CN102998493A - Probe unit, circuit board inspection apparatus and method for manufacturing probe unit - Google Patents

Probe unit, circuit board inspection apparatus and method for manufacturing probe unit Download PDF

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Publication number
CN102998493A
CN102998493A CN2012101797816A CN201210179781A CN102998493A CN 102998493 A CN102998493 A CN 102998493A CN 2012101797816 A CN2012101797816 A CN 2012101797816A CN 201210179781 A CN201210179781 A CN 201210179781A CN 102998493 A CN102998493 A CN 102998493A
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CN
China
Prior art keywords
contact unit
hole
probe
leading section
maintaining part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101797816A
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Chinese (zh)
Inventor
堀诚一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hioki EE Corp
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Hioki EE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011124702A external-priority patent/JP2012251873A/en
Priority claimed from JP2011135253A external-priority patent/JP2013003002A/en
Priority claimed from JP2011134795A external-priority patent/JP2013002976A/en
Application filed by Hioki EE Corp filed Critical Hioki EE Corp
Publication of CN102998493A publication Critical patent/CN102998493A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

The invention discloses a probe unit capable of preventing the short circuit or the electricity leakage while completing the detection successfully, which comprises a main body part 11 and a detector probe 12. The main body part 11 is provided with a first support part 31 with a first through hole 31a and a second support part 32 with a second through hole 32a. The detector probe 12 is supported by the main body part 11 while the front end 21 and the bottom end 22 of the detector probe 12 are respectively inserted in the first through hole 31a and the second through hole 32a. The central part 23 thereof is bendable during detection.

Description

Contact unit, circuit board inspection apparatus and contact unit manufacture method
Technical field
The present invention relates to by probe tip being inserted the contact unit that consists of in the through hole of pair of support parts, being had a plurality of probes and keep the contact unit of the maintaining part of each probe, the contact unit manufacture method that possesses the circuit board inspection apparatus of this contact unit and make this contact unit.
Background technology
As employed contact units such as check circuit substrates, known have a disclosed contact unit in the Japanese Patent Laid-Open 2000-292439 communique (vertically-acting type test card).This contact unit constitutes a plurality of probes of being included in central portion and having the section of buckling, be formed with the substrate of the wiring pattern that contacts with the connecting portion of each probe by the anisotropic conductive body and have the upside supporting substrates that is formed with respectively a plurality of through holes and the probe supporting member of downside supporting substrates.In this contact unit, with each probe under the state of the through hole of the through hole that connects the upside supporting substrates and downside supporting substrates, utilize bonding agent to be fixed on the upside supporting substrates.In this contact unit, stipulate the arrangement of popping one's head in according to the arrangement of the conductive pattern of detected object substrate, so that each probe can detect simultaneously to each conductive pattern.
The prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2000-292439 communique (the 3rd page, the 1st figure)
Summary of the invention
Yet there are the following problems for above-mentioned contact unit.That is to say, this contact unit has the labyrinth that utilizes a plurality of members (being upside supporting substrates and downside supporting substrates in above-mentioned example) in the mode that can buckle the probe that has the section of buckling at central portion to be supported.In addition, the electrode (at the probe relative position of above-mentioned example for the anisotropic conductive body) that is used for input/output signal because the structure of this contact unit is when detecting contacts with the connecting portion of probe, and when non-detection so that their separate, therefore, may come in contact the faults such as bad at this electric contact place.On the other hand, along with the densification of circuit substrate, need to make the further miniaturization of conductive pattern and spacing is narrowed down, in order to tackle this situation, require to realize the miniaturization of contact unit.Yet, because existing contact unit has aforesaid labyrinth, therefore, be difficult to realize its miniaturization, be difficult to the densification of reply circuit substrate.In addition, namely allow to realize miniaturization, but because miniaturization needs superb process technology, therefore, cause that thus the manufacturing cost of contact unit improves, and the fault such as aforesaid loose contact also may easily occur along with miniaturization.
On the other hand, in above-mentioned contact unit, because will utilize bonding agent to be fixed on the upside supporting substrates under the state of each probe in the through hole of the through hole that runs through the upside supporting substrates and downside supporting substrates, so also have the operation of taking out probe when changing probe and the comparatively complicated problem of the operation that probe is installed.
In order to address the above problem, the inventor has developed contact unit 102 as shown in Figure 9.This contact unit 102 constitutes and comprises the 1st support 131 and the 2nd support 132 that is formed probe tip 112 and the supporting probe tip 112 of probe body 120 by metal.This contact unit 102 has following structure: namely, and keep insulation between other adjacent probe tip 112, central portion 123 in probe tip 112 forms insulation course 124, utilizes this insulation course 124 that central portion 123 is formed diameter greater than the 1st through hole 131a of the 1st support 131.When this contact unit 102 of assembling, make probe tip 112 insert the 2nd through hole 132a of the 2nd support 132 and the 1st through hole 131a of the 1st support 131, and make leading section 121 outstanding from the 1st support 131, then, make battery lead plate 113 and the 2nd support 132 butts and fixing.Thus, probe tip 112 utilizes the 1st support 131 and the 2nd support 132 to keep.In this case, form diameter greater than the end of the central portion 123 of the 1st through hole 131a, namely be formed at the edge part butt of the 1st through hole 131a of the end of insulation course 124 of central portion 123 and the 1st supporting substrates 131, limit thus probe tip 112 and come off from the 1st through hole 131a.Like this, in this contact unit 102, use bonding agent to fix the operation of probe tip 112 because can omit, therefore, can easily carry out taking-up operation and the installation exercise of probe tip 112.
Yet, for the above-mentioned contact unit 102 that the applicant has developed, the improved problem of following needs is arranged.That is to say, in this contact unit 102, only be formed with insulation course 124 at central portion 123.Therefore, the surface by the formed probe body 120 of metal of the leading section 121 of probe tip 112 (metal surface) becomes the state that exposes.On the other hand, when the terminal that comes with probe tip 112 on the testing circuit substrate, terminal or the scolding tin that is attached on the terminal can by probe tip 112 scrapings, produce metal fillings (cutting swarf), and this metal fillings tend to be attached on the leading section 121 of probe tip 112.In this case, in this contact unit 102, in order to tackle the densification in circuit substrate, the interval of each probe tip 112 can be limited very narrow.Therefore, the leading section 121 that the metal covering on the adjacent probe tip 112 exposes can be electrically connected by accompanying metal fillings each other, may be short-circuited or leak thus.In addition, the inventor finds that the cutting swarf (scolding tin bits) of scolding tin accompanying on the leading section 121 of the probe tip 112 that metal covering exposes is easy to be attached on the metal covering of leading section 121.In this case, when detecting, when leading section 121 is slided with respect to the 1st support 131, the scolding tin bits that are attached on the leading section 121 are brought in the 1st through hole 131a, because these scolding tin bits can hinder the slip of leading section 121, also may cause being difficult to successfully detect.
The present invention finishes just in view of the above problems, fundamental purpose be to provide a kind of can capable of preventing short circuit or leakage and can the realizing contact unit and the circuit board inspection apparatus that detect smoothly.In addition, other fundamental purpose is to provide a kind of manufacturing cost that can suppress to improve and break down and realize contact unit, circuit board inspection apparatus and the contact unit manufacture method of miniaturization.
The technical scheme that the technical solution problem adopts
The described contact unit in the 1st aspect about the invention of reaching above-mentioned purpose, comprise main part and probe tip, described main part has the 1st tabular support that is formed with the 1st through hole and reaches the 2nd tabular support that relatively configures and be formed with the 2nd through hole with the 1st support, described probe tip is supported by described main part under state in described the 1st through hole and described the 2nd through hole is inserted respectively in its leading section and bottom, its central portion between described the 1st support and described the 2nd support constitutes can be crooked when detecting, and so that the diameter of this central portion forms the 1st insulation course greater than the thickness of the diameter of described the 1st through hole at the outer peripheral face of this central portion, part on the surface of the described leading section of described probe tip, namely except with position that the detected object thing contacts the front end area of predesignating so that the diameter of this front end area forms the 2nd insulation course less than the thickness of the diameter of described the 1st through hole.
In addition, the described contact unit in the 2nd aspect about invention, be invention the 1st aspect in the described contact unit, outer peripheral face and described front end area at described central portion form described the 2nd insulation course continuously, described the 1st insulation course is formed on the top of described the 2nd insulation course that is formed at described central portion as the upper strata.
About the described contact unit in the 3rd aspect of invention, be invention the 1st aspect in the described contact unit, the described leading section of described probe tip forms the identical right cylinder of thickness, with the whole outer peripheral face regulation of described leading section as described front end area.
About the described contact unit in the 4th aspect of invention, be invention the 2nd aspect in the described contact unit, the described leading section of described probe tip forms the identical right cylinder of thickness, with the whole outer peripheral face regulation of described leading section as described front end area.
The described contact unit in the 5th aspect about invention, be invention the 1st aspect in the described contact unit, consist of described probe tip, so that described leading section has along with towards front end and the minor diameter that diameter diminishes, with the outer peripheral face regulation of the part except this minor diameter of described leading section as described front end area.
And, the described contact unit in the 6th aspect about invention, be the invention the 2nd aspect the record contact unit in, consist of described probe tip, so that described leading section has along with towards front end and the minor diameter that diameter diminishes, with the outer peripheral face regulation of the part except this minor diameter of described leading section as described front end area.
The described circuit board inspection apparatus in the 7th aspect about invention comprises: each described contact unit in the 1st to the 6th aspect of invention; And inspection section, this inspection section carries out electric-examination to this circuit substrate and looks into according to the electric signal of the described probe tip institute input and output by the described contact unit that contacts with circuit substrate as the detected object thing.
The described contact unit in the 8th aspect about invention, the maintaining part that has a plurality of probes and keep this each probe, described maintaining part is made of the tabular body with through hole, described probe is made of linear or bar-shaped electric conductor, described electric conductor inserts in the described through hole so that leading section is outstanding from a surface of described maintaining part, and can move and keeping holding it on the described maintaining part by the resilient material that is filled in the described through hole under the state of insulation with other described electric conductor along the central shaft of this through hole.
About the described contact unit in the 9th aspect of invention, be that described probe is made of the coating wire in the described contact unit of the 8th invention of invention.
About the described contact unit in the 10th aspect of invention, be invention the 8th aspect in the described contact unit, in 1 described through hole, insert a plurality of described probes.
About the described contact unit in the 11st aspect of invention, be invention the 9th aspect in the described contact unit, in 1 described through hole, insert a plurality of described probes.
About the described contact unit in the 12nd aspect of invention, be invention the 10th aspect in the described contact unit, described a plurality of probes are being inserted in 1 described through hole under the state that reverses.
About the described contact unit in the 13rd aspect of invention, be invention the 11st aspect in the described contact unit, described a plurality of probes are being inserted in 1 described through hole under the state that reverses.
The described circuit board inspection apparatus in the 14th aspect about invention has: each described contact unit in the 8th to the 13rd aspect of invention; And inspection section, this inspection section carries out electric-examination to this circuit substrate and looks into according to the electric signal of the described probe tip institute input and output by the described contact unit that contacts with circuit substrate as the detected object thing.
The manufacture method of the described contact unit in the 15th aspect about invention, this contact unit manufacture method manufacturing has a plurality of probes, and the contact unit that keeps the maintaining part of this each probe, form through hole to make described maintaining part at tabular body, this electric conductor is inserted in the described through hole, so that play as the leading section of the linear or bar-shaped electric conductor of the effect of described probe outstanding from a surface of described maintaining part, in order to move along the central shaft of described through hole and to keep under the state of insulation at the described electric conductor with other, by resilient material this electric conductor is remained in this maintaining part, in this through hole, fill this resilient material, thereby make described contact unit.
The described contact unit in the 16th aspect about invention, have a plurality of probes, and the maintaining part that keeps this each probe, described maintaining part is made of the tabular body with through hole, described probe comprises wire and front end components, described wire is inserted described through hole and keeps being fixed in described maintaining part under the state of insulation at leading section, described front end components forms column, cone-shaped body, any shape and this front end components in sphere and the ellipsoid have electric conductivity and elasticity, described front end components is fixed on the described wire so that the bottom with state that the end face of described leading section is electrically connected under outstanding from a surface of described maintaining part
About the described contact unit in the 17th aspect of invention, be in the described contact unit of the 16th invention of invention, become on described end face and a described surface under same the state, described wire is fixed in described maintaining part.
About the described contact unit in the 18th aspect of invention, be that described front end components is by having electric conductivity and flexible macromolecular material forms in the described contact unit of the 16th invention of invention.
About the described contact unit in the 19th aspect of invention, be that described front end components is by having electric conductivity and flexible macromolecular material forms in the described contact unit of the 17th invention of invention.
About the described contact unit in the 20th aspect of invention, be invention the 16th aspect in the described contact unit, described front end components forms column.
About the described contact unit in the 21st aspect of invention, be invention the 17th aspect in the described contact unit, described front end components forms column.
About the described contact unit in the 22nd aspect of invention, be invention the 18th aspect in the described contact unit, described front end components forms column.
About the described contact unit in the 23rd aspect of invention, be invention the 19th aspect in the described contact unit, described front end components forms column.
The described circuit board inspection apparatus in the 24th aspect about invention has: each described contact unit in the 16th to the 23rd aspect of invention; And inspection section, this inspection section carries out electric-examination to this circuit substrate and looks into according to the electric signal of the described probe tip institute input and output by the described contact unit that contacts with circuit substrate as the detected object thing.
The described contact unit manufacture method in the 25th aspect about invention, this contact unit manufacture method manufacturing has a plurality of probes, and the contact unit that keeps the maintaining part of this each probe, form through hole to make described maintaining part at tabular body, the leading section that consists of the wire of described probe is inserted in the described through hole, under the state that keeps insulation, this wire is fixed in described maintaining part, to form column, cone-shaped body, under the bottom of the front end components of the described probe of formation of any shape in sphere and the ellipsoid and the state that the end face of described leading section is electrically connected, this front end components is fixed on the described wire so that its surface from described maintaining part gives prominence to, thereby make described contact unit.
The invention effect
The described contact unit in the 1st aspect according to invention, form the 2nd insulation course by the front end area at the leading section of probe tip, even the metal fillings that produces when detecting is attached on the leading section of probe tip, also can positively prevent the situation that the leading section of adjacent probe tip is electrically connected by this metal fillings each other.Therefore, according to this contact unit, can prevent positively that leading section because of adjacent probe tip is electrically connected the situation that is short-circuited or leaks of causing each other.In addition, according to this contact unit, because the front end area at leading section is formed with the 2nd insulation course and the metal surface of probe tip is not exposed, so even the cutting swarf (scolding tin bits) of the scolding tin that produces when detecting is attached to the front end area of leading section, can prevent positively that also these scolding tin bits are attached to the situation of front end area.Therefore, according to this contact unit, the scolding tin bits that can positively prevent from being attached to the front end area of leading section are brought in the 1st through hole of the 1st support and these scolding tin bits hinder the situation of the slip of leading section when detecting, and its result can realize detecting smoothly.
According to the described contact unit in the 2nd aspect of invention, form continuously the 2nd insulation course at the outer peripheral face of the central portion of probe tip and the front end area of leading section, form the 1st insulation course as the upper strata on the top of the 2nd insulation course that is formed at central portion.Therefore, according to this contact unit, because the part that expose from the outer peripheral face of central portion on the surface (metal covering) that does not have probe tip between the front end area of leading section, therefore, can more positively prevent the situation that the leading section of adjacent probe tip is electrically connected by metal fillings each other, and can more positively prevent the scolding tin bits to be attached to the front end area of leading section and be brought into situation in the 1st through hole of the 1st support.
The described contact unit in the 3rd and the 4th aspect according to invention, form the identical right cylinder of thickness by the leading section with probe tip, the whole outer peripheral face of leading section is stipulated as front end area to form the 2nd insulation course, thus can be enough the 2nd insulation course cover the whole surface portion of the leading section except end face, the state that does not expose to become the metal covering that makes probe tip.Therefore, according to this contact unit, the metal covering that exposes can be suppressed to minimum, its result can more positively prevent the situation that the leading section of adjacent probe tip is electrically connected by metal fillings each other, can prevent more positively that simultaneously the scolding tin bits are attached to the front end area of leading section and are brought into situation in the 1st through hole of the 1st support.
The described contact unit in the 5th and the 6th aspect according to invention, by leading section being constituted the minor diameter that has along with diminishing towards front end, for example as the semisphere that is shaped as of the terminal of the circuit substrate of detected object thing, perhaps the surface of the surface of circuit substrate and terminal is same, at this moment, can positively make leading section (minor diameter) and these termination contact.
According to the described circuit board inspection apparatus in the 7th aspect of invention, by having above-mentioned contact unit, can realize thus the identical effect of effect that has with above-mentioned contact unit.
The invention the 8th aspect described contact unit and the invention the described contact unit manufacture method in the 15th aspect in, form through hole to make maintaining part at tabular body, electric conductor inserted in the through hole so that play as the leading section of the linear or bar-shaped electric conductor of the effect of probe outstanding from a surface of maintaining part, in order to move along the central shaft of through hole and by resilient material electric conductor to be remained on the maintaining part, filling elastic material in the through hole, thus contact unit made.In a word, this contact unit constitutes and comprises the maintaining part that is made of 1 tabular body and the probe that is made of linear or bar-shaped electric conductor.Therefore, according to this contact unit and contact unit manufacture method, because the contact unit in the past than the type of the probe that supports the probe shape with a plurality of members in the mode that can buckle, contact unit of the present invention is the less and simple structure of the kind of textural element, so can simplify the operation when making, the result can fully reduce manufacturing cost.Therefore, according to this contact unit and contact unit manufacture method, owing to simplifying the structure, so tackle in can easily making the contact unit miniaturization as the highdensity circuit substrate of detected object thing, can fully reduce its manufacturing cost simultaneously.In addition, according to this contact unit and contact unit manufacture method, will be repeatedly so that be used for the in the past structure that the electrode of input/output signal contacts and separates with the connecting portion of probe when each the detection because be different from, the part that the present invention need to repeatedly contact and separate when not having so each detection, therefore, can positively prevent from this part the fault that causes because of loose contact occuring.
The described contact unit in the 9th aspect according to invention, because by consisting of probe with the coating wire, and the coating wire itself has insulativity, therefore, positively keep each other each coating wire to be remained on the maintaining part under the state of insulation at each coating wire.In addition, by consisting of probe with the coating wire, this coating wire directly can be connected with the inspection section of circuit board inspection apparatus.In a word, can be used as same as before the lead-in wire that is connected usefulness with inspection section etc. as the coating wire of probe.Therefore, than the structure of using the connection different from the electric conductor of conduct probe with lead-in wire, the present invention is not owing to needing therefore, can further reduce the manufacturing cost of contact unit with connecting with the lead-in wire that is connected usefulness as the electric conductor of popping one's head in.
According to the described contact unit in the 10th and the 11st aspect of invention, because a plurality of probes are inserted in 1 through hole, therefore, than the structure of 1 probe being inserted in 1 through hole, can dwindle each probe interval (spacing) each other.Therefore, according to this contact unit, can fully reduce manufacturing cost, tackle simultaneously in more highdensity circuit substrate and can make more miniaturization of contact unit.
According to the described contact unit in the 12nd and the 13rd aspect of invention, because a plurality of probes under the twisting states are inserted in 1 through hole, therefore, can further dwindle a plurality of probes interval (spacing) each other of inserting in 1 through hole.Therefore, according to this contact unit, can fully reduce manufacturing cost, tackle simultaneously in more highdensity circuit substrate and can make more miniaturization of contact unit.
According to the described circuit board inspection apparatus in the 14th aspect of invention, by having above-mentioned contact unit, can realize thus the identical effect of effect that has with above-mentioned contact unit.
The invention the 16th aspect described contact unit, and in the described contact unit manufacture method in the 25th aspect of invention, form through hole to make maintaining part at tabular body, make the leading section of the wire that consists of probe insert through hole, state with insulation is fixed in maintaining part with wire, to form column, cone-shaped body, in sphere and the ellipsoid under the bottom of the front end components of the formation of any shape probe and the state that the end face of wire is electrically connected, front end components is fixed on the wire so that this front end components is outstanding from a surface of maintaining part, thereby makes contact unit.In a word, this contact unit constitutes and comprises the maintaining part that is made of 1 tabular body and the probe that is made of wire and front end components.Therefore, according to this contact unit and contact unit manufacture method, because the contact unit in the past than the type of the probe that supports the probe shape with a plurality of members in the mode that can buckle, contact unit of the present invention is the less and simple structure of the kind of textural element, so can simplify the operation when making, the result can fully reduce manufacturing cost.Therefore, according to this contact unit and contact unit manufacture method, owing to simplifying the structure, so tackle in can easily making the contact unit miniaturization as the highdensity circuit substrate of detected object thing, can fully reduce its manufacturing cost simultaneously.In addition, according to this contact unit and contact unit manufacture method, will be repeatedly so that be used for the in the past structure that the electrode of input/output signal contacts and separates with the connecting portion of probe when each the detection because be different from, the part that the present invention need to repeatedly contact and separate when not having so each detection, therefore, can positively prevent from this part the fault that causes because of loose contact occuring.
Invention the 17th aspect in the described contact unit, become on a surface of the end face of wire and maintaining part under same the state, wire is fixed in maintaining part.Therefore, according to this contact unit, by the identical front end components of shape (size) being fixed in the end face of each wire, thus can be really and easily make front end components outstanding overhang (length till from a surface to the leading section of front end components) is unified into the high-precision contact unit of identical length from a surface of maintaining part.
In addition, the described contact unit in the 18th and the 19th aspect according to invention, because by with having electric conductivity and flexible macromolecular material forms front end components, thereby easily macromolecular material is processed, therefore, can be really and easily form the front end components with desirable shape corresponding with the shape of detected object thing, the result can be really and is easily made the contact unit that adapts with shape as the terminal of the substrate of detected object thing or conductive pattern.
In addition, the described contact unit in the 20th to the 23rd aspect according to invention, by front end components is formed column, therefore, be different from the structure with the front end components that forms sphere for example or cone-shaped body, no matter along the deformation quantity of central axis direction (inspection direction) how, the contact area with the detected object thing can both be maintained certain value (perhaps, substantially certain value).Thereby, can under the state that will maintain with the contact area of detected object thing certain value (perhaps, substantially certain value), produce large elastic deformation along central axis direction.Therefore, for each front end components, even the distance between the leading section of each front end components and the detected object thing differs widely, also can produce large elastic deformation by making front end components, make contact area maintain certain value (perhaps, substantially certain value), simultaneously the leading section of each front end components is positively contacted with the detected object thing.
According to the described circuit board inspection apparatus in the 24th aspect of invention, by having above-mentioned contact unit, can realize thus the identical effect of effect that has with above-mentioned contact unit.
Description of drawings
Fig. 1 is the structural drawing that the structure of circuit board inspection apparatus 1 is shown.
Fig. 2 is the structural drawing that the structure of contact unit 2 is shown.
Fig. 3 is the sectional view of contact unit 2.
Fig. 4 is the sectional view of probe tip 12.
Fig. 5 is the 1st key diagram of the assemble method of explanation contact unit 2.
Fig. 6 is the 2nd key diagram of the assemble method of explanation contact unit 2.
Fig. 7 is the sectional view of contact unit 2a.
Fig. 8 is the sectional view of contact unit 2b.
Fig. 9 is the structural drawing that the structure of contact unit 102 is shown.
Figure 10 is the structural drawing that the structure of circuit board inspection apparatus 701 is shown.
Figure 11 is the structural drawing that the structure of contact unit 702 is shown.
Figure 12 is the sectional view of contact unit 702.
Figure 13 is the vertical view from 712 the leading section 712a unilateral observation contact unit 702 of popping one's head in.
Figure 14 is the 1st key diagram of the manufacture method of explanation contact unit 702.
Figure 15 is the 2nd key diagram of the manufacture method of explanation contact unit 702.
Figure 16 is the 3rd key diagram of the manufacture method of explanation contact unit 702.
Figure 17 is the sectional view that the structure of contact unit 732 is shown.
Figure 18 is the sectional view that the structure of contact unit 742 is shown.
Figure 19 is the sectional view that the structure of contact unit 752 is shown.
Figure 20 is the sectional view that the structure of contact unit 762 is shown.
Figure 21 is the sectional view that the structure of contact unit 772 is shown.
Figure 22 is the structural drawing that the structure of circuit board inspection apparatus 801 is shown.
Figure 23 is the structural drawing that the structure of contact unit 802 is shown.
Figure 24 is the sectional view of contact unit 802.
Figure 25 is the vertical view from 812 the front end head 822 unilateral observation contact units 802 of popping one's head in.
Figure 26 is the 1st key diagram of the manufacture method of explanation contact unit 802.
Figure 27 is the 2nd key diagram of the manufacture method of explanation contact unit 802.
Figure 28 is the 3rd key diagram of the manufacture method of explanation contact unit 802.
Figure 29 is the 4th key diagram of the manufacture method of explanation contact unit 802.
Figure 30 is the 5th key diagram of the manufacture method of explanation contact unit 802.
Figure 31 is the stereographic map that the structure of front end head 832 is shown.
Figure 32 is the stereographic map that the structure of front end head 842 is shown.
Figure 33 is the stereographic map that the structure of front end head 852 is shown.
Figure 34 is the stereographic map that the structure of front end head 862 is shown.
Figure 35 is the stereographic map that the structure of front end head 872 is shown.
Figure 36 is the stereographic map that the structure of front end head 882 is shown.
Label declaration
1 circuit board inspection apparatus
2,2a, the 2b contact unit
5 inspection sections
6 control parts
11 main parts
12,12a, the 12b probe tip
21 leading sections
The 21b end face
The 21c outer peripheral face
21d, 21e minor diameter
22 bottoms
23 central portions
24 the 1st insulation courses
25 the 2nd insulation courses
31 the 1st supports
31a the 1st through hole
32 the 2nd supports
32a the 2nd through hole
41,42 support plates
41a, the 42a through hole
100 circuit substrates
101 terminals
The A front end area
D1, D4, D5 diameter
701 circuit board inspection apparatus
702,732,742 contact units
705 inspection sections
711 maintaining parts
The 711a lower surface
The 711c through hole
712 probes
The 712a leading section
713 elastic adhesives
721 coating wires
The 721a conductor portion
The 721b insulating protective film
The 721c leading section
The 701A central shaft
801 circuit board inspection apparatus
802 contact units
805 inspection sections
811 maintaining parts
The 811a lower surface
The 811c through hole
812 probes
813 bonding agents
814 conductive adhesives
The 821c leading section
The 821d end face
822,832～882 front end heads
The 822a bottom
Embodiment
Below, as the 1st embodiment, describe with reference to the embodiment of accompanying drawing to contact unit involved in the present invention and circuit board inspection apparatus.
At first, the structure of circuit board inspection apparatus 1 described.Circuit board inspection apparatus 1 shown in Figure 1 constitutes and can carry out galvanoscopic structure to the circuit substrate 100 as an example of detected object thing.Particularly, circuit board inspection apparatus 1 as shown in Figure 1, constitute have contact unit 2, travel mechanism 3, circuit substrate support 4, inspection section 5 and control part 6.
As an example of contact unit 2 as shown in Figure 2, constitute have main part 11, probe tip 12 and battery lead plate 13.
Main part 11 constitutes and has the 1st support 31, the 2nd support 32 and connecting portion 33 as shown in Figure 2.The 1st support 31 is to utilize to have dielectric resin material etc. and form tabular.In addition, as shown in Figure 3, be formed with a plurality of the 1st through hole 31a at the 1st support 31.In this case, the leading section 21 of probe tip described later 12 forms the 1st through hole 31a so that can insert, and have the size that the central portion 23 that can limit probe tip 12 inserts, namely the diameter D1 of the 1st through hole 31a is greater than the diameter D4 of leading section 21 and less than the diameter (with reference to Fig. 5) of the diameter D5 of central portion 23.
The 2nd support 32 constitutes and has support plate 41,42 as shown in Figure 3.Support plate 41 is to utilize to have dielectric resin material etc. and form tabular.In addition, support plate 41 as shown in Figure 2, utilizes connecting portion 33 to be connected with the 1st support 31 with the relatively configuration with the state of the 1st support 31 parallel (perhaps substantially parallel).In addition, as shown in Figure 3, be formed with a plurality of through hole 41a at support 41.In this case, form through hole 41a, have the size that the central portion 23 of probe tip 12 can insert, namely the diameter D2 of this through hole 41a is greater than the diameter D5 (with reference to Fig. 5) of central portion 23.
In addition, as shown in Figure 3, be formed with patchhole 41c, the 41d that can insert fixed pin 43 at support plate 41.In this case, patchhole 41c uses following the time: namely, as shown in Figure 5, when assembling contact unit 2, when making probe tip 12 insert among the 1st through hole 31a, through hole 41a and the through hole 42a described later, become under the coaxial state (the 1st state) at the central shaft of each through hole 31a, 41a, 42a support plate 41,42 is carried out position alignment.In addition, patchhole 41d uses following the time: namely, as shown in Figure 6, under the state (the 2nd state) that the central shaft of each through hole 41a, 42a staggers, support plate 41,42 is carried out position alignment, so that insert probe tip 12 among each through hole 31a, 41a, the 42a bend (elastic deformation).
As shown in Figure 3, support plate 42 be utilize have dielectric resin material etc. form tabular, and with this support plate 42 can be configured in respect to the mode that support plate 41 slides the top of support plate 41.In addition, as shown in Figure 5, be formed on a plurality of through hole 42a that are communicated with each through hole 41a of support plate 41 respectively under the 1st above-mentioned state at support plate 42.In this case, the diameter D3 of through hole 42a forms for example identical with the diameter D2 of through hole 41a diameter.In addition, utilize through hole 41a, 42a to consist of the 2nd through hole 32a (with reference to Fig. 3).
In addition, as shown in Figure 3, be formed with patchhole 42c, the 42d that can insert above-mentioned fixed pin 43 at support plate 42.In this case, patchhole 42c is formed on the position (with reference to Fig. 5) that is communicated with the patchhole 41c of support plate 41 under above-mentioned the 1st state, patchhole 42d is formed on the position (with reference to Fig. 6) that is communicated with the patchhole 41d of support plate 41 under above-mentioned the 2nd state.
As an example of probe tip 12, constitute and comprise that forming can elastically-deformable bar-shaped probe body 20 (with reference to Fig. 3,4) by the metal material with electric conductivity (such as beallon, SKH (high speed tool steel) and wolfram steel etc.).In addition, probe tip 12 (probe body 20) as shown in Figure 4, its leading section 21 forms the identical right cylinder of thickness, the front end of its bottom 22 forms sharp shape.
In addition, as shown in Figure 4, outer peripheral face at the central portion 23 of the zone of predesignating of the leading section 21 of probe tip 12 (probe body 20) (below, this zone is also referred to as " front end area A ") and probe tip 12 forms the 2nd insulation course 25.In this contact unit 2, as shown in Figure 4, with the Zone Full the end face 21b of the leading section 21 that contacts with the terminal 101 of circuit substrate 100 when detecting among the surperficial 21a (end face 21b shown in Figure 4 and outer peripheral face 21c) of leading section 21, form the Zone Full regulation of outer peripheral face 21c of columniform leading section 21 as front end area A.
In this case, so that the diameter of the probe tip 12 among the front end area A (the diameter D4 of leading section 21) forms the 2nd insulation course 25 less than the thickness of the diameter D1 of the 1st through hole 31a.In addition, an example as the 2nd insulation course 25, at the outer peripheral face of the central portion 23 of probe tip 12 (probe body 20) and the front end area A of leading section 21, the coating material (for example, fluorine same clan resin, polyurethane, polyester and the polyimide etc. such as teflon (registered trademark)) that has insulativity by coating forms described the 2nd insulation course 25.
In addition, as shown in Figure 4, on the top of the 2nd insulation course 25 that is formed at central portion 23, overlapping and form (stacked) as the 1st insulation course 24 on upper strata.In this case, for example by the above-mentioned coating material of coating, so that the diameter D5 of central portion 23 forms the 1st insulation course 24 greater than the thickness of the diameter D1 of the 1st through hole 31a.
In addition, as shown in Figure 3, in the 1st through hole 31a of leading section 21 insertion supports 31 and under the state among the 2nd through hole 32a of bottom 22 insertions the 2nd support 32, utilize main part 11 to support probe tip 12.
As shown in Figure 3, battery lead plate 13 is to utilize to have dielectric resin material etc. and form tabular, and this battery lead plate 13 is configured in the top of the 2nd support 32 (support plate 42) of main part 11, is fixed on the installing plate (not shown) of travel mechanism 3 with main part 11.In addition, the contact site of on battery lead plate 13 and each bottom 22 each probe tip 12, as shown in Figure 3, embed the terminal 13a with electric conductivity, 13a is connected respectively the cable 13b that is electrically connected with inspection section 5 for probe tip 12 with this each terminal.
Consist of travel mechanism 3 in mode that can static probe unit 2, according to the control of control part 6, make contact unit 2 towards approaching and moving away from the direction of circuit substrate support 4.Circuit substrate support 4 consists of in mode that can holding circuit substrate 100.Inspection section 5 is based on the control of control part 6, according to the electric signal of probe tip 12 inputs by contact unit 2, circuit substrate 100 carried out the electric-examination that testing for continuity or test for short-circuit etc. predetermine look into.Control part 6 moves the contact unit 2 that is fixed in travel mechanism 3 by control travel mechanism 3.In addition, control part 6 control inspection sections 5 carry out electric-examination to circuit substrate 100 and look into.
Then, the assemble method about contact unit 2 describes with reference to accompanying drawing.
At first, as shown in Figure 5, support plate 42 is slided, so that each central shaft of the through hole 42a of the through hole 41a of the 1st through hole 31a of the 1st support 31, support plate 41 and support plate 42 becomes coaxial state (the 1st state).At this moment, the patchhole 41c with support plate 41 is communicated with the patchhole 42c of support plate 42.Then, fixed pin 43 is inserted into patchhole 42c, 41c.Thus, support plate 41 and support plate 42 are maintained the 1st state.
Then, as shown in Figure 5, the order according to the 1st through hole 31a of the through hole 41a of each through hole 42a of support plate 42, support plate 41 and the 1st support 31 is inserted probe tip 12.In this case, in this contact unit 2, because the diameter D4 of the leading section 21 of probe tip 12 is less than the diameter D 1 of the 1st through hole 31a, therefore, only leading section 21 (part of leading section 21) is inserted among the 1st through hole 31a and lower side-prominent from the 1st support 31.In addition, because the diameter D1 of the 1st through hole 31a is less than the diameter D5 of the central portion 23 of probe tip 12, therefore, the end of central portion 23, namely be formed at the end of the 1st insulation course 24 of central portion 23 and the edge part butt of the 1st through hole 31a in the 1st support 31, limit thus probe tip 12 and come off from the 1st through hole 31a.
Then, be through with probe tip 12 is inserted into each through hole 31a, 41a, 42a after, extract fixed pin 43 from patchhole 41c, 42c.Then, as shown in Figure 6, support plate 42 is slided, until become the 2nd state that the central shaft of each through hole 41a, 42a staggers.At this moment because the slip of support plate 42 and so that bottom 22 1 lateral deviations of probe tip 12 to glide direction, the result makes central portion 23 bend slightly (elastic deformation) as shown in Figure 6.In addition, by sliding to the 2nd position, the patchhole 41d of support plate 41 is communicated with the patchhole 42d of support plate 42.Then, fixed pin 43 is inserted into patchhole 42d, 41d.Thus, make support plate 41 and support plate 42 maintain the 2nd state, make the central portion 23 of probe tip 12 maintain crooked slightly state.
Then, at the top configured electrodes plate 13 of the 2nd support 32 (support plate 42), upward the 2nd support 32 (main part 11) is tightened with battery lead plate 13 at the installing plate (not shown) of travel mechanism 3.Finished thus the assembling of contact unit 2.
Then, illustrate that with reference to accompanying drawing 1 pair of circuit substrate of use circuit board inspection apparatus 100 carries out galvanoscopic method.
At first, permanent circuit substrate 100 on circuit substrate support 4.Then, make circuit board inspection apparatus 1 work.At this moment, control part 6 is by control travel mechanism 3, so that contact unit 2 moves towards the direction near circuit substrate 100.Then, control part 6 makes the end face 21b of the leading section 21 on each probe tip 12 of contact unit 2 make contact unit 2 move predetermined distance (with reference to Fig. 3) from the position that contacts with the terminal 101 of circuit substrate 100 again.In this case, in this contact unit 2, make in advance the central portion 23 of probe tip 12 crooked slightly.Therefore, when making leading section 21 towards the 2nd support 32 1 side shifting of probe tip 12 along with moving of contact unit 2, the amount of bow of central portion 23 changes (increase), and the elastic force of utilizing simultaneously the variation because of amount of bow to cause makes the front end of bottom 22 contact reliably with the terminal 13a of battery lead plate 13.
Here, in this contact unit 2, at the outer peripheral face 21c of leading section 21 (the front end area A except end face 21b on the surface of leading section 21), form the 2nd insulation course 25.Therefore, even when detecting, produce metal fillings because of probe tip 12 cutting terminals 101, and this metal fillings is attached on the leading section 21 of probe tip 12, also can positively prevent the situation that the leading section 21 of adjacent probe tip 12 is electrically connected by accompanying metal fillings each other.In addition, owing to forming the 2nd insulation course 25 so that the metal covering of probe body 20 does not expose at the outer peripheral face 21c of leading section 21 (front end area A), therefore,, the scolding tin that adheres on the terminal 101 produces cutting swarf (scolding tin bits) even being cut, and the scolding tin bits are attached on the leading section 21 of probe tip 2, can prevent positively that also these scolding tin bits are attached to the situation of outer peripheral face 21c.
Then, inspection section 5 carries out electric-examination according to the electric signal by probe tip 12 inputs to circuit substrate 100 and looks into based on the control of control part 6.Then, after the inspection that is through with to circuit substrate 100, control part 6 control travel mechanisms 3 are so that contact unit 2 moves towards the direction of leaving circuit substrate 100.Then, when the circuit substrate 100 to other carries out electric-examination and looks into, repeatedly carry out above-mentioned operation.
Thus, according to this contact unit 2 and circuit board inspection apparatus 1, form the 2nd insulation course 25 by the outer peripheral face 21c as front end area A at the leading section 21 of probe tip 2, even the metal fillings that produces when detecting is attached on the leading section 21 of probe tip 12, also can positively prevent the situation that the leading section 21 of adjacent probe tip 12 is electrically connected by this metal fillings each other.Therefore, according to this contact unit 2 and circuit board inspection apparatus 1, can prevent positively that leading section 21 because of adjacent probe tip 12 from the situation that is short-circuited or leaks of causing occuring to be electrically connected each other.In addition, according to this contact unit 2 and circuit board inspection apparatus 1, because the outer peripheral face 21c at leading section 21 forms the 2nd insulation course 25 so that the metal covering of probe body 20 does not expose, therefore, even the cutting swarf (scolding tin bits) of the scolding tin that produces when detecting is attached on the leading section 21 of probe tip 12, can prevent positively that also these scolding tin bits are attached to the situation on the outer peripheral face 21c.Therefore, according to this contact unit 2 and circuit board inspection apparatus 1, the scolding tin bits that can positively prevent from being attached to leading section 21 are brought in the 1st through hole 31a and these scolding tin bits hinder the situation of the slip of leading section 21 when detecting, and its result can realize detecting smoothly.
In addition, in this contact unit 2 and circuit board inspection apparatus 1, form continuously the 2nd insulation course 25 at the outer peripheral face of the central portion 23 of probe tip 12 and the front end area A of leading section 21, form the 1st insulation course 24 as the upper strata on the top of the 2nd insulation course 25 that is formed at central portion 23.Therefore, according to this contact unit 2 and circuit board inspection apparatus 1, because the part that expose from the outer peripheral face of central portion 23 on the surface (metal covering) that does not have the body 20 of popping one's head between the front end area A of leading section 21, therefore, can more positively prevent the situation that the leading section 21 of adjacent probe tip 12 is electrically connected by metal fillings each other, and it is upper and be brought into situation in the 1st through hole 31a to prevent more positively that the scolding tin bits are attached to the outer peripheral face 21c of leading section 21.
And, according to this contact unit 2 and circuit board inspection apparatus 1, the leading section 21 of probe tip 12 is formed the identical right cylinder of thickness, with the Zone Full regulation of the outer peripheral face 21c of leading section 21 as front end area A to form the 2nd insulation course 25, thus, cover the whole surperficial 21a part of the leading section 21 except end face 21b with the 2nd insulation course 25, the state that does not expose with the metal covering of realizing probe body 20.Therefore, according to this contact unit 2 and circuit board inspection apparatus 1, the metal covering that exposes can be suppressed to minimum, its result can more positively prevent the situation that the leading section 21 of adjacent probe tip 12 is electrically connected by metal fillings each other, can prevent more positively that simultaneously the scolding tin bits are attached to the outer peripheral face 21c of leading section 21 upper and be brought into situation in the 1st through hole 31a.
In addition, contact unit and circuit board inspection apparatus are not limited to said structure.For example, form the identical cylindrical structure example of thickness although more than narrated the leading section 21 of probe tip 12, but as shown in Figure 7, also have to adopt to have along with towards front end and the probe tip 12a of the minor diameter 21d that diameter diminishes consists of contact unit 2a, also can have this contact unit 2a and come the forming circuit base board checking device.In addition, in Fig. 7 and Fig. 8 described later, have the member of identical function for the textural element with above-mentioned contact unit 2, indicate identical label and the repetitive description thereof will be omitted.
In addition, as shown in Figure 8, can adopt minor diameter 21e along with towards front end and the probe tip 12b that diameter diminishes and this front end forms sharp shape consists of contact unit 2b, also can have this contact unit 2b and come the forming circuit base board checking device.In the structure of these contact units 2a, 2b, the outer peripheral face 21c regulation of the part except minor diameter 21d of leading section 21 as front end area A, is formed the 2nd insulation course 25 at this front end area A.According to said structure, because leading section 21 has minor diameter 21d, 21e, therefore, when the surface of the surface that is shaped as semisphere (with reference to Fig. 7) or circuit substrate 100 of terminal 101 and terminal 101 is same (with reference to Fig. 8), leading section 21 ( minor diameter 21d, 21e) is contacted with these terminals 101.
In addition, although more than narrated the example that coating material is applied to form the 1st insulation course 24 and the 2nd insulation course 25, but also can adopt following structure: namely, to be installed to by the cylinder that insulating material forms the leading section 21 of probe body 20 or central portion 23 (probe body 20 is inserted in the cylinders), with this insulating material as the 1st insulation course 24 or the 2nd insulation course 25.
Below, as the 2nd embodiment, describe with reference to the embodiment of accompanying drawing to contact unit involved in the present invention, circuit board inspection apparatus and contact unit manufacture method.
At first, the structure of circuit board inspection apparatus 701 described.Circuit board inspection apparatus 701 shown in Figure 10 constitutes and can carry out galvanoscopic structure to the circuit substrate 100 as an example of detected object thing.Particularly, circuit board inspection apparatus 701 as shown in figure 10, constitute have contact unit 702, travel mechanism 703, circuit substrate support 704, inspection section 705 and control part 706.
As an example of contact unit, contact unit 702 constitutes and has maintaining part 711 and a plurality of probe 712 as shown in figure 11.
Maintaining part 711 consists of with 1 tabular body as shown in figure 11, is used for keeping probe 712.In this case, as an example of maintaining part 711, the resin of non-conductive to have (insulativity) consists of.In addition, as shown in figure 12, form the through hole 711c that can insert the coating wire 721 that consists of probe 712 in maintaining part 711.
Probe consists of with coating wire 721 (example of wire or bar-shaped electric conductor) 712 shown in Figure 12,13.Consist of coating wire 721, to form insulating protective film 721b in (part except end face 721d) around the conductor portion 721a.As an example of this probe 712, use D outer diameter 702 is that the magnetic wire about 50 μ m～500 μ m is used as coating wire 721.In addition, probe 712 as shown in figure 12, leading section 712a is inserted among the through hole 711c of maintaining part 711 so that its (being the leading section 721c of coating wire 721) from a surface (face of the downside Figure 12 of maintaining part 711, the below is also referred to as " lower surface 711a ") outstanding, and this leading section 712a is by being maintained on the maintaining part 711 as the elastic adhesive 713 that is filled into the resilient material among this through hole 711c.In this case, can come at random regulation leading section 712a from the outstanding outstanding length of lower surface 711a according to the D outer diameter 702 of coating wire 721 or material etc.In this contact unit 702, as an example, be about 10 times to 100 times of D outer diameter 702 with this outstanding length legislations.In addition, Figure 11,12 and Figure 15 described later～21 in, for the outstanding length of leading section 712a and the length ratio of other parts, illustrate with the ratio different from reality.
As elastic adhesive 713, can adopt the various bonding agents with following character: namely, under original state, have flowability, apply after (supply) having under the flexible state and solidify.Particularly, in this contact unit 702, as an example, can adopt natural rubber class bonding agent, synthetic rubber class bonding agent, silicon class bonding agent and sex change silicon class bonding agent etc. to be used as elastic adhesive 713.
In this contact unit 702, as shown in figure 12,712 are maintained on the maintaining part 711 by elastic adhesive 713 because pop one's head in, therefore, when the terminal 101 as the circuit substrate 100 of detected object thing is detected, leading section 712a (the leading section 721c of coating wire 721) is applied power, and this moment is by making elastic adhesive 713 that elastic deformations occur, and can make probe 712 in direction (above-below direction among Figure 12) movement along the central shaft 701A of through hole 711c.In addition, when detecting, utilize elastically-deformable elastic force along with elastic adhesive 713 with leading section 712a press terminal 101, make thus leading section 712a positively contact and be electrically connected with terminal 101.In addition; 712 consist of by the coating wire 721 that is insulated by insulating protective film 721b because pop one's head in; this coating wire 721 is had dielectric maintaining part 711 and is kept; therefore, make probe 712 become the state that insulate with other probe 712 (other coating wire 721) maintenance.
Consist of travel mechanism 703 in mode that can static probe unit 702, according to the control of control part 706, make contact unit 702 towards approaching and moving away from the direction of circuit substrate support 704.Circuit substrate support 704 consists of in mode that can holding circuit substrate 100.Inspection section 705 is based on the control of control part 706, according to the electric signal of each 712 input and output of popping one's head in by contact unit 702, circuit substrate 100 carried out the electric-examination that testing for continuity or test for short-circuit etc. predetermine look into.Control part 706 moves the contact unit 702 that is fixed in travel mechanism 703 by control travel mechanism 703.In addition, control part 706 control inspection sections 705 carry out electric-examination to circuit substrate 100 and look into.
Then, the manufacture method about contact unit 702 describes with reference to accompanying drawing.
At first, as shown in figure 14, for with the tabular body that has dielectric resin and consist of, with form through hole 711c as the identical Pareto diagram of the Pareto diagram (with reference to Figure 11) of the terminal 101 of the circuit substrate 100 of detected object thing, to make maintaining part 711.In this case, when the D outer diameter 702 of the coating wire 721 that consists of probe 712 for example is 50 μ m, the inside diameter D 701 of through hole 711c is defined as (that is, about 2 of D outer diameter 702 times) (with reference to Figure 12) about 100 μ m.
Then, as shown in figure 15, making above-mentioned D outer diameter 702 is that the coating wire 721 of 50 μ m inserts among each through hole 711c of maintaining parts 711.At this moment, such as Figure 15 and shown in Figure 16, make coating wire 721 insert through hole 711c, so that the leading section 721c of coating wire 721 is outstanding from the lower surface 711a of maintaining part 711.
Then, when when being through with coating wire 721 being inserted all through hole 711c, as shown in figure 16, the another side (face of the upside among Figure 16 in maintaining part 711, the below is also referred to as " upper surface 711b ") through hole 711c edge part (namely, around the coating wire 721 among the insertion through hole 711c) coating (supply) elastic adhesive 713 (as an example, being silicon class bonding agent).Then, lower surface 711a one side from maintaining part 711 attracts.At this moment, as shown in figure 12, the elastic adhesive 713 that is coated on the upper surface 711b is inhaled in the inner peripheral surface and the gap between the coating wire 721 of through hole 711c, so that this gap is filled.
Then, solidify (drying) afterwards at elastic adhesive 713, carry out smear metal processing or attrition process by the leading section 721c to each coating wire 721, so that unanimously become predetermined length from the outstanding length of outstanding each leading section 721c of the lower surface 711a of maintaining part 711.In this case, when forming oxide film at the end face 721d of leading section 712a or when end face 721d adheres to the fragment of insulating protective film 721b or dirt, by cut or attrition process they being removed.
Then, the end face 721d of the leading section 721c on the coating wire 721 is carried out plating (for example, gold-plated processing), thereby form (low-resistance) metal protective film with electric conductivity at end face 721d.Thus, finish contact unit 702.
In this case, this contact unit 702 constitutes and comprises the maintaining part 711 that is made of 1 tabular body and the probe 712 that is made of coating wire 721.Therefore, than the contact unit in the past of the type of the probe that supports the probe shape with a plurality of members in the mode that can buckle, the less and simple structure of the kind that contact unit 702 of the present invention is textural elements.In addition, because structure is comparatively simple, therefore as mentioned above, the operation during manufacturing is also comparatively simple, thereby can reduce manufacturing cost.
Then, illustrate that with reference to accompanying drawing 701 pairs of circuit substrates of use circuit board inspection apparatus 100 carry out galvanoscopic method.
At first, contact unit 702 is fixed in the travel mechanism 703.Then, permanent circuit substrate 100 on circuit substrate support 704.Then, make circuit board inspection apparatus 701 work.At this moment, control part 706 is by control travel mechanism 703, so that contact unit 702 is mobile towards the direction (downward direction among Figure 11) near circuit substrate 100.Then, when the leading section 712a in each probe 712 of contact unit 702 contacts with the terminal 101 of circuit substrate 100, control part 706 is controlled travel mechanisms 703, contact unit 702 is applied downwards pre-determined big or small load, and contact unit 702 is further moved down.
At this moment, be applied on the contact unit 702 load to each the probe 712 on, the load that disperses is pressed the terminal 101 of circuit substrate 100.Here, in this contact unit 702, probe 712 (consisting of the coating wire 721 of probe 712) is maintained on the maintaining part 711 by elastic adhesive 713.Therefore, in this contact unit 702, when the reacting force of the pressing force that when detecting terminal 101 is applied is applied on each probe 712, keep the elastic adhesive 713 of probe 712 that elastic deformations occur, allow thus the central shaft 701A of the through hole 711c of probe 712 on the maintaining part 711 to move.Therefore, for each probe 712, even the leading section 712a of each probe 712 is different from the distance between the terminal 101, also can elastic deformation occur by making elastic adhesive 713, thereby the leading section 712a of each probe 712 is positively contacted with terminal 101.
Then, inspection section 705 carries out electric-examination according to the electric signal by 712 input and output of popping one's head in to circuit substrate 100 and looks into based on the control of control part 706.Then, after the inspection that is through with to circuit substrate 100, control part 706 control travel mechanisms 703 are so that contact unit 702 moves towards the direction of leaving circuit substrate 100.Then, when the circuit substrate 100 to other carries out electric-examination and looks into, repeatedly carry out above-mentioned operation.
Like this, at this contact unit 702, in circuit board inspection apparatus 701 and the contact unit manufacture method, form through hole 711c to make maintaining part 711 at tabular body, coating wire 721 is inserted among the through hole 711c so that play as the leading section 721c of the coating wire 721 of the effect of probe 712 outstanding from the lower surface 711a of maintaining part 711, elastic adhesive 713 is filled among the through hole 711c, so that coating wire 721 is remained on the maintaining part 711 by elastic adhesive 713 in the mode that can move along the central shaft 701A of through hole 711c, make thus contact unit.In a word, this contact unit 702 constitutes and comprises the maintaining part 711 that is made of 1 tabular body and the probe 712 that is made of coating wire 721.Therefore, according to this contact unit 702, circuit board inspection apparatus 701 and contact unit manufacture method, because the contact unit in the past than the type of the probe that supports the probe shape with a plurality of members in the mode that can buckle, less and the simple structure of the kind that contact unit 702 of the present invention is textural elements, so can simplify the operation when making, the result can fully reduce manufacturing cost.Therefore, according to this contact unit 702, circuit board inspection apparatus 701 and contact unit manufacture method, owing to simplifying the structure, can easily make contact unit 702 miniaturizations so tackle in highdensity circuit substrate 100, can fully reduce its manufacturing cost simultaneously.In addition, according to this contact unit 702, circuit board inspection apparatus 701 and contact unit manufacture method, will be repeatedly so that be used for the in the past structure that the electrode of input/output signal contacts and separates with the connecting portion of probe when each the detection because be different from, the part that the present invention need to repeatedly contact and separate when not having so each detection, therefore, can positively prevent from this part the fault that causes because of loose contact occuring.
In addition, according to this contact unit 702 and circuit board inspection apparatus 701, because by consist of probe 712 with coating wire 721, and coating wire 721 itself has insulativity, therefore, positively make each coating wire 721 keep each other under the state of insulation each coating wire 721 being remained on the maintaining part 711.In addition, by consist of probe 712 with coating wire 721, this coating wire 721 directly can be connected with inspection section 705.In a word, can be used as same as before the lead-in wire that is connected usefulness with inspection section 705 as probe 712 coating wire 721.Therefore, than the structure of using the connection different from the electric conductor of conduct probe 712 with lead-in wire, therefore the present invention, can further reduce the manufacturing cost of contact unit 702 owing to not needing the electric conductor as probe 712 is connected with the lead-in wire that is connected usefulness.
Next, contact unit shown in Figure 17 732 is described.In addition, in the following description, for the textural element identical with above-mentioned contact unit 702, indicate identical label, and the repetitive description thereof will be omitted.As another example of contact unit, contact unit 732 constitutes and has maintaining part 711 and probe 712 as shown in figure 17.In this case, in the through hole 711c of maintaining part 711, insert 2 coating wires 721 that consist of respectively 2 (examples of " a plurality of ") probe 712.In addition, insert each coating wire 721 among the through hole 711c, under the state that can move along the central shaft 701A of through hole 711c and keep mutually insulating with other coating wire, be maintained on the maintaining part 711 by the elastic adhesive 713 that is filled among the through hole 711c.In addition, the quantity of inserting the probe 712 among 1 through hole 711c is not limited to 2, can be defined as a plurality of arbitrarily.
According to this contact unit 732, because a plurality of probes 712 are inserted among 1 through hole 711c, therefore, than the structure that 1 probe 712 is inserted among 1 through hole 711c, can dwindle each probe 712 interval (spacing) each other.Therefore, according to this contact unit 732, can fully reduce manufacturing cost, tackle simultaneously in more highdensity circuit substrate 100 and can make more miniaturization of contact unit 732.
Next, contact unit shown in Figure 180 742 is described.In addition, in the following description, for the textural element identical with above-mentioned contact unit 702, indicate identical label, and the repetitive description thereof will be omitted.As another example of contact unit, contact unit 742 constitutes and has maintaining part 711 and probe 712 as shown in figure 18.In this case, in the through hole 711c of maintaining part 711, insert 2 coating wires 721 that consist of respectively 2 (examples of " a plurality of ") probe 712, each coating wire 721 can move along the central shaft 701A of through hole 711c and keep being maintained on the maintaining part 711 by the elastic adhesive 713 that is filled among the through hole 711c under the state of insulation with other coating wire.In addition, as shown in figure 18, each probe 712 (inserting each coating wire 721 among 1 through hole 711c) are being inserted among the through hole 711c under the state that reverses.
According to this contact unit 742, because a plurality of probes 712 under the twisting states are inserted among 1 through hole 711c, so can further dwindle a plurality of probes 712 interval (spacing) each other of inserting among 1 through hole 711c.Therefore, according to this contact unit 742, can fully reduce manufacturing cost, tackle simultaneously in more highdensity circuit substrate 100 and can make more miniaturization of contact unit 742.
In addition, contact unit and circuit board inspection apparatus are not limited to said structure.For example, adopt as the coating wire 721 that forms the conductor of wire in the example of above narration, but also can adopt the structure that forms bar-shaped conductor, replace coating wire 721.
In addition; more than narrate the part except end face 721d that consists of the coating wire 721 of probe 712 and be insulated the topology example (with reference to Figure 12) that diaphragm 721b covers; but; as shown in figure 19; the probe 712 that coating wire 721 after can adopting insulating protective film 721b by the part (part except end face 721d) of the outer peripheral face of leading section 721c to be removed consists of consists of contact unit 752, also can adopt this contact unit 752 to come the forming circuit base board checking device.
In addition, as shown in figure 20, can adopt by leading section 721c be formed tip-like (along with towards front end and tapered shape) the probe 712 that consists of of coating wire 721, consist of contact unit 762, also can adopt this contact unit 762 to come the forming circuit base board checking device.In addition, as shown in figure 21, can adopt by leading section 721c and be formed the probe 712 that hemispheric coating wire 721 consists of, consist of contact unit 772, also can adopt this contact unit 772 to come the forming circuit base board checking device.
Below, as the 3rd embodiment, describe with reference to the embodiment of accompanying drawing to contact unit involved in the present invention, circuit board inspection apparatus and contact unit manufacture method.
At first, the structure of circuit board inspection apparatus 801 described.Circuit board inspection apparatus 801 shown in Figure 22 constitutes and can carry out galvanoscopic structure to the circuit substrate 100 as an example of detected object thing.Particularly, circuit board inspection apparatus 801 as shown in figure 22, constitute have contact unit 802, travel mechanism 803, circuit substrate support 804, inspection section 805 and control part 806.
Contact unit 802 constitutes and has maintaining part 811 and a plurality of probe 812 as shown in figure 23.
Maintaining part 811 consists of with 1 tabular body as shown in figure 23, is used for keeping probe 812.In this case, as an example of maintaining part 811, the resin of non-conductive to have (insulativity) consists of.In addition, as shown in figure 24, form the through hole 811c of the leading section 821c that can insert the coating wire 821 that consists of probe 812 in maintaining part 811.This contact unit 802 as described later, the leading section 821c of coating wire 821 that utilizes 813 pairs of bonding agents to insert the through hole 811c of maintaining part 811 carries out bonding, to be fixed in the interior perimeter surface of through hole 811c, utilize thus maintaining part 811 812 (the coating wires 821) that keep popping one's head in.
Probe constitutes and has as the coating wire 821 of an example of wire and as the front end head 822 of an example of front end components 812 shown in Figure 24,25.Periphery at conductor portion 821a forms insulating protective film 821b to consist of coating wire 821.As an example of this probe 812, use D outer diameter 802 is that the magnetic wire about 50 μ m～500 μ m is used as coating wire 821.In addition, coating wire 821 as shown in figure 24, leading section 821c is inserted among the through hole 811c of maintaining part 811, (be the surface of the downside of Figure 24 at the end face 821d of leading section 821c and a surface of maintaining part 811, the below is also referred to as " lower surface 811a ") become under same the state, utilize bonding agent 813 that this coating wire 821 is fixed in maintaining part 811 (leading section 821c is embedded in the maintaining part 811).
In this case; because utilizing insulating protective film 821b, coating wire 821 has insulativity; and leading section 821c is embedded in to have in the dielectric maintaining part 811, and therefore, each probe 812 maintained portion 811 under the state that keeps mutually each other insulation keeps.
Front end head 822 has electric conductivity and elasticity, shown in Figure 24,25, forms it into cylindrical (example of the arbitrary shape in sphere, ellipsoid, column and the cone-shaped body).In this case, front end head 822 forms to have electric conductivity and flexible macromolecular material (for example conducting rubber).In addition, as shown in figure 24, front end head 822 forms the minor diameter that its D outer diameter 803 is slightly less than the D outer diameter 802 of coating wire 821 (for example for the external diameter of the conductor portion 821a same degree of coating wire 821).In addition, as shown in figure 24, front end head 822 is fixed on the coating wire 821, so that outstanding from the lower surface 811a of maintaining part 811 under bottom 822a and state that the end face 821d of the leading section 821c of coating wire 821 is electrically connected.
In this case, because front end head 822 has electric conductivity and elasticity, when the terminal 101 as the circuit substrate 100 of detected object thing is detected, utilize the elastic deformation of front end head 822 to make the leading section 822b press terminal 101 of front end head 822, thus, the leading section 822b of front end head 822 positively is electrically connected with terminal 101.
Consist of travel mechanism 803 in mode that can static probe unit 802, according to the control of control part 806, make contact unit 802 towards approaching and moving away from the direction of circuit substrate support 804.Circuit substrate support 804 consists of in mode that can holding circuit substrate 100.Inspection section 805 is based on the control of control part 806, according to the electric signal of each 812 input and output of popping one's head in by contact unit 802, circuit substrate 100 carried out the electric-examination that testing for continuity or test for short-circuit etc. predetermine look into.Control part 806 moves the contact unit 802 that is fixed in travel mechanism 803 by control travel mechanism 803.In addition, control part 806 control inspection sections 805 carry out electric-examination to circuit substrate 100 and look into.
Then, the manufacture method about contact unit 802 describes with reference to accompanying drawing.
At first, as shown in figure 26, for with the tabular body that has dielectric resin and consist of, with form through hole 811c as the identical Pareto diagram of the Pareto diagram (with reference to Figure 23) of the terminal 101 of the circuit substrate 100 of detected object thing, to make maintaining part 811.In this case, for example when the D outer diameter 802 of the coating wire 821 that consists of probe 812 is 50 μ m, then stipulate the inside diameter D 801 of through hole 811c so that produce about the 1 μ m～5 μ m therebetween gap (with reference to Figure 24) of (that is about 2%～10% the length that, is equivalent to D outer diameter 802).
Then, as shown in figure 27, making above-mentioned D outer diameter 802 is that the coating wire 821 of 50 μ m inserts among each through hole 811c of maintaining parts 811.At this moment, such as Figure 27 and shown in Figure 28, coating wire 821 is inserted among the through hole 811c, so that the leading section 821c of coating wire 821 is slightly outstanding from the lower surface 811a of maintaining part 811.
Then, when when being through with coating wire 821 being inserted all through hole 811c, as shown in figure 28, the another side (face of the upside among Figure 28 in maintaining part 811, the below is also referred to as " upper surface 811b ") edge part (that is, insert coating wire 821 among the through hole 811c around) coating (supply) bonding agent 813 of through hole 811c.Then, lower surface 811a one side from maintaining part 811 attracts.At this moment, as shown in figure 29, the bonding agent 813 that is coated on the upper surface 811b is inhaled in the inner peripheral surface and the gap between the coating wire 821 of through hole 811c, so that this gap is filled.
Then, after this bonding agent 813 solidifies (drying), as shown in figure 29, will cut off from the leading section 821c of the outstanding coating wire 821 of the lower surface 811a of maintaining part 811.Then, grind so that the end face 821d of lower surface 811a and leading section 821c becomes same.Thus, become at the lower surface 811a of the end face 821d of leading section 821c and maintaining part 811 under same the state, and with respect under the state of maintaining part 811 for insulation, be fixed in maintaining part 811.
Then, front end head 822 is fixed on the coating wire 821.Particularly, as shown in figure 30, coating electrically conductive bonding agent 814 on the 822a of the bottom of front end head 822 for example.Then, bottom 822a is contacted so that both are electrically connected with end face 821d.Then, keep the contact condition of bottom 822a and end face 821d until till the conductive adhesive curing.Thus, front end head 822 is fixed on the coating wire 821, so that outstanding from the lower surface 811a of maintaining part 811 under bottom 822a and state that the end face 821d of the leading section 821c of coating wire 821 is electrically connected.The below by front end head 822 is fixed on each coating wire 821, thereby finishes contact unit 802 too.
In this case, this contact unit 802 constitutes and comprises the maintaining part 811 that is made of 1 tabular body and the probe 812 that is made of coating wire 821 and front end head 822.Therefore, than the contact unit in the past of the type of the probe that supports the probe shape with a plurality of members in the mode that can buckle, the less and simple structure of the kind that contact unit 802 of the present invention is textural elements.In addition, because structure is comparatively simple, therefore as mentioned above, the operation during manufacturing is also comparatively simple, thereby can reduce manufacturing cost.Therefore, because the structure of this contact unit 802 is comparatively simple, can easily makes contact unit 802 miniaturizations so tackle in highdensity circuit substrate 100, and can fully reduce the manufacturing cost of this contact unit 802.In addition, in this contact unit 802, will be repeatedly so that be used for the in the past structure that the electrode of input/output signal contacts and separates with the connecting portion of probe when each the detection because be different from, the part that the present invention need to repeatedly make its contact and separate when not having so each detection, therefore, can positively prevent from this part the fault that causes because of loose contact occuring.
In addition, in this contact unit 802, become at the lower surface 811a of the end face 821d of coating wire 821 and maintaining part 811 under same the state, coating wire 821 is fixed in maintaining part 811, front end head 822 is fixed in the end face 821d of this coating wire 821.Therefore, by the identical front end head 822 of solid shape (size) on the end face 821d of each coating wire 821, thus can be so that be unified into identical length from the overhang (length till the leading section 822b from lower surface 811a to front end head 822) of the outstanding front end head 822 of the lower surface 811a of maintaining part 811.
Then, illustrate that with reference to accompanying drawing 801 pairs of circuit substrates of use circuit board inspection apparatus 100 carry out galvanoscopic method.
At first, contact unit 802 is fixed in the travel mechanism 803.Then, permanent circuit substrate 100 on circuit substrate support 804.Then, make circuit board inspection apparatus 801 work.At this moment, control part 806 is by control travel mechanism 803, so that contact unit 802 is mobile towards the direction (downward direction among Figure 23) near circuit substrate 100.Then, when the leading section 822b of the front end head 822 in each probe 812 of contact unit 802 contacts with the terminal 101 of circuit substrate 100, control part 806 control travel mechanisms 803, pre-determined big or small load so that contact unit 802 is applied downwards, contact unit 802 is further moved down.
At this moment, be applied on the contact unit 802 load to each the probe 812 on, the load that disperses is pressed the terminal 101 of circuit substrate 100.In this case, elastic deformation (compression set) occurs in the leading section 822b of the front end head 822 of formation probe 812 along the detection side to (above-below direction).
Here, for the front end head 822 that for example forms sphere or cone-shaped body, according to the size along the deformation quantity of central axis direction (detection side to), changing with the contact area of terminal 101, (deformation quantity is larger, then contact area changes greatly, deformation quantity is less, and then contact area changes less).Differently therewith be, because the front end head 822 that adopts in this contact unit 802 is formed right cylinder, therefore, no matter along the deformation quantity of central axis direction how, contact area with terminal 101 can both be maintained certain value (perhaps, substantially certain value).That is to say, can under the state that will maintain with the contact area of terminal 101 certain value (perhaps, substantially certain value), produce large elastic deformation along central axis direction.Therefore, for each front end head 822, even the distance between the leading section 822b of each front end head 822 and the terminal 101 differs widely, also can produce large elastic deformation by making front end head 822, make contact area maintain certain value (perhaps, substantially certain value), simultaneously the leading section 822b of each front end head 822 is positively contacted with terminal 101.
Then, inspection section 805 carries out electric-examination according to the electric signal by 812 input and output of popping one's head in to circuit substrate 100 and looks into based on the control of control part 806.Then, after the inspection that is through with to circuit substrate 100, control part 806 control travel mechanisms 803 are so that contact unit 802 moves towards the direction of leaving circuit substrate 100.Then, when the circuit substrate 100 to other carries out electric-examination and looks into, repeatedly carry out above-mentioned operation.
Like this, in this contact unit 802, circuit board inspection apparatus 801 and contact unit manufacture method, form through hole 811c to make maintaining part 811 at tabular body, the leading section 821c that consists of the coating wire 821 of probe 812 is inserted among the through hole 811c to be fixed in maintaining part 811, under the bottom 822a of the cylindrical front end head 822 that consists of probe 812 and state that end face 821d is electrically connected, front end head 822 is fixed on the coating wire 821 so that it is outstanding from lower surface 811a, thereby makes contact unit 802.That is to say, this contact unit 802 constitutes and comprises the maintaining part 811 that is made of 1 tabular body and the probe 812 that is made of coating wire 821 and front end head 822.Therefore, according to this contact unit 802, circuit board inspection apparatus 801 and contact unit manufacture method, because the contact unit in the past than the type of the probe that supports the probe shape with a plurality of members in the mode that can buckle, less and the simple structure of the kind that contact unit 802 of the present invention is textural elements, so can simplify the operation when making, the result can fully reduce manufacturing cost.Therefore, according to this contact unit 802, circuit board inspection apparatus 801 and contact unit manufacture method, owing to simplifying the structure, can easily make contact unit 802 miniaturizations so tackle in highdensity circuit substrate 100, can fully reduce its manufacturing cost simultaneously.In addition, according to this contact unit 802, circuit board inspection apparatus 801 and contact unit manufacture method, will be repeatedly so that be used for the in the past structure that the electrode of input/output signal contacts and separates with the connecting portion of probe when each the detection because be different from, the part that the present invention need to repeatedly contact and separate when not having so each detection, therefore, can positively prevent from this part the fault that causes because of loose contact occuring.
In addition, in this contact unit 802 and circuit board inspection apparatus 801, become at the lower surface 811a of the end face 821d of coating wire 821 and maintaining part 811 under same the state, coating wire 821 is fixed in maintaining part 811.Therefore, according to this contact unit 802 and circuit board inspection apparatus 801, by the identical front end head 822 of solid shape (size) on the end face 821d of each coating wire 821, thus can be really and easily make a kind of high-precision contact unit 802, in this contact unit 802, can be so that be unified into identical length from the overhang (length till the leading section 822b from lower surface 811a to front end head 822) of the outstanding front end head 822 of the lower surface 811a of maintaining part 811.
In addition, according to this contact unit 802 and circuit board inspection apparatus 801, because by with having electric conductivity and flexible macromolecular material forms front end head 822, easily macromolecular material is processed, therefore, can be really and easily form the front end head 822 with desirable shape corresponding with the shape of detected object thing, the result can be really and is easily made the contact unit 802 that adapts with shape as the terminal 101 of the substrate of detected object thing or conductive pattern.
And, according to this contact unit 802 and circuit board inspection apparatus 801, by front end head 822 is formed column, thereby be different from the structure with the front end head that forms sphere for example or cone-shaped body, no matter along the deformation quantity of central axis direction (inspection direction) how, contact area with terminal 101 can both be maintained certain value (perhaps, substantially certain value).Thereby, can under the state that will maintain with the contact area of terminal 101 certain value (perhaps, substantially certain value), produce large elastic deformation along central axis direction.Therefore, for each front end head 822, even the distance between the leading section 822b of each front end head 822 and the terminal 101 differs widely, also can produce large elastic deformation by making front end head 822, make contact area maintain certain value (perhaps, substantially certain value), simultaneously the leading section 822b of each front end head 822 is positively contacted with terminal 101.
In addition, contact unit and circuit board inspection apparatus are not limited to said structure.For example, more than narrated the structure and the method that adopt by the front end head 822 that forms as the conducting rubber with electric conductivity and flexible macromolecular material, but also can adopt by structure and method with front end head 822 that electric conductivity and flexible resin form.In addition; also can adopt structure and the method for the front end head with following structure: namely; the resilient macromolecular material of apparatus forms the main part of front end head; on the surface of this main part; the diaphragm (for example, metal protective film) that utilizes evaporation or sputter to form electric conductivity consists of.
In addition, more than narrated and have the example that forms columniform front end head 822, but the shape of front end head 822 is not limited to this.Particularly, can adopt as shown in figure 31 the front end head 832 that the cross section is formed oval-shaped column or the front end head 842 that the cross section is formed tetragonal column shown in figure 32.In addition, also can adopt as shown in figure 33 the front end head 852 that forms four limit tapers or as shown in figure 34 form conical front end head 862.In addition, also can adopt as shown in figure 35 form spherical front end head 872 or as shown in figure 36 form ellipsoidal front end head 882.
In addition, more than narrated and adopted and around conductor portion 821a, to be formed with the coating wire 821 of insulating protective film 821b as the example of wire, but also can adopt the structure of the wire that does not form insulating protective film 821b.

Claims (25)

1. a contact unit is characterized in that,
This contact unit comprises main part and probe tip, described main part has the 1st tabular support that is formed with the 1st through hole and reaches the 2nd tabular support that relatively configures and be formed with the 2nd through hole with the 1st support, described probe tip is supported by described main part under state in described the 1st through hole and described the 2nd through hole is inserted respectively in its leading section and bottom, its central portion between described the 1st support and described the 2nd support constitutes can be crooked when detecting, and so that the diameter of this central portion forms the 1st insulation course greater than the thickness of the diameter of described the 1st through hole at the outer peripheral face of this central portion
The part on the surface of the described leading section of described probe tip, namely except with position that the detected object thing contacts the front end area of predesignating so that the diameter of this front end area forms the 2nd insulation course less than the thickness of the diameter of described the 1st through hole.
2. contact unit as claimed in claim 1 is characterized in that,
Outer peripheral face and described front end area at described central portion form described the 2nd insulation course continuously, and described the 1st insulation course is formed on the top of described the 2nd insulation course that is formed at described central portion as the upper strata.
3. contact unit as claimed in claim 1 is characterized in that,
The described leading section of described probe tip forms the identical right cylinder of thickness,
The whole outer peripheral face of described leading section is stipulated as described front end area.
4. contact unit as claimed in claim 2 is characterized in that,
The described leading section of described probe tip forms the identical right cylinder of thickness,
The whole outer peripheral face of described leading section is stipulated as described front end area.
5. contact unit as claimed in claim 1 is characterized in that,
Consist of described probe tip, so that described leading section has along with towards front end and the minor diameter that diameter diminishes,
With the outer peripheral face regulation of the part except this minor diameter of described leading section as described front end area.
6. contact unit as claimed in claim 2 is characterized in that,
Consist of described probe tip, so that described leading section has along with towards front end and the minor diameter that diameter diminishes,
With the outer peripheral face regulation of the part except this minor diameter of described leading section as described front end area.
7. circuit board inspection apparatus is characterized in that having:
Each described contact unit in the claim 1 to 6; And inspection section, this inspection section carries out electric-examination to this circuit substrate and looks into according to the electric signal of the described probe tip institute input and output by the described contact unit that contacts with circuit substrate as the detected object thing.
8. a contact unit is characterized in that,
The maintaining part that this contact unit has a plurality of probes and keeps this each probe,
Described maintaining part is made of the tabular body with through hole,
Described probe is made of linear or bar-shaped electric conductor, described electric conductor inserts in the described through hole so that leading section is outstanding from a surface of described maintaining part, and can move and keeping holding it on the described maintaining part by the resilient material that is filled in the described through hole under the state of insulation with other described electric conductor along the central shaft of this through hole.
9. contact unit as claimed in claim 8 is characterized in that,
Described probe is made of the coating wire.
10. contact unit as claimed in claim 8 is characterized in that,
In 1 described through hole, insert a plurality of described probes.
11. contact unit as claimed in claim 9 is characterized in that,
In 1 described through hole, insert a plurality of described probes.
12. contact unit as claimed in claim 10 is characterized in that,
Described a plurality of probes are being inserted in 1 described through hole under the state that reverses.
13. contact unit as claimed in claim 11 is characterized in that,
Described a plurality of probes are being inserted in 1 described through hole under the state that reverses.
14. a circuit board inspection apparatus is characterized in that having:
Each described contact unit in the claim 8 to 13; And inspection section, this inspection section carries out electric-examination to this circuit substrate and looks into according to the electric signal of the described probe institute input and output by the described contact unit that contacts with circuit substrate as the detected object thing.
15. a contact unit manufacture method is characterized in that,
The contact unit that this contact unit manufacture method manufacturing has a plurality of probes and keeps the maintaining part of this each probe,
Form through hole making described maintaining part at tabular body,
This electric conductor is inserted in the described through hole so that play as the leading section of the linear or bar-shaped electric conductor of the effect of described probe outstanding from a surface of described maintaining part,
In order to move along the central shaft of described through hole and to keep by resilient material this electric conductor being remained in this maintaining part under the state of insulation at the described electric conductor with other, in this through hole, fill this resilient material, thereby make described contact unit.
16. a contact unit is characterized in that,
The maintaining part that this contact unit has a plurality of probes and keeps this each probe,
Described maintaining part is made of the tabular body with through hole,
Described probe comprises wire and front end components, described wire is inserted described through hole and keeps being fixed in described maintaining part under the state of insulation at leading section, any shape and this front end components that described front end components forms in column, cone-shaped body, sphere and the ellipsoid have electric conductivity and elasticity, described front end components is fixed on the described wire so that the bottom with state that the end face of described leading section is electrically connected under outstanding from a surface of described maintaining part.
17. contact unit as claimed in claim 16 is characterized in that,
Become on described end face and a described surface under same the state, described wire is fixed in described maintaining part.
18. contact unit as claimed in claim 16 is characterized in that,
Described front end components is by having electric conductivity and flexible macromolecular material forms.
19. contact unit as claimed in claim 17 is characterized in that,
Described front end components is by having electric conductivity and flexible macromolecular material forms.
20. contact unit as claimed in claim 16 is characterized in that,
Described front end components forms column.
21. contact unit as claimed in claim 17 is characterized in that,
Described front end components forms column.
22. contact unit as claimed in claim 18 is characterized in that,
Described front end components forms column.
23. contact unit as claimed in claim 19 is characterized in that,
Described front end components forms column.
24. a circuit board inspection apparatus is characterized in that having:
Each described contact unit in the claim 16 to 23; And inspection section, this inspection section carries out electric-examination to this circuit substrate and looks into according to the electric signal of the described probe institute input and output by the described contact unit that contacts with circuit substrate as the detected object thing.
25. a contact unit manufacture method is characterized in that,
The contact unit that this contact unit manufacture method manufacturing has a plurality of probes and keeps the maintaining part of this each probe,
Form through hole making described maintaining part at tabular body,
The leading section that consists of the wire of described probe is inserted in the described through hole, under the state that keeps insulation, this wire is fixed in described maintaining part,
Under the bottom of the front end components of the described probe of formation of any shape in will forming column, cone-shaped body, sphere and ellipsoid and the state that the end face of described leading section is electrically connected, this front end components is fixed on the described wire so that its surface from described maintaining part gives prominence to, thereby make described contact unit.
CN2012101797816A 2011-06-03 2012-06-01 Probe unit, circuit board inspection apparatus and method for manufacturing probe unit Pending CN102998493A (en)

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JP2011124702A JP2012251873A (en) 2011-06-03 2011-06-03 Probe unit, circuit board inspection device and probe unit manufacturing method
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JP2011135253A JP2013003002A (en) 2011-06-17 2011-06-17 Probe unit and circuit board inspection device
JP2011134795A JP2013002976A (en) 2011-06-17 2011-06-17 Probe unit, circuit board inspection device and probe unit manufacturing method
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CN110088633A (en) * 2016-12-27 2019-08-02 Teps有限公司 Including having the probe card of the straight probe of adjustable contact force
CN110312940A (en) * 2017-02-15 2019-10-08 泰克诺探头公司 Improved probe card for frequency applications
CN110312940B (en) * 2017-02-15 2021-11-12 泰克诺探头公司 Improved probe card for high frequency applications
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