CA2780658C - Cooling device for a power module, and a related method thereof - Google Patents

Cooling device for a power module, and a related method thereof Download PDF

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Publication number
CA2780658C
CA2780658C CA2780658A CA2780658A CA2780658C CA 2780658 C CA2780658 C CA 2780658C CA 2780658 A CA2780658 A CA 2780658A CA 2780658 A CA2780658 A CA 2780658A CA 2780658 C CA2780658 C CA 2780658C
Authority
CA
Canada
Prior art keywords
inlet
manifold channels
plenum
cooling medium
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2780658A
Other languages
English (en)
French (fr)
Other versions
CA2780658A1 (en
Inventor
Richard Alfred Beaupre
Joseph Lucian Smolenski
William Dwight Gerstler
Xiaochun Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CA2780658A1 publication Critical patent/CA2780658A1/en
Application granted granted Critical
Publication of CA2780658C publication Critical patent/CA2780658C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA2780658A 2011-06-24 2012-06-22 Cooling device for a power module, and a related method thereof Expired - Fee Related CA2780658C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/168,030 US8982558B2 (en) 2011-06-24 2011-06-24 Cooling device for a power module, and a related method thereof
US13/168,030 2011-06-24

Publications (2)

Publication Number Publication Date
CA2780658A1 CA2780658A1 (en) 2012-12-24
CA2780658C true CA2780658C (en) 2019-08-06

Family

ID=46940202

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2780658A Expired - Fee Related CA2780658C (en) 2011-06-24 2012-06-22 Cooling device for a power module, and a related method thereof

Country Status (6)

Country Link
US (1) US8982558B2 (enExample)
EP (1) EP2538440B1 (enExample)
JP (1) JP6050617B2 (enExample)
CN (1) CN102869236B (enExample)
BR (1) BR102012015581A2 (enExample)
CA (1) CA2780658C (enExample)

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EP2523215B1 (en) * 2011-05-13 2015-02-18 ABB Oy Liquid cooling element
TWI489741B (zh) * 2013-12-20 2015-06-21 Ind Tech Res Inst 具有散熱功能之馬達驅控器及其散熱方法
US20150195951A1 (en) * 2014-01-06 2015-07-09 Ge Aviation Systems Llc Cooled electronic assembly and cooling device
US10576589B2 (en) * 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
US9345169B1 (en) 2014-11-18 2016-05-17 International Business Machines Corporation Liquid-cooled heat sink assemblies
US9865522B2 (en) 2014-11-18 2018-01-09 International Business Machines Corporation Composite heat sink structures
CN106165557B (zh) * 2014-12-08 2018-10-26 约翰逊控制技术公司 一种变速驱动系统以及一种用于封闭在壳体中的生热电子器件的冷却系统
US9538691B2 (en) * 2015-04-15 2017-01-03 Ford Global Technologies, Llc Power inverter for a vehicle
US10265812B2 (en) 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
US9980415B2 (en) * 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
CN106785823A (zh) * 2017-03-24 2017-05-31 武汉大学 一种用于高功率光纤激光器的扰流式微通道散热器
CN107101358A (zh) * 2017-06-06 2017-08-29 广东美的暖通设备有限公司 空调器的电控箱及空调器
US10822096B2 (en) * 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
CN113437031B (zh) * 2021-06-17 2024-06-07 西北工业大学 一种基于液态金属的嵌入式微通道散热装置
US11723173B1 (en) * 2022-03-23 2023-08-08 Rolls-Royce Corporation Stacked cold plate with flow guiding vanes and method of manufacturing
CN115055952B (zh) * 2022-07-06 2024-03-08 珠海格力电器股份有限公司 用于功率器件装配的螺钉自动旋拧装置及旋拧方法

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US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
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US5801442A (en) 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
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US6992382B2 (en) * 2003-12-29 2006-01-31 Intel Corporation Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
US7212405B2 (en) 2004-05-27 2007-05-01 Intel Corporation Method and apparatus for providing distributed fluid flows in a thermal management arrangement
US7190580B2 (en) 2004-07-01 2007-03-13 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7836940B2 (en) 2005-06-29 2010-11-23 Microvection, Inc. Microchannel cooling device for small heat sources
KR100677617B1 (ko) * 2005-09-29 2007-02-02 삼성전자주식회사 히트싱크 어셈블리
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US20070153474A1 (en) * 2005-12-29 2007-07-05 Jesper Alexander Andersen Cooling system and method of use
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
JP5120604B2 (ja) 2007-05-22 2013-01-16 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP5099417B2 (ja) 2007-05-22 2012-12-19 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP5182604B2 (ja) * 2007-05-24 2013-04-17 三菱マテリアル株式会社 パワーモジュール用冷却器
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US20100175857A1 (en) 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
US7898807B2 (en) 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US20100302734A1 (en) * 2009-05-29 2010-12-02 General Electric Company Heatsink and method of fabricating same
US8902589B2 (en) * 2010-04-21 2014-12-02 Fuji Electric Co., Ltd. Semiconductor module and cooler
EP2704191B1 (en) * 2011-04-26 2019-03-13 Fuji Electric Co., Ltd. Cooler for semiconductor module

Also Published As

Publication number Publication date
US20120327603A1 (en) 2012-12-27
CA2780658A1 (en) 2012-12-24
EP2538440A2 (en) 2012-12-26
US8982558B2 (en) 2015-03-17
BR102012015581A2 (pt) 2013-10-29
JP2013016794A (ja) 2013-01-24
JP6050617B2 (ja) 2016-12-21
EP2538440B1 (en) 2020-05-06
CN102869236B (zh) 2017-03-01
EP2538440A3 (en) 2017-12-27
CN102869236A (zh) 2013-01-09

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Legal Events

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EEER Examination request

Effective date: 20170421

MKLA Lapsed

Effective date: 20220301

MKLA Lapsed

Effective date: 20200831