CN102923936B - Etching device - Google Patents
Etching device Download PDFInfo
- Publication number
- CN102923936B CN102923936B CN201110229889.7A CN201110229889A CN102923936B CN 102923936 B CN102923936 B CN 102923936B CN 201110229889 A CN201110229889 A CN 201110229889A CN 102923936 B CN102923936 B CN 102923936B
- Authority
- CN
- China
- Prior art keywords
- liquid storage
- storage part
- etching
- etching system
- tumbler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0442—Installation or apparatus for applying liquid or other fluent material to separate articles rotated during spraying operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
- B05B3/10—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements discharging over substantially the whole periphery of the rotating member, i.e. the spraying being effected by centrifugal forces
- B05B3/1007—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements discharging over substantially the whole periphery of the rotating member, i.e. the spraying being effected by centrifugal forces characterised by the rotating member
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Weting (AREA)
Abstract
An etching device comprises a basal body and a liquid storing member, wherein the liquid storing member is arranged on the basal body and is provided with accommodation holes for accommodating an etching liquid; the side surface of the liquid storing member is provided with injection holes communicated with the accommodation holes, and the etching liquid is injected from the injection holes; and the etching device also comprises rotation members arranged on the basal body, and the rotation members are arranged opposite to the side surface of the liquid storing member. The etching liquid can be injected to curved glass from all angles because the rotation members drive the curved glass to rotate when the curved glass is etched by the etching device, so the curved glass is uniformly etched by the etching liquid, thereby the non-uniform etching caused by the non-uniform flow velocity of the etching liquid because of the irregular surface of the curved glass is avoided.
Description
Technical field
The present invention relates to a kind of etching system, relate in particular to a kind of for glass is carried out to etched etching system.
Background technology
In glass processing process, often relate to glass surface is carried out to etch processes, general etching system comprises multiple nozzles that are arranged side by side, and nozzle below vertically arranges multiple pieces of glass side by side regularly.When etching, etching solution is along glass sides substantially evenly to glass bottom diffluence.But above-mentioned etching system is only applicable to etching sheet glass, as while needing etching bend glass, due to the irregular variation of bend glass side curvature, make the flow velocity of etching solution inhomogeneous, etching solution is inconsistent in the residence time on bend glass surface, thereby causes bend glass etching inhomogeneous.
Summary of the invention
In view of above content, be necessary to provide a kind of etching system that can uniform etching bend glass.
A kind of etching system, it comprises matrix and liquid storage part, and liquid storage part is installed on matrix, and liquid storage part offers the accommodation hole for accommodating etching solution.The side of liquid storage part also offers the jet hole being communicated with accommodation hole, and etching solution is spouting from jet hole.Etching system also comprises that rotation is installed on the tumbler on matrix, and the side of tumbler and liquid storage part is oppositely arranged.
While adopting above-mentioned etching system etching bend glass, because driving bend glass, tumbler rotates, etching solution can be injected into bend glass from all angles, make bend glass be subject to equably the etching of etching solution, thereby avoided due to bend glass surface imperfection, the flow velocity that makes etching solution is inhomogeneous and cause etching inhomogeneous.
Brief description of the drawings
Fig. 1 is the solid assembling schematic diagram of the etching system that is equiped with bend glass of embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of the etching system that is equiped with bend glass shown in Fig. 1.
Fig. 3 is the sectional view along III-III line in Fig. 1.
Main element nomenclature
| Etching system | 100 |
| Matrix | 10 |
| The first open holes | 11 |
| The second open holes | 13 |
| Liquid storage part | 30 |
| Resettlement section | 31 |
| The first end face | 311 |
| Accommodation hole | 3110 |
| The second end face | 312 |
| Side | 313 |
| Jet hole | 3130 |
| End cap portions | 33 |
| Communicating aperture | 330 |
| Air compressor | 40 |
| Tumbler | 50 |
| Main body | 51 |
| Rotation axis | 53 |
| Bend glass | 200 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, etching system 100 is used for bend glass 200 surfaces to carry out etching, and etching system 100 comprises matrix 10, liquid storage part 30, air compressor 40 and tumbler 50.Liquid storage part 30 is used for holding etching solution, and it is connected with air compressor 40, so that etching solution is interior spouting from liquid storage part 30.Tumbler 50 is installed on matrix 10 rotationally, and contiguous liquid storage part 30.Bend glass 200 is fixed on tumbler 50, can be sprayed on the surface of bend glass 200, with etching bend glass 200 from the interior spouting etching solution of liquid storage part 30.
Please refer to Fig. 2 and Fig. 3, matrix 10 is used for installing liquid storage part 30 and tumbler 50, and in embodiment of the present invention, matrix 10 is discoid.On matrix 10, offer the first open holes 11 and the second open holes 13.The first open holes 11 is opened in the central position of matrix 10.The quantity of the second open holes 13 is multiple, and multiple the second open holess 13 are evenly offered around the first open holes 11, and is positioned at taking the first open holes 11 on the circumferential line in the center of circle.
Liquid storage part 30 comprises resettlement section 31 and end cap portions 33.Resettlement section 31 is roughly right cylinder, and correspondence is installed on the first open holes 11 places.Resettlement section 31 comprises the side 313 away from the second end face 312 and connection the first end face 311 and second end face 312 of the first end face 311 of matrix 10, close matrix 10.The mid-way of the first end face 311 offers accommodation hole 3110, and extends to vertically the position of contiguous the second end face 312, makes accommodation hole 3110 form blind hole to accommodate etching solution.The second end face 312 is fixedly connected with matrix 10.On side 313, radially offer multiple jet holes 3130 that are communicated with accommodation hole 3110 around accommodation hole 3110, multiple jet holes 3130 are covered with side 313.In embodiment of the present invention, multiple jet holes 3130 are rule arranges, and makes multiple jet holes 3130 form vertically laminate structure, and the plane at the every one deck of multiple jet hole 3130 place is parallel with the first end face 311 or the second end face 312.Be appreciated that multiple jet holes 3130 also can be random and arrange in a jumble.End cap portions 33 is connected with the first end face 311 of resettlement section 31, with capping resettlement section 31.End cap portions 33 is cylindrical, and intermediate position offers communicating aperture 330, and communicating aperture 330 is connected with the accommodation hole 3110 of resettlement section 31.
Air compressor 40 is connected with the communicating aperture 330 of liquid storage part 30, and to produce high-pressure air, to make to be contained in the etching solution blowing perforation 3130 of resettlement section 31 spouting.
Be appreciated that air compressor 40 also can omit, in the time of this kind of situation, can make liquid storage part 30 be arranged at rotationally on matrix 10, utilize an actuator to drive liquid storage part 30 to rotate, make etching solution blowing perforation 3130 under the effect of centrifugal force spouting.
Tumbler 50 correspondences are installed on the second open holes 13 places of matrix 10, and its quantity is corresponding with the quantity of the second open holes 13.Tumbler 50 comprises main body 51 and rotation axis 53.Main body 51 is roughly cylindrical, and multiple bend glasses 200 can be installed in its side, and is oppositely arranged with the jet hole 3130 of liquid storage part 30.In embodiment of the present invention, bend glass 200 adopts adhesive means to be fixed on the side of main body 51.Rotation axis 53 is fixed on main body 51 on matrix 10 rotationally through the second open holes 13.Be appreciated that tumbler 50 also can comprise the multiple suckers that are arranged in main body 51, with adsorption curve glass 200.Or tumbler 50 also can comprise the multiple snap-in structures that are arranged in main body 51, to fix engaging bend glass 200.
Etching system 100 also comprises the actuator for driving tumbler 50 to rotate.The quantity of actuator is corresponding with the quantity of tumbler 50, and each actuator is connected with a tumbler 50.Be appreciated that the quantity of actuator also can be less than the quantity of tumbler 50, in the time of this kind of situation, can between tumbler 50, gear mechanism be set, to realize interlock.
When etching bend glass 200, bend glass 200 is installed on to the side of the main body 51 of tumbler 50, then makes tumbler 50 rotate, etching solution blowing perforation 3130 is injected into the surface of bend glass 200.When etching, because driving bend glass 200, tumbler 50 rotates, etching solution can differently be injected into bend glass 200 from all angles height, make bend glass 200 be subject to equably the etching of etching solution, thereby avoided due to bend glass surface imperfection, the flow velocity that makes etching solution is inhomogeneous and cause etching inhomogeneous.
The etching system 100 that is appreciated that embodiment of the present invention also can be used for flat glass to carry out etching, or is used in conjunction with suitable etching solution and also can be used for to be etched of other material to carry out etching.
Be appreciated that those skilled in the art also can do other and change in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (9)
1. an etching system, it comprises matrix and liquid storage part, described liquid storage part is installed on described matrix, described liquid storage part offers the accommodation hole for accommodating etching solution, it is characterized in that: described liquid storage part comprises resettlement section, described resettlement section comprises the first end face away from described matrix, described the first end face is connected with the side of described liquid storage part, described liquid storage part also comprises the end cap portions being connected with the first end face of described resettlement section, described end cap portions offers communicating aperture, described communicating aperture is connected with described accommodation hole, described etching system also comprises air compressor, described air compressor is connected with described communicating aperture, the side of described liquid storage part also offers the jet hole being communicated with described accommodation hole, described etching solution is spouting from described jet hole, described etching system also comprises that rotation is installed on the tumbler on described matrix, and the side of described tumbler and described liquid storage part is oppositely arranged.
2. etching system as claimed in claim 1, is characterized in that: described accommodation hole is opened in described the first end face, and the quantity of described jet hole is multiple, and multiple described jet holes are offered around described accommodation hole.
3. etching system as claimed in claim 2, is characterized in that: described resettlement section is right cylinder, and described accommodation hole extends vertically, and described jet hole radially extends.
4. etching system as claimed in claim 2, is characterized in that: multiple described jet holes are rule and arrange.
5. etching system as claimed in claim 4, is characterized in that: multiple described jet holes form laminate structure, and the plane at the every one deck of multiple described jet holes place is parallel with described the first end face.
6. etching system as claimed in claim 2, is characterized in that: the quantity of described tumbler is multiple, and multiple described tumbler arranges around described liquid storage part.
7. etching system as claimed in claim 1, is characterized in that: described liquid storage part is rotatably installed on described matrix.
8. etching system as claimed in claim 1, is characterized in that: described tumbler comprises main body and is arranged on the side of described main body and multiple suckers or the snap-in structure relative with described jet hole.
9. etching system as claimed in claim 8, is characterized in that: described tumbler also comprises rotation axis, on described matrix, offers open holes, and described rotation axis is fixed on described main body on described matrix rotationally through described open holes.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110229889.7A CN102923936B (en) | 2011-08-11 | 2011-08-11 | Etching device |
| TW100129472A TWI412502B (en) | 2011-08-11 | 2011-08-17 | Etching device |
| US13/299,438 US20130037214A1 (en) | 2011-08-11 | 2011-11-18 | Curved glass sheet etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110229889.7A CN102923936B (en) | 2011-08-11 | 2011-08-11 | Etching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102923936A CN102923936A (en) | 2013-02-13 |
| CN102923936B true CN102923936B (en) | 2014-12-10 |
Family
ID=47638900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110229889.7A Active CN102923936B (en) | 2011-08-11 | 2011-08-11 | Etching device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130037214A1 (en) |
| CN (1) | CN102923936B (en) |
| TW (1) | TWI412502B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107916747A (en) * | 2017-11-13 | 2018-04-17 | 德睿盛兴（大连）装配式建筑科技有限公司 | Exquisiteness builds the assembled wallboard and production method of smooth outside |
| CN108000368B (en) * | 2017-12-01 | 2020-03-31 | 福建和达玻璃技术有限公司 | Anti-dazzle surface treatment equipment and treatment method for curved-edge glass cover plate |
| CN107962501B (en) * | 2017-12-01 | 2019-09-20 | 福建和达玻璃技术有限公司 | The anti-dazzle surface processing equipment of special-shaped glass cover board with angle |
| CN113499912A (en) * | 2021-06-04 | 2021-10-15 | 重庆工程职业技术学院 | Wheel hub paint spraying apparatus is used in new energy automobile production convenient to it is fixed |
| CN116177899A (en) * | 2023-03-17 | 2023-05-30 | 河北光兴半导体技术有限公司 | Glass thinning device |
Citations (6)
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| WO2001028950A1 (en) * | 1999-10-19 | 2001-04-26 | Phifer Smith Corporation | A method and apparatus for treating a substrate with an ozone-solvent solution |
| CN101033116A (en) * | 2006-02-17 | 2007-09-12 | 智圆技术株式会社 | Apparatus of thinning a glass substrate |
| CN101080806A (en) * | 2004-12-17 | 2007-11-28 | 英特尔公司 | Improved uniformity in batch spray processing using independent cassette rotation |
| CN101197255A (en) * | 2006-12-08 | 2008-06-11 | Lg.菲利浦Lcd株式会社 | Apparatus for etching substrate and fabrication line for fabricating liquid crystal display using the same |
| CN101229954A (en) * | 2007-01-25 | 2008-07-30 | 蔡孟廷 | Glass panel cutting method, glass panel cutting device and flat display |
| CN201347410Y (en) * | 2009-02-09 | 2009-11-18 | 新鋐源科技股份有限公司 | Upright type etching mechanism |
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| US1392855A (en) * | 1918-08-12 | 1921-10-04 | Jr Benjamin Skidmore | Hydraulic air-compressor and vacuum-producer |
| US3953276A (en) * | 1972-10-26 | 1976-04-27 | Zenith Radio Corporation | Etching apparatus with plural nozzle arrangements |
| US4485759A (en) * | 1983-01-19 | 1984-12-04 | Multi-Arc Vacuum Systems Inc. | Planetary substrate support apparatus for vapor vacuum deposition coating |
| US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
| US6406551B1 (en) * | 1999-05-14 | 2002-06-18 | Fsi International, Inc. | Method for treating a substrate with heat sensitive agents |
| US6399513B1 (en) * | 1999-11-12 | 2002-06-04 | Texas Instruments Incorporated | Ozonated DI water process for organic residue and metal removal processes |
| JP3662484B2 (en) * | 2000-08-09 | 2005-06-22 | エム・エフエスアイ株式会社 | Wet treatment method and wet treatment apparatus |
| US7524771B2 (en) * | 2002-10-29 | 2009-04-28 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing method using alkaline solution and acid solution |
| US6977215B2 (en) * | 2003-10-28 | 2005-12-20 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using gas sparged water |
| US7422031B2 (en) * | 2004-03-12 | 2008-09-09 | Fsi International, Inc. | Rotary unions, fluid delivery systems, and related methods |
| KR20080071988A (en) * | 2005-11-23 | 2008-08-05 | 에프 에스 아이 인터내셔날,인코포레이티드 | Process for removing material from substrates |
| JP2008013389A (en) * | 2006-07-04 | 2008-01-24 | Nec Corp | Etching device and method for manufacturing thin type glass substrate |
-
2011
- 2011-08-11 CN CN201110229889.7A patent/CN102923936B/en active Active
- 2011-08-17 TW TW100129472A patent/TWI412502B/en not_active IP Right Cessation
- 2011-11-18 US US13/299,438 patent/US20130037214A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001028950A1 (en) * | 1999-10-19 | 2001-04-26 | Phifer Smith Corporation | A method and apparatus for treating a substrate with an ozone-solvent solution |
| CN101080806A (en) * | 2004-12-17 | 2007-11-28 | 英特尔公司 | Improved uniformity in batch spray processing using independent cassette rotation |
| CN101033116A (en) * | 2006-02-17 | 2007-09-12 | 智圆技术株式会社 | Apparatus of thinning a glass substrate |
| CN101197255A (en) * | 2006-12-08 | 2008-06-11 | Lg.菲利浦Lcd株式会社 | Apparatus for etching substrate and fabrication line for fabricating liquid crystal display using the same |
| CN101229954A (en) * | 2007-01-25 | 2008-07-30 | 蔡孟廷 | Glass panel cutting method, glass panel cutting device and flat display |
| CN201347410Y (en) * | 2009-02-09 | 2009-11-18 | 新鋐源科技股份有限公司 | Upright type etching mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201307232A (en) | 2013-02-16 |
| TWI412502B (en) | 2013-10-21 |
| US20130037214A1 (en) | 2013-02-14 |
| CN102923936A (en) | 2013-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170316 Address after: Shenzhen City, Guangdong Guanlan Foxconn science and Technology Park B District Building 5 building C09 floor, C07 building, floor 2, C08 building, floor 4, floor C04, building, 1 Patentee after: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Guanlan Street third community Guanlan Foxconn Technology Park B District, building 4, building 6, building 7, building 13, (I) Patentee before: FuTaiHua Industry (Shenzhen) Co.,Ltd. Patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 518109 Foxconn H5 plant 101, No. 2, Donghuan 2nd Road, Fukang community, Longhua street, Longhua District, Shenzhen, Guangdong Province; plant 5, building C09, 4th floor, building C07, 2nd floor, building C08, 3rd floor, 4th floor, building C04, zone B, Foxconn Hongguan science and Technology Park, Fucheng Dasan community, Guanlan street, Guangdong Province Patentee after: Fulian Yuzhan Technology (Shenzhen) Co.,Ltd. Address before: 518109 Shenzhen Guanlan Foxconn Science and Technology Park, Guangdong Province, District B workshop 5 C09 4 storeys, C07 2 storeys, C08 3 storeys 4 storeys, C04 1 Patentee before: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |