CN102980552A - Measuring method of coplanar degree of circuit board surface - Google Patents
Measuring method of coplanar degree of circuit board surface Download PDFInfo
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- CN102980552A CN102980552A CN2012105297566A CN201210529756A CN102980552A CN 102980552 A CN102980552 A CN 102980552A CN 2012105297566 A CN2012105297566 A CN 2012105297566A CN 201210529756 A CN201210529756 A CN 201210529756A CN 102980552 A CN102980552 A CN 102980552A
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Abstract
The invention discloses a measuring method of a coplanar degree of a circuit board surface. The measuring method comprises the following steps of providing a three-D measuring meter having a height-measurement function, placing a circuit board on a measuring platform of the three-D measuring meter, allowing the top surface of the circuit board exposing a built-in component to face upward, using the three-D measuring meter to sequentially measure heights H1 to Hn from any points A1 to An of the top surface of the built-in component to the measuring platform, selecting points B1 to Bn on a board body, which are close to the points A1 to An of the built-in component, using the three-D measuring meter to sequentially measure heights h1 to hn from the points B1 to Bn on the board body to the measuring platform, calculating coplanar degrees D1 to Dn of the points A1 to An of the built-in component and the corresponding points B1 to Bn on the board body, comparing the coplanar degrees D1 to Dn, and selecting the maximum value as the coplanar degree between the built-in component and the board body.
Description
Technical field
The present invention relates to a kind of measuring method of coplane degree of circuit board plate face, particularly relate to a kind of measuring method of plate face with the coplane degree on the surface that is embedded in the built-in element in this circuit board of circuit board.
Background technology
Along with making rapid progress of science and technology, electronic component trends towards microminiature and extra-thin future development more, and printed circuit board also trends towards high-accuracy figure and slim multiple stratification more.Thus, arrange that at circuit board a large amount of electronic component of installation is more and more difficult.Passive device is in the great majority in the various electronic components of assembling on the existing circuit board, industry adopts the inside that a large amount of passive devices is assembled in circuit board in the mode of imbedding usually, can shorten element length of arrangement wire each other, improve electrical specification, improve effective circuit board package area, reduce the pad of circuit board plate face etc.Therefore, built-in device is ideal a kind of installation form and technology.Yet, the surface that built-in element need to guarantee to be embedded in the assembly in the circuit board and the plate face of circuit board at grade, with conserve space and prevent this fabricated section and other elements of being located on the circuit board interfere.
Existing circuit board is imbedded the measuring method of the coplane degree of the fabricated section in it with it, the partial circuit plate plate body that usually will comprise first this passive device is separated from whole circuit board, then measure the difference in height of the relative circuit board surface in surface of this passive device, thereby obtain the coplane degree of passive device and circuit board.Therefore, the measuring method of the coplane degree of existing circuit board plate face need to be destroyed its sample, and can only obtain the numerical value of the coplane degree of the surface of passive device at edge and circuit board plate face, the coplane degree of assembly and circuit board be can't reflect comprehensively, exactly, thereby quality and the use of product affected.
Summary of the invention
In view of this, be necessary to provide the method for plate face with the coplane degree on the surface that is embedded in the built-in element in this circuit board of metering circuit plate under a kind of prerequisite not destroying the circuit board sample.
A kind of measuring method of coplane degree of circuit board plate face, this circuit board comprise a plate body and be embedded in the built-in element of plate body, and the end face of this built-in element is exposed to the end face of this plate body, and the step of this measuring method comprises:
S1: a three-dimensional measuring instrument with height measurement function is provided, and this three-dimensional measuring instrument comprises a measuring table;
S2: this circuit board is positioned on the measuring table of this three-dimensional measuring instrument, and the end face that makes exposed described built-in element up;
S3: use this three-dimensional measuring instrument measure successively the surperficial arbitrfary point A1 of this built-in element, A2, A3 ..., the described measuring table of An distance height H 1, H2, H3 ..., Hn, n is the quantity of the measurement point of getting on this built-in element, and the n value is more than or equal to 3;
S4: plate body choose respectively the described built-in element of distance some A1, A2, A3 ..., the some B1 that approaches of An, B2, B3 ..., Bn;
S5: use this three-dimensional measuring instrument to measure successively to put on this plate body B1, B2, B3 ..., the described measuring table 21 of Bn distance height be respectively h1, h2, h3 ..., hn;
S6: calculate this built-in element some A1, A2, A3 ..., corresponding some B1 on An and the plate body, B2, B3 ..., Bn coplane degree D1, D2, D3 ..., Dn;
S7: relatively each coplane degree D1, D2, D3 ..., Dn, select maximal value as the coplane degree of this built-in element and this plate body.
