CN1704491A - Copper alloy with high thermal conductivity - Google Patents
Copper alloy with high thermal conductivity Download PDFInfo
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- CN1704491A CN1704491A CN 200410022626 CN200410022626A CN1704491A CN 1704491 A CN1704491 A CN 1704491A CN 200410022626 CN200410022626 CN 200410022626 CN 200410022626 A CN200410022626 A CN 200410022626A CN 1704491 A CN1704491 A CN 1704491A
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Abstract
The invention discloses a copper alloy with high thermal conductivity, which comprises (by weight ratio) 0.001-0.008% of comprehensive rare-earth metal, 0.01-0.35% of tellurium, 0.001-0.0035% of lithium, and balancing copper.
Description
Technical field
The present invention relates to a kind of alloy, specifically, relate to a kind of high heat conductance copper alloy.
Background technology
Many product facilities all need heat radiation.Especially in the electronic product field, because the continuous miniaturization of product, the integrated level of electronic component improves constantly, and the heat radiation of electronic product is restricting the development of product.Particularly in the computer chip field, integrated more than one hundred million transistors on the chip piece, its thermal value is huge especially.Intel of u s company produces Pentium4 3.2G notebook computer microprocessor at present, its power consumption just reaches 72 watts, be equivalent to the power consumption of 21 cun ordinary color tv sets, and the area of this microprocessor is very little, only have 9.6 square centimeters, as seen how important its heat radiation is.The heat sink conception of current employing be on chip, add heat-conducting effect preferably the mode of fine copper scatterer, chip fan solve heat dissipation problem.But the continuous lifting of dominant frequency, the further raising that has brought power and thermal value again.A chip testing group finds new types of processors because heat dissipation problem is not well solved by test and appraisal, aspect travelling speed, serviceability, not even as old treater.Thereby how to solve the heat dissipation problem of treater, become one difficulty that the current urgent need of Intel is captured.Solving on the heat dissipation problem, a very important aspect will further improve the thermal conductivity of Cu alloy material exactly.
Present Cu alloy material, the Wm more than 300 that generally has only
-1k
-1As authorization on July 19th, 1989 bulletin, Hunan Metallurgical Material Inst., Hangzhou non-ferrous metal calendering factory co-applications, notification number is CN1004813, the Chinese invention patent application that name is called " copper-antimony alloy " discloses a kind of Cu alloy material, contain 0.01～0.60% antimony, 0.01～0.60% tin, the cerium that contains the phosphorus of 0.01～0.3% zirconium or 0.01～0.1% or 0.01～0.3% cerium or 0.01～0.3% adds the mishmetal of lanthanum or 0.01～0.5%, or contain above-mentioned two or more element simultaneously, can also add lanthanum 0.01～0.3%, surplus is a copper.The thermal conductivity of the alloy material of this invention is 0.805 a card/cps ℃, i.e. 337Wm
-1k
-1The alloy of other materials, 2003 like this January 29 is disclosed, and notification number is CN1393572A, and name is called " a kind of silumin of low-expansion high heat conductivity " disclosed alloy material, its thermal conductivity 150Wm
-1k
-1Can not meet the demands especially.At present, the thermal conductivity of pure (purple) copper, silver is the highest, but also can only reach pure (purple) copper 388～391Wm
-1k
-1, silver-colored 416Wm
-1k
-1
Summary of the invention
Goal of the invention of the present invention is to overcome above-mentioned deficiency, and a kind of more copper alloy of high heat conductance that has is provided.
High heat conductance copper alloy of the present invention, including is 0.001～0.008% comprehensive rare earth metal by weight percentage, 0.01%～0.35% tellurium, 0.001%～0.0035% lithium, surplus is a copper.
High heat conductance copper alloy of the present invention, its thermal conductivity λ=511.6～524.4Wm
-1k
-1Therefore its thermal conductivity is than fine silver (＜414Wm
-1k
-1) high by 23.6%～26.7%, than fine copper (391Wm
-1k
-1) high by 31～34%, improved the thermal conductivity of thermal conducting material greatly.
Look into by retrieval newly, high heat conductance copper alloy of the present invention is in the leading position of international copper and Cu alloy material thermal conductivity.According to reckoning, it can solve present CPU in the world at the heat dissipation problem of 3.5G～5.5G, thereby, will solve the heat dissipation problem of present chip of new generation effectively.
Embodiment
Below in conjunction with the technological process of production and specific embodiment, high heat conductance copper alloy of the present invention is described in further detail and describes.
Technological process:
Adopt Cu-CATH-1 Cu
High purity tellurium Te
Low sodium lithium Li
Comprehensive rare earth metal RE
Obtain master alloy TeCu, LiCu by vacuum melting, again RE, TeCu, LiCu, Cu are become new special high heat conductance alloy material at vacuum condition melting ingot casting.Crystalline phase analysis and research Te on the crystal boundary face becomes beading through Sichuan Polytechincal College, and this is the key that constitutes high heat conductance.Bismuth Bi among Li and the Cu etc. generate high melting compound, are the refinement disperse state to be distributed in intragranular, improve the high-temp plastic of Cu.RE also is the high-temp plastic that improves Cu, and is useful to unit elongation δ, reduction of area Ψ.Detect through Institute of Analysis of Southwest Jiaotong University: thermal conductivity λ=511.6～524.4Wm
-1k
-1
Following table is several embodiment and the corresponding thermal conductivity test result of high heat conductance copper alloy of the present invention.
| Sequence number | Composition weight percent (%) | Thermal conductivity Wm -1k -1 | |||
| ????RE | ????Te | ????Li | ????Cu | ||
| ????01 | ????0.005 | ????0.35 | ????0.0036 | Surplus | ????487 |
| ????02 | ????0.004 | ????0.34 | ????0.0035 | Surplus | ????519 |
| ????03 | ????0.0035 | ????0.22 | ????0.0034 | Surplus | ????524.4 |
| ????04 | ????0.003 | ????0.17 | ????0.0030 | Surplus | ????520.8 |
| ????05 | ????0.002 | ????0.15 | ????0.0020 | Surplus | ????511.6 |
| ????06 | ????0.001 | ????0.10 | ????0.0010 | Surplus | ????488.5 |
We can see from last table, and high heat conductance copper alloy of the present invention is at the comprehensive rare earth metal RE that is 0.001～0.008% by weight percentage, 0.01%～0.35% tellurium Te, 0.001%～0.0035% lithium Li, surplus is in the scope of copper, thermal conductivity has and increases substantially.
High heat conductance copper alloy of the present invention is not limited to the scope of embodiment, and present embodiment just helps to understand the present invention, and all utilize innovation and creation that the present invention conceives all at the row of protection.
Claims (1)
1. high heat conductance copper alloy is characterized in that including by weight percentage and is:
0.001～0.008% comprehensive rare earth metal
0.01%～0.35% tellurium
0.001%～0.0035% lithium
Surplus is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100226269A CN1300353C (en) | 2004-05-28 | 2004-05-28 | Copper alloy with high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100226269A CN1300353C (en) | 2004-05-28 | 2004-05-28 | Copper alloy with high thermal conductivity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1704491A true CN1704491A (en) | 2005-12-07 |
| CN1300353C CN1300353C (en) | 2007-02-14 |
Family
ID=35576483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100226269A Expired - Fee Related CN1300353C (en) | 2004-05-28 | 2004-05-28 | Copper alloy with high thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1300353C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912179A (en) * | 2012-10-24 | 2013-02-06 | 四川大学 | High electrical and thermal conduction type copper-tellurium-selenium complex alloy material |
| CN113755714A (en) * | 2021-06-22 | 2021-12-07 | 上海交通大学 | High-thermal-conductivity copper alloy suitable for casting process and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10032627A1 (en) * | 2000-07-07 | 2002-01-17 | Km Europa Metal Ag | Use of a copper-nickel alloy |
| CN1177069C (en) * | 2002-09-18 | 2004-11-24 | 四川鑫炬矿业资源开发股份有限公司 | Copper alloy material for contact net wire |
-
2004
- 2004-05-28 CN CNB2004100226269A patent/CN1300353C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912179A (en) * | 2012-10-24 | 2013-02-06 | 四川大学 | High electrical and thermal conduction type copper-tellurium-selenium complex alloy material |
| CN113755714A (en) * | 2021-06-22 | 2021-12-07 | 上海交通大学 | High-thermal-conductivity copper alloy suitable for casting process and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1300353C (en) | 2007-02-14 |
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