CN102884590B - 带有绝缘性粒子的导电性粒子、带有绝缘性粒子的导电性粒子的制造方法、各向异性导电材料及连接结构体 - Google Patents

带有绝缘性粒子的导电性粒子、带有绝缘性粒子的导电性粒子的制造方法、各向异性导电材料及连接结构体 Download PDF

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CN102884590B
CN102884590B CN201180022694.3A CN201180022694A CN102884590B CN 102884590 B CN102884590 B CN 102884590B CN 201180022694 A CN201180022694 A CN 201180022694A CN 102884590 B CN102884590 B CN 102884590B
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particle
insulating
particles
conductive
electroconductive
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CN102884590A (zh
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真原茂雄
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
CN201180022694.3A 2010-07-28 2011-07-27 带有绝缘性粒子的导电性粒子、带有绝缘性粒子的导电性粒子的制造方法、各向异性导电材料及连接结构体 Expired - Fee Related CN102884590B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010-169503 2010-07-28
JP2010-169502 2010-07-28
JP2010169503 2010-07-28
JP2010169502 2010-07-28
PCT/JP2011/067069 WO2012014925A1 (ja) 2010-07-28 2011-07-27 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体

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CN102884590A CN102884590A (zh) 2013-01-16
CN102884590B true CN102884590B (zh) 2014-01-15

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JP (4) JP5025825B2 (enExample)
KR (1) KR101242235B1 (enExample)
CN (1) CN102884590B (enExample)
TW (1) TWI381037B (enExample)
WO (1) WO2012014925A1 (enExample)

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JPH0250858A (ja) * 1988-08-12 1990-02-20 Tokyo Electric Co Ltd 印刷装置
JP5821552B2 (ja) * 2011-11-10 2015-11-24 日立化成株式会社 撥水性導電粒子、異方導電材料及び導電接続構造体
WO2013108740A1 (ja) * 2012-01-19 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6188456B2 (ja) * 2012-07-03 2017-08-30 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6438186B2 (ja) * 2012-09-06 2018-12-12 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6212374B2 (ja) * 2012-12-05 2017-10-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
JP6357347B2 (ja) * 2013-05-14 2018-07-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6357348B2 (ja) * 2013-05-22 2018-07-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6426913B2 (ja) * 2013-05-29 2018-11-21 積水化学工業株式会社 突起粒子、導電性粒子、導電材料及び接続構造体
JP6392617B2 (ja) * 2013-10-02 2018-09-19 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6450154B2 (ja) * 2013-11-12 2019-01-09 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6397316B2 (ja) * 2013-11-18 2018-09-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6739894B2 (ja) * 2013-11-18 2020-08-12 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
CN105324854A (zh) * 2014-01-08 2016-02-10 积水化学工业株式会社 背接触式的太阳能电池模块的制造方法
JPWO2015105119A1 (ja) * 2014-01-08 2017-03-23 積水化学工業株式会社 バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール
CN105917418B (zh) * 2014-01-08 2018-02-13 积水化学工业株式会社 背接触式太阳能电池模块用导电性粒子、导电材料及太阳能电池模块
EP2942129B1 (de) * 2014-05-05 2017-07-05 Heraeus Deutschland GmbH & Co. KG Metallpaste und deren Verwendung zum Verbinden von Bauelementen
JP6564302B2 (ja) * 2014-10-28 2019-08-21 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
KR102545861B1 (ko) * 2014-10-29 2023-06-21 데쿠세리아루즈 가부시키가이샤 도전 재료
CN107615403B (zh) * 2015-09-24 2021-12-24 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP6543421B2 (ja) * 2016-07-04 2019-07-10 株式会社鈴木 転写方法および実装方法
CN110520938B (zh) * 2017-05-08 2021-10-08 日本化学工业株式会社 包覆颗粒及其制造方法
JP7062555B2 (ja) * 2018-08-27 2022-05-06 日本化学工業株式会社 被覆粒子
JP7651875B2 (ja) 2021-02-18 2025-03-27 オムロン株式会社 入出力装置

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CN1554100A (zh) * 2001-09-14 2004-12-08 ��Ԩ��ѧ��ҵ��ʽ���� 被覆导电性微粒、被覆导电性微粒的制造方法、各向异性导电材料以及导电连接结构体
JP2005209491A (ja) * 2003-09-29 2005-08-04 Sony Chem Corp 導電粒子及びこれを用いた異方導電性接着剤
CN1714131A (zh) * 2002-12-13 2005-12-28 Lg电线有限公司 各向异性导电粘合剂及使用该粘合剂的电路连接方法和结构
JP2010103081A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2010103080A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体

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JP2895872B2 (ja) * 1989-09-26 1999-05-24 触媒化成工業株式会社 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
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JP4991666B2 (ja) 2008-09-19 2012-08-01 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体

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CN1554100A (zh) * 2001-09-14 2004-12-08 ��Ԩ��ѧ��ҵ��ʽ���� 被覆导电性微粒、被覆导电性微粒的制造方法、各向异性导电材料以及导电连接结构体
CN1714131A (zh) * 2002-12-13 2005-12-28 Lg电线有限公司 各向异性导电粘合剂及使用该粘合剂的电路连接方法和结构
JP2005209491A (ja) * 2003-09-29 2005-08-04 Sony Chem Corp 導電粒子及びこれを用いた異方導電性接着剤
JP2010103081A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2010103080A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体

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JP5850806B2 (ja) 2016-02-03
TW201213493A (en) 2012-04-01
KR20120124075A (ko) 2012-11-12
JPWO2012014925A1 (ja) 2013-09-12
TWI381037B (zh) 2013-01-01
JP2012234821A (ja) 2012-11-29
CN102884590A (zh) 2013-01-16
JP2012094541A (ja) 2012-05-17
KR101242235B1 (ko) 2013-03-11
JP5850752B2 (ja) 2016-02-03
JP2012124169A (ja) 2012-06-28
WO2012014925A1 (ja) 2012-02-02
JP4977276B2 (ja) 2012-07-18
JP5025825B2 (ja) 2012-09-12

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