Further, among the described step S3, described some A1, A2, A3 ..., An is the arbitrfary point of this built-in element fringe region.
Further, among the described step S4, at first measure an A1 apart from the some C1 of the inward flange minimum of this plate body, take C1 as the center of circle, in the zone that plate body is got Radius r, on this zone, choose arbitrarily a bit as the some B1 of plate body near A1; In like manner measure A2, A3 ..., An apart from some C2, the C3 of this built-in element edge minimum ..., Cn, correspondence select B2, B3 on this plate body ..., Bn.
Further, among the described step S4, when A1, A2, A3 ..., An has respectively two or morely apart from the point of this built-in element edge minimum, choose at random one.
Further, among the described step S4, the value of described radius r is less than or equal to half of this built-in element breadth extreme.
Further, among the described step S4, the value of described radius r is inversely proportional to the quantity n of selected point, and n is larger, and r is then less.
Further, among the described step S6, coplane degree D1 be the absolute value of the difference of H1 and h1, absolute value that D2 is the difference of H2 and h2 ..., Dn is the absolute value of the difference of Hn and hn.
What further, described three-dimensional measuring instrument used is the non-contact measurement height.
Further, described three-dimensional measuring instrument uses optical focusing to survey high method.
Compared with prior art, this measuring method can record coplane degree built-in element and plate face circuit board accurately under the prerequisite of not destroying circuit board, and measurement accuracy is high.
Description of drawings
Fig. 1 is the side sectional view of an embodiment of circuit board of the present invention.
Fig. 2 is the vertical view of circuit board shown in Figure 1.
Embodiment
For technical scheme of the present invention can more clearly be showed, the invention will be further described below in conjunction with accompanying drawing.
As shown in Figures 1 and 2, the measuring method of present embodiment is the measuring method to the coplane degree on plate body 11 surfaces of a circuit board 10 and built-in element 12 surfaces.
This plate body 11 is the plate body of printed circuit board (PCB), has the parts such as insulation course, conductive layer, is the supporter of electronic devices and components.This built-in element 12 can be the electronic components such as passive device.This built-in element 12 is assembled in the inside of this plate body 11 by modes such as the person imbed.The bottom of this built-in element 12 and sidewall are contained in this plate body 11, and the end face of this built-in element 12 is exposed on the end face of plate body 11.
The measuring method of the coplane degree on the surface of the built-in element 12 of this circuit board 10 and the surface of plate body 11 may further comprise the steps, and wherein this built-in element 12 is the rectangle setting:
S1: a three-dimensional measuring instrument 20 with height measurement function is provided, and in the present embodiment, this three-dimensional measuring instrument 20 is that what to use is the non-contact measurement height, surveys high mode as using the Z axis optical focusing;
S2: this circuit board 10 is positioned on the measuring table 21 of this three-dimensional measuring instrument 20, and makes its exposed surface that described built-in element 12 is installed up;
S3: use this three-dimensional measuring instrument 20 measure successively the surperficial arbitrfary point A1 of this built-in element 12, A2, A3 ..., the described measuring table 21 of An distance height be respectively H1, H2, H3 ..., Hn; N is the quantity of the measurement point of getting on this built-in element 12, and the n value is more than or equal to 3;
S4: on plate body 11 selected distance described some A1, A2, A3 ..., the some B1 that approaches of An, B2, B3 ..., Bn; Particularly, measure an A1 apart from the some C1 of the inward flange minimum of this plate body 11, take C1 as the center of circle, in the zone that plate body 11 is got Radius r, on this zone, choose arbitrarily 1 B1 as the point of plate body 11 near A1; In like manner measure A2, A3 ..., An apart from some C2, the C3 of these built-in element 12 edge minimums ..., Cn, correspondence select B2, B3 on this plate body 11 ..., Bn; Wherein, two or more if A1 has apart from the point of these built-in element 12 edge minimums, then choose at random one; The value of radius r is less than or equal to half of this built-in element 12 breadth extremes; In the present embodiment, the value of this radius r is inversely proportional to the quantity n of selected point, and n is larger, and r is then less.
