CN102869204A - Manufacture method of rigid-flex board - Google Patents
Manufacture method of rigid-flex board Download PDFInfo
- Publication number
- CN102869204A CN102869204A CN2012103502867A CN201210350286A CN102869204A CN 102869204 A CN102869204 A CN 102869204A CN 2012103502867 A CN2012103502867 A CN 2012103502867A CN 201210350286 A CN201210350286 A CN 201210350286A CN 102869204 A CN102869204 A CN 102869204A
- Authority
- CN
- China
- Prior art keywords
- soft board
- rigid flex
- hardboard
- manufacture method
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacture method of a rigid-flex board. The manufacture method comprises the steps of: firstly, providing a rigid board with a first circuit layer and a plurality of flex boards with second circuit layers, wherein the rigid board comprises an area preset to be removed and a plurality of rigid board units; then, cutting a plurality of cutting lines preset to be exposed from an area of the flex boards between the rigid board units and the area preset to be removed; then, combining the flex boards onto the rigid board by using a gluing layer and forming a plurality of through holes in the rigid board and the flex boards, and electrically conducting the first circuit layer on the rigid board and the second circuit layers on the flex boards; respectively breaking the areas preset to be removed along the cutting lines on the rigid board so as to expose all flex boards, and forming the rigid board units; and finally, folding each flex board along respectively multiple folding lines so as to make the rigid board units arrayed in an extension manner in one direction.
Description
The application is that the application number of submitting on May 24th, 2010 is: the dividing an application of 201010187728.1 Chinese patent application.
Technical field
The invention relates to a kind of manufacture method of circuit board, and particularly about a kind of manufacture method of Rigid Flex.
Background technology
In simple terms, Rigid Flex (Rigid-Flex Circuit Board) is combined into soft board and hardboard the circuit board of identical product, exactly with the pliability of Flexible Printed Circuit and the intensity of rigid wiring board.Early stage purposes is many in fields such as military affairs, medical treatment, industrial instrumentations, begins in recent years for end products such as mobile phone and consumption electronic products (digital camera, digital camera etc.).The application of Rigid Flex in mobile phone common are image module, key-press module and the radio-frequency module etc. of clamshell phone.
Mobile phone uses the advantage of Rigid Flex, comprises allowing the easier integration of part of mobile phone and the reliability of working transmission improve.Use Rigid Flex, can replace the combination that originally utilized two connectors to add soft board, with durability and the long-term reliability of using that increases phone folded place moving point.
The application of Rigid Flex is expanded gradually to other field, such as flash memory (Flash Memory), dynamic random access memory module (DRAM Module), tft liquid crystal display module (TFT-LCD Module) etc., yet, general rigid-flex in conjunction with processing procedure in, usually all be that soft board is between the intermediate layer of two hardboards, the two ends of soft board are by two hardboard clampings, and the interlude of soft board is bent zone, with as the bridge joint sections of signal transmission between two hardboards.Yet, the length of Rigid Flex can be subject to the machining area restriction of printed circuit board (PCB) production equipment, so that the plate length of Rigid Flex can't be extended to beyond the machining area, particularly still can't break through obstacle on the size for the manufacture method of strip Rigid Flex, the in addition external form of Rigid Flex restriction also may cause the utilance of hardboard to reduce.Thereby how to improve the convenience that the existing mode of production and subsequent group are loaded onto, all are problems of the required solution of industry.
Summary of the invention
The invention provides a kind of manufacture method of Rigid Flex, breaking through the obstacle on the size, and can arrange so that the hardboard unit extends in a direction via the doubling soft board, and then improve the convenience that the existing mode of production and subsequent group are loaded onto.
The present invention proposes a kind of manufacture method of Rigid Flex.At first, provide a hardboard with one first line layer, with a plurality of soft boards with one second line layer, hardboard comprises predetermined zone and a plurality of hardboards unit of removing.Then, cut many predetermined lines of cut that expose the zone of soft board between the zone in these hardboard unit and this predetermined removing.Utilize a cementing layer in conjunction with these soft boards to hardboard.Afterwards, form a plurality of vias in hardboard and these soft boards, with the first line layer on the hardboard that electrically conducts and the second line layer on the soft board.These lines of cut on the hardboard predetermined zone that removes that fractures respectively manifesting each soft board, and makes these hardboard unit formations.Each soft board along separately multiple folding lines doubling, so that extending in a direction, is arranged these hardboard unit.
