CN103526069B - Electric-conductivity heat-conductivity high copper selenium complex alloy material - Google Patents
Electric-conductivity heat-conductivity high copper selenium complex alloy material Download PDFInfo
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- CN103526069B CN103526069B CN201310500248.XA CN201310500248A CN103526069B CN 103526069 B CN103526069 B CN 103526069B CN 201310500248 A CN201310500248 A CN 201310500248A CN 103526069 B CN103526069 B CN 103526069B
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Abstract
A kind of high connductivity, conduction copper selenium complex alloy material, belong to novel alloy Material Field.This alloy contains copper, selenium, third element and trace additives, is by weight percentage: selenium 0.1 ~ 0.5%, third element 0.1 ~ 0.5%, trace additives 0.02 ~ 0.1%, copper surplus, and wherein third element is at least the one in zirconium, chromium; Trace additives be at least in magnesium, phosphorus, rare earth one or both.This kind of alloy material has excellent conduction, heat conduction and cutting ability, and specific conductivity can reach 88 ~ 97%IACS, and thermal conductivity can reach 430 ~ 482wm
-1k
-1.
Description
Technical field
The invention belongs to novel alloy field of material technology, be specifically related to a kind of electric-conductivity heat-conductivity high copper selenium complex alloy material.
Background technology
Industrial pure copper has good conduction, heat conductivility, and there is good plasticity, therefore be usually used in conductive and heat-conductive device etc., but along with the develop rapidly of electronic industrial technology, the miniaturization of electronic devices and components and the appearance of super large-scale integration, number of transistors in unit surface increases, and its power consumption and heat dissipation problem are rapidly by whole electronics and information industry is paid close attention to.Although industrial pure copper and existing Cu alloy material have good electrical and thermal conductivity performance, take into account its performance and cost, the requirements at the higher level of information industry can not be met gradually, therefore in the urgent need to Study and Development Novel high-conductivity thermally conductive material.
The kind of Copper and its alloy is in the market more, and study also day by day deep, its heat conductivility is generally at 330 ~ 400wm
-1k
-1.The thermal conductivity of such as fine copper is 390wm
-1k
-1, the Chinese invention patent disclosed " copper-antimony alloy " of publication number CN1004813, its thermal conductivity is 337wm
-1k
-1; The national inventing patent of application number 200310110909.4 and 200410022626.9 proposes the kuttern material of high heat conductance, and its thermal conductivity exceeds 21 ~ 24% than fine copper; Also have the national inventing patent of application number 201210407770.9 to propose electric-conductivity heat-conductivity high copper tellurium selenium complex alloy material, its electric conductivity is close to fine copper, and the comparable fine copper of thermal conductivity exceeds nearly 20%; Copper-tellurium-chromium, copper tellurium Zirconium alloy material also have good electrical and thermal conductivity performance for another example, but these alloys are owing to adopting high purity copper, high purity tellurium to be raw material, resource-constrained, cause its research and development and application to be restricted.
Summary of the invention
The present invention is directed to the deficiency that prior art exists, electric-conductivity heat-conductivity high copper selenium complex alloy material is provided, be characterized in replacing tellurium element with selenium element, prepare copper selenium complex alloy material, this kind of alloy material not only has excellent electrical and thermal conductivity performance, can also adjust its cutting ability according to processing needs.
The technical scheme that the present invention proposes: introduce selenium, zirconium, chromium and trace additives, utilizes the gas, impurity etc. that produce in trace additives removal fusion process to reduce casting flaw, improves its cutting ability.
Copper selenium complex alloy material provided by the invention contains the trace additives of copper, selenium, third element and adjustment performance, and the weight percent of copper, selenium, third element and trace additives is as follows:
Selenium 0.1 ~ 0.5%
Third element 0.1 ~ 0.5%
Trace additives 0.02 ~ 0.1%
Copper surplus
Above-mentioned third element is at least the one in zirconium, chromium; Trace additives be at least in magnesium, phosphorus, rare earth one or both.
The technique preparing copper selenium complex alloy material is common process, and its processing step comprises batching, alloy melting, cast, forging, cold and hot working are shaping.Starting material both can be industrial pure copper, industrial pure selenium, industrial pure zirconium, technical pure chromium, technical pure Rare Earth Lanthanum or cerium as required, and also can be high purity copper, high-purity selenium, high purity zirconium, High Pure Chromium, high-purity rare-earth lanthanum or cerium, alloying element adds with master alloy.
The present invention has following beneficial effect:
1, copper selenium complex alloy materials conductive, the excellent thermal conductivity prepared of the present invention, specific conductivity can reach 88 ~ 97%IACS, and thermal conductivity can reach 410 ~ 460wm
-1k
-1;
2, the copper selenium complex alloy material cutting ability prepared of the present invention is good, and selenium, phosphorus etc. all can improve the cutting ability of alloy material, therefore can by controlling selenium, the add-on of phosphorus adjust the cutting ability of alloy.Wherein selenium is the non-solid solution element of Copper substrate, and in alloy graining process, the selenium atom of non-solid solution is separated out and produces chemical reaction with high temperature copper atom, zirconium atom or chromium atom from aluminium alloy, generates Cu
2se, Cu
xse
yzr
zor Cu
xse
ycr
zparticle phase, is randomly distributed in crystal boundary and the intracrystalline of Copper substrate, enhances Copper substrate, but weakens less to Copper substrate electroconductibility, imparts the cutting ability that copper alloy is excellent simultaneously;
3, the present invention adopts selenium element to replace tellurium element to prepare electric-conductivity heat-conductivity high copper alloy, and on market, the price of selenium is about 2/5 ~ 3/5 of tellurium price, and therefore, copper selenium complex alloy has than kuttern and significantly reduces on the cost of Addition ofelements;
4, the present invention opens the novelty teabag of China's selenium resource, has also opened up the new direction of the copper alloy with high strength and high conductivity of leadless environment-friendly, has wide market outlook.
Embodiment
Embodiment 1
1, prepare burden
Industry pure selenium: 20 grams
Industrial pure zirconium: 10 grams
Technical pure phosphorus: 5 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding zirconium, selenium, phosphorus respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 97%IACS, and thermal conductivity is 460wm
-1k
-1.
Embodiment 2
1, prepare burden
Industry pure selenium: 40 grams
Industrial pure zirconium: 15 grams
Technical pure chromium: 10 grams
Technical pure phosphorus: 5 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding zirconium, chromium, selenium, phosphorus respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 93%IACS, and thermal conductivity is 435wm
-1k
-1.
Embodiment 3
1, prepare burden
Industry pure selenium: 35 grams
Industrial pure zirconium: 20 grams
Pure magnesium: 3 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding zirconium, selenium, magnesium respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 94%IACS, and thermal conductivity is 446wm
-1k
-1.
Embodiment 4
1, prepare burden
Industry pure selenium: 50 grams
Industrial pure zirconium: 45 grams
Pure magnesium: 3 grams
Technical pure phosphorus: 3 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding zirconium, selenium, magnesium, phosphorus respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 88%IACS, and thermal conductivity is 411wm
-1k
-1.
Embodiment 5
1, prepare burden
Industry pure selenium: 45 grams
Industrial pure zirconium: 15 grams
Technical pure chromium: 15 grams
Technical pure lanthanum: 6 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding zirconium, chromium, selenium, lanthanum respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 91%IACS, and thermal conductivity is 422wm
-1k
-1.
Embodiment 6
1, prepare burden
Industry pure selenium: 50 grams
Industrial pure zirconium: 20 grams
Technical pure cerium: 6 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding zirconium, selenium, cerium respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 92%IACS, and thermal conductivity is 428wm
-1k
-1.
Embodiment 7
1, prepare burden
Industry pure selenium: 20 grams
Technical pure chromium: 15 grams
Technical pure phosphorus: 5 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding chromium, selenium, phosphorus respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 96%IACS, and thermal conductivity is 459wm
-1k
-1.
Embodiment 8
1, prepare burden
Industry pure selenium: 40 grams
Technical pure chromium: 15 grams
Industrial pure zirconium: 10 grams
Technical pure phosphorus: 5 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding chromium, zirconium, selenium, phosphorus respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 93%IACS, and thermal conductivity is 431wm
-1k
-1.
Embodiment 9
1, prepare burden
Industry pure selenium: 40 grams
Technical pure chromium: 20 grams
Pure magnesium: 3 grams
Technical pure phosphorus: 3 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding chromium, selenium, magnesium, phosphorus respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 95%IACS, and thermal conductivity is 447wm
-1k
-1.
Embodiment 10
1, prepare burden
Industry pure selenium: 50 grams
Technical pure chromium: 15 grams
Industrial pure zirconium: 15 grams
Pure magnesium: 3 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding chromium, zirconium, selenium, magnesium respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 90%IACS, and thermal conductivity is 420wm
-1k
-1.
Embodiment 11
1, prepare burden
Industry pure selenium: 40 grams
Technical pure chromium: 25 grams
Technical pure lanthanum: 6 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding chromium, selenium, lanthanum respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 93%IACS, and thermal conductivity is 432wm
-1k
-1.
Embodiment 12
1, prepare burden
Industry pure selenium: 20 grams
Technical pure chromium: 20 grams
Technical pure phosphorus: 3 grams
Technical pure cerium: 5 grams
Industrial pure copper: surplus
Amount to: 10000 grams
2, smelting and pouring
First in vacuum induction furnace, industrial pure copper is loaded, be heated to 1140 ~ 1150 DEG C, make fine copper melting down, then by the above-mentioned elementary composition master alloy adding chromium, selenium, phosphorus, cerium respectively, continue melting, temperature controls at 1180 ~ 1200 DEG C, makes alloying element be uniformly distributed in copper liquid, be incubated 10 ~ 15 minutes until completely melted, melting completes and namely pours into ingot casting;
The electric conductivity of copper selenium complex alloy material prepared by the present embodiment is 95%IACS, and thermal conductivity is 448wm
-1k
-1.
Claims (1)
1. high connductivity, a conduction copper selenium complex alloy material, be made up of the trace additives of copper, selenium, third element and adjustment performance, the weight percent of copper, selenium, third element and trace additives is as follows:
Selenium 0.1-0.5%
Third element 0.1-0.5%
Trace additives 0.02-0.1%
Copper surplus
Above-mentioned third element is at least the one in zirconium, chromium; Trace additives be at least in magnesium, phosphorus, rare earth one or both; This alloy material specific conductivity reaches 88-97%IACS, and thermal conductivity reaches 430-482wm
-1k
-1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310500248.XA CN103526069B (en) | 2013-10-23 | 2013-10-23 | Electric-conductivity heat-conductivity high copper selenium complex alloy material |
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| CN201310500248.XA CN103526069B (en) | 2013-10-23 | 2013-10-23 | Electric-conductivity heat-conductivity high copper selenium complex alloy material |
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| CN103526069B true CN103526069B (en) | 2016-02-24 |
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| CN110527865A (en) * | 2019-09-09 | 2019-12-03 | 四川大学 | A kind of preparation of high-strength high-conductivity copper selenium complex alloy material and deformation method |
| CN110616352A (en) * | 2019-09-09 | 2019-12-27 | 四川大学 | Preparation method of high-strength high-conductivity copper-selenium multi-element alloy material |
| CN113684393B (en) * | 2020-05-22 | 2022-06-17 | 信承瑞技术有限公司 | Preparation process of high-strength high-conductivity copper-selenium alloy contact wire |
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| JPS62253744A (en) * | 1986-04-24 | 1987-11-05 | Daido Steel Co Ltd | Free-cutting oxygen-free copper |
| JP2501306B2 (en) * | 1994-07-08 | 1996-05-29 | 株式会社東芝 | Semiconductor device |
| JP2005290543A (en) * | 2004-03-12 | 2005-10-20 | Sumitomo Metal Ind Ltd | Copper alloy and its production method |
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Granted publication date: 20160224 Termination date: 20211023 |