S5: use this three-dimensional measuring instrument 20 to measure successively to put on this plate body 11 B1, B2, B3 ..., the described measuring table 21 of Bn distance height be respectively h1, h2, h3 ..., hn; During concrete the measurement, regulate the X of this three-dimensional measuring instrument 20, the position that Y-axis can move to required measurement, at the height that can measure required point by the Z axis optical measurement;
S6: calculate this built-in element 12 some A1, A2, A3 ..., corresponding some B1 on An and the plate body 11, B2, B3 ..., Bn coplane degree D1, D2, D3 ..., Dn, wherein D1=︱ H1-h1 ︱, D2=︱ H2-h2 ︱, D3=︱ H3-h3 ︱ ..., Dn=︱ Hn-hn ︱, namely D1 be the absolute value of the difference of H1 and h1, absolute value that D2 is the difference of H2 and h2 ..., Dn is the absolute value of the difference of Hn and hn;
S7: relatively each coplane degree D1, D2, D3 ..., Dn, select maximal value and then be the coplane degree of this built-in element 12 with this plate body 11.
In the S3 of present embodiment step, this arbitrfary point A1, A2, A3 ..., An is the arbitrfary point of these built-in element 12 fringe regions, in S4, only need like this measurement point A1, A2, A3 ..., An is apart from the obvious distance at two close edges on the plate body 11, thereby find out A1, A2, A3 ..., An apart from some C2, the C3 of these plate body 11 inward flange minimums ..., Cn.
This measuring method can be under the prerequisite of not destroying circuit board 10, can record accurately the coplane degree of the plate face of the surperficial any point of built-in element 12 and circuit board 10, and measuring speed is fast, and computing method are easy.Further, since taked to find out first among the S4 A1, A2, A3 ..., An apart from the some C1 of the inward flange minimum of this plate body 11, C2, C3 ..., Cn, so that the some A1 of built-in element 12, A2, A3 ..., corresponding some B1 on An and the plate body 11, B2, B3 ..., Bn is positioned at the same side of built-in element 12, the error that has caused when having reduced circuit board 10 relative measurement platforms 21 integral inclination.
The above embodiment has only expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. the measuring method of the coplane degree of a circuit board plate face, this circuit board comprise a plate body and be embedded in the built-in element of plate body, and the end face of this built-in element is exposed to the end face of this plate body, and the step of this measuring method comprises:
S1: a three-dimensional measuring instrument with height measurement function is provided, and this three-dimensional measuring instrument comprises a measuring table;
S2: this circuit board is positioned on the measuring table of this three-dimensional measuring instrument, and the end face that makes exposed described built-in element up;
S3: use this three-dimensional measuring instrument measure successively the surperficial arbitrfary point A1 of this built-in element, A2, A3 ..., the described measuring table of An distance height H 1, H2, H3 ..., Hn, n is the quantity of the measurement point of getting on this built-in element, and the n value is more than or equal to 3;
S4: plate body choose respectively the described built-in element of distance some A1, A2, A3 ..., the some B1 that approaches of An, B2, B3 ..., Bn;
S5: use this three-dimensional measuring instrument to measure successively to put on this plate body B1, B2, B3 ..., the described measuring table of Bn distance height be respectively h1, h2, h3 ..., hn;
S6: calculate this built-in element some A1, A2, A3 ..., corresponding some B1 on An and the plate body, B2, B3 ..., Bn coplane degree D1, D2, D3 ..., Dn;
S7: relatively each coplane degree D1, D2, D3 ..., Dn, select maximal value as the coplane degree of this built-in element and this plate body.
2. the measuring method of the coplane degree of circuit board plate face as claimed in claim 1 is characterized in that: among the described step S3, described some A1, A2, A3 ..., An is the arbitrfary point of this built-in element fringe region.
3. the measuring method of the coplane degree of circuit board plate face as claimed in claim 1, it is characterized in that: among the described step S4, at first measure an A1 apart from the some C1 of the inward flange minimum of this plate body, take C1 as the center of circle, in the zone that plate body is got Radius r, on this zone, choose arbitrarily a bit as the some B1 of plate body near A1; In like manner measure A2, A3 ..., An apart from some C2, the C3 of this built-in element edge minimum ..., Cn, correspondence select B2, B3 on this plate body ..., Bn.
4. the measuring method of the coplane degree of circuit board plate face as claimed in claim 3 is characterized in that: among the described step S4, when A1, A2, A3 ..., An has respectively two or morely apart from the point of this built-in element edge minimum, choose at random one.
5. the measuring method of the coplane degree of circuit board plate face as claimed in claim 3 is characterized in that: among the described step S4, the value of described radius r is less than or equal to half of this built-in element breadth extreme.
6. the measuring method of the coplane degree of circuit board plate face as claimed in claim 3 is characterized in that: among the described step S4, the value of described radius r is inversely proportional to the quantity n of selected point, and n is larger, and r is then less.
7. the measuring method of the coplane degree of circuit board plate face as claimed in claim 1 is characterized in that: among the described step S6, coplane degree D1 be the absolute value of the difference of H1 and h1, absolute value that D2 is the difference of H2 and h2 ..., Dn is the absolute value of the difference of Hn and hn.
8. the measuring method of the coplane degree of circuit board plate face as claimed in claim 1 is characterized in that: what described three-dimensional measuring instrument used is the non-contact measurement height.
9. the measuring method of the coplane degree of circuit board plate face as claimed in claim 1 is characterized in that: described three-dimensional measuring instrument uses optical focusing to survey high method.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210529756.6A CN102980552B (en) | 2012-12-07 | 2012-12-07 | Measuring method of coplanar degree of circuit board surface |
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| CN201210529756.6A CN102980552B (en) | 2012-12-07 | 2012-12-07 | Measuring method of coplanar degree of circuit board surface |
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| CN102980552A true CN102980552A (en) | 2013-03-20 |
| CN102980552B CN102980552B (en) | 2015-04-22 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822392A1 (en) * | 1998-05-19 | 1999-12-09 | Fraunhofer Ges Forschung | Method to determine three-dimensional coordinates of defect on surface of another object, for use in quality control |
| CN1847784A (en) * | 2005-04-05 | 2006-10-18 | 华为技术有限公司 | Device pin coplanarity measuring method |
| JP2012058057A (en) * | 2010-09-08 | 2012-03-22 | Tresa Co Ltd | Gage for three-dimensional coordinate measuring instrument and precision evaluation method for three-dimensional coordinate measuring instrument |
| CN102749064A (en) * | 2012-06-19 | 2012-10-24 | 歌尔声学股份有限公司 | Method and device for measuring backboard planeness of liquid crystal display device |
-
2012
- 2012-12-07 CN CN201210529756.6A patent/CN102980552B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822392A1 (en) * | 1998-05-19 | 1999-12-09 | Fraunhofer Ges Forschung | Method to determine three-dimensional coordinates of defect on surface of another object, for use in quality control |
| CN1847784A (en) * | 2005-04-05 | 2006-10-18 | 华为技术有限公司 | Device pin coplanarity measuring method |
| JP2012058057A (en) * | 2010-09-08 | 2012-03-22 | Tresa Co Ltd | Gage for three-dimensional coordinate measuring instrument and precision evaluation method for three-dimensional coordinate measuring instrument |
| CN102749064A (en) * | 2012-06-19 | 2012-10-24 | 歌尔声学股份有限公司 | Method and device for measuring backboard planeness of liquid crystal display device |
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| CN102980552B (en) | 2015-04-22 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |