CN102912179A - High electrical and thermal conduction type copper-tellurium-selenium complex alloy material - Google Patents
High electrical and thermal conduction type copper-tellurium-selenium complex alloy material Download PDFInfo
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- CN102912179A CN102912179A CN2012104077709A CN201210407770A CN102912179A CN 102912179 A CN102912179 A CN 102912179A CN 2012104077709 A CN2012104077709 A CN 2012104077709A CN 201210407770 A CN201210407770 A CN 201210407770A CN 102912179 A CN102912179 A CN 102912179A
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Abstract
The invention provides a high electrical and thermal conduction type copper-tellurium-selenium complex alloy material. The high electrical and thermal conduction type copper-tellurium-selenium complex alloy material contains copper, tellurium, selenium and trace adding elements; the material is prepared from the following components in percentage by weight: 0.05 to 0.2% of tellurium, 0.1 to 0.4% of selenium, 0.01 to 0.1% of trace adding elements, and the balance of copper. The trace adding elements are at least one or two kinds of lithium, magnesium and rare earth. The alloy material has electric conductivity of 90 to 103% IACS (International Annealed Copper Standard), and thermal conductivity of 450 to 500wm<-1>k<-1>.
Description
Technical field
The invention belongs to and have high conduction, heat conduction concurrently, easily cut the alloy material of over-all properties, particularly a kind of copper-based multicomponent alloy material.
Background technology
Develop rapidly along with electronic industrial technology, the continuous miniaturization of electronic devices and components, integrated level is also more and more higher, heat radiation is had higher requirement, in order to guarantee the normal operation of electronic devices and components, the heat sink conception of current employing be add on chip heat-conducting effect preferably the mode of fine copper scatterer, chip fan solve.But entered into super large-scale integration from large-scale integrated circuit at present, the transistor on unit surface is more and more, and its power consumption and heat radiation will become the large problem of the whole information industry of restriction, even affect Economic development; The high speed of simultaneous communications system, Controlling System, the high-power of semiconductor lighting also faces same high-performance radiating requirements, although industrial pure copper has good heat-conductivity conducting performance, but the requirements at the higher level to the electric-conductivity heat-conductivity high material can not have been satisfied, therefore in the urgent need to exploitation electric-conductivity heat-conductivity high material.
Present copper and copper alloy, its thermal conductivity is generally at 300-400Wm
-1k
-1, for example publication number is the Chinese invention patent disclosed " copper-antimony alloy " of CN1004813, its thermal conductivity is 337 Wm
-1k
-1, the thermal conductivity of fine copper, fine silver is respectively 390 Wm
-1k
-1, 416 Wm
-1k
-1Although more to the research of such material in recent years, be that 200310110909.4,200410022626.9 national inventing patent has proposed the high heat conductance kuttern as application number, its thermal conductivity is than the high 23.6-26.7% of fine silver, than the high 31-34% of fine copper, but because raw material adopts high purity copper, high purity tellurium, resource-constrained makes its application limited.。
Summary of the invention
The present invention is directed to the deficiency that prior art exists, a kind of novel copper-based alloy material is provided, this kind alloy material not only has good electrical and thermal conductivity performance, in addition, can also adjust its cutting ability according to the processing needs.
Technical scheme of the present invention: introduce selenium, tellurium and other trace additives, utilize the gas that produces in trace additives removal fusion process to reduce casting flaw, selenium, tellurium improve cutting ability.
Copper tellurium selenium complex alloy material provided by the invention contains copper, tellurium, selenium and trace additives, and the weight percent of copper, tellurium, selenium and trace additives is as follows:
Tellurium 0.05-0.2%
Selenium 0.1-0.4%
Trace additives: 0.01-0.1%
Copper surplus
Above-mentioned trace additives is at least one or both in lithium, magnesium, rare earth
The technique of preparation copper tellurium selenium complex alloy material is common process, its processing step comprises batching, alloy melting, cast, cold and hot working moulding, starting material both can adopt industrial pure copper, technical pure tellurium, industrial pure selenium as required, also can adopt high purity copper, high purity tellurium, high-purity selenium.
The present invention has following beneficial effect:
Conduction, heat conductivility excellence, specific conductivity is 90-103%IACS, thermal conductivity is 450-500wm
-1k
-1
Selenium, tellurium add the cutting ability that can improve alloy material
Embodiment:
Embodiment 1:
1, batching
Technical pure tellurium: 5 grams
Industry pure selenium: 40 grams
Technical pure lithium: 2 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
At first the industrial pure copper of packing in vacuum induction furnace is heated to 1150 ℃, makes fine copper molten clear, then add respectively tellurium, selenium, lithium to continue melting, temperature is controlled at 1200 ℃, and alloying element is evenly distributed in copper liquid, be incubated 10-15 minute, the complete ingot casting that namely pours into of melting.
The copper tellurium selenium complex alloy material electric conductivity of the present embodiment preparation is 98%, and thermal conductivity is 495 wm
-1k
-1
Embodiment 2:
1, batching
Technical pure tellurium: 8 grams
Industry pure selenium: 35 grams
Technical pure rare earth: 4 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
At first the industrial pure copper of packing in vacuum induction furnace is heated to 1150 ℃, makes fine copper molten clear, then add respectively tellurium, selenium, rare earth to continue melting, temperature is controlled at 1200 ℃, and alloying element is evenly distributed in copper liquid, be incubated 15-20 minute, the complete ingot casting that namely pours into of melting.
The copper tellurium selenium complex alloy material electric conductivity of the present embodiment preparation is 96%, and thermal conductivity is 487 wm
-1k
-1
Embodiment 3:
1, batching
Technical pure tellurium: 12 grams
Industry pure selenium: 30 grams
Pure magnesium: 3 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
At first the industrial pure copper of packing in vacuum induction furnace is heated to 1150 ℃, makes fine copper molten clear, then add respectively tellurium, selenium, magnesium to continue melting, temperature is controlled at 1200 ℃, and alloying element is evenly distributed in copper liquid, be incubated 15-20 minute, the complete ingot casting that namely pours into of melting.
The copper tellurium selenium complex alloy material electric conductivity of the present embodiment preparation is 93%, and thermal conductivity is 476 wm
-1k
-1
Embodiment 4:
1, batching
Technical pure tellurium: 15 grams
Industry pure selenium: 35 grams
Technical pure lithium: 4 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
At first the industrial pure copper of packing in vacuum induction furnace is heated to 1150 ℃, makes fine copper molten clear, then add respectively tellurium, selenium, lithium to continue melting, temperature is controlled at 1200 ℃, and alloying element is evenly distributed in copper liquid, be incubated 15-20 minute, the complete ingot casting that namely pours into of melting.
The copper tellurium selenium complex alloy material electric conductivity of the present embodiment preparation is 92%, and thermal conductivity is 458wm
-1k
-1
Embodiment 5:
1, batching
High purity tellurium: 20 grams
High-purity selenium: 15 grams
High-purity rare-earth: 6 grams
High purity copper: surplus
Amount to: 10000 grams
2, smelting and pouring
At first the industrial pure copper of packing in vacuum induction furnace is heated to 1150 ℃, makes fine copper molten clear, then add respectively tellurium, selenium, rare earth to continue melting, temperature is controlled at 1200 ℃, and alloying element is evenly distributed in copper liquid, be incubated 15-20 minute, the complete ingot casting that namely pours into of melting.
The copper tellurium selenium complex alloy material electric conductivity of the present embodiment preparation is 102%, and thermal conductivity is 498 wm
-1k
-1
Embodiment 6:
1, batching
Technical pure tellurium: 20 grams
Industry pure selenium: 25 grams
Technical pure rare earth: 4 grams
Technical pure lithium: 1 gram
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
At first the industrial pure copper of packing in vacuum induction furnace is heated to 1150 ℃, makes fine copper molten clear, then add respectively tellurium, selenium, rare earth, lithium to continue melting, temperature is controlled at 1200 ℃, and alloying element is evenly distributed in copper liquid, be incubated 15-20 minute, the complete ingot casting that namely pours into of melting.
The copper tellurium selenium complex alloy material electric conductivity of the present embodiment preparation is 92%, and thermal conductivity is 462 wm
-1k
-1
Claims (1)
1. the copper tellurium selenium complex alloy material of a high conduction, heat conduction, is characterized in that this alloy material contains copper, tellurium, selenium and trace additives, and the weight percent of copper, tellurium, selenium and trace additives is as follows:
Tellurium 0.05-0.2%
Selenium 0.1-0.4%
Trace additives: 0.01-0.1%
Copper surplus
Above-mentioned trace additives is at least one or both in lithium, magnesium, rare earth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104077709A CN102912179A (en) | 2012-10-24 | 2012-10-24 | High electrical and thermal conduction type copper-tellurium-selenium complex alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104077709A CN102912179A (en) | 2012-10-24 | 2012-10-24 | High electrical and thermal conduction type copper-tellurium-selenium complex alloy material |
Publications (1)
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| CN102912179A true CN102912179A (en) | 2013-02-06 |
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| CN2012104077709A Pending CN102912179A (en) | 2012-10-24 | 2012-10-24 | High electrical and thermal conduction type copper-tellurium-selenium complex alloy material |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222477A (en) * | 2016-08-22 | 2016-12-14 | 徐高磊 | A kind of electric automobile charging pile adapter tellurium copper alloy and production technology thereof |
| CN108273973A (en) * | 2018-03-22 | 2018-07-13 | 宁波金田铜业(集团)股份有限公司 | A method of tellurium bronze stick is produced using horizontal continuous casting process |
| CN110527865A (en) * | 2019-09-09 | 2019-12-03 | 四川大学 | A kind of preparation of high-strength high-conductivity copper selenium complex alloy material and deformation method |
| CN110616352A (en) * | 2019-09-09 | 2019-12-27 | 四川大学 | Preparation method of high-strength high-conductivity copper-selenium multi-element alloy material |
| CN112111669A (en) * | 2020-09-18 | 2020-12-22 | 成都本征新材料技术有限公司 | High-thermal-conductivity diamond/copper material and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1704491A (en) * | 2004-05-28 | 2005-12-07 | 成都宇太科技有限公司 | Copper alloy with high thermal conductivity |
-
2012
- 2012-10-24 CN CN2012104077709A patent/CN102912179A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1704491A (en) * | 2004-05-28 | 2005-12-07 | 成都宇太科技有限公司 | Copper alloy with high thermal conductivity |
Non-Patent Citations (2)
| Title |
|---|
| 朱达川等: "镁对铜碲合金电性能的影响", 《稀有金属材料与工程》 * |
| 王继东: "温度对铜碲硒铁合金热导率的影响", 《机械工程材料》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222477A (en) * | 2016-08-22 | 2016-12-14 | 徐高磊 | A kind of electric automobile charging pile adapter tellurium copper alloy and production technology thereof |
| CN106222477B (en) * | 2016-08-22 | 2018-08-03 | 中山市诺乐盟电子有限公司 | A kind of electric automobile charging pile connector tellurium copper alloy and its production technology |
| CN108273973A (en) * | 2018-03-22 | 2018-07-13 | 宁波金田铜业(集团)股份有限公司 | A method of tellurium bronze stick is produced using horizontal continuous casting process |
| CN110527865A (en) * | 2019-09-09 | 2019-12-03 | 四川大学 | A kind of preparation of high-strength high-conductivity copper selenium complex alloy material and deformation method |
| CN110616352A (en) * | 2019-09-09 | 2019-12-27 | 四川大学 | Preparation method of high-strength high-conductivity copper-selenium multi-element alloy material |
| CN112111669A (en) * | 2020-09-18 | 2020-12-22 | 成都本征新材料技术有限公司 | High-thermal-conductivity diamond/copper material and application thereof |
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Application publication date: 20130206 |