with elliptic curve microstrip line, the both sides of dielectric-slab have several the first metallization via holes along its edge, the top in upper rectangular slab front is provided with the second metallization groups of vias and the 3rd metallization groups of vias along its length, and the second metallization groups of vias is between the first antenna element and the second antenna element, 3rd metallization groups of vias is between third antenna unit and the 4th antenna element, the middle part in upper rectangular slab front is equidistantly provided with four the 4th metallization via holes along its length, the bottom in upper rectangular slab front is provided with two the 5th metallization via holes along its length, the front of middle rectangular slab is equidistantly provided with one the 6th metallization via hole along its length successively, one the 8th metallization via hole and one the 6th metallization via hole, the middle part of dielectric-slab is provided with the 7th metallization groups of vias, and the 7th metallization groups of vias is the inversion T-shaped of several metallization via hole compositions.
The invention has the beneficial effects as follows: the present invention is compared with the current Vivald aerial array by waveguide power divider or microstrip type power splitter feed, owing to using novel substrate integrated waveguide technology, have and be easy to integrated, be convenient to processing, parasitic radiation is little, the advantage that power capacity is large.Working band of the present invention is within the scope of 8.9 ~ 10.07GHz, and reflection coefficient is less than-10dB, and within the scope of 9 ~ 10GHz, reflection coefficient is less than-14dB; The present invention is when frequency is 9.0GHz, and gain is 13.2dB; The present invention is when frequency is 9.5GHz, and gain is 12.62dB; The present invention is when frequency is 10GHz, and gain is 12.2dB.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present invention.
Embodiment
Embodiment one: composition graphs 1 illustrates present embodiment, described in present embodiment, a kind of X-band substrate integration wave-guide four-element array antenna comprises dielectric-slab 1, Y-shaped structure 2, first antenna element 3, second antenna element 4, third antenna unit 5 and the 4th antenna element 6, dielectric-slab 1 is by upper rectangular slab 1-1, middle rectangular slab 1-2, lower rectangular slab 1-3 from top to bottom connects to form successively, the upper end of Y-shaped structure 2 is connected with the middle part on dielectric-slab 1 base, first antenna element 3, second antenna element 4, third antenna unit 5 and the 4th antenna element 6 are along the length direction spaced set from left to right of dielectric-slab 1 top margin, first antenna element 3, second antenna element 4, the front of third antenna unit 5 and the 4th antenna element 6 is all printed with elliptic curve microstrip line 7, the both sides of dielectric-slab 1 have several the first metallization via holes 8 along its edge, the top in upper rectangular slab 1-1 front is provided with the second metallization groups of vias 9 and the 3rd metallization groups of vias 10 along its length, and the second metallization groups of vias 9 is between the first antenna element 3 and the second antenna element 4, 3rd metallization groups of vias 10 is between third antenna unit 5 and the 4th antenna element 6, the middle part in upper rectangular slab 1-1 front is equidistantly provided with four the 4th metallization via holes 11 along its length, the bottom in upper rectangular slab 1-1 front is provided with two the 5th metallization via holes 12 along its length, the front of middle rectangular slab 1-2 is equidistantly provided with one the 6th metallization via hole 13 along its length successively, one the 8th metallization via hole 15 and one the 6th metallization via hole 13, the middle part of dielectric-slab 1 is provided with the 7th metallization groups of vias 14, and the 7th metallization groups of vias 14 is inversion T-shaped of several metallization via hole compositions.
Radio-frequency (RF) signal input end of the present invention uses 50 Ω coaxial lines to carry out feed.
Embodiment two: composition graphs 1 illustrates present embodiment, described in present embodiment, a kind of thickness of dielectric-slab 1 of X-band substrate integration wave-guide four-element array antenna is 1.6mm, and the dielectric constant of dielectric-slab 1 is 4.5.
The technique effect of present embodiment is: so arrange, and this design makes this array antenna that the technique of printed circuit board (PCB) can be adopted to carry out processing and fabricating.Other composition and annexation identical with embodiment one.
Embodiment three: composition graphs 1 illustrates present embodiment, the width of the first antenna element 3, second antenna element 4 of a kind of X-band substrate integration wave-guide four-element array antenna described in present embodiment, third antenna unit 5 and the 4th antenna element 6 is 12.8mm, and the width of the first antenna element 3, second antenna element 4, third antenna unit 5 and the 4th antenna element 6 is 11.6mm.
The technique effect of present embodiment is: so arrange, and such design makes the directional diagram of each antenna element reach unanimity.Other composition and annexation identical with embodiment one.
Embodiment four: composition graphs 1 illustrates present embodiment, described in present embodiment, a kind of length L1 of Y-shaped structure 2 top of X-band substrate integration wave-guide four-element array antenna is 56mm, the width W 1 on Y-shaped structure 2 top is 17mm, the length L2 of Y-shaped structure 2 bottom is 85mm, and the width W 2 of Y-shaped structure 2 bottom is 17mm.
The technique effect of present embodiment is: so arrange, and such design can meet the needs of impedance matching, makes antenna meet bandwidth demand.Other composition and annexation identical with embodiment one.
Embodiment five: composition graphs 1 illustrates present embodiment, the diameter of each first metallization via hole 8 of a kind of X-band substrate integration wave-guide four-element array antenna described in present embodiment is 0.8mm, the diameter of each metallization via hole of the second metallization groups of vias 9, the 3rd metallization groups of vias 10, the 7th metallization groups of vias 14 is 0.8mm, the diameter of each 4th metallization via hole 11 is 0.5mm, the diameter of each 5th metallization via hole 12 is 0.6mm, the diameter of each six metallization via holes 13 is 0.8mm, and the diameter of the 8th metallization via hole 15 is 0.6mm.
The technique effect of present embodiment is: so arrange, and design can make the power of feed-in carry out the quartering like this, is redistributed to each antenna element.Other composition and annexation identical with embodiment one.
Claims (5)
1. an X-band substrate integration wave-guide four-element array antenna, it is characterized in that: described a kind of X-band substrate integration wave-guide four-element array antenna comprises dielectric-slab (1), Y-shaped structure (2), first antenna element (3), second antenna element (4), third antenna unit (5) and the 4th antenna element (6), dielectric-slab (1) is by upper rectangular slab (1-1), middle rectangular slab (1-2), lower rectangular slab (1-3) from top to bottom connects to form successively, the upper end of Y-shaped structure (2) is connected with the middle part on dielectric-slab (1) base, first antenna element (3), second antenna element (4), third antenna unit (5) and the 4th antenna element (6) are along the length direction spaced set from left to right of dielectric-slab (1) top margin, first antenna element (3), second antenna element (4), the front of third antenna unit (5) and the 4th antenna element (6) is all printed with elliptic curve microstrip line (7), the both sides of dielectric-slab (1) have several the first metallization via hole (8) along its edge, the top in upper rectangular slab (1-1) front is provided with the second metallization groups of vias (9) and the 3rd metallization groups of vias (10) along its length, and the second metallization groups of vias (9) is positioned between the first antenna element (3) and the second antenna element (4), 3rd metallization groups of vias (10) is positioned between third antenna unit (5) and the 4th antenna element (6), the middle part in upper rectangular slab (1-1) front is equidistantly provided with four the 4th metallization via hole (11) along its length, the bottom in upper rectangular slab (1-1) front is provided with two the 5th metallization via hole (12) along its length, the front of middle rectangular slab (1-2) is equidistantly provided with one the 6th metallization via hole (13) along its length successively, one the 8th metallization via hole (15) and one the 6th metallization via hole (13), the middle part of dielectric-slab (1) is provided with the 7th metallization groups of vias (14), and the 7th metallization groups of vias (14) is the inversion T-shaped of several metallization via hole compositions.
2. a kind of X-band substrate integration wave-guide four-element array antenna according to claim 1, it is characterized in that: the thickness of dielectric-slab (1) is 1.6mm, the dielectric constant of dielectric-slab (1) is 4.5.
3. a kind of X-band substrate integration wave-guide four-element array antenna according to claim 1, it is characterized in that: the width of the first antenna element (3), the second antenna element (4), third antenna unit (5) and the 4th antenna element (6) is 12.8mm, the width of the first antenna element (3), the second antenna element (4), third antenna unit (5) and the 4th antenna element (6) is 11.6mm.
4. a kind of X-band substrate integration wave-guide four-element array antenna according to claim 1, it is characterized in that: the length (L1) on Y-shaped structure (2) top is 56mm, the width (W1) on Y-shaped structure (2) top is 17mm, the length (L2) of Y-shaped structure (2) bottom is 85mm, and the width (W2) of Y-shaped structure (2) bottom is 17mm.
5. a kind of X-band substrate integration wave-guide four-element array antenna according to claim 1, it is characterized in that: the diameter of each first metallization via hole (8) is 0.8mm, second metallization groups of vias (9), 3rd metallization groups of vias (10), the diameter of each metallization via hole of the 7th metallization groups of vias (14) is 0.8mm, the diameter of each 4th metallization via hole (11) is 0.5mm, the diameter of each 5th metallization via hole (12) is 0.6mm, the diameter of each six metallization via hole (13) is 0.8mm, the diameter of the 8th metallization via hole (15) is 0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510020498.2A CN104577353A (en) | 2015-01-15 | 2015-01-15 | X-band substrate integrated waveguide four-element array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510020498.2A CN104577353A (en) | 2015-01-15 | 2015-01-15 | X-band substrate integrated waveguide four-element array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104577353A true CN104577353A (en) | 2015-04-29 |
Family
ID=53092887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510020498.2A Pending CN104577353A (en) | 2015-01-15 | 2015-01-15 | X-band substrate integrated waveguide four-element array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104577353A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206938A (en) * | 2015-09-06 | 2015-12-30 | 哈尔滨工业大学 | High-gain low-sidelobe slot array antenna based on substrate integrated waveguide |
| CN106099353A (en) * | 2016-08-03 | 2016-11-09 | 华南理工大学 | A kind of broadband millimeter-wave antenna array |
| CN115332753A (en) * | 2022-08-24 | 2022-11-11 | 华南理工大学 | Power divider applied to millimeter wave communication |
| CN115347341A (en) * | 2022-10-20 | 2022-11-15 | 南京正銮电子科技有限公司 | Substrate integrated waveguide power divider |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2796136Y (en) * | 2005-05-30 | 2006-07-12 | 东南大学 | Substrate integrated waveguide broad band multiple path power distributor |
| CN201266675Y (en) * | 2008-08-26 | 2009-07-01 | 东南大学 | Low loss high gain multi-beam intelligent antenna |
| CN102856651A (en) * | 2012-09-28 | 2013-01-02 | 重庆绿色智能技术研究院 | Millimeter wave cylindrical surface conformal substrate integrated waveguide slot array antenna |
| CN103606754A (en) * | 2013-11-29 | 2014-02-26 | 东南大学 | Thin-substrate phase amplitude correction quari-yagi difference beam planar horn antenna |
| EP2822095A1 (en) * | 2013-06-24 | 2015-01-07 | Delphi Technologies, Inc. | Antenna with fifty percent overlapped subarrays |
-
2015
- 2015-01-15 CN CN201510020498.2A patent/CN104577353A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2796136Y (en) * | 2005-05-30 | 2006-07-12 | 东南大学 | Substrate integrated waveguide broad band multiple path power distributor |
| CN201266675Y (en) * | 2008-08-26 | 2009-07-01 | 东南大学 | Low loss high gain multi-beam intelligent antenna |
| CN102856651A (en) * | 2012-09-28 | 2013-01-02 | 重庆绿色智能技术研究院 | Millimeter wave cylindrical surface conformal substrate integrated waveguide slot array antenna |
| EP2822095A1 (en) * | 2013-06-24 | 2015-01-07 | Delphi Technologies, Inc. | Antenna with fifty percent overlapped subarrays |
| CN103606754A (en) * | 2013-11-29 | 2014-02-26 | 东南大学 | Thin-substrate phase amplitude correction quari-yagi difference beam planar horn antenna |
Non-Patent Citations (5)
| Title |
|---|
| ROBAB KAZEMI ETAL: "Ultra-wide band Vivaldi antenna array using low loss SIW power divider and GCPW wide band transition", 《RADIO AND WIRELESS SYMPOSIUM(RES),2012 IEEE》 * |
| WEI LI,ETL: "Design and Analysis of X-band Substrate Integrated Waveguide Vivaldi Array Antenna", 《MICROWAVE,ANTENNA,PROPAGATION,AND EMC TECHNOLOGIES(MAPE),2015 IEEE 6TH INTERNATIONAL SYMPOSIUM ON》 * |
| 徐航: "K波段集成阵列天线实验研究", 《中国优秀硕士学位论文全文数据库信息科技辑》 * |
| 李斌等: "基于基片集成波导技术的毫米波超宽带Vivaldi阵列天线研究", 《2009年全国天线年会论文集（下）》 * |
| 邹雄等: "X波段基片集成波导四路功分器的设计", 《工程设计学报》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206938A (en) * | 2015-09-06 | 2015-12-30 | 哈尔滨工业大学 | High-gain low-sidelobe slot array antenna based on substrate integrated waveguide |
| CN105206938B (en) * | 2015-09-06 | 2018-04-27 | 哈尔滨工业大学 | High-gain Sidelobe slot array antenna based on substrate integration wave-guide |
| CN106099353A (en) * | 2016-08-03 | 2016-11-09 | 华南理工大学 | A kind of broadband millimeter-wave antenna array |
| CN106099353B (en) * | 2016-08-03 | 2018-10-30 | 华南理工大学 | A kind of broadband millimeter-wave antenna array |
| CN115332753A (en) * | 2022-08-24 | 2022-11-11 | 华南理工大学 | Power divider applied to millimeter wave communication |
| CN115347341A (en) * | 2022-10-20 | 2022-11-15 | 南京正銮电子科技有限公司 | Substrate integrated waveguide power divider |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9509034B2 (en) | N-way coaxial waveguide power divider/combiner | |
| CN105190998B (en) | Array antenna | |
| CN206602169U (en) | A kind of ultra wide band low-loss power distributor based on double-deck micro-strip | |
| CN105789802B (en) | A kind of ultra wide band balun based on novel interconnection architecture | |
| CN102763269A (en) | Phase shifter using substrate integrated waveguide | |
| CN108172958B (en) | Periodic slow wave transmission line unit based on coplanar waveguide | |
| CN104091990A (en) | Multiple-substrate integrated waveguide filtering power divider | |
| CN104577353A (en) | X-band substrate integrated waveguide four-element array antenna | |
| Jin et al. | Broadband transition between waveguide and substrate integrated waveguide based on quasi-Yagi antenna | |
| CN107275738B (en) | Waveguide-microstrip power combiner based on magnetic coupling principle | |
| CN204391233U (en) | A kind of ultra wide band balun based on novel interconnect architecture | |
| Jun-Yu et al. | High-directivity single-and dual-band directional couplers based on substrate integrated coaxial line technology | |
| CN101662062A (en) | Dual-band unequal power distributor containing selectable isolating structure | |
| CN107425251B (en) | Mirror power synthesis method based on planar circuit board | |
| Rebollo et al. | Full W-band microstrip-to-waveguide inline transition | |
| Bialkowski et al. | UWB planar out-of-phase Wilkinson power divider utilizing UWB±90° phase shifters in microstrip-slot technology | |
| Athanasopoulos et al. | Millimeter-wave passive front-end based on substrate integrated waveguide technology | |
| CN104051831A (en) | Small ultra-wide band filter | |
| US20140285282A1 (en) | Power dividing phase shifter | |
| Song et al. | Broadband multilayer in-phase power divider | |
| KR20190056884A (en) | Transition structure between micro stripline and rectangular waveguide | |
| Arshad et al. | 0 dB coupler employing slot technique on planar microstrip | |
| CN107634301B (en) | Magic plane T with common mode rejection function | |
| CN101494311B (en) | Miniaturisation power distribution/synthesis network based on substrate integrated waveguide | |
| Moyra et al. | Design of t-split power dividers using dumbbell shared dgs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |