CN102967291B - Measuring method of coplanarity of surface of circuit board - Google Patents
Measuring method of coplanarity of surface of circuit board Download PDFInfo
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- CN102967291B CN102967291B CN201210525554.4A CN201210525554A CN102967291B CN 102967291 B CN102967291 B CN 102967291B CN 201210525554 A CN201210525554 A CN 201210525554A CN 102967291 B CN102967291 B CN 102967291B
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Abstract
The invention provides a measuring method of the coplanarity of the surface of a circuit board, comprising the following steps of: providing a three-dimensional measuring apparatus with a height measuring function; placing the circuit board on a measuring platform of the three-dimensional measuring apparatus and enabling a top face to which an internally-arranged element is exposed, to be placed upwards; measuring three-dimensional coordinates of four points of a board body on the periphery of the internally arranged element; measuring three-dimensional coordinates of the four points of the peripheral part of the surface of the internally arranged element and one point of a central part; configuring a plane by any one of the four points on the board body and two points adjacent to the point; calculating the distance from each of the five points on the internally arranged element to four configured planes of the board body; judging whether difference judging data of the maximum value and the minimum value of the distance from each point of the internally arranged element to each configured plane is effective or not; and comparing the coplanarity of the five points of the internally arranged element corresponding to the coplanarity of the board body, and taking the maximum value as the coplanarity of the internally arranged element and the board body.
Description
Technical field
The present invention relates to a kind of measuring method of coplane degree of circuit board surface, the measuring method of the plate face particularly relating to a kind of circuit board and the coplane degree on the surface that is embedded in the built-in element in this circuit board.
Background technology
Along with making rapid progress of science and technology, electronic component trends towards microminiature and extra-thin future development more, and printed circuit board also trends towards high-accuracy figure and slim multiple stratification more.Thus, the electronic component that layout installation is a large amount of is on circuit boards more and more difficult.In the various electronic components that existing circuit board is assembled, passive device is in the great majority, industry adopts the inside a large amount of passive devices being assembled in circuit board in the mode imbedded usually, element length of arrangement wire each other can be shortened, improve electrical specification, improve effective circuit board package area, reduce the pad etc. of circuit board surface.Therefore, built-in device is ideal a kind of installation form and technology.But built-in element needs to ensure the plate face of surface and the circuit board being embedded in assembly in circuit board at grade, prevent this fabricated section and other elements be located on circuit board from interfering with conserve space.
The measuring method of the coplane degree of the fabricated section in it imbedded by existing circuit board with it, usually first the partial circuit plate comprising this passive device is separated from whole circuit board, then measure the difference in height on the surperficial opposing circuit board surface of this passive device, thus obtain the coplane degree of passive device and circuit board.Therefore, the measuring method of the coplane degree of existing circuit board surface needs to destroy its sample, and the numerical value of the surface of the passive device at edge and the coplane degree of circuit board surface can only be obtained, the coplane degree of assembly and circuit board cannot be reflected comprehensively, exactly, thus affect quality and the use of product.
Summary of the invention
In view of this, the method for the plate face that metering circuit plate under a kind of prerequisite not destroying circuit board sample is provided to provide and the coplane degree on the surface being embedded in the built-in element in this circuit board.
A measuring method for the coplane degree of circuit board surface, this circuit board comprises a plate body and is embedded in the built-in element of plate body, and the end face of this built-in element is exposed to the end face of this plate body, and the step of this measuring method comprises:
S1: provide the three-dimensional measuring instrument that has a height measurement function, this three-dimensional measuring instrument comprises a measuring table, this three-dimensional measuring instrument can the three-dimensional coordinate of any point on metering circuit plate;
S2: this circuit board is positioned on the measuring table of this three-dimensional measuring instrument, and the end face making exposed described built-in element is upward;
S3: use this three-dimensional measuring instrument to measure four points of described plate body at this built-in element periphery successively;
S4: use this three-dimensional measuring instrument to measure four points of the surface perimeter part of this built-in element and a point of core successively, four points of four points of the surface perimeter part of this built-in element corresponding described plate body separately;
S5: construct a plane by any one point in the point of four on described plate body and at 2 adjacent with this point, four formation levels are set altogether, calculate the distance of four formation levels of the relatively described plate body of every bit in five points on this built-in element;
S6: maximal value and minimum value are got to four distances of the relatively described formation level of every bit in five points on described built-in element surface, the independent difference calculating the maxima and minima of the distance of every bit and each formation level, if this difference is less than a preset value, then enter next step S7; If this difference is more than or equal to this preset value, then plate body out-of-flatness, above-mentioned measurement data is invalid, returns described step S3 and remeasures;
S7: using the every bit of the peripheral part of built-in element relative to the distance of point close on plate body and the formation level of adjacent two as the coplane degree of the relative plate body of this point, the point of the core of this built-in element is got apart from four distances of described four formation levels the coplane degree that maximal value is the relative plate body of this point; Relatively the coplane degree of five relative plate bodys of point of this built-in element, gets the coplane degree that maximal value is this built-in element and plate body.
Further, in described step S3, four points of this plate body are evenly distributed on the periphery of built-in element.
Further, in described step S3, four points of this plate body successively line are a rectangle.
Further, the rectangular setting of described built-in element, in step S4, four some distributions of this built-in element peripheral part are on four angles of built-in element.
Further, in described step S5, described formation level is set by the principle of planar process vector and calculates on described plate body each point respectively apart from the distance of each formation level.
Further, in described step S6, described preset value is considered according to the accuracy synthesis measuring requirement and surveying instrument.
Further, described preset value is the numerical value between 0.05mm to 0.25mm.
Further, described preset value is 0.2mm.
Further, described three-dimensional measuring instrument uses non-contact measurement instrument.
Further, described three-dimensional measuring instrument uses optical focusing to survey high method.
Compared with prior art, this measuring method can under the prerequisite not destroying circuit board, that can record built-in element accurately with coplane degree that the is plate face of circuit board, and measurement accuracy is high.
Accompanying drawing explanation
Fig. 1 is the side sectional view of an embodiment of circuit board of the present invention.
Fig. 2 is the vertical view of the circuit board shown in Fig. 1.
Embodiment
In order to make technical scheme of the present invention more clearly show, below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figures 1 and 2, the measuring method of the present embodiment is the measuring method to plate body 11 surface of a circuit board 10 and the coplane degree on built-in element 12 surface.
This plate body 11 is the plate body of printed circuit board (PCB), has the part such as insulation course, conductive layer, is the supporter of electronic devices and components.This built-in element 12 can be the electronic components such as passive device.This built-in element 12 is assembled in the inside of this plate body 11 by the mode such as embedding or imbed.The bottom of this built-in element 12 and sidewall are contained in this plate body 11, and the end face of this built-in element 12 is exposed on the end face of plate body 11.In the present embodiment, the rectangular setting of this built-in element 12.This built-in element 12 can be circular or other regular shapes in other embodiments, and the sidewall of this built-in element 12 is contained in this plate body 11, and one or two end face of this built-in element 12 is exposed on the end face of plate body 11.
The measuring method of the coplane degree on the surface of the built-in element 12 of this circuit board 10 and the surface of plate body 11 comprises the following steps, and wherein this built-in element 12 is rectangle setting:
S1: provide the three-dimensional measuring instrument 20 that has a height measurement function, in the present embodiment, this three-dimensional measuring instrument 20 uses non-contact measurement, as used the modes such as optical focusing measurement; This three-dimensional measuring instrument 20 can the three-dimensional coordinate x, y, z of any point on metering circuit plate 10.
S2: this circuit board 10 is positioned on the measuring table 21 of this three-dimensional measuring instrument 20, and make its exposed surface being provided with described built-in element 12 upward;
S3: use this three-dimensional measuring instrument 20 to measure successively on plate body 11 and be positioned at the D coordinates value A of four somes A, B, C, D of built-in element 12 periphery
x, A
y, A
z, B
x, B
y, B
z, C
x, C
y, C
z, D
x, D
y, D
z, these four somes A, B, C, D are evenly distributed on the periphery of built-in element 12; In the present embodiment, these four somes A, B, C, D successively line are a rectangle, and namely these four somes A, B, C, D are four angle points of a rectangle; In the present embodiment, these four some A, B, C, D distributions are near four angles of described built-in element 12; For ensureing to measure accurately, single-point can be carried out survey repeatedly to be worth and then average by each point;
S4: use this three-dimensional measuring instrument 20 to measure the D coordinates value E of four somes E, F, J, K of the surface perimeter part of this built-in element 12 successively
x, E
y, E
z, F
x, F
y, F
z, J
x, J
y, J
z, K
x, K
y, K
zand the D coordinates value L of the some L of the centre of surface part of this built-in element 12
x, L
y, L
z, these four somes E, F, J, K are corresponding four somes A, B, C, D near plate body 11 respectively; In the present embodiment, these four some E, F, J, K distributions are near four angles of built-in element 12; In other embodiments, if built-in element 12 is circular, then four somes A, B, C, D of plate body 11 are the peripheral equally distributed point of built-in element 12, E, F, J, K be built-in element 12 surface in be uniformly distributed and distinguish the point of corresponding A, B, C, D, point centered by some L; For ensureing to measure accurately, can carry out averaging after single-point surveys repeatedly value by each point;
S5: the three-dimensional coordinate formation level utilizing any point on plate body 11 four somes A, B, C, D and at adjacent 2, can obtain four formation level P
a, P
b, P
c, P
d, utilize formulae discovery to go out E, F, J, K, L respectively apart from each formation level P
a, P
b, P
c, P
ddistance;
Wherein, with the formation level P of an A and the some D adjacent with this A and some B
a, with a B and the some A adjacent with this B and some C formation level P
b, with a C and the some B adjacent with this C and some D formation level P
c, with a D and the some C adjacent with this D and some A formation level P
d;
The present invention takes the mode of normal vector to construct each plane, and the equation of the plane wherein constructed by A, B, D is as follows:
Point A, B construct vectorial α: (B
x-A
x, B
y-A
y, B
z-A
z); Point A, D construct vectorial β: (D
x-A
x, D
y-A
y, D
z-A
z); The vectorial γ (normal vector) vertical with α, β: (a1, a2, a3), can draw according to normal vector definition the plane P constructed by A, B, D
aequation: a1(x-A
x)+a2(y-A
y)+a3(z-A
z)=0; Wherein
a1=（B
y-A
y）*（D
z-A
z）-（B
z-A
z）*（D
y-A
y），
a2=-（（B
x-A
x）*（D
z-A
z）-（B
z-A
z）*（D
x-A
x）），
a3=（B
x-A
x）*（D
y-A
y）-（B
y-A
y）*（D
x-A
x），
In like manner, each formation level P can be calculated
b, P
c, P
dequation;
Calculate E point apart from P
athe distance E of plane
pA=(a1(E
x-A
x)+a2(E
y-A
y)+a3(E
z-A
z))/(a1
2+ a2
2+ a3
2)
1/2, in like manner calculate E point distance plane P
b, P
c, P
ddistance E
pB, E
pC, E
pD, F is apart from formation level P
a, P
b, P
c, P
ddistance be F
pA, F
pB, F
pC, F
pD, J is apart from formation level P
a, P
b, P
c, P
ddistance be J
pA, J
pB, J
pC, J
pD, K is apart from formation level P
a, P
b, P
c, P
ddistance be K
pA, K
pB, K
pC, K
pD, L is apart from formation level P
a, P
b, P
c, P
ddistance be L
pA, L
pB, L
pC, L
pD;
S6: to the every bit opposed formations plane P of E, F, J, K, the L on built-in element 12 surface
a, P
b, P
c, P
dfour distances get maximal value and minimum value, calculate the difference of this maxima and minima, if this difference is less than this preset value, this measurement result is effective, then enter next step; If this difference is more than or equal to a preset value M, then plate body 11 out-of-flatness of circuit board 10, above-mentioned data invalid, returns step S3 and carries out remeasuring data; This preset value M considers according to the accuracy synthesis measuring requirement and surveying instrument, in the present embodiment, the precision of described three-dimensional measuring instrument 20 is 0.010mm, and described preset value M can take the numerical value between 0.05mm to 0.25mm, more optimally, this preset value M is 0.2mm;
Particularly, for E point, E point distance plane P
a, P
b, P
c, P
ddistance E
pA, E
pB, E
pC, E
pD, find out E
pA, E
pB, E
pC, E
pDmaximal value and minimum value, whether the difference then calculating this maxima and minima meets and is less than M value, and expression formula is as follows: MAX(E
pA, E
pB, E
pC, E
pD)-MIN(E
pA, E
pB, E
pC, E
pD) < M;
S7: when this measurement result is effective, the some E on built-in element 12 surface are relative to the formation level P of some A close on plate body 11 and consecutive point D, B
adistance E
pAas the coplane degree G of the relative plate body 11 of an E
e, in like manner put F and formation level P
bdistance F
pBas the coplane degree G of the relative plate body 11 of a F
f, some J and formation level P
cdistance J
pCas the coplane degree G of the relative plate body 11 of a J
j, some K and formation level P
ddistance K
pDas the coplane degree G of the relative plate body 11 of a K
k; Point L and each formation level P
a, P
b, P
c, P
deach distance L
pA, L
pB, L
pC, L
pDmaximal value be the coplane degree G of the relative plate body 11 of a L
l; Get some E, F, J, K, L coplanar G relative to plate body 11 on built-in element 12 surface
e, G
f, G
j, G
k, G
lmaximal value as built-in element 12 coplane degree with plate body 11.
Understandably, the quantity of the point that described plate body 11 is got can be more than four, and getting of this built-in element 12 a little can correspondingly increase simultaneously.
This measuring method under the prerequisite not destroying circuit board 10, can record the coplane degree in the surface of built-in element 12 and the plate face of circuit board 10 accurately, and measuring speed is fast, and computing method can realize software programming and seem easy.Further, because the present invention takes at least four measurement points on plate body 11, and by same point and the checking of the range difference of different formation level on built-in element 12, avoid the error that plate body 11 out-of-flatness causes, ensure that the accuracy of this coplane degree.
The above embodiment only have expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a measuring method for the coplane degree of circuit board surface, this circuit board comprises a plate body and is embedded in the built-in element of plate body, and the end face of this built-in element is exposed to the end face of this plate body, and the step of this measuring method comprises:
S1: provide the three-dimensional measuring instrument that has a height measurement function, this three-dimensional measuring instrument comprises a measuring table, this three-dimensional measuring instrument can the three-dimensional coordinate of any point on metering circuit plate;
S2: this circuit board is positioned on the measuring table of this three-dimensional measuring instrument, and the end face making exposed described built-in element is upward;
S3: use this three-dimensional measuring instrument to measure the three-dimensional coordinate of described plate body four points (A, B, C, D) of this built-in element periphery successively;
S4: use this three-dimensional measuring instrument to measure the three-dimensional coordinate of four points (E, F, J, K) of the surface perimeter part of this built-in element and a point (L) of core successively, four points of four points of the surface perimeter part of this built-in element corresponding described plate body separately;
S5: construct a plane by any one point in the point (A, B, C, D) of four on described plate body and at 2 adjacent with this arbitrfary point be selected, four formation levels are set altogether, calculate the distance of four formation levels of the relatively described plate body of every bit in five points on this built-in element;
S6: maximal value and minimum value are got to four distances of the relatively described formation level of every bit in five points (E, F, J, K, L) on described built-in element surface, the independent difference calculating the maxima and minima of the distance of every bit and each formation level, if this difference is less than a preset value, then enter next step S7; If this difference is more than or equal to this preset value, then plate body out-of-flatness, above-mentioned measurement data is invalid, returns described step S3 and remeasures;
S7: using the coplane degree of the relative plate body of point that the every bit in four of the peripheral part of built-in element points (E, F, J, K) is selected with the distance of the formation level of adjacent two relative to point close on plate body in four points (E, F, J, K) of the peripheral part of this built-in element, gets apart from four distances of described four formation levels the coplane degree that maximal value is the relative plate body of point (L) of the core of this built-in element by the point (L) of the core of this built-in element; Relatively the coplane degree of the relative plate body of five points (E, F, J, K, L) of this built-in element, gets the coplane degree that maximal value is this built-in element and plate body.
2. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, it is characterized in that: in described step S3, four points of this plate body are evenly distributed on the periphery of built-in element.
3. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: in described step S3, and four points of this plate body successively line are a rectangle.
4. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, it is characterized in that: the rectangular setting of described built-in element, in step S4, four point (E, F, J, K) distributions of this built-in element peripheral part are on four angles of built-in element.
5. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, it is characterized in that: in described step S5, described formation level is set by the principle of planar process vector and calculates on described plate body each point respectively apart from the distance of each formation level.
6. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: in described step S6, and described preset value is considered according to the accuracy synthesis measuring requirement and surveying instrument.
7., as the measuring method of the coplane degree of claim 1 or circuit board surface according to claim 6, it is characterized in that: described preset value is the numerical value between 0.05mm to 0.25mm.
8. the measuring method of the coplane degree of circuit board surface as claimed in claim 7, is characterized in that: described preset value is 0.2mm.
9. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: described three-dimensional measuring instrument uses non-contact measurement instrument.
10. the measuring method of the coplane degree of circuit board surface as claimed in claim 1, is characterized in that: described three-dimensional measuring instrument uses optical focusing to survey high method.
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| CN201210525554.4A CN102967291B (en) | 2012-12-07 | 2012-12-07 | Measuring method of coplanarity of surface of circuit board |
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| CN201210525554.4A CN102967291B (en) | 2012-12-07 | 2012-12-07 | Measuring method of coplanarity of surface of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104061897B (en) * | 2014-07-10 | 2017-01-11 | 二重集团（德阳）重型装备股份有限公司 | Large split type nut column coplanarity detection method |
| CN106682413B (en) * | 2016-12-23 | 2019-01-29 | 湖北航天技术研究院计量测试技术研究所 | The determination method of Surface Mount leads of IC basal plane |
| CN108931213B (en) * | 2018-05-07 | 2021-06-25 | 百度在线网络技术（北京）有限公司 | Flatness detection method, device, equipment and storage medium |
| CN111220106A (en) * | 2019-12-05 | 2020-06-02 | 紫光宏茂微电子(上海)有限公司 | Measuring method for chip attached to substrate, storage device and terminal |
| CN112833831A (en) * | 2020-12-31 | 2021-05-25 | 中国航发长春控制科技有限公司 | Coplanarity parameter detection method |
| CN112923874B (en) * | 2021-01-28 | 2023-06-20 | 广州视源电子科技股份有限公司 | Intelligent interaction flat plate and method and device for detecting flatness of spliced screen |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |