CN102869204B - The manufacture method of Rigid Flex - Google Patents
The manufacture method of Rigid Flex Download PDFInfo
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- CN102869204B CN102869204B CN201210350286.7A CN201210350286A CN102869204B CN 102869204 B CN102869204 B CN 102869204B CN 201210350286 A CN201210350286 A CN 201210350286A CN 102869204 B CN102869204 B CN 102869204B
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- soft board
- hardboard
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Abstract
A kind of manufacture method of Rigid Flex.First, provide the hardboard that has a first line layer, with multiple soft board with one second line layer, hardboard comprises one and predeterminedly removes region and multiple hardboard unit.Then, many predetermined lines of cut exposing the region of soft board are cut at these hardboard unit and this predetermined removing between region.Afterwards, utilize a cementing layer in conjunction with these soft boards on hardboard, and form multiple via in hardboard and these soft boards, with the first line layer on hardboard and the second line layer on soft board of electrically conducting.Fracture respectively along these lines of cut on hardboard and make a reservation for remove region, to manifest each soft board, and make these hardboard unit formations.Finally, by each soft board along respective multiple folding lines doubling, extend arrangement in one direction to make these hardboard unit.
Description
The application is the application number submitted on May 24th, 2010: the divisional application of the Chinese patent application of 201010187728.1.
Technical field
The invention relates to a kind of manufacture method of circuit board, and particularly about a kind of manufacture method of Rigid Flex.
Background technology
In simple terms, Rigid Flex (Rigid-Flex Circuit Board), is combined into the circuit board of identical product exactly by soft board and hardboard, with the pliability of Flexible Printed Circuit and the intensity of rigid wiring board.Early stage purposes is many in fields such as military affairs, medical treatment, industrial instrumentations, starts in recent years for end products such as mobile phone and consumption electronic products (digital camera, digital camera etc.).The application of Rigid Flex in mobile phone, common are the image module of clamshell phone, key-press module and radio-frequency module etc.
Mobile phone uses the advantage of Rigid Flex, comprises and allows the part of mobile phone more easily integrate and the reliability raising of working transmission.Use Rigid Flex, the combination originally utilizing two connectors to add soft board can be replaced, with the reliability of the durability and Long-Time Service that increase phone folded place moving point.
The application of Rigid Flex is expanded gradually to other field, as flash memory (FlashMemory), dynamic random access memory module (DRAM Module), tft liquid crystal display module (TFT-LCD Module) etc., but, in general rigid-flex combination process, usually be all the intermediate layer of soft board between two hardboards, the two ends of soft board are by two hardboard clampings, and the interlude of soft board is bent region, with as the bridge joint sections of signal transmission between two hardboards.But, the length of Rigid Flex can be subject to the machining area restriction of printed circuit board (PCB) production equipment, the plate length of Rigid Flex cannot be extended to beyond machining area, the obstacle in size particularly still cannot be broken through for the manufacture method of strip Rigid Flex, in addition the external form restriction of Rigid Flex, the utilance that also may cause hardboard reduces.Thus how improving the convenience that the existing mode of production and subsequent group are loaded onto, is all the required problems solved of industry.
Summary of the invention
The invention provides a kind of manufacture method of Rigid Flex, to break through the obstacle in size, and can via doubling soft board, to make hardboard unit extend arrangement in one direction, and then improve the convenience that the existing mode of production and subsequent group load onto.
The present invention proposes a kind of manufacture method of Rigid Flex.First, provide the hardboard that has a first line layer, with multiple soft board with one second line layer, hardboard comprises one and predeterminedly removes region and multiple hardboard unit.Then, many predetermined lines of cut exposing the region of soft board are cut at these hardboard unit and this predetermined removing between region.Utilize a cementing layer in conjunction with these soft boards on hardboard.Afterwards, form multiple via in hardboard and these soft boards, with the first line layer on hardboard and the second line layer on soft board of electrically conducting.Fracture respectively along these lines of cut on hardboard and make a reservation for remove region, to manifest each soft board, and make these hardboard unit formations.By each soft board along respective multiple folding lines doubling, extend arrangement in one direction to make these hardboard unit.
In one embodiment of this invention, above-mentioned soft board doubling step comprise sequentially by a soft board along orthogonal fold line doubling, and along horizontal fold line doubling, the subregion of soft board is overlapped on another part region of soft board soft board.
The present invention proposes a kind of manufacture method of Rigid Flex, comprising: provide two hardboard unit and a soft board, and soft board is bonded between two hardboard unit by a cementing layer, makes Rigid Flex have one first length; And along the multiple folding lines doubling on soft board, to make Rigid Flex have one second length along the first length, the second length is greater than the first length.
In one embodiment of this invention, above-mentioned hardboard is the hard circuit board with Double-side line layer.
In one embodiment of this invention, above-mentioned soft board is the flexible circuit board with Double-side line layer.
In one embodiment of this invention, after above-mentioned Rigid Flex engages, also comprise and form multiple via in soft board and two hardboard unit.
In one embodiment of this invention, above-mentioned soft board doubling step comprises: along an orthogonal fold line doubling; And along a horizontal fold line doubling, and make a part of region overlapping of soft board on another part region of soft board.
In one embodiment of this invention, above-mentioned soft board doubling step comprises: along a horizontal fold line doubling; And along the doubling of pair of horns fold line, and make a part of region overlapping of soft board on another part region of soft board.
Based on above-mentioned, the manufacture method of Rigid Flex of the present invention overcomes the obstacle that size cannot break through, and may be combined with into an extended Rigid Flex, improves the defect of the existing mode of production and improves the convenience loaded onto of subsequent group.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the Rigid Flex of one embodiment of the invention when not launching.
Fig. 2 A ~ Fig. 2 B is the generalized section of the Rigid Flex cut perpendicular to the fold line of Fig. 1.
Fold sequence schematic diagram when Fig. 3 A ~ Fig. 3 G is Rigid Flex of the present invention expansion.
Fig. 4 A ~ Fig. 4 B is the folding schematic diagram of the Rigid Flex of another embodiment of the present invention.
Main element symbol description
100: Rigid Flex
100a: extended Rigid Flex
110: hardboard
110A: make a reservation for remove region
110B: line of cut
110C:V type line of cut
110D: first line layer
111 ~ 118: hardboard unit
120: soft board
122: pi film
124: the second line layers
130: cementing layer
132: the region of deflected position
140: via
140A: conductive layer
140B: through hole
142: welding resisting layer
211,212: hardboard unit
220: soft board
C1, C2: contact
L1, L2: fold line
L3, L4: fold line
Embodiment
Fig. 1 is the schematic diagram of the Rigid Flex of one embodiment of the invention when not launching.Fig. 2 A ~ Fig. 2 B is along the generalized section of the Rigid Flex of I-I line perpendicular to the fold line cutting of Fig. 1.
Please refer to Fig. 1 and Fig. 2 A, Rigid Flex 100 comprises hardboard 110, multiple soft board 120 and is connected to the cementing layer 130 between hardboard 110 and soft board 120.Hardboard 110 has one and makes a reservation for remove region 110A and multiple hardboard unit 111 ~ 118, and each hardboard unit 111 ~ 118 and predetermined removing between the 110A of region can form multiple line of cut 110B.Line of cut 110B such as utilizes V-type cutting machine or is formed with laser cutting, but incomplete cut-off, the degree of depth can be controlled in 8 ~ 16 Mills.Cementing layer 130 can first utilize mould punching or with laser cutting, form the cementing layer 130 with pattern with the region 132 removed corresponding to each soft board 120 palpus deflected position.And each hardboard 110 relends and is pressed into one by cementing layer 130 and pi (Polyimide) film 122 of soft board 120.
Hardboard 110 has first line layer 110D, and each soft board 120 has the second line layer 124.After hardboard 110 with soft board 120 pressing, multiple via 140 can be formed between hardboard 110 and each soft board 120.Via 140 general bore mode forms recycling plating and forms conductive layer on hole wall, with first line layer 110D and the second line layer 124 of electrically conducting.On hardboard 110 or soft board 120, general circuit board can be utilized to increase layer mode and to form outer-layer circuit again.
Afterwards, predetermined remove in the step in region fractureing, first make each hardboard unit 111 ~ 118 shaping, its molding mode can be general printed circuit board (PCB) the mode commonly used.Then V-type line of cut 110C is gone out with V-type cutting machine or with laser cutting at the lower surface of each hardboard unit 111 ~ 118 again relative to the predetermined line of cut 110B removing region 110A, at this, with incomplete cut-off, this makes a reservation for remove region 110A for principle, the degree of depth can be controlled in 8 ~ 16 Mills, residual thickness about can be controlled in 4 ~ 20 Mills, fractures follow-up to facilitate.
Then, as shown in Figure 2 B, each hardboard unit 111 ~ 118 can make via pulling folding predetermined remove region 110A along line of cut 110B and fractureed, and take out that these have fractureed remove region 110A and manifest the pi film 122 of soft board 120.
How to utilize above-mentioned Rigid Flex 100 to make extended circuit board by introducing in detail below.Please refer to Fig. 1, in the present embodiment, the hardboard 110 of a preliminary dimension is formed with multiple hardboard unit 111 ~ 118 arranged in parallel.In addition, multiple soft board 120 is bonded between two hardboard unit, but does not repeat to engage two identical hardboards, but adopts staggered mode sequentially to connect two hardboard unit.The present invention is via above-mentioned configuration, 8 hardboard unit 111 ~ 118 and 7 soft boards 120 can be combined and via after following process fabrication steps (such as: via step, anti-welding step etc.) process, utilize hardboard unit formation to remove removing step and forming extended Rigid Flex by folding step of region 110A with predetermined.The just citing of above-mentioned hardboard 111 ~ 118 and the quantity of soft board 120, can adjust according to the demand of reality.
Hardboard 110 is preferably the hard circuit board that has Double-side line layer, can be formed, and be shaped via solidification, can provide the function supporting soft board 120 during assembling by the Copper Foil of fiberglass resin and patterning in mode that is superimposed or increasing layer.Soft board 120 is preferably the flexible circuit board that has Double-side line layer, but also can have one side second line layer 124(as shown in Figure 2 A), can be made up of the Copper Foil of pi film, viscose glue and patterning.
Please refer to Fig. 2 A and Fig. 2 B, first, cut out many predetermined line of cut 110B exposing the region of soft board at each hardboard unit 111 ~ 118 and predetermined removing between the 110A of region.Then, a cementing layer 130 is utilized in conjunction with these soft boards 120 on hardboard 110.Form multiple via 140 in hardboard 110 with these soft boards 120, with the first line layer 110D on hardboard 110 and the second line layer 124 on soft board 120 of electrically conducting.Afterwards, form V-type line of cut 110C along these lines of cut 110B correspondence on hardboard 110, then fracture respectively and predeterminedly remove region 110A, to manifest each soft board 120, and make these hardboard unit 111 ~ 118 shaping.
Wherein, the practice of via 140 is as follows: (1) uses drilling machine to get out the through hole 140A be communicated among soft board 120 and hardboard 110, and in the preferred case, the diameter of through hole 140A is 0.2mm ~ 3.175mm; (2) through hole 140A is electroplated, with the first line layer 110D on each hardboard 110 and the second line layer 124 on each soft board 120 of electrically conducting.Before usual plating, first through hole 140A is carried out to the operation of de-smear, then in electroplate liquid, direct current is passed into, carry out chemical reduction reaction, to make the second line layer 124 on first line layer 110D on hardboard 110 and soft board 120 and the conductive layer 140A conducting in through hole 140B, the thickness of conductive layer 140A can be controlled in 0.5 ~ 2 Mill.
After completing via 140, a welding resisting layer 142 can be coated with again on the second line layer 124 of soft board 120 and on the first line layer 110D of hardboard 110, be oxidized to prevent line layer or polluted by solder, but manifest contact C1, C2 outside welding resisting layer 142, with the composition surface as Signal transmissions.
Please refer to the fold sequence schematic diagram of Fig. 3 A ~ Fig. 3 G, its representativeness illustrates the fold sequence of four hardboards, but is also applicable on the hardboard of greater number.First, as shown in Fig. 3 A ~ Fig. 3 C, by the first hardboard unit 111 to left folding, to make soft board 120 along orthogonal fold line L1 doubling left, soft board 120 makes a part of region overlapping of soft board 120 on another part region of soft board 120 along the downward doubling of horizontal fold line L2 more afterwards.Then, as shown in Fig. 3 D and Fig. 3 E, by the 3rd hardboard unit 113 and the 4th hardboard unit 114 to right folding, to make soft board 120 along orthogonal fold line L1 doubling to the right, soft board is again along horizontal fold line L2 upwards doubling and make a part of region overlapping of soft board 120 on another part region of soft board 120 afterwards.Then, as shown in Fig. 3 F and Fig. 3 G, by the 4th hardboard unit 114 to right folding, to make soft board 120 along orthogonal fold line L1 doubling to the right, soft board 120 makes a part of region overlapping of soft board 120 on another part region of soft board 120 along the downward doubling of horizontal fold line L2 more afterwards.In Fig. 3 G, all the first to the four hardboard unit 111 ~ 114 all arranges in the direction of extension.So, extended Rigid Flex 100a completes haply, thus folding after length S2(second length of Rigid Flex 100a) be greater than folding before original length S1(first length of Rigid Flex 100) be namely greater than the circuit board of preliminary dimension on original printed circuit board (PCB) production equipment.Therefore, the restriction of printed circuit board (PCB) production equipment can not be subject to.
Please refer to the folding schematic diagram of Fig. 4 A and Fig. 4 B, in another embodiment, it is orthogonal fold line and horizontal fold line that the eighty percent discount superimposing thread on soft board 220 does not limit, and can also be the fold line be positioned on diagonal.First, first hardboard unit 211 folds downwards, to make soft board 220 along the downward doubling of horizontal fold line L3, second hardboard unit 212 upwards folds afterwards, to make soft board 220 along diagonal fold line L4 upwards doubling, and make a part of region overlapping of soft board 220 on another part region of soft board 220.So, the L shape that the second hardboard unit 212 at right angles intersects with the first hardboard unit 211 is not arrange in the longitudinal direction.Therefore the present invention can make the Rigid Flex of different folding mode according to the demand of client, to meet the requirement of customization.
In sum, the manufacture method of Rigid Flex of the present invention overcomes the obstacle that size cannot break through, it can be made to extend along equidirectional or different directions and be combined into an extended Rigid Flex via doubling hardboard, improve the defect of the existing mode of production and improve the convenience loaded onto of subsequent group, can be widely used in the industry of the electronic products such as panel, mobile phone, memory module.
Although the present invention with embodiment openly as above; so itself and be not used to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on claims.
Claims (4)
1. a manufacture method for Rigid Flex, comprising:
There is provided two hardboard unit and a soft board, this soft board is bonded between this two hardboards unit by a cementing layer, makes this Rigid Flex have one first length; And
Along the multiple folding lines doubling on this soft board, to make this Rigid Flex have one second length along this first length, this second length is greater than this first length;
Wherein this soft board doubling step comprises:
Along an orthogonal fold line doubling, and along a horizontal fold line doubling, and make a part of region overlapping of this soft board on another part region of this soft board; And/or along a horizontal fold line doubling, and along the doubling of pair of horns fold line, and make a part of region overlapping of this soft board on another part region of this soft board.
2. the manufacture method of Rigid Flex according to claim 1, wherein those hardboards are the hard circuit board with Double-side line layer.
3. the manufacture method of Rigid Flex according to claim 1, wherein this soft board is the flexible circuit board with Double-side line layer.
4. the manufacture method of Rigid Flex according to claim 1, after wherein this Rigid Flex engages, also comprises and forms multiple via in this soft board and this two hardboards unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210350286.7A CN102869204B (en) | 2010-05-24 | 2010-05-24 | The manufacture method of Rigid Flex |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210350286.7A CN102869204B (en) | 2010-05-24 | 2010-05-24 | The manufacture method of Rigid Flex |
| CN 201010187728 CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010187728 Division CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN102869204A CN102869204A (en) | 2013-01-09 |
| CN102869204B true CN102869204B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210350286.7A Active CN102869204B (en) | 2010-05-24 | 2010-05-24 | The manufacture method of Rigid Flex |
| CN 201010187728 Active CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010187728 Active CN102264193B (en) | 2010-05-24 | 2010-05-24 | Method for manufacturing rigid-flex circuit board |
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| CN (2) | CN102869204B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968140B (en) * | 2015-06-10 | 2018-08-10 | 江西鑫力华数码科技有限公司 | Flexible folding wiring board |
| CN110324992A (en) * | 2019-07-10 | 2019-10-11 | 高德（无锡）电子有限公司 | A kind of processing technology that Rigid Flex is uncapped using V-Cut docking cutting |
| CN113630970B (en) * | 2020-03-05 | 2023-04-25 | 武汉联影智融医疗科技有限公司 | Folding flexible wearable detection device and manufacturing method thereof |
| CN113853059B (en) * | 2020-06-28 | 2023-12-22 | 深南电路股份有限公司 | Rigid-flex printed circuit board and circuit connector |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005197295A (en) * | 2003-12-26 | 2005-07-21 | Fujikura Ltd | Connector and its manufacturing method |
| JP2008258357A (en) * | 2007-04-04 | 2008-10-23 | Fujikura Ltd | Rigid flexible board and manufacturing method thereof |
| CN100562221C (en) * | 2007-08-27 | 2009-11-18 | 南亚电路板股份有限公司 | The manufacture method of soft-hard composite board |
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2010
- 2010-05-24 CN CN201210350286.7A patent/CN102869204B/en active Active
- 2010-05-24 CN CN 201010187728 patent/CN102264193B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102264193A (en) | 2011-11-30 |
| CN102264193B (en) | 2013-06-26 |
| CN102869204A (en) | 2013-01-09 |
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