CN103076863B - A kind of liquid cold computer card pressure relief device - Google Patents
A kind of liquid cold computer card pressure relief device Download PDFInfo
- Publication number
- CN103076863B CN103076863B CN201210539677.3A CN201210539677A CN103076863B CN 103076863 B CN103076863 B CN 103076863B CN 201210539677 A CN201210539677 A CN 201210539677A CN 103076863 B CN103076863 B CN 103076863B
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- China
- Prior art keywords
- pressure relief
- radiating shell
- relief element
- liquid
- computer card
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of liquid cold computer card pressure relief device, mainly solves the problem that existing liquid cold computer card pressure relief device structure is complicated, reliability is low.This liquid cold computer card pressure relief device includes the radiating shell being arranged in the cold computer of liquid, the cooling liquid flowing channel end of described radiating shell is provided with pressure relief element, pressure relief element is fixedly installed on radiating shell, and forms, with radiating shell, the cooling liquid flowing channel sealed；Described pressure relief element is the rubber pressure relief element of corrosion of not being cooled；The blind hole contacted with extraneous air it is provided with in pressure relief element.Liquid cold computer card pressure relief device simple in construction, reliability that the present invention provides are high, efficiently solve the coolant pressure release problem after board radiating shell is heated.
Description
Technical field
The present invention relates to a kind of liquid cold computer card pressure relief device, belong to avionic device structure.
Background technology
Along with the development of microelectric technique, the power consumption of chip is more and more higher, traditional natural heat dissipation and forcing
Air-cooled radiating mode can not solve the heat dissipation problem of chip.Compared with air, specific heat of liquid is wanted
Much higher times, therefore liquid cooling is the preferable approach solving the heat radiation of big power dissipating chip.Utilize liquid
Cooling down computer, the general liquid that passes through in the radiating shell internal flow of computer card thus carries
Walk heat on board.Therefore, coolant can be full of the radiating shell of board and the coolant of computer cabinet
In passage.
Expanding with heat and contract with cold is the build-in attribute of material, and coolant also certainly exists the phenomenon expanded with heat and contract with cold.If
Computer card takes out in computer cabinet, will in the cooling passage in the radiating shell of board
There is substantial amounts of coolant.If raising outside, the volume of coolant will increase, owing to board is from meter
After taking out in calculating machine enclosure, radiating shell is one and seals structure, and the pressure within radiating shell will increase
Add.When pressure is increased to a certain degree, it is possible to cause module housing to damage so that outside coolant
Let out and cause lethal effect.
At present conventional pressure relief device uses spring piston structure mostly, utilizes piston stress pusher to move spring
Compression, provides a space that can enter to coolant.Although this structure is largely effective, but
There is the shortcoming that structure is complicated, reliability is low.
Summary of the invention
The present invention provides a kind of liquid cold computer card pressure relief device, mainly solves the cold computer of existing liquid
The problem that board pressure relief device structure is complicated, reliability is low.
The concrete technical solution of the present invention is as follows:
This liquid cold computer card pressure relief device, including the radiating shell being arranged in the cold computer of liquid, institute
The cooling liquid flowing channel end stating radiating shell is provided with pressure relief element, and pressure relief element is fixedly installed on radiation shell
On body, and form, with radiating shell, the cooling liquid flowing channel sealed；Described pressure relief element is not rotten by coolant
The rubber pressure relief element of erosion；The blind hole contacted with extraneous air it is provided with in pressure relief element.
The steel wire for increasing bearing pressure it is provided with in above-mentioned pressure relief element.
It is fixedly installed on radiating shell by clamp nut in above-mentioned pressure relief element.
When above-mentioned coolant is No. 65 coolants, pressure relief element uses nitrile rubber to make；Coolant is
During PAO602 coolant, pressure relief element uses fluorosioloxane rubber to make.
It is an advantage of the current invention that:
Liquid cold computer card pressure relief device simple in construction, reliability that the present invention provides are high, effectively solve
Board radiating shell be heated after coolant pressure release problem.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram.
Detailed description of the invention
Solve that liquid cold computer card pressure relief device structure is complicated, reliability is low, radiating shell is easily by heat waste
Bad problem, general thinking is more reserved spaces on radiating shell, if coolant volume increases,
The part increased just can take space reserved on radiating shell, thus avoids owing to temperature raises dissipating
The destruction of hot housing.
Based on above-mentioned thinking, the present invention provides a kind of simple structure form, completes this purpose, and it is the most such as
Under: this liquid cold computer card pressure relief element includes the radiating shell being arranged in the cold computer of liquid, heat radiation
Housing side fits tightly with heat conductive pad side, and heat conductive pad opposite side and euthermic chip fit tightly for entering
Row conduction of heat, euthermic chip is arranged in printed board, and printed board is fixedly installed in the cold computer cabinet of liquid.
The cooling liquid flowing channel end of radiating shell is provided with pressure relief element, and pressure relief element is fixedly installed on heat radiation
On housing, and form, with radiating shell, the cooling liquid flowing channel sealed；Pressure relief element is the corrosion that is not cooled
Rubber pressure relief element, elastomeric material must coolant compatible, namely coolant should not be to elastomeric material
Cause corrosion；It is, in general, that No. 65 coolants are compatible with nitrile rubber, PAO602 coolant and fluorine silicon
Rubber is compatible；The blind hole contacted with extraneous air it is provided with, within board radiating shell in pressure relief element
After temperature of liquid raises, volume starts to expand, and causes its internal pressure to raise, inside pressure relief element
Be connected with extraneous air, the pressure within radiating shell promote module make pressure relief element to contract,
Thus reduce the pressure within board radiating shell.
In order to improve the resistance to forcing up the targets of pressure relief element so that pressure relief element can bear bigger pressure, can
Some steel wires are increased with the inside at the elastomeric material of pressure relief element.
Claims (3)
1. a liquid cold computer card pressure relief device, it is in avionic device, including being arranged on liquid
Radiating shell in cold computer, it is characterised in that: the cooling liquid flowing channel end of described radiating shell is provided with lets out
Pressure element, pressure relief element is fixedly installed on radiating shell, and forms, with radiating shell, the cooling liquid flowing channel sealed；
Described pressure relief element is the rubber pressure relief element of corrosion of not being cooled；It is provided with in pressure relief element and extraneous air
The blind hole of contact, is provided with the steel wire for increasing bearing pressure in described pressure relief element.
Liquid the most according to claim 1 cold computer card pressure relief device, it is characterised in that: described pressure release
It is fixedly installed on radiating shell by clamp nut in element.
Liquid the most according to claim 1 and 2 cold computer card pressure relief device, it is characterised in that: described
When coolant is No. 65 coolants, pressure relief element uses nitrile rubber to make；Coolant is PAO602 coolant
Time, pressure relief element uses fluorosioloxane rubber to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539677.3A CN103076863B (en) | 2012-12-13 | 2012-12-13 | A kind of liquid cold computer card pressure relief device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539677.3A CN103076863B (en) | 2012-12-13 | 2012-12-13 | A kind of liquid cold computer card pressure relief device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103076863A CN103076863A (en) | 2013-05-01 |
| CN103076863B true CN103076863B (en) | 2016-08-17 |
Family
ID=48153423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210539677.3A Active CN103076863B (en) | 2012-12-13 | 2012-12-13 | A kind of liquid cold computer card pressure relief device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103076863B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201035493Y (en) * | 2007-03-05 | 2008-03-12 | 方志宏 | Non-noise liquid cooling computer cabinet |
| CN201289630Y (en) * | 2008-11-05 | 2009-08-12 | 金龙 | Intelligent cool-down cabinet |
| CN101861086A (en) * | 2009-04-06 | 2010-10-13 | 国际商业机器公司 | Be used to form the apparatus and method that mechanical seal connects |
-
2012
- 2012-12-13 CN CN201210539677.3A patent/CN103076863B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201035493Y (en) * | 2007-03-05 | 2008-03-12 | 方志宏 | Non-noise liquid cooling computer cabinet |
| CN201289630Y (en) * | 2008-11-05 | 2009-08-12 | 金龙 | Intelligent cool-down cabinet |
| CN101861086A (en) * | 2009-04-06 | 2010-10-13 | 国际商业机器公司 | Be used to form the apparatus and method that mechanical seal connects |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103076863A (en) | 2013-05-01 |
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