CN103077903A - 用于导线键合机的自动线尾调节系统 - Google Patents
用于导线键合机的自动线尾调节系统 Download PDFInfo
- Publication number
- CN103077903A CN103077903A CN2012104032638A CN201210403263A CN103077903A CN 103077903 A CN103077903 A CN 103077903A CN 2012104032638 A CN2012104032638 A CN 2012104032638A CN 201210403263 A CN201210403263 A CN 201210403263A CN 103077903 A CN103077903 A CN 103077903A
- Authority
- CN
- China
- Prior art keywords
- wire
- bonding
- pipe
- point pipe
- line tail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78611—Feeding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
- H01L2224/78631—Means for wire tension adjustments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
本发明公开了一种用于形成导线互连的导线键合方法,使用尖管以形成锲形导线键合;使用设置在导线夹具和尖管上方的导线固定设备以在导线夹具打开和没有夹持在导线上的同时锁固该导线;在远离锲形导线键合和朝向导线固定设备的方向上相对于导线可提升导线夹具和尖管,以便于自该尖管送出一段导线;在尖管的预定高度处,闭合导线夹具以夹持在导线上;其后可移动尖管和导线夹具更进一步远离锲形导线键合,而引起导线自该锲形导线键合处断开,以致于形成从尖管延伸的、具有期望长度的线尾。
Description
技术领域
本发明涉及导线键合机,更具体地涉及导线键合机的导线馈送系统。
背景技术
在半导体装配和封装过程中,导线键合机被用来在半导体芯片上的电性接触盘(contact pads)和衬底之间,或者在不同半导体芯片的电性接触盘之间形成电性导线连接。导线从包含有键合导线的线圈(wire spool)处被馈送至键合工具,如尖管(capillary),以在该键合工具处完成导线键合。最广泛使用的导线材料为金、铜或铝。电性接触盘可能包括位于半导体芯片上的和位于互连衬底上的喷涂有金属的键合区域。
用于将导线键合或者焊接至连接盘的通用方法是通过组合热能、压力和/或超声波能量。它是一个固态的焊接方法,其中两种金属材料(导线和连接盘表面)进入了密切接触。一旦这些表面进入了密切接触,那么电子共享或者原子的相互扩散将会发生,而导致导线键合形成。键合力能够导致材料形变、污染层的破裂和表面粗糙度的平滑,这可能通过应用超声波能量而得以强化。热量能够加速原子之间的相互扩散,从而形成导线键合。
一种类型的导线键合形成是使用球形导线键合(ball wire bond:球焊)。该方法包括在一段由尖管所固定的导线上熔融球形的导线材料,其被降低并焊接到第一键合位置。其后,尖管拉出一段线弧(loop),然后使用通常为月牙形的键合,通常谓之为锲形导线键合(wedge wire bond:锲焊)将导线连接到第二键合位置。再后,另一个焊球被再次形成以进行后续的第一球形导线键合。目前,金或铜球键合是最为广泛使用的键合方法。其优点是:一旦球形导线键合被形成在器件的连接盘上,那么导线在其上没有应力的情形下可以在任一方向上移动,这一点非常有助于自动导线键合。
在球形键合操作过程中,第二键合是在第二键合位置以锲形导线键合的形成出现。在锲形形成以后,当导线仍然连接在锲形导线键合时,键合头将会向上移动,以致于在尖管和锲形导线键合块之间一段导线被送出(paid out)。键合头将会提升至线尾高度位置,在那里当键合头移动至电子火焰熄灭 (Electronic Flame-Off:EFO)水平面时导线键合装置的导线夹具将会闭合。在导线夹具闭合时的进一步向上移动过程中,导线将会在锲形导线键合位置处断开,藉此形成自由地伸展在尖管之外的线尾(wire tail)。EFO设备将会产生火花以将线尾熔融而产生熔融的焊球,其被用于形成下一个球形导线键合。