In one embodiment of this invention, above-mentioned soft board doubling step comprises sequentially a soft board along the orthogonal fold line doubling, and along the horizontal fold line doubling subregion of soft board is overlapped on another part zone of soft board soft board.
The present invention proposes a kind of manufacture method of Rigid Flex, comprising: two hardboard unit and a soft board are provided, and soft board is bonded between the two hardboard unit by a cementing layer, makes Rigid Flex have one first length; And along the multiple folding lines doubling on the soft board, so that Rigid Flex has one second length along the first length, the second length is greater than the first length.
In one embodiment of this invention, above-mentioned hardboard is the hard circuit board with Double-side line layer.
In one embodiment of this invention, above-mentioned soft board is the flexible circuit board with Double-side line layer.
In one embodiment of this invention, after above-mentioned Rigid Flex engages, also comprise forming a plurality of vias in soft board and two hardboard unit.
In one embodiment of this invention, above-mentioned soft board doubling step comprises: along an orthogonal fold line doubling; And along a horizontal fold line doubling, and a part of region overlapping that makes soft board is on another part zone of soft board.
In one embodiment of this invention, above-mentioned soft board doubling step comprises: along a horizontal fold line doubling; And along the doubling of pair of horns fold line, and a part of region overlapping that makes soft board is on another part zone of soft board.
Based on above-mentioned, the manufacture method of Rigid Flex of the present invention has overcome the obstacle that can't break through on the size, and one-tenth one extended Rigid Flex capable of being combined improves the defective of the existing mode of production and improves the convenience that subsequent group is loaded onto.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the schematic diagram of the Rigid Flex of one embodiment of the invention when not launching.
Fig. 2 A～Fig. 2 B is the generalized section perpendicular to the Rigid Flex of the fold line cutting of Fig. 1.
Fold sequence schematic diagram when Fig. 3 A～Fig. 3 G is Rigid Flex expansion of the present invention.
Fig. 4 A～Fig. 4 B is the folding schematic diagram of the Rigid Flex of another embodiment of the present invention.
The main element symbol description
100: Rigid Flex
100a: extended Rigid Flex
110: hardboard
110A: the predetermined zone that removes
110B: line of cut
110C:V type line of cut
110D: the first line layer
111～118: the hardboard unit
120: soft board
122: the pi film
124: the second line layers
130: cementing layer
132: the zone of deflected position
140: via
140A: conductive layer
140B: through hole
142: welding resisting layer
211,212: the hardboard unit
220: soft board
C1, C2: contact
L1, L2: fold line
L3, L4: fold line
Embodiment
Fig. 1 is the schematic diagram of the Rigid Flex of one embodiment of the invention when not launching.Fig. 2 A～Fig. 2 B is perpendicular to the generalized section of the fold line of Fig. 1 cutting along the Rigid Flex of I-I line.
Please refer to Fig. 1 and Fig. 2 A, Rigid Flex 100 comprise hardboard 110, a plurality of soft board 120 and be connected in hardboard 110 and soft board 120 between a cementing layer 130.Hardboard 110 has one to be scheduled to remove regional 110A and a plurality of hardboards unit 111～118, and each hardboard unit 111～118 and predetermined removing can form a plurality of line of cut 110B between the regional 110A.Line of cut 110B for example utilizes the V-type cutting machine or forms with laser cutting, but incomplete cut-off, the degree of depth can be controlled in 8～16 Mills.Cementing layer 130 can utilize first mould punching or with laser cutting, form the cementing layer 130 with pattern with the zone 132 that removes corresponding to each soft board 120 palpus deflected position.And pi (Polyimide) film 122 that each hardboard 110 relends by cementing layer 130 and soft board 120 is pressed into one.
Hardboard 110 has the first line layer 110D, and each soft board 120 has the second line layer 124.After hardboard 110 and soft board 120 pressings, a plurality of vias 140 can be formed between hardboard 110 and each soft board 120.Via 140 general using bore modes form recycling and electroplate the formation conductive layer on hole wall, with the first line layer 110D and the second line layer 124 of electrically conducting.On hardboard 110 or the soft board 120, can utilize general circuit board to increase layer mode and form again outer-layer circuit.
Afterwards, predetermined the removing in the regional step that fracture, make first each hardboard unit 111～118 moulding, its molding mode can be the mode that general printed circuit board (PCB) is commonly used.Then the lower surface in each hardboard unit 111～118 goes out V-type line of cut 110C with the V-type cutting machine or with laser cutting again with respect to the predetermined line of cut 110B that removes regional 110A, this is scheduled to remove regional 110A as principle take incomplete cut-off at this, the degree of depth can be controlled in 8～16 Mills, residual thickness can be controlled in 4～20 Mills approximately, fractures follow-up with convenient.
Then, shown in Fig. 2 B, each hardboard unit 111～118 can make via pulling folding and predetermined remove regional 110A and fractureed along line of cut 110B, and take out that these have fractureed remove regional 110A and manifest the pi film 122 of soft board 120.
How below will introduce in detail utilizes above-mentioned Rigid Flex 100 to make the extended circuit board.Please refer to Fig. 1, in the present embodiment, be formed with a plurality of hardboard unit 111～118 that are arranged in parallel at the hardboard 110 of a preliminary dimension.In addition, a plurality of soft boards 120 are bonded between the two hardboard unit, but do not repeat to engage two identical hardboards, but adopt staggered mode sequentially to connect two hardboard unit.The present invention is via above-mentioned configuration, can with 8 hardboard unit 111～118 and 7 soft boards 120 combine and process via following process fabrication steps (such as via step, anti-welding step etc.) after, utilize the hardboard unit formation to remove removing step and forming the extended Rigid Flex by folding step of regional 110A with predetermined.Above-mentioned hardboard 111～118 and the quantity of soft board 120 just for example can be according to the demand adjustment of reality.
Hardboard 110 is a hard circuit board with Double-side line layer preferably, can be formed in mode superimposed or that increase layer by the Copper Foil of fiberglass resin and patterning, and be shaped via curing, supports the function of soft board 120 when assembling can be provided.Soft board 120 preferably one has the flexible circuit board of Double-side line layer, but also can have single face the second line layer 124(shown in Fig. 2 A), can be made by the Copper Foil of pi film, viscose glue and patterning.
Please refer to Fig. 2 A and Fig. 2 B, at first, cut out many predetermined line of cut 110B that expose the zone of soft board between the regional 110A in each hardboard unit 111～118 and predetermined removing.Then, utilize a cementing layer 130 in conjunction with these soft boards 120 on hardboard 110.Form a plurality of vias 140 in hardboard 110 and these soft boards 120, with the first line layer 110D on the hardboard 110 that electrically conducts and the second line layer 124 on the soft board 120.Afterwards, the corresponding V-type line of cut 110C that forms of these lines of cut 110B on the hardboard 110, the predetermined regional 110A that removes that fractures respectively again manifesting each soft board 120, and makes these hardboard unit 111～118 moulding.
Wherein, the practice of via 140 is as follows: (1) uses drilling machine to get out to be communicated to the through hole 140A among soft board 120 and the hardboard 110, and in the preferred case, the diameter of through hole 140A is 0.2mm～3.175mm; (2) through hole 140A is electroplated, with the first line layer 110D on each hardboard 110 that electrically conducts and the second line layer 124 on each soft board 120.Usually before electroplating, first through hole 140A is carried out the operation of de-smear, then in electroplate liquid, pass into direct current, carry out chemical reduction reaction, so that the second line layer 124 on the first line layer 110D on the hardboard 110 and the soft board 120 and the conductive layer 140A conducting among the through hole 140B, the thickness of conductive layer 140A can be controlled in 0.5～2 Mill.
Finish after the via 140, can be again on the second line layer 124 of soft board 120 and the first line layer 110D of hardboard 110 coating one welding resisting layer 142, to prevent the line layer oxidation or to be polluted by scolder, but manifest contact C1, C2 outside welding resisting layer 142, with the composition surface as the signal transmission.
Please refer to the fold sequence schematic diagram of Fig. 3 A～Fig. 3 G, its representativeness illustrates the fold sequence of four hardboards, but also is applicable on the hardboard of greater number.At first, shown in Fig. 3 A～Fig. 3 C, to left folding, so that soft board 120 is along orthogonal fold line L1 doubling left, soft board 120 makes a part of region overlapping of soft board 120 again on another part zone of soft board 120 along the downward doubling of horizontal fold line L2 afterwards with the first hardboard unit 111.Then, shown in Fig. 3 D and Fig. 3 E, with the 3rd hardboard unit 113 and the 4th hardboard unit 114 to right folding, so that soft board 120 is along orthogonal fold line L1 doubling to the right, afterwards soft board again along horizontal fold line L2 make progress doubling and a part of region overlapping of making soft board 120 on another part zone of soft board 120.Then, shown in Fig. 3 F and Fig. 3 G, to right folding, so that soft board 120 is along orthogonal fold line L1 doubling to the right, soft board 120 makes a part of region overlapping of soft board 120 again on another part zone of soft board 120 along the downward doubling of horizontal fold line L2 afterwards with the 4th hardboard unit 114.In Fig. 3 G, all first to the 4th hardboard unit 111～114 all are arranged on the bearing of trend.So, extended Rigid Flex 100a finishes haply, so length S2(the second length of the Rigid Flex 100a after folding) greater than original length S1(first length of Rigid Flex 100 before folding) namely greater than the circuit board of preliminary dimension on original printed circuit board (PCB) production equipment.Therefore, can not be subject to the restriction of printed circuit board (PCB) production equipment.
Please refer to the folding schematic diagram of Fig. 4 A and Fig. 4 B, in another embodiment, it is orthogonal fold line and horizontal fold line that the eighty percent discount superimposing thread on the soft board 220 does not limit, and can also be the fold line that is positioned on the diagonal.At first, the first hardboard unit 211 is folding downwards, so that soft board 220 is along the downward doubling of horizontal fold line L3, the second hardboard unit 212 is upwards folding afterwards, so that soft board 220 is along the diagonal fold line L4 doubling that makes progress, and a part of region overlapping that makes soft board 220 is on another part zone of soft board 220.So, the second hardboard unit 212 and the first hardboard unit 211 rectangular intersect L shaped are not to arrange in the longitudinal direction.So the present invention can make according to client's demand the Rigid Flex of different folding modes, to meet the requirement of customization.
In sum, the manufacture method of Rigid Flex of the present invention has overcome the obstacle that can't break through on the size, can make it extend and be combined into an extended Rigid Flex along equidirectional or different directions via the doubling hardboard, improve the defective of the existing mode of production and improve the convenience that subsequent group is loaded onto, can be widely used on the industry of the electronic products such as panel, mobile phone, memory module.
Although the present invention with embodiment openly as above; so it is not to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that claims define.
Claims (6)
1. the manufacture method of a Rigid Flex comprises:
Two hardboard unit and a soft board are provided, and this soft board is bonded between this two hardboards unit by a cementing layer, makes this Rigid Flex have one first length; And
Along the multiple folding lines doubling on this soft board, so that this Rigid Flex has one second length along this first length, this second length is greater than this first length.
2. the manufacture method of Rigid Flex according to claim 1, wherein those hardboards are the hard circuit board with Double-side line layer.
3. the manufacture method of Rigid Flex according to claim 1, wherein this soft board is the flexible circuit board with Double-side line layer.
4. the manufacture method of Rigid Flex according to claim 1 after wherein this Rigid Flex engages, also comprises forming a plurality of vias in this soft board and this two hardboards unit.
5. the manufacture method of Rigid Flex according to claim 1, wherein this soft board doubling step comprises:
Along an orthogonal fold line doubling; And
Along a horizontal fold line doubling, and a part of region overlapping that makes this soft board is on another part zone of this soft board.
6. the manufacture method of Rigid Flex according to claim 1, wherein this soft board doubling step comprises:
Along a horizontal fold line doubling; And
Along the doubling of pair of horns fold line, and a part of region overlapping that makes this soft board is on another part zone of this soft board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210350286.7A CN102869204B (en) | 2010-05-24 | 2010-05-24 | The manufacture method of Rigid Flex |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210350286.7A CN102869204B (en) | 2010-05-24 | 2010-05-24 | The manufacture method of Rigid Flex |
| CN 201010187728 CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010187728 Division CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102869204A true CN102869204A (en) | 2013-01-09 |
| CN102869204B CN102869204B (en) | 2015-08-19 |
Family
ID=45010575
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010187728 Active CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
| CN201210350286.7A Active CN102869204B (en) | 2010-05-24 | 2010-05-24 | The manufacture method of Rigid Flex |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010187728 Active CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN102264193B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968140B (en) * | 2015-06-10 | 2018-08-10 | 江西鑫力华数码科技有限公司 | Flexible folding wiring board |
| CN110324992A (en) * | 2019-07-10 | 2019-10-11 | 高德（无锡）电子有限公司 | A kind of processing technology that Rigid Flex is uncapped using V-Cut docking cutting |
| CN113630970B (en) * | 2020-03-05 | 2023-04-25 | 武汉联影智融医疗科技有限公司 | Folding flexible wearable detection device and manufacturing method thereof |
| CN113853059B (en) * | 2020-06-28 | 2023-12-22 | 深南电路股份有限公司 | Rigid-flex printed circuit board and circuit connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258357A (en) * | 2007-04-04 | 2008-10-23 | Fujikura Ltd | Rigid flexible board and manufacturing method thereof |
| CN101378625A (en) * | 2007-08-27 | 2009-03-04 | 南亚电路板股份有限公司 | Preparation method for soft and hard composite boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005197295A (en) * | 2003-12-26 | 2005-07-21 | Fujikura Ltd | Connector and its manufacturing method |
-
2010
- 2010-05-24 CN CN 201010187728 patent/CN102264193B/en active Active
- 2010-05-24 CN CN201210350286.7A patent/CN102869204B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258357A (en) * | 2007-04-04 | 2008-10-23 | Fujikura Ltd | Rigid flexible board and manufacturing method thereof |
| CN101378625A (en) * | 2007-08-27 | 2009-03-04 | 南亚电路板股份有限公司 | Preparation method for soft and hard composite boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102869204B (en) | 2015-08-19 |
| CN102264193A (en) | 2011-11-30 |
| CN102264193B (en) | 2013-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60029524T2 (en) | Flexible circuit board, electro-optical device and electronic device | |
| US10117328B1 (en) | Flexible circuit board and method for manufacturing same | |
| CN102387672B (en) | Method for manufacturing multilayer circuit board | |
| CN102264193B (en) | Method for manufacturing rigid-flex circuit board | |
| CN113156727B (en) | Array substrate, liquid crystal display panel and liquid crystal display device | |
| KR20040061409A (en) | Two-sided PCB without via hole and the manufacturing method thereof | |
| KR100671660B1 (en) | Flexible printed circuits and display device having the same | |
| US10010001B1 (en) | Circuit board and method for making the same | |
| ATE281755T1 (en) | PRODUCTION PROCESS FOR A CIRCUIT BOARD MODULE | |
| US11474572B2 (en) | Signal transmission apparatus and display apparatus | |
| CN101480114A (en) | Printed circuit board, printed circuit board unit, and electronic apparatus | |
| US11445611B2 (en) | Signal transmission apparatus and display apparatus | |
| US7576992B2 (en) | Flexible printed circuit and display device utilizing the same | |
| US20070074901A1 (en) | Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus | |
| US20070133184A1 (en) | Printed Circuit Board and Manufacturing Method Thereof | |
| CN110288936B (en) | Display device | |
| JP2001109391A (en) | Substrate for connection and method for packaging plane display device using the substrate for connection | |
| CN102497732A (en) | PCB (printed circuit board) spliced plate | |
| JP2008151981A (en) | Display device | |
| CN103917058A (en) | Method for manufacturing pluggable finger type flexible circuit board | |
| CN110149757A (en) | A kind of high frequency circuit board and preparation method thereof | |
| CN105657971A (en) | Embedded element packaging structure and manufacturing method thereof | |
| CN102378489A (en) | Soft and hard circuit board and manufacturing method thereof | |
| CN113747655B (en) | Circuit board and manufacturing method thereof | |
| KR101037544B1 (en) | A Fabricating method of a printed circuit board having side contact hole pad |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |