JP6050617B2 - 電源モジュール用冷却装置及びそれに関連する方法 - Google Patents

電源モジュール用冷却装置及びそれに関連する方法 Download PDF

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Publication number
JP6050617B2
JP6050617B2 JP2012140632A JP2012140632A JP6050617B2 JP 6050617 B2 JP6050617 B2 JP 6050617B2 JP 2012140632 A JP2012140632 A JP 2012140632A JP 2012140632 A JP2012140632 A JP 2012140632A JP 6050617 B2 JP6050617 B2 JP 6050617B2
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Japan
Prior art keywords
inlet
heat sink
refrigerant
plenum
base plate
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Expired - Fee Related
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JP2012140632A
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English (en)
Japanese (ja)
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JP2013016794A5 (enExample
JP2013016794A (ja
Inventor
リチャード・アルフレッド・ボープレ
ジョセフ・ルシアン・スモーレンスキ
ウィリアム・ドワァイト・ジャートストラー
シャオチュン・シェン
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General Electric Co
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General Electric Co
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Publication date
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Publication of JP2013016794A5 publication Critical patent/JP2013016794A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2012140632A 2011-06-24 2012-06-22 電源モジュール用冷却装置及びそれに関連する方法 Expired - Fee Related JP6050617B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/168,030 US8982558B2 (en) 2011-06-24 2011-06-24 Cooling device for a power module, and a related method thereof
US13/168,030 2011-06-24

Publications (3)

Publication Number Publication Date
JP2013016794A JP2013016794A (ja) 2013-01-24
JP2013016794A5 JP2013016794A5 (enExample) 2015-08-06
JP6050617B2 true JP6050617B2 (ja) 2016-12-21

Family

ID=46940202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012140632A Expired - Fee Related JP6050617B2 (ja) 2011-06-24 2012-06-22 電源モジュール用冷却装置及びそれに関連する方法

Country Status (6)

Country Link
US (1) US8982558B2 (enExample)
EP (1) EP2538440B1 (enExample)
JP (1) JP6050617B2 (enExample)
CN (1) CN102869236B (enExample)
BR (1) BR102012015581A2 (enExample)
CA (1) CA2780658C (enExample)

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EP2523215B1 (en) * 2011-05-13 2015-02-18 ABB Oy Liquid cooling element
TWI489741B (zh) * 2013-12-20 2015-06-21 Ind Tech Res Inst 具有散熱功能之馬達驅控器及其散熱方法
US20150195951A1 (en) * 2014-01-06 2015-07-09 Ge Aviation Systems Llc Cooled electronic assembly and cooling device
US10576589B2 (en) * 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
US9345169B1 (en) 2014-11-18 2016-05-17 International Business Machines Corporation Liquid-cooled heat sink assemblies
US9865522B2 (en) 2014-11-18 2018-01-09 International Business Machines Corporation Composite heat sink structures
CN106165557B (zh) * 2014-12-08 2018-10-26 约翰逊控制技术公司 一种变速驱动系统以及一种用于封闭在壳体中的生热电子器件的冷却系统
US9538691B2 (en) * 2015-04-15 2017-01-03 Ford Global Technologies, Llc Power inverter for a vehicle
US10265812B2 (en) 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
US9980415B2 (en) * 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
CN106785823A (zh) * 2017-03-24 2017-05-31 武汉大学 一种用于高功率光纤激光器的扰流式微通道散热器
CN107101358A (zh) * 2017-06-06 2017-08-29 广东美的暖通设备有限公司 空调器的电控箱及空调器
US10822096B2 (en) * 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
CN113437031B (zh) * 2021-06-17 2024-06-07 西北工业大学 一种基于液态金属的嵌入式微通道散热装置
US11723173B1 (en) * 2022-03-23 2023-08-08 Rolls-Royce Corporation Stacked cold plate with flow guiding vanes and method of manufacturing
CN115055952B (zh) * 2022-07-06 2024-03-08 珠海格力电器股份有限公司 用于功率器件装配的螺钉自动旋拧装置及旋拧方法

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JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5099910A (en) 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5801442A (en) 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
DK176137B1 (da) 2003-10-27 2006-09-25 Danfoss Silicon Power Gmbh Flowfordelingsenhed og köleenhed med bypassflow
US6992382B2 (en) * 2003-12-29 2006-01-31 Intel Corporation Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
US7212405B2 (en) 2004-05-27 2007-05-01 Intel Corporation Method and apparatus for providing distributed fluid flows in a thermal management arrangement
US7190580B2 (en) 2004-07-01 2007-03-13 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7836940B2 (en) 2005-06-29 2010-11-23 Microvection, Inc. Microchannel cooling device for small heat sources
KR100677617B1 (ko) * 2005-09-29 2007-02-02 삼성전자주식회사 히트싱크 어셈블리
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US20070153474A1 (en) * 2005-12-29 2007-07-05 Jesper Alexander Andersen Cooling system and method of use
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
JP5120604B2 (ja) 2007-05-22 2013-01-16 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP5099417B2 (ja) 2007-05-22 2012-12-19 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP5182604B2 (ja) * 2007-05-24 2013-04-17 三菱マテリアル株式会社 パワーモジュール用冷却器
EP2031332B1 (en) * 2007-08-27 2010-09-15 ABB Research LTD Heat exchanger for power-electronics components
US20100175857A1 (en) 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
US7898807B2 (en) 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US20100302734A1 (en) * 2009-05-29 2010-12-02 General Electric Company Heatsink and method of fabricating same
US8902589B2 (en) * 2010-04-21 2014-12-02 Fuji Electric Co., Ltd. Semiconductor module and cooler
EP2704191B1 (en) * 2011-04-26 2019-03-13 Fuji Electric Co., Ltd. Cooler for semiconductor module

Also Published As

Publication number Publication date
US20120327603A1 (en) 2012-12-27
CA2780658A1 (en) 2012-12-24
CA2780658C (en) 2019-08-06
EP2538440A2 (en) 2012-12-26
US8982558B2 (en) 2015-03-17
BR102012015581A2 (pt) 2013-10-29
JP2013016794A (ja) 2013-01-24
EP2538440B1 (en) 2020-05-06
CN102869236B (zh) 2017-03-01
EP2538440A3 (en) 2017-12-27
CN102869236A (zh) 2013-01-09

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