线尾必须具有足够的长度,以便为下一次球形键合形成合适的熔融的焊球。然而,由于各种原因,线尾可能太短或者缺少。例如,如果用于锲形形成的键合参数不是良好地优化,或者被键合的材料被污染了,那么导线可能较早地从锲形导线键合处断开。然后导线可能不期望地从导线路径或者尖管自身上突然飞出。如果存在较短的线尾或者根本上不存在线尾,那么熔融的焊球不可能被恰当地形成以完成下一个球形键合。如果该装置检测到合适的线尾没有被形成,表明了一个操作错误,那么机器将会停止,并且由人工操作员手动干预通常被需要以致于通过尖管重新进给键合导线。所以,在线尾形成中这种错误导致了不必要的机器停车时间,并降低了生产率。
发明内容
所以,本发明的目的在于寻求提供一种在导线键合操作过程中防止延伸自尖管的线尾不足和/或使其恢复的方法,以便于减少人工干预的操作并提高导线键合装置的生产率。
本发明相关联的目的在于寻求提供一种测量延伸自尖管的线尾的方法,以保证该线尾具有合适的长度而有助于实施后续的导线键合操作。
因此,本发明提供一种用于形成导线互连的导线键合方法,其包括锲形导线键合,该方法包含有以下步骤:使用尖管以形成锲形导线键合;使用设置在导线夹具和尖管上方的导线固定设备以在导线夹具打开和没有夹持在导线上的同时锁固该导线;在远离锲形导线键合和朝向导线固定设备的方向上相对于导线提升导线夹具和尖管,以便于自该尖管送出一段导线;在尖管的预定高度处,闭合导线夹具以夹持在导线上;其后移动尖管和导线夹具更进一步远离锲形导线键合,而引起导线自该锲形导线键合处断开,以致于形成从尖管延伸的、具有期望长度的线尾。
参阅后附的描述本发明实施例的附图,随后来详细描述本发明是很方便的。附图和相关的描述不能理解成是对本发明的限制,本发明的特点限定在权利要求书中。
附图说明
现在参考附图描述本发明所述的导线键合装置和方法较佳实施例的示例,其中。
图1所示为本发明较佳实施例所述的导线键合装置的立体示意图。
图2所示为表明一段键合导线如何可能被控制以减少出现短线尾可能性的示意图。
图3所示为图1导线键合装置的侧视图,其表示了根据本发明较佳实施例所述的线尾长度测量系统。
图4所示为图1导线键合装置的侧视图,其表示了释放一段粘附在尖管上的导线的第一方法。
图5所示为释放一段粘着在尖管上的导线的第二方法的示意图。
图6所示为将键合导线送出至合适的线尾长度以便于后续的导线键合操作的示意图。
图7所示为在正确的线尾长度不能被合适地送出的情形下,一个新的线尾如何可能被产生的示意图。
具体实施方式
图1所示为本发明较佳实施例所述的导线键合装置10的立体示意图。诸如金线或铜线之类的键合导线12从线圈(图中未示)处被馈送进入气动设备14,该气动设备14被操作来施加向上的或者向下的垂直真空吸附力,以促使键合导线12在这些方向上移动。导线固定设备16,其可以是导线夹具的形式,设置在该气动设备14的下方并被操作来锁固键合导线12和控制键合导线12沿着导线进给路径的移动。导线固定设备16也可以包括螺线管激励机构、气动机构或者可以实现在导线键合期间提供固定力以将导线固定定位的功能的任何其他机构。
导线夹具18设置在导线固定设备16的下方,以当键合导线12的相对移动将被限制或者被馈送的键合导线的移动将被控制时夹持在该键合导线12上。导线固定设备16与导线夹具18单独地被操作。然后在导线夹具18的下方,该键合导线12通过尖管20。尖管20通常设置在换能器角体22的一端。导线键合在尖管20的底端端部进行。通常,球形导线键合和锲形导线键合可以通过该尖管20形成。
电子火焰熄灭(“EFO”)打火棒24相邻于尖管20的底端设置,以提供电火花将键合导线12的线尾端部熔融,而实现导线键合的目的。键合导线12的线尾端部也称之为线尾。熔融的键合导线12是以焊球的形式存在,然后该焊球通过尖管20被键合在电子器件26上,以产生导线互连的第一键合。该第一键合较合适地为球形导线键合。其后,尖管20延伸通过键合导线12以形成自第一键合延伸的线弧。然后,使用尖管20在第二键合位置形成第二键合,其以锲形导线键合的形式存在,以在第一键合位置和第二键合位置之间完成导线互连。
图2所示为表明一段键合导线12如何可能被控制以减少出现短线尾可能性的示意图。在第二键合位置,在产生锲形导线键合时,尖管20与电子器件26相接触。在这个时刻,导线固定设备16闭合以锁固键合导线12,并且导线夹具18打开以便于其不再夹持于键合导线12上。在锲形导线键合已经产生之后,尖管20被提升,并连同导线夹具18相对于键合导线12在沿着背离锲形导线键合和朝向导线固定设备16的方向向上移动,以在导线仍然连接于锲形导线键合块时距离锲形导线键合块送出一段导线。这个动作延长了一段足够长度的键合导线12以产生线尾。
当尖管20和导线夹具18正向上移动以从尖管20处送出导线时,导线固定设备16应该夹持在键合导线12上以锁固该键合导线12并控制其位置,以便于在键合导线12过早地从锲形键合块处断开的情形下,键合导线12不会偏离导线进给路径。键合导线位置的所述控制会减少键合导线12偏离导线进给路径的可能性,并避免不必要的机器停车。
在尖管20已经提升到一个预定高度和足够的线尾长度被形成之后,导线夹具18闭合在键合导线12上而导线固定设备16现在能够被打开。一旦尖管20和导线夹具18进一步向上移动离开锲形导线键合,那么具有期望长度的线尾从电子器件26上的锲形导线键合处断开。现在,延伸自尖管20的、具有期望长度的线尾准备被EFO设备24熔融,以形成焊球而便于产生下一个球形导线键合。
图3所示为图1导线键合装置10的侧视图,其表示了根据本发明较佳实施例所述的线尾长度测量系统。当短线尾被发现时,线尾长度测量是非常有用的,导线键合装置10需要自动地确定键合导线12送出多少,以便于获得足够长度的线尾,而在没有操作员干预的情形下继续进行导线键合操作。
接触检测设备28和导线键合装置10联合使用以检测线尾的长度。当可能较短的线尾或缺失的线尾被系统发现时,通常在导线键合装置10检测到键合导线12已经较早地从第二或锲形键合处断开时,保留的线尾的长度应该得以被确定。为此,接触检测设备28的一个电极电性连接至键合导线12,而接触检测设备28的另一个电极电性连接至电子器件26或某个其他电性导电表面。可供选择地,任何其他合适的电气传感器可以分别电性连接至键合导线12和电性导电表面,以检测键合导线12和电性导电表面之间的接触。这些连接形成了一个电路回路。当键合导线12不与电子器件26或某个其他电性导电表面接触时,所述的电路回路是断开的,而当键合导线12与它们相接触时,所述的电路回路是闭合的。
在这个位置,键合导线12的线尾局部的一部分可以自尖管20的端部自由地悬浮,以便于接触检测设备28的电路回路是断开的。然后,固定有键合导线12的尖管20设置在预定的高度处,并在尖管20的垂直位置或键合头的其他合适部分正被监控时朝向电子器件26逐渐降低。尖管20被降低一直到键合导线12首先接触电子器件26或其他电性导电表面,于是接触检测设备28的电路回路将会是闭合的。在这个位置,尖管20的垂直位置或键合头上的其他相对位置被标注。由于电子器件26或其他电性导电表面的高度是公知的,所以从尖管20的端部凸伸出的键合导线12的长度能够得以被确定。
一旦确定了凸伸的键合导线12的长度,那么系统能够计算键合导线需要被送出(或缩回)的附加长度,以便于获得期望的线尾长度而在没有操作员干预的情形下继续进一步的键合操作。在期望的线尾长度已经获得之后,或者如果线尾长度是在预定的范围以内,源自EFO设备24的火花将线尾的端部熔融,以产生熔融的焊球而便于进行后续的导线键合。
在某些实例中,尽管导线夹具18相对于键合导线12操控移动,但键合导线12可能被阻滞粘附于尖管20以致于其不能被进一步送出。图4所示为图1导线键合装置的侧视图,其表示了释放一段粘附在尖管20上,通常是在尖管20的端部的导线的第一方法。在这个第一方法中,尖管20的端部相邻于EFO设备24移动。在键合导线12上,一个或多个火花30然后从EFO设备24处产生,以便于熔融粘附在尖管20的端部的键合导线12的局部。在键合导线12熔融之后,其不再粘附并可以自尖管20处离开,以致于键合导线12可以被送出,而导线键合操作可以继续。
图5所示为释放一段粘附在尖管20上的导线的第二方法的示意图。在这个方法中,以球形导线键合块形式存在的凸点(bump ball)32已经通过将其预键合在名义区域或表面上而被预形成,其可能被设置在电子器件26或某个其他表面的不被使用的局部上。如果可以确定键合导线12是粘附于尖管20的端部,那么尖管20朝向凸点32带动键合导线12,并且尖管20设置在凸点32的顶部。然后,尖管20设法键合和将粘附的键合导线12安装在凸点32上,如通过超声波振动使用刷洗动作(scrubbing action)的方式,以致于粘附的导线自尖管20处分离。
当键合导线12的端部仍然粘着于凸点32上时,在导线夹具18打开以生成一个新的线尾的同时,尖管20被提升。一旦足够长度的线尾被获得时,导线夹具18被闭合。一旦尖管20和导线夹具18进一步被提升,线尾从凸点32处断开,而一个新的具有期望长度的线尾将会可用于进一步的键合操作。
图6所示为将键合导线12送出至合适的线尾长度以便于后续的导线键合操作的示意图。一旦线尾的长度已经确定,导线键合装置10将会知道键合导线12需要被送出的数量以便于实现所期望的长度。为了送出键合导线12,在导线固定设备16打开和键合导线12从被导线固定设备16锁固中释放的同时,导线夹具18将会首先夹持在键合导线12上。导线夹具18然后将会沿着背离导线固定设备16和朝向尖管20的方向向下拉引键合导线12以便于更多的键合导线12自线圈处被馈送。其后,导线固定设备16在键合导线12上闭合以防止键合导线12移动,而导线夹具18打开。导线夹具18然后将会朝向导线固定设备16向上移动以准备下一次的拉引动作。在导线夹具18相对于键合导线12已经被提升之后,其再次在键合导线12上闭合,然后导线固定设备16打开以将键合导线12从被锁固中释放。导线夹具18再次背离导线固定设备16和朝向尖管20向下拉引键合导线12直到达到正确的线尾长度。如果没有达到,可以再次重复循环以送出更多的键合导线12。
图7所示为在正确的线尾长度不能被合适地送出的情形下,一个新的线尾如何可能被产生的示意图。在调节线尾长度的多次努力已经完成之后,正确的线尾长度可能仍然没有实现,或者线尾的形状可能由于产生来将粘附的键合导线12自尖管20处分离的火花30而变形。如果如此,那么可能有必要移离有缺陷的线尾并且形成新的线尾以保证键合操作的平滑延续。在这种情形下,可能产生名义上的键合。
首先将尖管20移动至名义区域,其可能位于电子器件26或某个其他表面的未被使用的局部。EFO设备24产生火花以熔融线尾和形成熔融的焊球。然后,第一、球形导线键合产生于该名义区域。其后,尖管20向上移动,并朝向第二键合位置延伸键合导线12以产生第二、锲形导线键合。在该过程中,线弧34被形成。在线弧34被形成之后,键合导线12从锲形键合处断开,并形成一个新的自尖管20处延伸的具有期望长度的线尾。然后,导线键合操作能够更为流畅地继续。
可供选择地,代替形成线弧34,凸点32可以被形成,并且在键合导线12已经从凸点32处延伸之后,键合导线12能够立即自凸点32处断开,以形成一个新的自尖管20处延伸的具有期望长度的线尾,如图5所示。以这种方式,能够节约键合时间,或者有时,使得分离粘着的导线更为容易。但是,在这种情形下,凸点必须键合得足够坚固,以致于当键合导线12正被拉引以从球形导线键合块处断开时,它不会自名义区域移动。
此处描述的本发明在所具体描述的内容基础上很容易产生变化、修正和/或补充,可以理解的是所有这些变化、修正和/或补充都包括在本发明的上述描述的精神和范围内。
Claims (16)
1.一种用于形成导线互连的导线键合方法,其包括锲形导线键合,该方法包含有以下步骤:
使用尖管以形成锲形导线键合;
使用设置在导线夹具和尖管上方的导线固定设备以在导线夹具打开和没有夹持在导线上的同时锁固该导线;
在远离锲形导线键合和朝向导线固定设备的方向上相对于导线提升导线夹具和尖管,以便于自该尖管送出一段导线;
在尖管的预定高度处,闭合导线夹具以夹持在导线上;其后
移动尖管和导线夹具更进一步远离锲形导线键合,而引起导线自该锲形导线键合处断开,以致于形成从尖管延伸的、具有期望长度的线尾。
2.如权利要求1所述的导线键合方法,该方法还包含有以下步骤:
在闭合导线夹具之后,将导线从由导线固定设备的锁固中释放。
3.如权利要求1所述的导线键合方法,该方法还包含有以下步骤:
在形成线尾之后,在预定高度处定位尖管,并朝向电性导电表面逐渐降低线尾;
确定从尖管延伸的线尾的长度;其后
产生火花熔融线尾的端部,以产生熔融的焊球而便于进行后续的导线键合。
4.如权利要求3所述的导线键合方法,其中,确定从尖管延伸的线尾的长度的步骤还包含有以下步骤:
使用接触检测设备以检测线尾接触电性导电表面的垂直位置,并根据线尾接触电性导电表面的所述垂直位置确定线尾的长度。
5.如权利要求4所述的导线键合方法,其中,该接触检测设备包含有:
第一电极,其和键合导线电性连接;
第二电极,其和电性导电表面电性连接。
6.如权利要求3所述的导线键合方法,其中,检测从尖管延伸的线尾的长度的步骤还包含有以下步骤:
将电气传感器分别连接至导线和电性导电表面上以形成电路回路,其中当导线不和电性导电表面相接触时电路回路是断开的,而当导线和电性导电表面相接触时电路回路是闭合的;
将尖管朝向电性导电表面逐渐移动,直到导线和电性导电表面相接触而将电路回路闭合;其后
当电路回路闭合时确定从尖管端部延伸至位于尖管的垂直位置处的电性导电表面的线尾长度。
7.如权利要求1所述的导线键合方法,该方法还包含有从尖管处送出一段附加的线尾的步骤,该从尖管处松开一段附加的线尾的步骤包含有以下步骤:
将导线从导线固定设备的锁固中释放;
在远离导线固定设备和朝向尖管的方向上使用导线夹具拉引导线;
使用导线固定设备锁固导线;
在导线夹具打开之后,在朝向导线固定设备的方向上相对于导线移动尖管和导线夹具,以从尖管中送出导线;其后
使用导线夹具夹持导线,并将导线从导线固定设备的锁固中释放。
8.如权利要求1所述的方法,其中,如果导线粘附于尖管,那么该方法还包含有以下步骤:
在粘附于尖管的导线上产生一个或多个电火花,以熔融导线,并然后使熔融的线尾从尖管处离开。
9.如权利要求1所述的方法,其中,如果导线粘附于尖管,那么该方法还包含有以下步骤:
将粘附的导线设置在已经预键合在一表面上的焊球上,将粘附的导线安装在焊球上,并将粘附的导线自尖管分离,然后,将导线从尖管处延伸,其后将导线从焊球处断开。
10.如权利要求1所述的方法,其中,如果导线夹具不能从尖管处送出更多的导线以延长线尾,或者线尾不适合于形成正常的球形导线键合,那么该方法还包含有以下步骤:
形成包含有第一导线键合和第二导线键合的线弧,并从第二导线键合处断开导线,以形成从尖管延伸的、具有期望长度的一段新的线尾。
11.如权利要求1所述的方法,其中,如果导线夹具不能从尖管处送出更多的导线以延长线尾,那么该方法还包含有以下步骤:
形成球形导线键合,将尖管和球形导线键合之间的导线长度延长,其后,从球形导线键合处断开导线以形成从尖管延伸的、具有期望长度的一段新的线尾。
12.如权利要求1所述的方法,其中,该导线固定设备包括导线夹具。
13.一种用于导线键合的装置,该装置包含有:
尖管,其用于在其端部形成导线键合;
导线夹具,其设置在尖管的上方,用于控制将导线馈送给尖管;以及
导线固定设备,其设置在导线夹具和尖管的上方,该导线固定设备与导线夹具独立地被操作,并被用于相对于导线夹具和尖管锁固导线。
14.如权利要求12所述的用于导线键合的装置,该装置还包含有:
接触检测设备,其用于检测当延伸自尖管处的线尾接触电性导电表面时的时刻。
15.如权利要求13所述的用于导线键合的装置,其中,该接触检测设备包含有:
第一电极,其被设置来和键合导线电性连接;
第二电极,其被设置来和电性导电表面电性连接。
16.如权利要求13所述的用于导线键合的装置,其中,该导线固定设备包括导线夹具。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161550996P | 2011-10-25 | 2011-10-25 | |
US61/550,996 | 2011-10-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103077903A true CN103077903A (zh) | 2013-05-01 |
CN103077903B CN103077903B (zh) | 2016-04-06 |
Family
ID=48135114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210403263.8A Active CN103077903B (zh) | 2011-10-25 | 2012-10-22 | 用于导线键合机的自动线尾调节系统 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9502374B2 (zh) |
JP (1) | JP5645903B2 (zh) |
KR (1) | KR101378324B1 (zh) |
CN (1) | CN103077903B (zh) |
MY (1) | MY166195A (zh) |
PH (1) | PH12012000317B1 (zh) |
SG (1) | SG189657A1 (zh) |
TW (1) | TWI483323B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104772417A (zh) * | 2014-01-15 | 2015-07-15 | 库利克和索夫工业公司 | 线材焊接操作中的短尾恢复技术 |
CN105405778A (zh) * | 2014-09-11 | 2016-03-16 | 矽品精密工业股份有限公司 | 打线装置及排除不良焊线的方法 |
CN106898558A (zh) * | 2015-12-21 | 2017-06-27 | 矽品精密工业股份有限公司 | 打线装置及排除不良焊线的方法 |
CN111668124A (zh) * | 2019-03-05 | 2020-09-15 | 先进科技新加坡有限公司 | 键合引线垂直互连部的形成 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012021349A2 (en) * | 2010-08-10 | 2012-02-16 | Kulicke And Soffa Industries, Inc. | Wire loops, methods of forming wire loops, and related process |
JP5426000B2 (ja) * | 2012-11-16 | 2014-02-26 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
US9165904B1 (en) * | 2014-06-17 | 2015-10-20 | Freescale Semiconductor, Inc. | Insulated wire bonding with EFO before second bond |
KR20220160553A (ko) * | 2020-03-29 | 2022-12-06 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 와이어 본딩 머신 상의 지지 구조에 대한 반도체 소자의 클램핑 최적화 방법, 및 관련된 방법 |
KR20210140957A (ko) | 2020-05-14 | 2021-11-23 | 삼성전자주식회사 | 반도체 패키지의 와이어 본딩 방법 |
KR20220007247A (ko) | 2020-07-10 | 2022-01-18 | 삼성전자주식회사 | 와이어 본딩 장치 |
KR20230088502A (ko) * | 2020-11-25 | 2023-06-19 | 가부시키가이샤 신가와 | 반도체 장치의 제조 방법 및 반도체 장치의 제조 장치 |
KR20230120187A (ko) * | 2022-02-07 | 2023-08-17 | 에스케이하이닉스 주식회사 | 와이어 본딩 방법 및 장치 |
JP7546314B1 (ja) | 2023-06-12 | 2024-09-06 | 株式会社新川 | 半導体装置の製造方法、及びワイヤボンディング装置 |
JP7515216B1 (ja) | 2023-06-16 | 2024-07-12 | 株式会社新川 | ワイヤボンディング装置及びリカバリ方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307575A (ja) * | 1998-04-17 | 1999-11-05 | Sanken Electric Co Ltd | ワイヤボンディング方法 |
TW473884B (en) * | 1999-12-28 | 2002-01-21 | Shinkawa Kk | Wire bonding method and apparatus |
TW200725766A (en) * | 2005-12-28 | 2007-07-01 | Shinkawa Kabushiki Kaisha | Wire bonding apparatus, recording media with connecting control program and connecting method |
KR20070084867A (ko) * | 2006-02-22 | 2007-08-27 | 삼성전자주식회사 | 와이어 고정 수단을 갖는 와이어 본딩 장치 및 그를 이용한와이어 테일 형성 방법 |
TW201034780A (en) * | 2009-03-19 | 2010-10-01 | Powertech Technology Inc | Method and device of continuously wire-bonding between multiple terminals |
CN102054718A (zh) * | 2009-10-29 | 2011-05-11 | 先进科技新加坡有限公司 | 用于导线键合机的自动导线进给系统 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5176310A (en) * | 1988-11-28 | 1993-01-05 | Hitachi, Ltd. | Method and apparatus for wire bond |
JPH02303138A (ja) * | 1989-05-18 | 1990-12-17 | Matsushita Electric Ind Co Ltd | ワイヤボンディング装置及び方法 |
US20100065963A1 (en) * | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
JP3338848B2 (ja) * | 1997-07-01 | 2002-10-28 | シャープ株式会社 | バンプ形成におけるボンディング不良検出方法およびボンディング装置の制御方法 |
KR100548008B1 (ko) * | 2004-05-20 | 2006-02-01 | 삼성테크윈 주식회사 | 와이어 본딩 기기의 자동 볼 형성방법 |
JP4530230B2 (ja) * | 2007-03-29 | 2010-08-25 | 鈴鹿富士ゼロックス株式会社 | ワイヤーボンディング方法およびledプリントヘッドの製造方法 |
SG148901A1 (en) * | 2007-07-09 | 2009-01-29 | Micron Technology Inc | Packaged semiconductor assemblies and methods for manufacturing such assemblies |
JP5117462B2 (ja) * | 2009-09-18 | 2013-01-16 | 株式会社新川 | ワイヤボンディング装置及び方法 |
-
2012
- 2012-10-18 SG SG2012077814A patent/SG189657A1/en unknown
- 2012-10-18 PH PH12012000317A patent/PH12012000317B1/en unknown
- 2012-10-19 MY MYPI2012004653A patent/MY166195A/en unknown
- 2012-10-22 CN CN201210403263.8A patent/CN103077903B/zh active Active
- 2012-10-23 KR KR1020120117974A patent/KR101378324B1/ko active IP Right Grant
- 2012-10-23 TW TW101138987A patent/TWI483323B/zh active
- 2012-10-24 US US13/658,957 patent/US9502374B2/en active Active
- 2012-10-25 JP JP2012235460A patent/JP5645903B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307575A (ja) * | 1998-04-17 | 1999-11-05 | Sanken Electric Co Ltd | ワイヤボンディング方法 |
TW473884B (en) * | 1999-12-28 | 2002-01-21 | Shinkawa Kk | Wire bonding method and apparatus |
TW200725766A (en) * | 2005-12-28 | 2007-07-01 | Shinkawa Kabushiki Kaisha | Wire bonding apparatus, recording media with connecting control program and connecting method |
KR20070084867A (ko) * | 2006-02-22 | 2007-08-27 | 삼성전자주식회사 | 와이어 고정 수단을 갖는 와이어 본딩 장치 및 그를 이용한와이어 테일 형성 방법 |
TW201034780A (en) * | 2009-03-19 | 2010-10-01 | Powertech Technology Inc | Method and device of continuously wire-bonding between multiple terminals |
CN102054718A (zh) * | 2009-10-29 | 2011-05-11 | 先进科技新加坡有限公司 | 用于导线键合机的自动导线进给系统 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104772417A (zh) * | 2014-01-15 | 2015-07-15 | 库利克和索夫工业公司 | 线材焊接操作中的短尾恢复技术 |
CN104772417B (zh) * | 2014-01-15 | 2018-04-27 | 库利克和索夫工业公司 | 线材焊接操作中的短尾恢复技术 |
CN105405778A (zh) * | 2014-09-11 | 2016-03-16 | 矽品精密工业股份有限公司 | 打线装置及排除不良焊线的方法 |
CN105405778B (zh) * | 2014-09-11 | 2018-08-17 | 矽品精密工业股份有限公司 | 打线装置及排除不良焊线的方法 |
CN106898558A (zh) * | 2015-12-21 | 2017-06-27 | 矽品精密工业股份有限公司 | 打线装置及排除不良焊线的方法 |
CN106898558B (zh) * | 2015-12-21 | 2019-03-12 | 矽品精密工业股份有限公司 | 打线装置及排除不良焊线的方法 |
CN111668124A (zh) * | 2019-03-05 | 2020-09-15 | 先进科技新加坡有限公司 | 键合引线垂直互连部的形成 |
Also Published As
Publication number | Publication date |
---|---|
CN103077903B (zh) | 2016-04-06 |
PH12012000317A1 (en) | 2014-08-04 |
TW201320211A (zh) | 2013-05-16 |
KR20130045808A (ko) | 2013-05-06 |
US20130098877A1 (en) | 2013-04-25 |
JP5645903B2 (ja) | 2014-12-24 |
PH12012000317B1 (en) | 2014-08-04 |
KR101378324B1 (ko) | 2014-03-27 |
TWI483323B (zh) | 2015-05-01 |
JP2013179255A (ja) | 2013-09-09 |
MY166195A (en) | 2018-06-07 |
SG189657A1 (en) | 2013-05-31 |
US9502374B2 (en) | 2016-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103077903A (zh) | 用于导线键合机的自动线尾调节系统 | |
TWI397138B (zh) | 打線接合方法、打線接合裝置及打線接合控制程式 | |
KR100283501B1 (ko) | 반도체소자 및 그 제조방법과 반도체 장치 및 그 제조방법 | |
KR100536898B1 (ko) | 반도체 소자의 와이어 본딩 방법 | |
KR950009619B1 (ko) | 반도체장치의 와이어 본딩방법 | |
TWI634602B (zh) | 在線接合操作中之短尾恢復技術 | |
US20050199677A1 (en) | Wire bonding apparatus having actuated flame-off wand | |
KR101804232B1 (ko) | 와이어 접합 중에 자유 에어 볼 크기를 측정하기 위한 방법 및 장치 | |
CN103069557B (zh) | 引线环、形成引线环的方法及相关处理 | |
US6244499B1 (en) | Structure of a ball bump for wire bonding and the formation thereof | |
US6350632B1 (en) | Semiconductor chip assembly with ball bond connection joint | |
US20150235975A1 (en) | Methods for Stud Bump Formation and Apparatus for Performing the Same | |
KR100465552B1 (ko) | 범프형성방법 및 범프본더 | |
TWI511209B (zh) | 傳導凸塊、線環及其形成方法 | |
US20050092815A1 (en) | Semiconductor device and wire bonding method | |
US4687897A (en) | Flame-off limited circuit for wire bonding ball forming apparatus | |
US20060032894A1 (en) | Wire bond with improved shear strength | |
JP3202193B2 (ja) | ワイヤボンディング方法 | |
JPH02250328A (ja) | ワイヤボンダ、ワイヤボンダを用いたバンプ形成方法 | |
JPS62104126A (ja) | ワイヤボンデイング方法 | |
JPH098046A (ja) | 半導体チップの突起電極形成方法 | |
JPH0831459B2 (ja) | ボ−ルバンプ形成方法及びその装置 | |
JP2586679B2 (ja) | ワイヤボンディング方法 | |
JPS61117846A (ja) | 接合用金属突起の製造方法 | |
JPH04251948A (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |