CN102869236B - 用于功率模块的冷却装置及其相关方法 - Google Patents

用于功率模块的冷却装置及其相关方法 Download PDF

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Publication number
CN102869236B
CN102869236B CN201210323662.3A CN201210323662A CN102869236B CN 102869236 B CN102869236 B CN 102869236B CN 201210323662 A CN201210323662 A CN 201210323662A CN 102869236 B CN102869236 B CN 102869236B
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China
Prior art keywords
inlet
cooling
substrate
cooling medium
passage
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Chinese (zh)
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CN102869236A (zh
Inventor
R·A·博普雷
J·L·斯莫伦斯基
W·D·格斯特勒
申晓春
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201210323662.3A 2011-06-24 2012-06-25 用于功率模块的冷却装置及其相关方法 Active CN102869236B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/168,030 US8982558B2 (en) 2011-06-24 2011-06-24 Cooling device for a power module, and a related method thereof
US13/168030 2011-06-24
US13/168,030 2011-06-24

Publications (2)

Publication Number Publication Date
CN102869236A CN102869236A (zh) 2013-01-09
CN102869236B true CN102869236B (zh) 2017-03-01

Family

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CN201210323662.3A Active CN102869236B (zh) 2011-06-24 2012-06-25 用于功率模块的冷却装置及其相关方法

Country Status (6)

Country Link
US (1) US8982558B2 (enExample)
EP (1) EP2538440B1 (enExample)
JP (1) JP6050617B2 (enExample)
CN (1) CN102869236B (enExample)
BR (1) BR102012015581A2 (enExample)
CA (1) CA2780658C (enExample)

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TWI489741B (zh) * 2013-12-20 2015-06-21 Ind Tech Res Inst 具有散熱功能之馬達驅控器及其散熱方法
US20150195951A1 (en) * 2014-01-06 2015-07-09 Ge Aviation Systems Llc Cooled electronic assembly and cooling device
US10576589B2 (en) * 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
US9345169B1 (en) 2014-11-18 2016-05-17 International Business Machines Corporation Liquid-cooled heat sink assemblies
US9865522B2 (en) 2014-11-18 2018-01-09 International Business Machines Corporation Composite heat sink structures
CN106165557B (zh) * 2014-12-08 2018-10-26 约翰逊控制技术公司 一种变速驱动系统以及一种用于封闭在壳体中的生热电子器件的冷却系统
US9538691B2 (en) * 2015-04-15 2017-01-03 Ford Global Technologies, Llc Power inverter for a vehicle
US10265812B2 (en) 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
US9980415B2 (en) * 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
CN106785823A (zh) * 2017-03-24 2017-05-31 武汉大学 一种用于高功率光纤激光器的扰流式微通道散热器
CN107101358A (zh) * 2017-06-06 2017-08-29 广东美的暖通设备有限公司 空调器的电控箱及空调器
US10822096B2 (en) * 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
CN113437031B (zh) * 2021-06-17 2024-06-07 西北工业大学 一种基于液态金属的嵌入式微通道散热装置
US11723173B1 (en) * 2022-03-23 2023-08-08 Rolls-Royce Corporation Stacked cold plate with flow guiding vanes and method of manufacturing
CN115055952B (zh) * 2022-07-06 2024-03-08 珠海格力电器股份有限公司 用于功率器件装配的螺钉自动旋拧装置及旋拧方法

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CN1942088A (zh) * 2005-09-29 2007-04-04 三星电子株式会社 散热组件
US20070153474A1 (en) * 2005-12-29 2007-07-05 Jesper Alexander Andersen Cooling system and method of use
CN101103659A (zh) * 2004-11-24 2008-01-09 通用电气公司 带有用于功率器件的微槽道冷却的散热器
CN101377392A (zh) * 2007-08-27 2009-03-04 Abb研究有限公司 热交换器
US20100226093A1 (en) * 2009-03-09 2010-09-09 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US20100302734A1 (en) * 2009-05-29 2010-12-02 General Electric Company Heatsink and method of fabricating same

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JP5099417B2 (ja) 2007-05-22 2012-12-19 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
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CN101103659A (zh) * 2004-11-24 2008-01-09 通用电气公司 带有用于功率器件的微槽道冷却的散热器
CN1942088A (zh) * 2005-09-29 2007-04-04 三星电子株式会社 散热组件
US20070153474A1 (en) * 2005-12-29 2007-07-05 Jesper Alexander Andersen Cooling system and method of use
CN101377392A (zh) * 2007-08-27 2009-03-04 Abb研究有限公司 热交换器
US20100226093A1 (en) * 2009-03-09 2010-09-09 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US20100302734A1 (en) * 2009-05-29 2010-12-02 General Electric Company Heatsink and method of fabricating same

Also Published As

Publication number Publication date
US20120327603A1 (en) 2012-12-27
CA2780658A1 (en) 2012-12-24
CA2780658C (en) 2019-08-06
EP2538440A2 (en) 2012-12-26
US8982558B2 (en) 2015-03-17
BR102012015581A2 (pt) 2013-10-29
JP2013016794A (ja) 2013-01-24
JP6050617B2 (ja) 2016-12-21
EP2538440B1 (en) 2020-05-06
EP2538440A3 (en) 2017-12-27
CN102869236A (zh) 2013-01-09

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