CN102981370B - 光刻设备、用于光刻设备的支撑台以及器件制造方法 - Google Patents

光刻设备、用于光刻设备的支撑台以及器件制造方法 Download PDF

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Publication number
CN102981370B
CN102981370B CN201210292390.5A CN201210292390A CN102981370B CN 102981370 B CN102981370 B CN 102981370B CN 201210292390 A CN201210292390 A CN 201210292390A CN 102981370 B CN102981370 B CN 102981370B
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China
Prior art keywords
support table
support
conditioning
substrate
thermal energy
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CN201210292390.5A
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English (en)
Chinese (zh)
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CN102981370A (zh
Inventor
J·G·C·昆尼
J·H·W·雅各布斯
C·C·W·沃斯帕盖特
R·范德哈姆
I·A·J·托马斯
M·霍本
T·S·M·劳伦特
G·M·M·考克兰
R·H·M·J·布洛克斯
G·彼得斯
P·L·J·岗特尔
M·J·里米
S·C·R·德尔克斯
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ASML Netherlands BV
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ASML Netherlands BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Microscoopes, Condenser (AREA)
CN201210292390.5A 2011-08-18 2012-08-16 光刻设备、用于光刻设备的支撑台以及器件制造方法 Active CN102981370B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161524960P 2011-08-18 2011-08-18
US61/524,960 2011-08-18

Publications (2)

Publication Number Publication Date
CN102981370A CN102981370A (zh) 2013-03-20
CN102981370B true CN102981370B (zh) 2015-08-05

Family

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Country Status (7)

Country Link
US (3) US9897928B2 (https=)
EP (1) EP2560050A1 (https=)
JP (2) JP2013042127A (https=)
KR (2) KR20130020636A (https=)
CN (1) CN102981370B (https=)
SG (1) SG188036A1 (https=)
TW (1) TWI512408B (https=)

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EP2856262B1 (en) 2012-05-29 2019-09-25 ASML Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
JP2016522568A (ja) * 2013-04-09 2016-07-28 エーエスエムエル ネザーランズ ビー．ブイ． 支持構造、その温度を制御する方法、及びそれを含む装置
JP6216460B2 (ja) 2013-08-30 2017-10-18 エーエスエムエル ネザーランズ ビー．ブイ． 液浸リソグラフィ装置
US9541846B2 (en) 2013-09-06 2017-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Homogeneous thermal equalization with active device
CN105683839B (zh) 2013-09-27 2017-08-08 Asml荷兰有限公司 用于光刻设备的支撑台、光刻设备以及器件制造方法
JP6018606B2 (ja) * 2014-06-27 2016-11-02 東京エレクトロン株式会社 温度制御可能なステージを含むシステム、半導体製造装置及びステージの温度制御方法
WO2016012175A1 (en) 2014-07-23 2016-01-28 Asml Netherlands B.V. Conditioning system and lithographic apparatus comprising a conditioning system
NL2015579A (en) * 2014-10-23 2016-08-30 Asml Netherlands Bv Support table for a lithographic apparatus, method of loading a substrate, lithographic apparatus and device manufacturing method.
CN104614951B (zh) * 2015-03-04 2016-10-19 京东方科技集团股份有限公司 曝光装置和曝光方法
WO2017060259A1 (en) * 2015-10-06 2017-04-13 Asml Holding N.V. Chucks and clamps for holding objects of a lithographic apparatus and methods for controlling a temperature of an object held by a clamp of a lithographic apparatus
NL2020011A (en) 2017-01-26 2018-08-01 Asml Netherlands Bv A lithography apparatus and a method of manufacturing a device
WO2019096554A1 (en) 2017-11-20 2019-05-23 Asml Netherlands B.V. Substrate holder, substrate support and method of clamping a substrate to a clamping system
CN110554572B (zh) * 2018-05-31 2020-10-16 上海微电子装备（集团）股份有限公司 吸盘
KR102002625B1 (ko) * 2018-06-11 2019-07-22 한국표준과학연구원 확장된 검사 영역을 갖는 웨이퍼 센서, 및 이를 이용한 건식 공정 장치
US11500298B2 (en) 2018-12-21 2022-11-15 Asml Holding N.V. Reticle sub-field thermal control
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Also Published As

Publication number Publication date
JP2013042127A (ja) 2013-02-28
TWI512408B (zh) 2015-12-11
KR20150082145A (ko) 2015-07-15
JP2015065482A (ja) 2015-04-09
US11300890B2 (en) 2022-04-12
TW201314378A (zh) 2013-04-01
US9897928B2 (en) 2018-02-20
US20130045447A1 (en) 2013-02-21
SG188036A1 (en) 2013-03-28
CN102981370A (zh) 2013-03-20
JP6080875B2 (ja) 2017-02-15
US20180284627A1 (en) 2018-10-04
US10520837B2 (en) 2019-12-31
KR101932995B1 (ko) 2018-12-27
EP2560050A1 (en) 2013-02-20
US20200124993A1 (en) 2020-04-23
KR20130020636A (ko) 2013-02-27

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