CN102890166B - 检查用接触器和检查用夹具 - Google Patents
检查用接触器和检查用夹具 Download PDFInfo
- Publication number
- CN102890166B CN102890166B CN201210252405.5A CN201210252405A CN102890166B CN 102890166 B CN102890166 B CN 102890166B CN 201210252405 A CN201210252405 A CN 201210252405A CN 102890166 B CN102890166 B CN 102890166B
- Authority
- CN
- China
- Prior art keywords
- notch part
- inspection
- cartridge
- cylinder portion
- checkpoint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 125
- 230000008602 contraction Effects 0.000 claims abstract description 23
- 238000012360 testing method Methods 0.000 claims description 14
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims description 13
- 238000003825 pressing Methods 0.000 abstract description 14
- 239000000758 substrate Substances 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2844—Fault-finding or characterising using test interfaces, e.g. adapters, test boxes, switches, PIN drivers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-159519 | 2011-07-21 | ||
JP2011159519A JP5845678B2 (ja) | 2011-07-21 | 2011-07-21 | 検査用接触子及び検査用治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102890166A CN102890166A (zh) | 2013-01-23 |
CN102890166B true CN102890166B (zh) | 2015-03-25 |
Family
ID=47533731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210252405.5A Active CN102890166B (zh) | 2011-07-21 | 2012-07-20 | 检查用接触器和检查用夹具 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5845678B2 (ja) |
KR (1) | KR101312340B1 (ja) |
CN (1) | CN102890166B (ja) |
TW (1) | TWI457571B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6317270B2 (ja) * | 2015-02-03 | 2018-04-25 | 株式会社日本マイクロニクス | 電気的接続装置およびポゴピン |
TW201723492A (zh) * | 2015-12-31 | 2017-07-01 | 旺矽科技股份有限公司 | 探針結構及探針裝置 |
JP2017142080A (ja) * | 2016-02-08 | 2017-08-17 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
WO2018101232A1 (ja) * | 2016-11-30 | 2018-06-07 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
CN109596677A (zh) * | 2018-11-02 | 2019-04-09 | 大族激光科技产业集团股份有限公司 | 一种质量检测装置、方法、系统及一体式探针组件 |
JP2022060711A (ja) | 2020-10-05 | 2022-04-15 | 東京特殊電線株式会社 | コンタクトプローブ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101900748A (zh) * | 2009-05-29 | 2010-12-01 | 日本电产理德株式会社 | 检查用夹具 |
CN101907642A (zh) * | 2009-06-02 | 2010-12-08 | 日本电产理德株式会社 | 检查用夹具及检查用触头 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3990915B2 (ja) | 2002-01-23 | 2007-10-17 | 日本発条株式会社 | 導電性接触子 |
US6945827B2 (en) * | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
JP4614434B2 (ja) * | 2004-09-30 | 2011-01-19 | 株式会社ヨコオ | プローブ |
JP2010281592A (ja) * | 2009-06-02 | 2010-12-16 | Nidec-Read Corp | プローブ及び検査用治具 |
JP5381609B2 (ja) * | 2009-10-20 | 2014-01-08 | 日本電産リード株式会社 | 検査用治具及び接触子 |
GB201000344D0 (en) * | 2010-01-11 | 2010-02-24 | Cambridge Silicon Radio Ltd | An improved test probe |
JP4572303B1 (ja) * | 2010-02-12 | 2010-11-04 | 株式会社ルス・コム | 通電検査治具用接触子の製造方法及び、これにより製造した通電検査治具用接触子、並びにこれを備えている通電検査治具 |
-
2011
- 2011-07-21 JP JP2011159519A patent/JP5845678B2/ja not_active Expired - Fee Related
-
2012
- 2012-07-20 CN CN201210252405.5A patent/CN102890166B/zh active Active
- 2012-07-20 TW TW101126326A patent/TWI457571B/zh not_active IP Right Cessation
- 2012-07-20 KR KR1020120079080A patent/KR101312340B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101900748A (zh) * | 2009-05-29 | 2010-12-01 | 日本电产理德株式会社 | 检查用夹具 |
CN101907642A (zh) * | 2009-06-02 | 2010-12-08 | 日本电产理德株式会社 | 检查用夹具及检查用触头 |
Also Published As
Publication number | Publication date |
---|---|
TW201329457A (zh) | 2013-07-16 |
JP2013024716A (ja) | 2013-02-04 |
KR20130011964A (ko) | 2013-01-30 |
CN102890166A (zh) | 2013-01-23 |
JP5845678B2 (ja) | 2016-01-20 |
TWI457571B (zh) | 2014-10-21 |
KR101312340B1 (ko) | 2013-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |