CN201289630Y - Intelligent cool-down cabinet - Google Patents
Intelligent cool-down cabinet Download PDFInfo
- Publication number
- CN201289630Y CN201289630Y CNU2008202189060U CN200820218906U CN201289630Y CN 201289630 Y CN201289630 Y CN 201289630Y CN U2008202189060 U CNU2008202189060 U CN U2008202189060U CN 200820218906 U CN200820218906 U CN 200820218906U CN 201289630 Y CN201289630 Y CN 201289630Y
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- brace
- metal tube
- water tank
- metal pipe
- intelligent
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Abstract
An intelligent cooling case comprises a case housing, a power source and a switch. The intelligent cooling case is characterized in that the case also includes a water tank, a water tank relief valve, a metal pipe relief valve, a cooling fan, a thermal film, an upper cover panel of the case, a water pump, a display card chip connection sheet, a north bridge chip connection sheet, a CPU chip connection sheet, a heat generating diode connection sheet of the power source, a flow indicator, an intelligent temperature controller, a temperature probe, a bending metal pipe and a metal pipe, wherein the metal pipe relief valve is arranged on the metal pipe; the metal pipe is arranged on the water pump and is sequentially connected with each connection sheet in a clamping manner; the flow indicator is arranged on the metal pipe; the intelligent temperature controller is connected with the temperature probe and the cooling fan through a wire respectively; and the bending metal pipe is correspondingly connected with the metal pipe. The intelligent cooling case has the advantages of high cooling efficiency, dust prevention, environmental protection, simple structure, low cost of batch manufacture, and wide market prospect.
Description
Technical field
The utility model relates to computer housing equipment, and a kind of intelligent cooling cabinet is provided especially.
Background technology
At present, known common computer cabinet noise is big, and cabinet adopts semiclosed design entirely, the vent port that leaves is many, needs cabinet inside and outside string wind just can reach radiating effect, and the interior radiator fan quantity of cabinet is many and radiating effect is poor, especially in summer, each part pollution level height in the cabinet, circuit board is contaminated serious, the overclocking weak effect, power consumption, the radiation height, cpu fan and video card fan spoilage height, fan material waste rate height.
The utility model content
The purpose of this utility model is to have all deficiencies of cabinet now in order to overcome, and the utility model provides a kind of intelligent cooling cabinet, and this cabinet not only is fit to the computer office, more is applicable to recreation and overclocking etc.
The utility model provides a kind of intelligent cooling cabinet, comprise cabinet housing, power supply and switch, it is characterized in that: described intelligent cooling cabinet also comprises water tank 1, water tank blowdown valve 2, metal tube blowdown valve 3, radiator fan 4, heat radiator 5, chassis cover panel 6, water pump 9, video card chip brace 10, north bridge chips brace 11, cpu chip brace 12, chassis power supply heating diode brace 13, flow indicator 14, intelligent temperature controller 15, temp probe 16, bending metals pipe 17, metal tube 18;
Wherein: water tank blowdown valve 2 is installed on the water tank 1, metal tube pressure-release valve 3 is installed on the metal tube 18, be installed on the heat radiator 5 below the radiator fan 4 corresponding chassis cover panels 6, metal tube 18 is installed on the water pump 9, video card chip brace 10, north bridge chips brace 11, cpu chip brace 12, chassis power supply heating diode brace 13 corresponding respectively being installed on the respective element of computer main board, metal tube 18 is mode and the video card chip brace 10 by tightening successively, north bridge chips brace 11, cpu chip brace 12, chassis power supply heating diode brace 13 connects, flow indicator 14 is installed on the metal tube 18, intelligent temperature controller 15 is connected with temp probe 16 by lead, intelligent temperature controller 15 is connected with radiator fan 4 by lead, bending metals pipe 17 and 18 corresponding connections of metal tube.
Described intelligent cooling cabinet also comprises Cistern valve 7, and Cistern valve 7 is installed on the water tank 1.
Described intelligent cooling cabinet also comprises safety net 8, and safety net (8) is installed between radiator fan (4) the chassis cover panel (6).
Advantage of the present utility model:
Intelligent cooling cabinet described in the utility model, the cooling effectiveness height, the dust-separation environmental protection, simple in structure, the batch making cost is low, will have extensive market prospects.
Description of drawings
Below in conjunction with drawings and the embodiments the utility model is described in further detail:
Fig. 1 is the radiator portion structural representation;
Fig. 2 is a components and parts cooling segment structural representation.
Embodiment
Embodiment 1
Present embodiment provides a kind of intelligent cooling cabinet, comprises cabinet housing, power supply and switch, it is characterized in that: described intelligent cooling cabinet also comprises water tank 1, water tank blowdown valve 2, metal tube blowdown valve 3, radiator fan 4, heat radiator 5, chassis cover panel 6, water pump 9, video card chip brace 10, north bridge chips brace 11, cpu chip brace 12, chassis power supply heating diode brace 13, flow indicator 14, intelligent temperature controller 15, temp probe 16, bending metals pipe 17, metal tube 18;
Wherein: water tank blowdown valve 2 is installed on the water tank 1, metal tube blowdown valve 3 is installed on the metal tube 18, be installed on the heat radiator 5 below the radiator fan 4 corresponding chassis cover panels 6, metal tube 18 is installed on the water pump 9, video card chip brace 10, north bridge chips brace 11, cpu chip brace 12, chassis power supply heating diode brace 13 corresponding respectively being installed on the respective element of computer main board, metal tube 18 is mode and the video card chip brace 10 by tightening successively, north bridge chips brace 11, cpu chip brace 12, chassis power supply heating diode brace 13 connects, flow indicator 14 is installed on the metal tube 18, intelligent temperature controller 15 is connected with temp probe 16 by lead, intelligent temperature controller 15 is connected with radiator fan by lead, bending metals pipe 17 and 18 corresponding connections of metal tube.
Described intelligent cooling cabinet also comprises Cistern valve 7, and Cistern valve 7 is installed on the water tank 1.
Described intelligent cooling cabinet also comprises safety net 8, and safety net 8 is installed between the radiator fan 4 chassis cover panels 6.
Each parts effect and principle:
Water pump---transmission refrigerating fluid circulation makes respectively generate heat components and parts temperature and water tank temperature of cabinet inside synchronous.
The chip brace---be made of two copper sheets up and down, the centre has groove, and two copper sheets connect with the Luo silk, the middle copper tube that clamps, when needing with the conduction of metallic silicon auxiliary temperature.
Flow indicator---when passing through flow indicator, refrigerating fluid shows the refrigerating fluid flowing velocity.
The digital intelligent temperature controller---have the intelligent temperature controller of temp probe, the temperature bound is provided with voluntarily, after setting, the temperature bound after ceiling temperature surpasses set point of temperature, starts the water tank radiator fan, reduce to the temperature aft-fan of stipulating to roll off the production line when water tank temperature and stop, being used as the Push And Release of cabinet top radiator fan by intelligent temperature controller control.
The bending metals pipe---can arbitrarily crooked metal tube.
Metal catheter---transmission refrigerating fluid, metal tube is selected copper tube for use, and it is soft that red copper has matter, and heat build-up is fast, the slow characteristic of dispelling the heat, the temperature with each euthermic chip and heating diode in its collection cabinet is sent in the water tank.Wrap up with flexible plastic tube the metal tube outside, makes its insulation, avoids interior each the components and parts solder joint of physics contact cabinet to cause the consequence of short circuit.Refrigerating fluid is housed in the metal tube, and refrigerating fluid has heat conduction fast, and characteristics such as low corrosion are cheap, are applicable to the transmission of temperature.
Water tank---water tank material aluminum products, aluminium has rapid heat dissipation, and the characteristic that heat build-up is slow is used as main heat radiation, and liquid serves as the temperature conduction medium with distilled water or pure water in the water tank.
Pressure-release valve---anti-Baidu high-temp glue leather material, the colloid of good springiness is made, the likeness in form water bag, being installed in needs pressure release place, interior dress sponge, inside to have mouth to communicate with the external world, pressure increases after fluid temperature rises, sponge shrank after pressure raise, and the air after the contraction is discharged into the external world, and blowdown valve recovered normally after temperature descended.
The intake-outlet of Cistern valve---water tank lowers weight for convenient carrying and annotates Drainage Design.
Big blade is adopted in radiator fan---auxiliary water tank heat radiation, reduces noise, and airflow is had friendly relations, good heat dissipation effect.
Heat radiator---be connected auxiliary heat dissipation with water tank.
Safety net---prevent finger and other article contact fan.
Chassis cover panel---auxiliary heat dissipation.
Water tank material aluminium goods, aluminium has rapid heat dissipation, the characteristic that heat build-up is slow, metal tube and metal bending pipe are selected the red copper material for use, and red copper has heat build-up fast, and the slow characteristic two media that dispels the heat utilizes the water in the water tank to come combination, remove the cost of making alloy from, improve the recycling rate.
Connect each heat generating components by metal tube, outer cup insulate with flexible plastic tube, the inner loop refrigerating fluid, each needs the thermal component temperature to reach water tank to water pump transmission refrigerating fluid with cabinet inside, the inner dress of water tank water, utilization water shows that with refrigerating fluid temperature and water tank in the metal tube temperature is synchronous, and each chip and power pack are not furnished with radiator fan.
The cabinet cooling segment, area of dissipation is big, and the temperature that water tank is responsible for raising is cooled off, radiator fan adopts super-silent design, strengthens fan blade quantity and area, is that prerequisite makes this cabinet quiet to reduce rotation speed of the fan, reduce radiation, economize on electricity, ventilating opening is not stayed in the totally-enclosed design of chassis shell, inner air and outer air does not circulate, farthest reduce dust and radiation, metal tube needs the junction to be connected with screw buckle is straight-through with the bending metals pipe, guarantees no leakage.
Metal tube is connected in the sheet metal on the chip, have the metal tube groove in the middle of two sheet metals, groove is placed metal tube, two sheet metals are tightened with the Luo silk, junction metallic silicon heat conduction, refrigerating fluid is housed in the metal tube, refrigerating fluid in the water pump recycle metal pipe is sent to water tank to the temperature of each heater element, water tank inside is filled with water, after temperature raises, refrigerating fluid and water tank are inner to expand, the inner sponge of blowdown valve after the expansion shrinks pressure release, smaller volume, inner air is discharged into the external world, back blowdown valve sponge reduces to treat to recover temperature normally, there is not the pressure release leakage, simultaneously not to extraneous evaporating liquid, avoided owing to evaporate, the danger of using fewer and fewer, the digital intelligent temperature controller has probe, probe sticks on the sheet metal on the CPU, send real time temperature to the digital intelligent temperature controller, the digital intelligent temperature controller detects water tank temperature, the temperature bound is provided with voluntarily, starts the water tank cooling fan after the temperature bound sets after ceiling temperature surpasses set point of temperature, is stopped by intelligent temperature controller control when water tank temperature is reduced to the set point of temperature temperature aft-fan that rolls off the production line, the cabinet first half is linked to each other by the metal bending pipe with Lower Half, Convenient switch chassis lid and no leakage.Metal tube is connected with screw buckle is straight-through with metal bending pipe junction.Each chip; the heating diode; metal tube; the metal bending pipe; refrigerating fluid; water; water tank; heat radiator; the casing temperature is synchronous up and down; all the heating and heat conducting part all utilizes CPU to burn not dead technical protection; realize that all zero burns; radiator fan belongs to the auxiliary heat dissipation instrument; computer office at ordinary times; mapping; listen song; see a film; when online waited the CPU low consumption of resources, water tank temperature was constant about 35 degree, only just can use the fan auxiliary heat dissipation when the high resource consumptions of CPU such as recreation and overclocking; this cabinet can be by natural wind; the family expenses fan; auxiliary heat dissipations such as air-conditioning, effect is better.
Claims (3)
1, a kind of intelligent cooling cabinet, comprise cabinet housing, power supply and switch, it is characterized in that: described intelligent cooling cabinet also comprises water tank (1), water tank blowdown valve (2), metal tube blowdown valve (3), radiator fan (4), heat radiator (5), chassis cover panel (6), water pump (9), video card chip brace (10), north bridge chips brace (11), cpu chip brace (12), chassis power supply heating diode brace (13), flow indicator (14), intelligent temperature controller (15), temp probe (16), bending metals pipe (17), metal tube (18);
Wherein: water tank blowdown valve (2) is installed on the water tank (1), metal tube blowdown valve (3) is installed on the metal tube (18), be installed in below the corresponding chassis cover panel of radiator fan (4) (6) on the heat radiator (5), metal tube (18) is installed on the water pump (9), video card chip brace (10), north bridge chips brace (11), cpu chip brace (12), chassis power supply heating diode brace (13) is corresponding respectively to be installed on the respective element of computer main board, metal tube (18) is mode and the video card chip brace (10) by tightening successively, north bridge chips brace (11), cpu chip brace (12), chassis power supply heating diode brace (13) connects, flow indicator (14) is installed on the metal tube (18), intelligent temperature controller (15) is connected with temp probe (16) by lead, intelligent temperature controller (15) is connected with radiator fan (4) by lead, and bending metals pipe (17) is connected with metal tube (18) is corresponding.
2, according to the described intelligent cooling cabinet of claim 1, it is characterized in that: described intelligent cooling cabinet also comprises Cistern valve (7), and Cistern valve (7) is installed on the water tank (1).
3, according to the described intelligent cooling cabinet of claim 1, it is characterized in that: described intelligent cooling cabinet also comprises safety net (8), and safety net (8) is installed between radiator fan (4) the chassis cover panel (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202189060U CN201289630Y (en) | 2008-11-05 | 2008-11-05 | Intelligent cool-down cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202189060U CN201289630Y (en) | 2008-11-05 | 2008-11-05 | Intelligent cool-down cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201289630Y true CN201289630Y (en) | 2009-08-12 |
Family
ID=40981311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202189060U Expired - Fee Related CN201289630Y (en) | 2008-11-05 | 2008-11-05 | Intelligent cool-down cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201289630Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103076863A (en) * | 2012-12-13 | 2013-05-01 | 中国航空工业集团公司第六三一研究所 | Board card pressure relieving device for liquid-cooled computer |
| CN106371473A (en) * | 2016-10-20 | 2017-02-01 | 桂林大创科技有限公司 | Controller for heat radiation of power supply |
| WO2018032314A1 (en) * | 2016-08-16 | 2018-02-22 | 陈玮彤 | Computer chassis |
-
2008
- 2008-11-05 CN CNU2008202189060U patent/CN201289630Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103076863A (en) * | 2012-12-13 | 2013-05-01 | 中国航空工业集团公司第六三一研究所 | Board card pressure relieving device for liquid-cooled computer |
| CN103076863B (en) * | 2012-12-13 | 2016-08-17 | 中国航空工业集团公司第六三一研究所 | A kind of liquid cold computer card pressure relief device |
| WO2018032314A1 (en) * | 2016-08-16 | 2018-02-22 | 陈玮彤 | Computer chassis |
| CN106371473A (en) * | 2016-10-20 | 2017-02-01 | 桂林大创科技有限公司 | Controller for heat radiation of power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20101105 |