CN204118057U - A kind of compression joint type IGBT encapsulating structure using heat pipe - Google Patents
A kind of compression joint type IGBT encapsulating structure using heat pipe Download PDFInfo
- Publication number
- CN204118057U CN204118057U CN201420602519.2U CN201420602519U CN204118057U CN 204118057 U CN204118057 U CN 204118057U CN 201420602519 U CN201420602519 U CN 201420602519U CN 204118057 U CN204118057 U CN 204118057U
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- CN
- China
- Prior art keywords
- heat pipe
- end cover
- joint type
- encapsulating structure
- type igbt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000006835 compression Effects 0.000 title claims abstract description 35
- 238000007906 compression Methods 0.000 title claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000004332 silver Substances 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004519 grease Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L2224/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of compression joint type IGBT encapsulating structure using heat pipe, is made up of shell and the multiple sub-unit structures being positioned at enclosure, and multiple subelement is parallel to be arranged; Described sub-unit structure comprises upper end cover, conductive copper sheet, disc spring group, heat pipe, base, silver strip, molybdenum sheet, chip and bottom end cover; Described bottom end cover, chip, molybdenum sheet, silver strip and base set gradually from the bottom up, and described heat pipe upper end inserts upper end cover, through disc spring group, its lower end inserted base; Described conductive copper sheet upper end is between upper end cover and disc spring group, and its lower end is between disc spring group and base.The utility model chips can by available protecting, and simultaneously owing to employing heat pipe, functionally achieve two-side radiation, overall thermal resistance is less; The introducing of heat pipe, although make one side firmly contact, heat dissipation path is still fine, has taken into account chip protection and less thermal resistance.Overall structure has advantages such as realizing compression joint type IGBT short-circuit failure, high reliability.
Description
Technical field
The utility model relates to a kind of encapsulating structure, is specifically related to a kind of compression joint type IGBT encapsulating structure using heat pipe.
Background technology
Igbt (IGBT) has that on-state voltage drop is low, current capacity is large, input impedance is high, fast response time and the simple feature of control, is widely used in industry, information, new forms of energy, medical science, traffic, military affairs and aviation field.Compression joint type IGBT has higher reliability, and be convenient to series connection, and show short circuit failure mode when device failure, therefore it is widely used in the fields such as intelligent grid.
The impact of temperature on device performance is most important, and high temperature not only can affect the electrology characteristic of device, more can have a strong impact on its fatigue life.In device running, temperature can affect the thermal stress of chip internal, this may cause the damage of chip, existing multinomial research proves that the fatigue life of electronic device exponentially declines with the rising of temperature, in device layout process, just must consider thermal design simultaneously.
Existing two kinds of main flow compression joint type IGBT are the product of ABB AB and WESTCODE company respectively, and its internal structure is respectively see patent CN1596472A and US6678163B1.
Publication number is that the patent of invention of CN1596472A discloses a kind of high-power semiconductor module, its structure chips downside and substrate are sintered together, opposite side is crimping structure, and contact with upper end cover eventually through disc spring structure, the use of disc spring structure makes device have the advantage of protect IC, namely unnecessary when pressure assembling force is excessive pressure can be born by the shell of device, stressed of chip institute can be relevant by reduction length with disc spring, but also just because of the existence of disc spring, make the capacity of heat transmission of chip upper side very poor, heat can only be derived by downside substantially, overall thermal resistance is larger.
Publication number is in the structure of the patent of US6678163B1, chip upper and lower sides two sides is crimping structure, until upper and lower end cap, the advantage of this structure is that device can realize two-side radiation, chip upper and lower surface has intimate equal heat to derive, the overall thermal resistance of device is less, but also just because of vertical direction is all hard crimping structure, when device press-fits, chip bears all pressure assembling forces, when pressure assembling force is excessive, chip institute is stressed also increases on an equal basis, and therefore chip just may because of excessive pressure by mechanical damage.
By above analysis, the product of known two companies respectively has advantage, but also respectively has shortcoming, and chip protection cannot take into account with heat conduction.
Utility model content
In order to overcome above-mentioned the deficiencies in the prior art; the utility model provides a kind of compression joint type IGBT encapsulating structure using heat pipe, and this encapsulating structure overall structure is simply compact, and can take into account chip protection; there is better heat dissipation path, realize compression joint type IGBT short-circuit failure, high reliability etc.
To achieve these goals, the utility model takes following scheme:
The utility model provides a kind of compression joint type IGBT encapsulating structure using heat pipe, and described encapsulating structure is made up of shell and the multiple sub-unit structures being positioned at enclosure, and multiple subelement is parallel to be arranged; Described sub-unit structure comprises upper end cover, conductive copper sheet, disc spring group, heat pipe, base, silver strip, molybdenum sheet, chip and bottom end cover; Described bottom end cover, chip, molybdenum sheet, silver strip and base set gradually from the bottom up, and described heat pipe upper end inserts upper end cover, through disc spring group, its lower end inserted base; Described conductive copper sheet upper end is between upper end cover and disc spring group, and its lower end is between disc spring group and base.
Described upper end cover adopts copper material to make, and thickness is 3.0 ~ 6.0mm.
The position that described upper end cover correspondence inserts heat pipe is provided with hole, fills thermal grease conduction in the gap between heat pipe and hole.
The cross section of described conductive copper sheet is rectangle, and its thickness is 0.5 ~ 1.0mm, the area in this cross section by the electric current of leading determine; The side of conductive copper sheet is polygon or arc, is freely compressed under pressure.
Described disc spring group is combined by least one pair of oppositely stacking disc spring, and its compression travel scope should between 30% ~ 75% of its maximum compression stroke.
Described base adopts copper material to make, and its thickness is 2.0 ~ 4.0mm.
Described silver strip is corresponding with chip form with the shape of molybdenum sheet.
The thickness of described silver strip is 0.1 ~ 0.5mm, and the thickness of molybdenum sheet is 1.5 ~ 3.0mm.
Described bottom end cover adopts molybdenum sheet, and thickness is 1.5 ~ 5.0mm.
Compared with prior art, the beneficial effects of the utility model are:
1. overall structure can realize the advantages such as compression joint type IGBT short-circuit failure, high reliability;
Chip can by available protecting, and simultaneously owing to employing heat pipe, although make one side firmly contact, heat dissipation path is still fine, and functionally achieve two-side radiation, overall thermal resistance is less, thus achieves and take into account chip protection and less thermal resistance.
Accompanying drawing explanation
Fig. 1 is the compression joint type IGBT encapsulating structure schematic diagram using heat pipe in the utility model embodiment 1;
Fig. 2 is the A-A cutaway view (not containing disc spring) of structure in Fig. 1 in the utility model embodiment 1;
Fig. 3 is the compression joint type IGBT encapsulating structure explosive view using heat pipe in the utility model embodiment 1;
Fig. 4 is conductive copper sheet structure 1 schematic diagram in the utility model embodiment 1;
Fig. 5 is conductive copper sheet structure 2 schematic diagram in the utility model embodiment 1;
Fig. 6 is the compression joint type IGBT encapsulating structure schematic diagram using heat pipe in the utility model embodiment 2;
Fig. 7 is the B-B cutaway view of structure in Fig. 6 in the utility model embodiment 2;
Fig. 8 is the compression joint type IGBT encapsulating structure schematic diagram (not containing conductive copper sheet) using heat pipe in the utility model embodiment 3;
Fig. 9 is the C-C cutaway view (not containing disc spring) of structure in Fig. 8 in the utility model embodiment 3;
Figure 10 is the compression joint type IGBT encapsulating structure overall schematic using heat pipe in the utility model embodiment;
Wherein, 1-upper end cover, 2-conductive copper sheet, 3-disc spring group, 4-base, 5-silver strip, 6-molybdenum sheet, 7-bottom end cover, 8-chip, 9-heat pipe, 10-thermal grease conduction.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
The utility model provides a kind of compression joint type IGBT encapsulating structure using heat pipe, and described encapsulating structure is made up of shell and the multiple sub-unit structures being positioned at enclosure, and multiple subelement is parallel to be arranged; Described sub-unit structure comprises upper end cover 1, conductive copper sheet 2, disc spring group 3, heat pipe, base 4, silver strip 5, molybdenum sheet 6, chip 8 and bottom end cover 7; Described bottom end cover 7, chip 8, molybdenum sheet 6, silver strip 5 and base 4 set gradually from the bottom up, and described heat pipe upper end inserts upper end cover 1, through disc spring group 3, its lower end inserted base 4; Described conductive copper sheet 2 upper end is between upper end cover 1 and disc spring group 3, and its lower end is between disc spring group 3 and base 4.
Described upper end cover 1 adopts copper material to make, and thickness is 3.0 ~ 6.0mm.
The position that described upper end cover 1 correspondence inserts heat pipe is provided with hole, fills thermal grease conduction 10 in the gap between heat pipe and hole.
The cross section of described conductive copper sheet 2 is rectangle, and its thickness is 0.5 ~ 1.0mm, the area in this cross section by the electric current of leading determine; The side of conductive copper sheet 2 is polygon or arc, is freely compressed under pressure.
Described disc spring group 3 is closed by least one pair of oppositely stacking disc spring group 3 and is formed, and its compression travel scope should between 30% ~ 75% of its maximum compression stroke.
Heat pipe relies on the phase transformation of therein hydraulic fluid to realize the heat transfer element conducted heat, and has following fundamental characteristics:
1, very high thermal conductivity;
Inside heat pipe is mainly by vapour, the liquid phase-change heat transfer of hydraulic fluid, and thermal resistance is very little, therefore has the very high capacity of heat transmission.With Metal Phase ratios such as silver, copper, aluminium, the heat pipe of Unit Weight can transmit the heat of several order of magnitude more.
2, excellent isothermal;
The steam of heat pipe inner chamber is in saturation condition, the pressure of saturated steam is decided by saturation temperature, and it is very little that saturated steam flows to from evaporation section the pressure drop that condensation segment produces, according to the equation in thermodynamics, temperature drop is also very little, and thus heat pipe has excellent isothermal.
Described heat pipe closed at both ends, there is heat-conducting work medium its inside, and described heat-conducting work medium is water or methyl alcohol, for transmitting the heat that chip 8 sends; The operating temperature range of described heat pipe is-40 DEG C ~ 200 DEG C.
Described base 4 adopts copper material to make, and its thickness is 2.0 ~ 4.0mm.
Described silver strip 5 is corresponding with chip 8 shape with the shape of molybdenum sheet.
The thickness of described silver strip 5 is 0.1 ~ 0.5mm, and the thickness of molybdenum sheet 6 is 1.5 ~ 3.0mm.
Described bottom end cover 7 adopts molybdenum sheet 6, and thickness is 1.5 ~ 5.0mm.
Embodiment 1
Device inside has multiple subelement, and a sub-whole unit is laminated construction, and there is one or more chip 8 its inside.Subelement periphery is protected by shell, and under non-operating state, the upper surface of subelement is slightly higher than the upper surface of shell, and representative value is 2 ~ 3mm.
As shown in Fig. 1 ~ 5, IGBT encapsulating structure is bottom end cover 7, chip 8, upper molybdenum sheet 6, silver strip 5 (or aluminium flake), base 4, conductive copper sheet 2 (lower end), heat pipe, disc spring group 3, conductive copper sheet 2 (upper end), upper end cover 1 from bottom to up respectively.
Its chips 8 directly can crimp with bottom end cover 7, also can sinter with bottom end cover 7, the position of the corresponding heat pipe of upper end cover 1 has deep hole in addition, heat pipe upper end is inserted wherein, gap-fill has a certain amount of high efficacy heat conduction grease 10 therebetween, can ensure that disc spring group 3 is had good thermally conductive pathways by between heat pipe during compression and upper end cover 1.Operationally upper end cover 1 is pressed downward contracting, and then compression disc spring, pressure finally reaches chip 8, makes chip 8 can play its electric property under a certain pressure, thus realize the initial object of design compression joint type IGBT, i.e. short circuit failure mode, preferably reliability etc.
In addition; in normal operation; subelement upper surface moves down under the applied pressure effect of radiator institute; until its upper surface flushes with shell upper surface; when radiator is excessive to pressure that device applies; unnecessary pressure can be born by device outer case; Here it is achieves protection mechanism to chip 8; simultaneously because the use of heat pipe; and heat pipe has splendid heat conductivility; this makes chip 8 both sides have good heat dissipation path, can be close to think two-side radiation, namely achieves chip 8 and protects and the taking into account of heat conduction.
Embodiment 2
As shown in Figure 6 and Figure 7, substructure is identical with embodiment 1, distinguish and have through hole at upper end cover 1 and heat pipe correspondence position, heat pipe is from wherein passing, then on radiator, correspondence position has the hole of certain depth, wherein being filled with high efficacy heat conduction grease 10, can ensureing to descend heat pipe by having good thermally conductive pathways between thermal grease conduction 10 and radiator in working order.
Embodiment 3
As shown in Figure 8 and Figure 9, several groove is had bottom base 4, heat pipe can be inlayed wherein, be compressed between base 4 and upper molybdenum sheet 6 simultaneously, thus ensure that heat can reach heat pipe preferably from molybdenum sheet 6, then heat pipe is from the both sides upwards bending of base 4, until in the deep hole of upper end cover 1 correspondence, be filled with high efficacy heat conduction grease 10 in same deep hole.All there is heat pipe in base 4 both sides in figure, also can only have in side.Similarly similar embodiment 2, upper end cover 1 also can have through hole, and heat pipe until the deep hole of correspondence position radiator, is filled with high efficacy heat conduction grease 10 from wherein passing in deep hole.In addition, base 4 guide rod also can the same with the first two embodiment be heat pipe.
The corresponding upper end cover of the laminated construction of a chip 8 in Figure 10, also can the corresponding upper end cover of several laminated construction.
Finally should be noted that: above embodiment is only in order to illustrate that the technical solution of the utility model is not intended to limit; those of ordinary skill in the field still can modify to embodiment of the present utility model with reference to above-described embodiment or equivalent replacement; these do not depart from any amendment of the utility model spirit and scope or equivalent replacement, are all applying within the claims of the present utility model awaited the reply.
Claims (9)
1. use a compression joint type IGBT encapsulating structure for heat pipe, it is characterized in that: described encapsulating structure is made up of shell and the multiple sub-unit structures being positioned at enclosure, multiple subelement is parallel to be arranged; Described sub-unit structure comprises upper end cover, conductive copper sheet, disc spring group, heat pipe, base, silver strip, molybdenum sheet, chip and bottom end cover; Described bottom end cover, chip, molybdenum sheet, silver strip and base set gradually from the bottom up, and described heat pipe upper end inserts upper end cover, through disc spring group, its lower end inserted base; Described conductive copper sheet upper end is between upper end cover and disc spring group, and its lower end is between disc spring group and base.
2. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: described upper end cover adopts copper material to make, and thickness is 3.0 ~ 6.0mm.
3. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: the position that described upper end cover correspondence inserts heat pipe is provided with hole, fills thermal grease conduction in the gap between heat pipe and hole.
4. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: the cross section of described conductive copper sheet is rectangle, and its thickness is 0.5 ~ 1.0mm, the area in this cross section by the electric current of leading determine; The side of conductive copper sheet is polygon or arc, is freely compressed under pressure.
5. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, it is characterized in that: described disc spring group is combined by least one pair of oppositely stacking disc spring, its compression travel scope should between 30% ~ 75% of its maximum compression stroke.
6. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: described base adopts copper material to make, and its thickness is 2.0 ~ 4.0mm.
7. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: described silver strip is corresponding with chip form with the shape of molybdenum sheet.
8. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: the thickness of described silver strip is 0.1 ~ 0.5mm, and the thickness of molybdenum sheet is 1.5 ~ 3.0mm.
9. the compression joint type IGBT encapsulating structure of use heat pipe according to claim 1, is characterized in that: described bottom end cover adopts molybdenum sheet, and thickness is 1.5 ~ 5.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420602519.2U CN204118057U (en) | 2014-10-17 | 2014-10-17 | A kind of compression joint type IGBT encapsulating structure using heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420602519.2U CN204118057U (en) | 2014-10-17 | 2014-10-17 | A kind of compression joint type IGBT encapsulating structure using heat pipe |
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| Publication Number | Publication Date |
|---|---|
| CN204118057U true CN204118057U (en) | 2015-01-21 |
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| CN201420602519.2U Active CN204118057U (en) | 2014-10-17 | 2014-10-17 | A kind of compression joint type IGBT encapsulating structure using heat pipe |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016058554A1 (en) * | 2014-10-17 | 2016-04-21 | 国家电网公司 | Pressure contact igbt packaging structure using heat pipe |
| CN108281406A (en) * | 2017-12-11 | 2018-07-13 | 全球能源互联网研究院有限公司 | A kind of power device packaging structure and its manufacturing method |
| CN108281405A (en) * | 2017-12-11 | 2018-07-13 | 全球能源互联网研究院有限公司 | A kind of power device packaging structure and method |
| CN111146169A (en) * | 2018-11-06 | 2020-05-12 | 株洲中车时代电气股份有限公司 | Conductive disc spring assembly for crimping module |
| CN113834527A (en) * | 2021-09-18 | 2021-12-24 | 重庆大学 | Crimping type power semiconductor structure and internal pressure online measurement method thereof |
-
2014
- 2014-10-17 CN CN201420602519.2U patent/CN204118057U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016058554A1 (en) * | 2014-10-17 | 2016-04-21 | 国家电网公司 | Pressure contact igbt packaging structure using heat pipe |
| CN108281406A (en) * | 2017-12-11 | 2018-07-13 | 全球能源互联网研究院有限公司 | A kind of power device packaging structure and its manufacturing method |
| CN108281405A (en) * | 2017-12-11 | 2018-07-13 | 全球能源互联网研究院有限公司 | A kind of power device packaging structure and method |
| CN108281405B (en) * | 2017-12-11 | 2019-08-27 | 全球能源互联网研究院有限公司 | A kind of power device packaging structure and method |
| CN111146169A (en) * | 2018-11-06 | 2020-05-12 | 株洲中车时代电气股份有限公司 | Conductive disc spring assembly for crimping module |
| CN113834527A (en) * | 2021-09-18 | 2021-12-24 | 重庆大学 | Crimping type power semiconductor structure and internal pressure online measurement method thereof |
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