CN102980552B - Measuring method of coplanar degree of circuit board surface - Google Patents
Measuring method of coplanar degree of circuit board surface Download PDFInfo
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- CN102980552B CN102980552B CN201210529756.6A CN201210529756A CN102980552B CN 102980552 B CN102980552 B CN 102980552B CN 201210529756 A CN201210529756 A CN 201210529756A CN 102980552 B CN102980552 B CN 102980552B
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Abstract
The invention discloses a measuring method of a coplanar degree of a circuit board surface. The measuring method comprises the following steps of providing a three-D measuring meter having a height-measurement function, placing a circuit board on a measuring platform of the three-D measuring meter, allowing the top surface of the circuit board exposing a built-in component to face upward, using the three-D measuring meter to sequentially measure heights H1 to Hn from any points A1 to An of the top surface of the built-in component to the measuring platform, selecting points B1 to Bn on a board body, which are close to the points A1 to An of the built-in component, using the three-D measuring meter to sequentially measure heights h1 to hn from the points B1 to Bn on the board body to the measuring platform, calculating coplanar degrees D1 to Dn of the points A1 to An of the built-in component and the corresponding points B1 to Bn on the board body, comparing the coplanar degrees D1 to Dn, and selecting the maximum value as the coplanar degree between the built-in component and the board body.
Description
Technical field
The present invention relates to a kind of measuring method of coplane degree of circuit board surface, the measuring method of the plate face particularly relating to a kind of circuit board and the coplane degree on the surface that is embedded in the built-in element in this circuit board.
Background technology
Along with making rapid progress of science and technology, electronic component trends towards microminiature and extra-thin future development more, and printed circuit board also trends towards high-accuracy figure and slim multiple stratification more.Thus, the electronic component that layout installation is a large amount of is on circuit boards more and more difficult.In the various electronic components that existing circuit board is assembled, passive device is in the great majority, industry adopts the inside a large amount of passive devices being assembled in circuit board in the mode imbedded usually, element length of arrangement wire each other can be shortened, improve electrical specification, improve effective circuit board package area, reduce the pad etc. of circuit board surface.Therefore, built-in device is ideal a kind of installation form and technology.But built-in element needs to ensure the plate face of surface and the circuit board being embedded in assembly in circuit board at grade, prevent this fabricated section and other elements be located on circuit board from interfering with conserve space.
The measuring method of the coplane degree of the fabricated section in it imbedded by existing circuit board with it, usually first the partial circuit plate plate body comprising this passive device is separated from whole circuit board, then measure the difference in height on the surperficial opposing circuit board surface of this passive device, thus obtain the coplane degree of passive device and circuit board.Therefore, the measuring method of the coplane degree of existing circuit board surface needs to destroy its sample, and the numerical value of the surface of the passive device at edge and the coplane degree of circuit board surface can only be obtained, the coplane degree of assembly and circuit board cannot be reflected comprehensively, exactly, thus affect quality and the use of product.
Summary of the invention
In view of this, the method for the plate face that metering circuit plate under a kind of prerequisite not destroying circuit board sample is provided to provide and the coplane degree on the surface being embedded in the built-in element in this circuit board.
A measuring method for the coplane degree of circuit board surface, this circuit board comprises a plate body and is embedded in the built-in element of plate body, and the end face of this built-in element is exposed to the end face of this plate body, and the step of this measuring method comprises:
S1: provide the three-dimensional measuring instrument that has a height measurement function, this three-dimensional measuring instrument comprises a measuring table;
S2: this circuit board is positioned on the measuring table of this three-dimensional measuring instrument, and the end face making exposed described built-in element is upward;
S3: use this three-dimensional measuring instrument measure successively this built-in element surperficial arbitrfary point A1, A2, A3 ..., An apart from the height H 1 of described measuring table, H2, H3 ..., Hn, n on this built-in element get the quantity of measurement point, n value is more than or equal to 3;
S4: choose on plate body respectively apart from described built-in element some A1, A2, A3 ..., close some B1, the B2 of An, B3 ..., Bn;
S5: use this three-dimensional measuring instrument to measure successively this plate body puts B1, B2, B3 ..., Bn apart from the height of described measuring table 21 be respectively h1, h2, h3 ..., hn;
S6: calculate some A1, the A2 of this built-in element, A3 ..., some B1, B2 that An is corresponding with on plate body, B3 ..., Bn coplane degree D1, D2, D3 ..., Dn;
S7: more each coplane degree D1, D2, D3 ..., Dn, select the coplane degree of maximal value as this built-in element and this plate body.
Further, in described step S3, described some A1, A2, A3 ..., An is the arbitrfary point of this built-in element fringe region.
Further, in described step S4, first measure the some C1 that an A1 is minimum apart from the inward flange of this plate body, be the center of circle with C1, plate body is got the region of Radius r, choose arbitrarily on the area a bit as the some B1 close to A1 on plate body; In like manner measure A2, A3 ..., the An point C2 minimum apart from this built-in element edge, C3 ..., Cn, correspondence select B2 on this plate body, B3 ..., Bn.
Further, in described step S4, when A1, A2, A3 ..., minimum apart from this built-in element edge respectively point of An has two or more, random selecting one.
Further, in described step S4, the value of described radius r is less than or equal to the half of this built-in element breadth extreme.
Further, in described step S4, the value of described radius r follows the quantity n of selected point to be inversely proportional to, and n is larger, and r is then less.
Further, in described step S6, coplane degree D1 is the absolute value of the difference of H1 and h1, D2 is the difference of H2 and h2 absolute value ..., Dn is the absolute value of the difference of Hn and hn.
Further, described three-dimensional measuring instrument uses non-contact measurement height.
Further, described three-dimensional measuring instrument uses optical focusing to survey high method.
Compared with prior art, this measuring method can under the prerequisite not destroying circuit board, that can record built-in element accurately with coplane degree that the is plate face of circuit board, and measurement accuracy is high.
Accompanying drawing explanation
Fig. 1 is the side sectional view of an embodiment of circuit board of the present invention.
Fig. 2 is the vertical view of the circuit board shown in Fig. 1.
Embodiment
In order to make technical scheme of the present invention more clearly show, below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figures 1 and 2, the measuring method of the present embodiment is the measuring method to plate body 11 surface of a circuit board 10 and the coplane degree on built-in element 12 surface.
This plate body 11 is the plate body of printed circuit board (PCB), has the part such as insulation course, conductive layer, is the supporter of electronic devices and components.This built-in element 12 can be the electronic components such as passive device.This built-in element 12 is assembled in the inside of this plate body 11 by modes such as person imbed.The bottom of this built-in element 12 and sidewall are contained in this plate body 11, and the end face of this built-in element 12 is exposed on the end face of plate body 11.
The measuring method of the coplane degree on the surface of the built-in element 12 of this circuit board 10 and the surface of plate body 11 comprises the following steps, and wherein this built-in element 12 is rectangle setting:
S1: provide the three-dimensional measuring instrument 20 that has a height measurement function, in the present embodiment, this three-dimensional measuring instrument 20 uses non-contact measurement height, surveys high mode as used Z axis optical focusing;
S2: this circuit board 10 is positioned on the measuring table 21 of this three-dimensional measuring instrument 20, and make its exposed surface being provided with described built-in element 12 upward;
S3: use this three-dimensional measuring instrument 20 measure successively this built-in element 12 surperficial arbitrfary point A1, A2, A3 ..., An apart from the height of described measuring table 21 be respectively H1, H2, H3 ..., Hn; N on this built-in element 12 get the quantity of measurement point, n value is more than or equal to 3;
S4: put described in selected distance on plate body 11 A1, A2, A3 ..., close some B1, the B2 of An, B3 ..., Bn; Particularly, measure the some C1 that an A1 is minimum apart from the inward flange of this plate body 11, take C1 as the center of circle, plate body 11 is got the region of Radius r, choose arbitrarily 1 B1 on the area as the point close to A1 on plate body 11; In like manner measure A2, A3 ..., the An point C2 minimum apart from this built-in element 12 edge, C3 ..., Cn, correspondence select B2 on this plate body 11, B3 ..., Bn; Wherein, if the A1 point minimum apart from this built-in element 12 edge has two or more, then random selecting one; The value of radius r is less than or equal to the half of this built-in element 12 breadth extreme; In the present embodiment, the value of this radius r follows the quantity n of selected point to be inversely proportional to, and n is larger, and r is then less.
S5: use this three-dimensional measuring instrument 20 to measure successively this plate body 11 puts B1, B2, B3 ..., Bn apart from the height of described measuring table 21 be respectively h1, h2, h3 ..., hn; During concrete measurement, regulate the X of this three-dimensional measuring instrument 20, Y-axis can move to the required position measured, the height of required point can measured by Z axis optical measurement;
S6: calculate some A1, the A2 of this built-in element 12, A3 ..., some B1, B2 that An is corresponding with on plate body 11, B3 ..., Bn coplane degree D1, D2, D3 ..., Dn, wherein D1=︱ H1-h1 ︱, D2=︱ H2-h2 ︱, D3=︱ H3-h3 ︱ ..., Dn=︱ Hn-hn ︱, namely D1 be the absolute value of the difference of H1 and h1, D2 be the difference of H2 and h2 absolute value ..., Dn is the absolute value of the difference of Hn and hn;
S7: more each coplane degree D1, D2, D3 ..., Dn, selecting maximal value is then this built-in element 12 and the coplane degree of this plate body 11.
In the S3 step of the present embodiment, this arbitrfary point A1, A2, A3 ..., An is the arbitrfary point of this built-in element 12 fringe region, only need in S4 like this measurement point A1, A2, A3 ..., the distance at obviously close two edges on An distance plate body 11, thus find out A1, A2, A3 ..., the An point C2 minimum apart from this plate body 11 inward flange, C3 ..., Cn.
This measuring method under the prerequisite not destroying circuit board 10, can record the coplane degree in the surperficial any point of built-in element 12 and the plate face of circuit board 10 accurately, and measuring speed is fast, and computing method are easy.Further, due to take in S4 first find out an A1, A2, A3 ..., An point C1, the C2 minimum apart from the inward flange of this plate body 11, C3 ..., Cn, make some A1, the A2 of built-in element 12, A3 ..., some B1, B2 that An is corresponding with on plate body 11, B3 ..., Bn is positioned at the same side of built-in element 12, decrease circuit board 10 relative measurement platform 21 integral inclined time the error that causes.
The above embodiment only have expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a measuring method for the coplane degree of circuit board surface, this circuit board comprises a plate body and is embedded in the built-in element of plate body, and the end face of this built-in element is exposed to the end face of this plate body, and the step of this measuring method comprises:
S1: provide the three-dimensional measuring instrument that has a height measurement function, this three-dimensional measuring instrument comprises a measuring table;
S2: this circuit board is positioned on the measuring table of this three-dimensional measuring instrument, and the end face making exposed described built-in element is upward;
S3: use this three-dimensional measuring instrument measure successively this built-in element surperficial arbitrfary point A1, A2, A3 ..., An apart from the height H 1 of described measuring table, H2, H3 ..., Hn, n on this built-in element get the quantity of measurement point, n value is more than or equal to 3;
S4: choose on plate body respectively apart from described built-in element some A1, A2, A3 ..., close some B1, the B2 of An, B3 ..., Bn;
S5: use this three-dimensional measuring instrument to measure successively this plate body puts B1, B2, B3 ..., Bn apart from the height of described measuring table be respectively h1, h2, h3 ..., hn;
S6: calculate some A1, the A2 of this built-in element, A3 ..., some B1, B2 that An is corresponding with on plate body, B3 ..., Bn coplane degree D1, D2, D3 ..., Dn; In this step S6, D1=︱ H1-h1 ︱, D2=︱ H2-h2 ︱, D3=︱ H3-h3 ︱ ..., Dn=︱ Hn-hn ︱, namely coplane degree D1 is the absolute value of the difference of H1 and h1, D2 is the absolute value of the difference of H2 and h2, D3 is the difference of H3 and h3 absolute value ..., Dn is the absolute value of the difference of Hn and hn;
S7: more each coplane degree D1, D2, D3 ..., Dn, select the coplane degree of maximal value as this built-in element and this plate body.
2. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: in described step S3, described some A1, A2, A3 ..., An is the arbitrfary point of this built-in element fringe region.
3. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, it is characterized in that: in described step S4, first the some C1 that an A1 is minimum apart from the inward flange of this plate body is measured, take C1 as the center of circle, plate body is got the region of Radius r, chooses arbitrarily on the area a bit as the some B1 close to A1 on plate body; In like manner measure A2, A3 ..., the An point C2 minimum apart from this built-in element edge, C3 ..., Cn, correspondence select B2 on this plate body, B3 ..., Bn.
4. the measuring method of the coplane degree of circuit board surface as claimed in claim 3, is characterized in that: in described step S4, when A1, A2, A3 ..., minimum apart from this built-in element edge respectively point of An has two or more, random selecting one.
5. the measuring method of the coplane degree of circuit board surface as claimed in claim 3, it is characterized in that: in described step S4, the value of described radius r is less than or equal to the half of this built-in element breadth extreme.
6. the measuring method of the coplane degree of circuit board surface as claimed in claim 3, is characterized in that: in described step S4, and the value of described radius r follows the quantity n of selected point to be inversely proportional to, and n is larger, and r is then less.
7. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: described three-dimensional measuring instrument uses non-contact measurement height.
8. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: described three-dimensional measuring instrument uses optical focusing to survey high method.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210529756.6A CN102980552B (en) | 2012-12-07 | 2012-12-07 | Measuring method of coplanar degree of circuit board surface |
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| CN201210529756.6A CN102980552B (en) | 2012-12-07 | 2012-12-07 | Measuring method of coplanar degree of circuit board surface |
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| CN102980552A CN102980552A (en) | 2013-03-20 |
| CN102980552B true CN102980552B (en) | 2015-04-22 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822392A1 (en) * | 1998-05-19 | 1999-12-09 | Fraunhofer Ges Forschung | Method to determine three-dimensional coordinates of defect on surface of another object, for use in quality control |
| CN1847784A (en) * | 2005-04-05 | 2006-10-18 | 华为技术有限公司 | Device pin coplanarity measuring method |
| JP2012058057A (en) * | 2010-09-08 | 2012-03-22 | Tresa Co Ltd | Gage for three-dimensional coordinate measuring instrument and precision evaluation method for three-dimensional coordinate measuring instrument |
| CN102749064A (en) * | 2012-06-19 | 2012-10-24 | 歌尔声学股份有限公司 | Method and device for measuring backboard planeness of liquid crystal display device |
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2012
- 2012-12-07 CN CN201210529756.6A patent/CN102980552B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822392A1 (en) * | 1998-05-19 | 1999-12-09 | Fraunhofer Ges Forschung | Method to determine three-dimensional coordinates of defect on surface of another object, for use in quality control |
| CN1847784A (en) * | 2005-04-05 | 2006-10-18 | 华为技术有限公司 | Device pin coplanarity measuring method |
| JP2012058057A (en) * | 2010-09-08 | 2012-03-22 | Tresa Co Ltd | Gage for three-dimensional coordinate measuring instrument and precision evaluation method for three-dimensional coordinate measuring instrument |
| CN102749064A (en) * | 2012-06-19 | 2012-10-24 | 歌尔声学股份有限公司 | Method and device for measuring backboard planeness of liquid crystal display device |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |