CN102959698B - 在具有初始断点的线缆上安装的芯片元件 - Google Patents

在具有初始断点的线缆上安装的芯片元件 Download PDF

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CN102959698B
CN102959698B CN201180030660.9A CN201180030660A CN102959698B CN 102959698 B CN102959698 B CN 102959698B CN 201180030660 A CN201180030660 A CN 201180030660A CN 102959698 B CN102959698 B CN 102959698B
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cable
recess
chip component
chain
antenna
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CN102959698A (zh
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J.布鲁恩
F.弗拉萨蒂
D.维卡德
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Abstract

本发明涉及链，该链包括牢固地连接到线缆（12a）的多个微电子芯片元件（10）。线缆具有凹口（18a），该凹口限定当线缆经受拉伸应力时的优先断裂点。如果线缆是导电的，则凹口（18a）展开为使线缆在芯片和凹口之间的长度等于天线的长度。

Description

在具有初始断点的线缆上安装的芯片元件
技术领域
本发明涉及连接到线缆的微电子芯片元件，该微电子芯片元件的最大尺寸可小于一个毫米，本发明尤其涉及形成由自动化系统可更容易处理的链。
背景技术
图1A和1B示出了微电子芯片元件的链，例如通过专利申请EP2099060中描述的方法形成的链。
图1A示出了一部分链的俯视图。通常为平行六面体形状的若干芯片元件10连接在两个平行的线缆12a和12b之间。
图1B示出了其中一个芯片元件10的侧视图。该元件提供有两个横向凹槽，其中线缆12a和12b安装其中。在线缆为导体且用于传输电信号的情况下，这样的凹槽可提供有电连接焊盘。
线缆12a和12b通常大部分用于传输电信号和连接小尺寸的芯片元件在一起二者，以形成可由自动化系统更容易处理的组件。
专利申请WO2009004243描述了使用图1A中类型的链以形成射频收发装置，尤其是用于识别目的（RFID）。然后，每个芯片元件10并入所有的RFID功能。线缆12a和12b在每个芯片元件周围被切开以形成偶极天线。该偶极天线由芯片元件一侧上的一根线缆12a和该元件相对侧上的一根线缆12b形成。
图2示出了将若干RFID元件16结合其中而形成的目标物14。
目标物14可为管子，希望用RFID元件按规律间隔做标记。连续制造的管子旨在以适合于不同需要的长度切开。在此情况下，希望每个切割长度包括能用以识别管子的至少一个RFID元件。按规律分布在较长的管段中的RFID元件可沿管子标记具体位置或识别管段。
更为普遍的是，可考虑按规律地将RFID元件结合在连续制造的目标物中。除了管子外，也可涉及绳、型材、织物、膜、带等。
链在诸如挤出管子的连续制造目标物中的结合没有出现具体问题，因为希望芯片元件以链的形式在最终的目标物中仍保持连接。
然而，如果希望链的芯片元件分开结合在目标物中则出现了问题，尤其是在这些芯片元件将成为RFID元件的情况下。例如，无法设想在自动化的管子挤出工艺中，分开芯片元件且将它们逐一设在挤出端口的位置。
分开的RFID芯片元件的天线导致处理上的问题。实际上，天线应保持直线，因此必须确保它们不被弯曲。
发明内容
因此，希望有一种装置，其能在连续制造目标物中自动结合分开的芯片元件，尤其是RFID元件。
为了满足该需要，提供包括连接到线缆的若干微电子芯片元件的链。线缆具有凹口，其限定当线缆经受拉伸应力时的优先断裂点。如果线缆是导体，则凹口可被展开为使包括在芯片元件和凹口之间的线缆长度等于天线的长度。
还提供用于结合微电子芯片元件在目标物中的方法，包括下面的步骤：将包括连接至线缆的若干微电子芯片元件的链引入目标物，线缆具有凹口，该凹口限定当线缆经受拉伸应力时的优先断裂点；以及在目标物中产生在链的轴线上的拉伸应力以在凹口位置断开线缆。
根据一种改进，该方法包括下面的步骤：由储备的材料连续形成目标物；以及将芯片元件的链引入正在形成的目标物。
附图说明
其它的优点和特征通过下面对本发明特定实施例的描述将更加明显易懂，本发明的特定实施例仅以非限定性示例的目的给出且表示在附图中，其中：
图1A和1B示出了前面描述的安装在链上的芯片元件；
图2示出了前面描述的结合了执行RFID功能的芯片元件的细长目标物；
图3示出了芯片元件链的实施例，其能自动化地将元件结合在连续制造的目标物中，尤其是在这些元件集成了RFID功能的情况下；
图4示出了将芯片元件结合在挤出物中的方法；
图5示出了能在线缆上切口的芯片元件的实施例；以及
图6示出了图3的链的可替代实施例。
具体实施方式
图3示出了能使元件由简单的拉伸应力分开的芯片元件链的实施例。
作为示例，图3示出了与图1A相同的构造，其中芯片元件10通过相对两侧连接到两个线缆12’a和12’b。
每一个线缆12’a和12’b在两个元件10之间的部分分别具有凹口18a和18b。这些凹口限定优先断裂点或有意初始断裂点，旨在当足够的拉伸应力施加到链或线缆时，在线缆的任何其它点之前断开。因此，旨在通过作用在链上的拉伸应力使线缆在凹口位置受控断开，从而分开链的芯片元件。
凹口可以以不同的方式制造，例如，通过锯切割、刀片切入、局部腐蚀或局部熔化。前面的两个示例（锯和刀片）对应于线缆的切割，另外的两个示例（腐蚀和熔化）对应于线缆的局部变形。换言之，至少一个凹口是线缆12a的切口或局部变形。
已示出凹口18a和18b位于两个芯片元件10之间的线缆部分的中心。这在线缆没有后续功能的情况下是方便的。
如果线缆要用作RFID元件的偶极天线，则凹口19a和19b最好设在线缆部分12a和12b的相对侧。因此，当拉伸应力作用在链上时，元件10与指向相反方向的天线部分分开，如图2的元件16所示。这意味着链中元件10之间的节距对应于天线的长度。
在更普遍的情况下，如果链节距大于天线长度，则提供四个凹口18a至19b。于是，凹口18限定了天线的长度，并且凹口19用于切断多余的金属线部分。
图4示出了在由塑料材料制造的型材或管子的挤出方法中使用图3的具有切口的线缆链。非常示意性地示出了包括原料材料40的挤出装置，原料材料40以膏的形式容纳在压力供给罐42中。该罐提供有喷嘴44，型材或管子46通过该喷嘴44以如箭头Ve所示的恒定速度挤出。
将图3类型的芯片元件链48以小于挤出速度Ve的速度Vi插入在喷嘴44的位置经受挤出的膏中。在链48插入膏的区域中，膏以足够的流动性涂覆在链48上。当膏达到喷嘴时，它开始凝固且束缚住链48。然后，在沿着链48拉动时，膏被拉长且加速到速度Ve。以小于Ve的速度提供的链在喷嘴出口的加速区域中经受拉伸应力而在它们的凹口位置断开线缆，如所示。在最终的型材中发现，芯片元件之间的节距与链节距成比例且与比率Ve/Vi成比例。
图4所示类型的链包括在两个芯片元件之间的每个金属线部分中的两个凹口（18、19）。在形成了连接至元件的具有期望长度（例如用作偶极天线）的两个线缆部分的同时，也形成了切断的多余部分。
为了讨论清楚，链48已经示出在图4中的挤出物46的轴线上。在实际的挤出装置中，链48可能不设置在原料材料40中，因为在这里它将难于处理。最好通过喷嘴的侧开口引入链，从而将线性元件结合在挤出物中，像已知在传统的挤出装置中的一样。
也可考虑一步接着一步地将链引入目标物。在每个步骤上，新的芯片元件呈现为与目标物接触，从而通过拉动线缆使其在它们的凹口位置断开而跟着拖动芯片元件。该方法更尤其适合于目标物是通过编织而连续形成的情况，其中被编织的线缆束缚住芯片元件，使芯片元件跟着编织的目标物被拖动。
还可考虑将链结合在目标物中而不初始断开线缆。一旦目标物已经形成，则沿着链的轴线拉伸目标物，使线缆在它们的凹口位置断开。该方案更适合于目标物经受永久变形的拉伸方法。
图5以侧视图的方式示出了芯片元件10的实施例，其能在形成链时在线缆12上切口。元件10包括凹槽，线缆12（12a或12b）插入该凹槽中。凹槽的侧壁之一在凹槽的端部包括尖肋50，其延伸通过一部分凹槽宽度。在所述线缆连接到芯片元件时，该肋在线缆12上切口。通过给每个芯片元件的两个凹槽提供这样的肋，可形成图3的凹口19a和19b而没有额外的步骤。进一步地，如果链节距对应于所期望的天线长度，则多出中心凹口18a和18b，但也无需额外的凹口形成步骤。
图4还示出了两个芯片元件之间的金属线部分在两个位置断开，这两个位置分别对应于凹口18和19。实际上，如果线缆能自由地轴向滑动，该部分仅在两个凹口中单独一个的位置上断开。断开的第一凹口在金属线部分上释放出拉伸应力，并且保护了第二凹口。该行为将根据线缆和涂覆材料之间的粘合力而变化。如果粘合力很高，则获得接近于所示的结果。
图6示出了可替代的芯片元件链，如果希望，它能在两个芯片元件之间增加多个线缆断裂点，而与涂覆于链的材料的性质无关。
锚定元件60连接到线缆12的在两个芯片元件10之间的部分。该锚定元件可以与元件10相同的方式制造，除了它不包括微电子芯片外。位于图3中心的凹口18a和18b此处被移位在锚定元件60两侧的线缆部分上，与包括凹口19的线缆部分相反。
与图3一样，凹口18限定了与芯片元件10保持连接的天线部分的长度。由凹口19限定的其余金属线部分将在被拉伸应力分离后，与锚定元件60保持连接。
当然，与芯片元件10一样，锚定元件60可为如图5所示的那样，就是说，锚定元件60可包括在形成链时在线缆上切口的肋。在此情况下，避免了任何额外的凹口形成步骤。
在链结合于高粘合力材料中的情况下，尤其是在链结合于不断开的目标物中的情况下，为了以后通过拉长目标物而使目标物断开，线缆可能在凹口位置外的某处断开。为了避免该缺点，线缆可涂有抗粘合剂，其可与线缆希望结合的材料相容。
本领域的技术人员可进行本发明的各种替换和修改。尽管已经描述了将链的每个芯片元件单独结合在目标物中，但是可考虑将芯片元件链的子链结合至其中，也就是，在多个芯片元件后面断开链，而不是在每个芯片元件后面断开链。于是，线缆仅在子链之间被切口。
提供有用于容纳线缆的凹槽的芯片元件已作为示例加以描述。本发明描述的原理并不限于这种线缆安装方式；本领域的技术人员可考虑以另外的方式安装线缆，例如，通过在芯片元件表面上提供的焊盘上焊接的方式来安装。
尽管图3的示例基于使用通过两个线缆12’a和12’b连接在一起的微电子芯片元件10，但是本领域的技术人员可将本发明应用到包括连接至单根线缆12a的若干微电子芯片元件10的链，所述单根线缆12a具有凹口18a，用来限定当所述线缆12a经受拉伸应力时的优先断裂点。于是，本领域的技术人员易于根据上面给出的示例而采用例如包括单个凹槽的芯片元件，旨在容纳该线缆。

Claims (20)

1.一种链，包括连接到线缆(12a)的若干微电子芯片元件(10)，其特征在于，
该线缆具有凹口(18a)，其限定当该线缆经受拉伸应力时的优先断裂点；
该线缆是导体且该链包括需要天线的芯片元件(10)，该凹口(18a)展开为使在需要天线的芯片元件和凹口之间包括的线缆长度等于天线的长度；
两个芯片元件(10)之间的该线缆长度大于该天线的长度，所述线缆长度具有两个凹口，其中一个凹口(18a)位于距两个元件之一的天线长度上。
2.根据权利要求1所述的链，其特征在于，其包括提供有凹槽的芯片元件，该凹槽具有插入其中的该线缆(12)，该凹槽包括靠近其端部之一的凸脊(50)，设置为在该线缆插入该凹槽时将其切口。
3.根据权利要求1所述的链，其特征在于，其包括接附到该线缆(12’a)且设置在该芯片元件(10)之间的锚定元件(60)，使得该线缆在锚定元件和芯片元件之间具有单一凹口(18a、19a)。
4.根据权利要求1所述的链，其特征在于，其包括连接到该芯片元件(10)的两个相对侧的两个导线(12a、12b)，该凹口展开在该两个线缆上以限定从每个需要天线的芯片元件的相对侧开始的天线长度。
5.根据权利要求1所述的链，其特征在于，该线缆涂有抗粘合剂。
6.根据权利要求1所述的链，其特征在于，该凹口的至少一个是该线缆(12a)的切口或局部变形。
7.一种链，包括连接到线缆(12a)的若干微电子芯片元件(10)，其特征在于，
该线缆具有凹口(18a)，其限定当该线缆经受拉伸应力时的优先断裂点；
该线缆是导体且该链包括需要天线的芯片元件(10)，该凹口(18a)展开为使在需要天线的芯片元件和凹口之间包括的线缆长度等于天线的长度；
该链包括提供有凹槽的芯片元件，该凹槽具有插入其中的该线缆(12)，该凹槽包括靠近其端部之一的凸脊(50)，设置为在该线缆插入该凹槽时将其切口。
8.根据权利要求7所述的链，其特征在于，其包括接附到该线缆(12’a)且设置在该芯片元件(10)之间的锚定元件(60)，使得该线缆在锚定元件和芯片元件之间具有单一凹口(18a、19a)。
9.根据权利要求7所述的链，其特征在于，其包括连接到该芯片元件(10)的两个相对侧的两个导线(12a、12b)，该凹口展开在该两个线缆上以限定从每个需要天线的芯片元件的相对侧开始的天线长度。
10.根据权利要求7所述的链，其特征在于，该线缆涂有抗粘合剂。
11.根据权利要求7所述的链，其特征在于，该凹口的至少一个是该线缆(12a)的切口或局部变形。
12.一种链，包括连接到线缆(12a)的若干微电子芯片元件(10)，其特征在于，
该线缆具有凹口(18a)，其限定当该线缆经受拉伸应力时的优先断裂点；
该线缆是导体且该链包括需要天线的芯片元件(10)，该凹口(18a)展开为使在需要天线的芯片元件和凹口之间包括的线缆长度等于天线的长度；
该链包括连接到该芯片元件(10)的两个相对侧的两个导线(12a、12b)，该凹口展开在该两个线缆上以限定从每个需要天线的芯片元件的相对侧开始的天线长度。
13.根据权利要求12所述的链，其特征在于，其包括接附到该线缆(12a)且设置在该芯片元件(10)之间的锚定元件(60)，使得该线缆在锚定元件和芯片元件之间具有单一凹口(18a、19a)。
14.根据权利要求12所述的链，其特征在于，该线缆涂有抗粘合剂。
15.根据权利要求12所述的链，其特征在于，该凹口的至少一个是该线缆(12a)的切口或局部变形。
16.一种将微电子芯片元件结合在目标物中的方法，其特征在于，包括如下步骤：
将链(48)引入该目标物(46)，该链(48)包括连接到线缆(12a)的若干微电子芯片元件(10)，该线缆(12a)具有凹口(18a)，其限定当该线缆经受拉伸应力时的优先断裂点；以及
在该目标物(46)中产生与该链方向一致的拉伸应力以在该凹口上断裂该线缆。
17.根据权利要求16所述的方法，其特征在于，其包括下面的步骤：
由原料材料(40)连续形成该目标物(46)；以及
将该芯片元件的链引入正在形成的该目标物。
18.根据权利要求17所述的方法，其特征在于，该芯片元件的链以小于该目标物的形成速度的速度连续引入。
19.根据权利要求18所述的方法，其特征在于，该目标物通过塑料材料的挤出形成。
20.根据权利要求17所述的方法，其特征在于，该芯片元件的链逐步引入。
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