CN113156727B

CN113156727B - Array substrate, liquid crystal display panel and liquid crystal display device

Info

Publication number: CN113156727B
Application number: CN202110477213.3A
Authority: CN
Inventors: 张立志; 林欣; 康报虹
Original assignee: HKC Co Ltd
Current assignee: HKC Co Ltd
Priority date: 2021-04-29
Filing date: 2021-04-29
Publication date: 2022-09-20
Anticipated expiration: 2041-04-29
Also published as: CN113156727A; WO2022227676A1

Abstract

The application provides an array substrate, liquid crystal display panel and liquid crystal display device relates to and shows technical field, and this array substrate includes: the base plate of base and the metal pattern layer of range upon range of setting, the array substrate still includes: the display device comprises a display area and a binding area, wherein the binding area is positioned on at least one side outside the display area; the metal pattern layer is located the bonding region, and the metal pattern layer includes a plurality of pads and many test leads, and the array substrate still includes: the two laser marks are arranged along the second direction, and a laser cutting area is defined by the two laser marks; in the laser cutting area, when the distance between two adjacent test leads along the second direction is greater than or equal to the reference distance, the array substrate further comprises at least one auxiliary lead arranged on the same layer as the metal pattern layer between the two adjacent test leads. The auxiliary lead is additionally arranged between the sparse test leads to assist subsequent machine detection, so that the purpose of preventing the machine from being misreported is achieved.

Description

Array substrate, liquid crystal display panel and liquid crystal display device

Technical Field

The application belongs to the technical field of display, and particularly relates to an array substrate, a liquid crystal display panel and a liquid crystal display device.

Background

A Liquid Crystal Display (LCD) panel has the advantages of low radiation, small size, and low power consumption, and is widely used in various electronic devices such as notebook computers and televisions.

The liquid crystal display panel generally includes an array substrate (TFT), a color filter substrate (CF), a Liquid Crystal (LC) sandwiched between the array substrate and the color filter substrate, and a sealant frame.

The array substrate comprises a display area and a peripheral area arranged outside the display area. Since the array substrate needs to connect a circuit in the display area with a driving circuit outside the array substrate to realize signal transmission, a plurality of pads and a plurality of signal leads are disposed in the peripheral area of the array substrate. The first end of each signal lead is connected with one bonding pad, and the second end of each signal lead is connected with a driving circuit outside the array substrate. By using the structure, when the circuit in the display area is connected with the bonding pad, an external signal can be transmitted to the inside of the display area of the array substrate so as to control a display picture.

In addition, some pads and test leads are usually distributed in the peripheral region for testing the display region, and after the test is completed, the test leads are usually required to be disconnected in order to avoid the subsequent short-circuit problem. In the exemplary technique, the test leads are typically cut using a laser technique, and the machine is used to check whether the test leads are completely cut after the cutting is completed.

However, in the actual operation process, due to the problems of limited detection range and detection precision of the machine, the machine determines the place where some test leads are cut as being incorrect as the place where no test lead is cut, and further the detection result is inaccurate.

Disclosure of Invention

The embodiment of the application provides an array substrate, a liquid crystal display panel and a liquid crystal display device, and the auxiliary lead is additionally arranged between sparse test leads to assist subsequent machine detection, so that the condition that a machine mistakenly regards the sparse area of the test leads as the test leads which are not cut off by laser is avoided, and the purpose of preventing the machine from being mistakenly reported is achieved.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect, an array substrate is provided, which includes a substrate base plate and a metal pattern layer, which are stacked, and the array substrate further includes: the display device comprises a display area and a binding area, wherein the binding area is positioned on at least one side outside the display area;

the metal pattern layer is positioned in the binding region and comprises a plurality of bonding pads and a plurality of test leads, and the bonding pads are in one-to-one correspondence with and connected with the test leads;

the array substrate further includes: the laser cutting device comprises two laser marks arranged along a second direction and a laser cutting area defined by the two laser marks; the second direction is parallel to the direction in which the edge of the display area closest to the binding area is located;

the length of the laser cutting area along the second direction is greater than a preset length; the test leads positioned in the laser cutting area are parallel to the first direction, the distance between every two adjacent test leads along the second direction is larger than or equal to the first distance, and the first direction is perpendicular to the second direction;

in the laser cutting area, when the distance between two adjacent test leads along the second direction is greater than or equal to a reference distance, between the two adjacent test leads, the array substrate further includes at least one auxiliary lead disposed on the same layer as the metal pattern layer, and the reference distance is greater than the first distance.

The array substrate that first aspect provided, in radium-shine cutting zone, when two adjacent test lead wires are greater than or equal to the reference interval along the interval of second direction, through between two adjacent test lead wires, add the auxiliary lead wire with the same layer setting of metal pattern layer, come supplementary follow-up machine platform to detect radium-shine effect, avoid the machine platform mistake to regard as the test lead wire sparse region not by the test lead wire that radium-shine cut off to play the purpose that prevents the machine platform false positive.

In a possible implementation manner of the first aspect, the two laser marks are a first laser mark and a second laser mark, respectively;

when the distance between the test lead closest to the first laser mark and the first laser mark along the second direction is greater than or equal to the reference distance, the array substrate further comprises at least one auxiliary lead between the test lead closest to the first laser mark and the first laser mark;

when the distance between the test lead closest to the second laser mark and the second laser mark along the second direction is greater than or equal to the reference distance, the array substrate further comprises at least one auxiliary lead between the test lead closest to the second laser mark and the second laser mark.

In a possible implementation manner of the first aspect, a relationship between the reference pitch and the first pitch is: dc is more than or equal to 2 XD 1+ ds;

where Dc is the reference pitch, D1 is the first pitch, and ds is the length of the auxiliary lead in the second direction. In this implementation, when the spacing between two adjacent test leads is greater than or equal to the reference spacing, at least one auxiliary lead having a width ds may be disposed between the spacings.

In a possible implementation manner of the first aspect, at least 25 μm or more of the first pitch is larger than or equal to.

In a possible implementation manner of the first aspect, a width of the auxiliary lead along the second direction is in a range of 2.5 μm to 100 μm.

In a possible implementation manner of the first aspect, the auxiliary lead extends along the first direction, and a length of the auxiliary lead along the first direction is greater than a length of the laser mark along the first direction.

In a possible implementation manner of the first aspect, when the array substrate includes a plurality of auxiliary leads, the plurality of auxiliary leads are arranged at intervals along the second direction with a second pitch, and the second pitch is equal to the first pitch.

In a possible implementation manner of the first aspect, the array substrate further includes a first metal pattern layer, an insulating layer, a second metal pattern layer, and a pixel electrode layer, which are located in the display area and stacked;

the auxiliary lead and the first metal pattern layer, or the auxiliary lead and the insulating layer, or the auxiliary lead and the second metal pattern layer, or the auxiliary lead and the pixel electrode layer are made of the same material.

In a second aspect, there is provided a liquid crystal display panel comprising: a counter substrate and an array substrate as in the first aspect or any possible implementation manner of the first aspect, and a liquid crystal layer disposed between the counter substrate and the array substrate.

In a third aspect, there is provided a liquid crystal display device comprising: a liquid crystal display panel as described in the second aspect.

The embodiment of the application provides an array substrate, liquid crystal display panel and liquid crystal display device, in radium-shine cutting zone, when two adjacent test lead wires are greater than or equal to the reference interval along the interval of second direction, through between two adjacent test lead wires, add the auxiliary lead wire with the same layer setting of metallic pattern layer, come supplementary follow-up platform to detect radium-shine effect, avoid the platform mistake to regard as the test lead wire sparse region not by the radium-shine test lead wire that cuts off, thereby play the purpose that prevents the board mistake and report.

Drawings

FIG. 1 is a schematic diagram of a liquid crystal display device;

FIG. 2 is a schematic top view of the array substrate of FIG. 1;

FIG. 3 is a schematic diagram of the structure of the bonding region of FIG. 2;

FIG. 4 is a schematic diagram of the corresponding binarized image of FIG. 3 (b);

fig. 5 is a schematic structural diagram of a bonding area provided in an embodiment of the present application;

fig. 6 is a schematic diagram of the corresponding binarized image of fig. 5 (b).

Reference numerals:

1-a frame; 2-cover glass; 3-a liquid crystal display panel; 4-a backlight module; 5-a circuit board; 10-a display area; 11-a signal line; 20-a peripheral zone; 21-a binding region; 22-an unbound region; 31-an array substrate; 32-a counter substrate; 33-a liquid crystal layer; 110-substrate base plate; 120-a metal pattern layer; 210-a pad; 220-test leads; 30-laser cutting area; 310-laser marking; 311-first laser mark; 312-second laser mark; 40-auxiliary lead.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art. The terms "first," "second," "third," "fourth," and the like, as used in the description and in the claims, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Thus, features defined as "first", "second", "third", "fourth" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specified.

The directional terms "left", "right", "upper" and "lower" are defined with respect to the orientation in which the display assembly is schematically placed in the drawings, and it is to be understood that these directional terms are relative concepts, which are used for descriptive and clarifying purposes, and may be changed accordingly according to the change of the orientation in which the array substrate or the display device is placed.

With the development of display technology, liquid crystal display technology has been widely applied to various electronic devices. An electronic apparatus for performing display using a liquid crystal display technology includes a liquid crystal display device, and the liquid crystal display device generally includes a liquid crystal display panel including an array substrate and a driving device for driving the liquid crystal display panel. The embodiment of the application provides an array substrate which is applied to a liquid crystal display device in electronic equipment.

The electronic device can be a plurality of different types of electronic devices such as a smart phone, a tablet computer, an electronic reader, a vehicle-mounted computer, a navigator, a digital camera, a smart television and a smart wearable device. The embodiments of the present application do not set any limit to this.

Fig. 1 shows a schematic structural diagram of a liquid crystal display device provided in an embodiment of the present application. As shown in fig. 1, the main structure of the liquid crystal display device includes a frame 1, a cover glass 2, a liquid crystal display panel 3, a backlight module 4, a circuit board 5, and other electronic components including a camera. The circuit board 5 is a driving device for driving the liquid crystal display panel 3, or is a part of the driving device for driving the liquid crystal display panel 3. Further, the circuit board 5 may be a flexible circuit board.

As shown in fig. 1, the liquid crystal display panel 3 includes an array substrate 31, a counter substrate 32, a liquid crystal layer 33 provided between the array substrate 31 and the counter substrate 32, and upper and lower polarizing layers and the like. The array substrate 31 and the opposite substrate 32 are bonded together by the sealant, so that the liquid crystal layer 33 is limited in the region surrounded by the sealant. When the color filter layer is disposed on the opposite substrate 32, the opposite substrate 32 is a color filter substrate.

The longitudinal section of the frame 1 is U-shaped, the liquid crystal display panel 3, the backlight module 4, the circuit board 5 and other electronic accessories including a camera and the like are arranged in the frame 1, the backlight module 4 is positioned below the liquid crystal display panel 3, the circuit board 5 is positioned between the backlight module 4 and the frame 1, and the cover plate 2 is positioned on one side of the liquid crystal display panel 3 far away from the backlight module 4.

The light path propagation sequence in the liquid crystal display device of fig. 1 is: the backlight module 4 emits light through the array substrate 31, the liquid crystal layer 33, and the counter substrate 32 of the liquid crystal display panel 3 in this order, and then emits light through the cover plate 2.

Fig. 2 shows a schematic top view of the array substrate 31 in fig. 1 on the basis of fig. 1. As shown in fig. 2, in the top view, the array substrate 31 includes a display region 10 and a peripheral region 20 surrounding the display region 10, the peripheral region 20 includes a bonding region 21 and an unbonded region 22, the bonding region 21 is disposed at least one side outside the display region 10, and fig. 2 illustrates an example where the bonding region 21 is located at a lower side outside the display region 10.

Fig. 3 is a schematic diagram of the structure of the bonding area 21 in fig. 2 in an exemplary technique. Fig. 3 (a) is a schematic structural view of a test lead before being cut by a laser technique in an exemplary technique; fig. 3 (b) is a schematic diagram of the test leads after they are cut by laser technique in the exemplary technique.

As shown in fig. 2 and 3, a plurality of signal lines 11 for displaying are disposed in the display region 10 of the array substrate 31, and the bonding region 21 is disposed with a plurality of bonding pads 210 arranged along the x direction, and the bonding pads 210 are, for example, square. In addition, a plurality of test leads 220 are disposed in the bonding region 21, the test leads 220 are bent, and the test leads 220 are in one-to-one correspondence with and connected to the pads 210.

It should be understood that the pad 210 of the bonding area 21 is used to connect with the signal line 11 in the display area 10, one end of the testing lead 220 is connected with the pad 210, and the other end is connected with an external driving circuit, so that the circuit structure formed by the testing lead 220 and the pad 210 can transmit the signal provided by the driving circuit to the inside of the display area 10 according to the sequence of the testing lead 220, the pad 210, and the signal line 11 in the display area 10, so as to control the display screen and test the display function of the display area 10.

Illustratively, as shown in fig. 3, taking a plurality of pads 210 as an example, the plurality of pads 210 are arranged along a second direction (e.g., y direction). Each pad 210 is connected to one test lead 220, that is, there are a plurality of test leads 220, and all the test leads 220 extend along a first direction (for example, x direction) and are bent, and the x direction and the y direction are perpendicular to each other.

A laser cutting area 30 is further distributed in the binding area 21, and the laser cutting area 30 is defined by two laser marks 310 arranged along the second direction. The test leads 220 in the laser cutting area 30 are all parallel to the first direction x, and the test leads 220 in the laser cutting area 30 will be laser cut after the test is completed. In the case of the laser mark 310 being a square, the size of the laser cutting area 30 is generally determined by taking the distance between two laser marks 310 as the length and taking the side length of the laser mark 310 as the width, so as to form a rectangular laser cutting area 30.

When laser cutting is carried out, a machine station firstly searches for two laser marks 310, and then determines a laser cutting area 30 through the two laser marks 310; laser cutting is then typically selected to begin at laser mark 310, which is closer to the edge of the bonded area 21. For example, in fig. 3, second laser mark 312 is closer to the edge of bonding area 21 extending along first direction x than first laser mark 311, and the machine performs laser from the position of second laser mark 312 to the position of first laser mark 311, so as to cut off test lead 220 located in laser cutting area 30.

After the laser technology is used for cutting, the machine can photograph the laser cutting area 30 to generate a corresponding binary image, and the laser effect is detected according to the binary image. For example, fig. 4 is a binarized image corresponding to (b) in fig. 3, in which the pad 210, the test lead 220, and the laser mark 310 correspond to a white area in fig. 4, and the others correspond to a black area in fig. 4. It should be understood that the binarized image here is usually a part of the binding area 21 due to the limited range of the photographing lens. The machine station can determine the laser cutting area 30 according to the binary image, and then judge whether the laser effect is qualified according to whether the corresponding pixel value in the laser cutting area 30 meets the preset condition.

However, during actual wiring, the pads 210 in the bonding area 21 are usually distributed unevenly along the second direction y, and the test leads 220 connected thereto are also distributed unevenly along the second direction y, and in addition, in order to save the layout space, the bending conditions of the test leads 220 are also different, which further causes uneven distribution of the test leads 220 along the second direction y, for example, uneven distribution of the test leads 220 located in the laser cutting area 30 along the second direction y. Some of the test leads 220 are closer together, some of the test leads 220 are farther apart, and the test lead 220 closest to the laser mark 310 may be further apart from the laser mark 310.

Therefore, after the cutting is performed by using the laser technology, when the machine station detects the laser effect according to the binary image, the machine station is limited by the lens range of the machine station, and when the machine station judges the laser effect according to the pixel value, the machine station can mistakenly think that no test lead 220 is cut off by the laser in the lens range, so that the error is reported.

For example, after the machine tool cuts from the position of the second laser mark 312 to the position of the first laser mark 311, when the rightmost test lead 220 is far from the second laser mark 312, most of the pixel values detected by the machine tool in the lens range (the region P shown in fig. 4) are 0, and the preset condition (for example, 98% of the pixel values in the binarized image are 0) is satisfied, so that although two test leads 220 are actually cut by the laser, the machine tool may mistakenly assume that no test lead 220 is cut by the laser in the lens range, resulting in a false alarm.

In view of this, the embodiment of the present application provides an array substrate, in which auxiliary leads are added between test leads having a distance greater than or equal to a reference distance, so that a machine can refer to the auxiliary leads to determine whether the test leads are cut when performing laser, thereby achieving the purpose of preventing false alarm of the machine.

The structure of the array substrate according to the embodiment of the present application will be described in detail with reference to fig. 2 and 5 to 6. Fig. 5 (a) is a schematic structural diagram of a bonding region in an array substrate according to an embodiment of the present application, fig. 5 (b) is a schematic structural diagram of fig. 5 (a) after laser cutting, and fig. 6 is a schematic structural diagram of a binarized image corresponding to fig. 5 (b).

As shown in fig. 2 and 5, an array substrate provided in an embodiment of the present application includes: the array substrate 31 further includes: a display area 10 and a binding area 21, the binding area 21 being located at least at one side outside the display area 10.

It should be understood that the display region 10, which refers to a region where the array substrate 31 can display an image, may be disposed in a middle region of the array substrate 31, and the display region 10, which is disposed in the center of the array substrate 31 and has a rectangular shape, is taken as an example in the present embodiment. In addition, the array substrate 31 generally further includes a peripheral area 20, the peripheral area 20 refers to an area where an image cannot be displayed, the peripheral area 20 is generally disposed around the display area 10, and the embodiment of the present invention takes the peripheral area 20 with a uniform width around the display area 10 as an example. The peripheral region 20 is used for arranging circuit traces and other driving electronic components.

It is to be understood that the peripheral region 20 includes a bonded region 21 and an unbonded region 22, as shown in fig. 2. The bonding region 21, which is a region of the array substrate 31 for connecting an external driving circuit with a circuit in the display region 10, is usually disposed at a side outside the display region 10, and the bonding region 21 is located at a lower side of the display region 10 in this embodiment of the present application. The unbonded area 22 refers to an area remaining in the peripheral area 20 except for the unbonded area 21.

It should be understood that the array substrate 31 may include a plurality of bonding regions 21, and the application is not limited in any way to the number of bonding regions 21. The plurality of binding regions 21 may be distributed on the same side outside the display region 10 at the same time, or may be distributed on different sides outside the display region 10, which is not limited in this embodiment of the application.

The metal pattern layer 120 is located in the bonding region 21, the metal pattern layer 120 includes a plurality of pads 210 and a plurality of test leads 220, and the pads 210 are in one-to-one correspondence with and connected to the test leads 220.

It should be understood that the pad 210 is used for connecting with the signal line 11 in the display area 10, and the end of the test lead 220 not connected with the pad 210 is used for connecting with an external driving circuit, so that the external driving circuit, the test lead 220, the pad 210, and the signal line 11 in the display area 10 can form a conductive loop, and an external signal is transmitted to the inside of the display area 10 to test the display function of the display area 10.

Here, the number and arrangement of the pads 210, and the number and routing manner of the test leads 220 may be set according to the requirement, which is not limited in this embodiment of the application.

It should be understood that the metal pattern layer 120 may be laid on the same layer as the signal lines 11 of the display area 10, and the embodiment of the present application does not limit this.

The array substrate 31 further includes: two laser marks 310 arranged along the second direction, and a laser cut area 30 defined by the two laser marks 310. The second direction is the direction in which the edge of display area 10 closest to binding area 21 is located.

It should be appreciated that the laser mark 310, the pad 210 and the test leads 220 may be made of the same material in the same layer, and the laser mark is convenient for the machine to use and will not be laser-off.

Illustratively, the binding region 21 is located at the lower side of the display region 10, and the edge of the display region 10 closest to the binding region 21 is the edge of the lower side, and the direction of the edge is the horizontal direction, that is, the second direction is the horizontal direction y. Thus, the two laser marks 310 are arranged in the horizontal direction y. The first direction is perpendicular to the second direction, and the first direction is a perpendicular direction x.

As shown in fig. 5, the distance between two laser marks 310 (the length along the second direction y) is the length of the laser cutting area 30 along the second direction y, and the length of the laser mark 310 along the first direction x is the length of the laser cutting area 30 along the first direction x. Thus, a rectangular laser cut 30 is defined by two laser marks 310.

It should be appreciated that the laser mark 310 is used to define the laser cutting area 30, so that the machine can subsequently determine the laser cutting area 30 from the laser mark 310, and then perform laser cutting on the test lead 220 located in the laser cutting area 30.

The length of the laser cutting area 30 along the second direction is greater than the preset length; the test leads 220 in the laser cutting area 30 are all parallel to the first direction, and the distance between two adjacent test leads 220 along the second direction is greater than or equal to the first distance, and the first direction is perpendicular to the second direction.

The length of the laser cutting area 30 along the second direction is greater than the preset length, that is, the distance between two laser marks 310 is greater than the preset length.

The preset length is set according to needs, and the embodiment of the application does not limit the preset length. Illustratively, the range of the lens detected by the machine station is usually less than 3000 μm, and therefore, the preset length can be set to 3000 μm, based on which, when the machine station detects the laser effect of the laser cutting area 30 by using one laser mark 310 as a reference point, another laser mark 310 does not appear in the range of the lens, so that false alarm does not appear.

It should be appreciated that when the test leads 220 located in the laser cutting area 30 are all parallel to the first direction x, the effective cutting length for each test lead 220 is the cross-sectional length of the test lead 220, thereby avoiding wasting laser energy. In addition, when the distance between two adjacent test leads 220 along the second direction is greater than or equal to the first distance, short circuit can be avoided.

In the laser cutting area 30, when the distance between two adjacent test leads 220 along the second direction is greater than or equal to the reference distance, between two adjacent test leads 220, the array substrate 31 further includes at least one auxiliary lead 40 disposed on the same layer as the metal pattern layer 120, and the reference distance is greater than the first distance.

The reference pitch may be set as needed, and the embodiment of the present application does not limit this.

It should be understood that, when the distance between two adjacent test leads 220 along the second direction is greater than or equal to the reference distance, the reference distance is greater than the first distance, at this time, the test leads 220 are sparse, and when the laser effect detection is performed on the machine, it may be mistaken that no test lead 220 is cut off, and therefore, the auxiliary lead 40 may be added between two sparse test leads 220 to use the auxiliary lead 40 as a reference, so that when the subsequent detection is performed, the erroneous judgment of the machine can be avoided, and the detection accuracy is improved.

Here, the auxiliary lead 40 and the metal pattern layer 120 are disposed in the same layer, that is, the auxiliary lead 40 and the test lead 220 are disposed in the same layer, so that the auxiliary lead 40 and the test lead 220 in the laser cutting area 30 can be cut off at the same time when performing laser cutting.

The embodiment of the application provides an array substrate, in radium-shine cutting zone, when two adjacent test lead wires are greater than or equal to the reference interval along the interval of second direction, through between two adjacent test lead wires, add the supplementary lead wire with the same layer setting of metal pattern layer, assist follow-up machine platform and detect radium-shine effect, avoid the machine platform mistake to regard as the test lead wire sparse region not by the test lead wire that radium-shine cut off to play the purpose that prevents the machine platform mistake and report.

In an embodiment of the present application, as shown in fig. 3 to 6, the two laser marks 310 are a first laser mark 311 and a second laser mark 312.

As shown in fig. 5 and 6, when the distance between the test lead 220 closest to the first laser mark 311 and the first laser mark 311 in the second direction y is greater than or equal to the reference distance, the array substrate 31 further includes at least one auxiliary lead 40 between the test lead 220 closest to the first laser mark and the first laser mark 311.

When the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 in the second direction is greater than or equal to the reference distance, the array substrate 31 further includes at least one auxiliary lead 40 between the test lead 220 closest to the second laser mark 312 and the second laser mark 312.

For example, as shown in fig. 5 and 6, the laser mark 310 near the left side of the bounded region 21 is a first laser mark 311, and the laser mark 310 near the right side of the bounded region 21 is a second laser mark 312. Of course, the positions of the two laser marks 310 may be interchanged, which is not limited by the embodiment of the present application.

Thus, the test lead 220 closest to the first laser mark 311 is the leftmost test lead 220 (e.g., G1 in fig. 5), and the test lead 220 closest to the second laser mark 312 is the rightmost test lead 220 (e.g., Gn in fig. 5).

Therefore, when the distance between the test lead G1 and the first laser mark 311 along the second direction y is greater than or equal to the reference distance, it indicates that the distance between the test lead G1 and the first laser mark 311 is too far, and when the machine performs the laser effect detection in the later stage, it may be mistaken that no test lead 220 is cut off between the test lead G1 and the first laser mark 311 by the laser, and therefore, the auxiliary lead 40 is further added between the test lead G1 and the first laser mark 311 in the embodiment of the present application. Here, a plurality of auxiliary leads 40 may be disposed between the test lead G1 and the first laser mark 311 according to the distance therebetween, and may be disposed specifically according to the requirement, which is not limited in this application. The auxiliary lead 40 may have the same structure as the auxiliary lead 40 added between the two test leads 220.

When the distance between the test lead Gn and the second laser mark 312 along the second direction y is greater than or equal to the reference distance, it is indicated that the distance between the test lead Gn and the second laser mark 312 is too far, and when the laser effect is detected by a machine in the later stage, it may be mistakenly assumed that no test lead 220 is cut off by laser between the test lead Gn and the second laser mark 312, so that the auxiliary lead 40 is additionally arranged between the test lead Gn and the second laser mark 312 in the embodiment of the present application. Here, according to the distance between the test lead G1 and the first laser mark 311, a plurality of auxiliary leads 40 may be disposed between the test lead G1 and the first laser mark 311, and may be particularly disposed as needed, which is not limited in this application. The auxiliary lead 40 may have the same structure as the auxiliary lead 40 additionally provided between the two test leads 220.

In an embodiment of the present application, the auxiliary wire 40 extends along the first direction and the length of the auxiliary wire 40 along the first direction is greater than the length of the laser mark 310 along the first direction.

It should be appreciated that the auxiliary leads 40 in the laser cutting area 30 are parallel to the first direction x, i.e. the auxiliary leads 40 are parallel to the test leads 220, so as to avoid wasting laser energy by making the auxiliary leads 40 too wide.

As shown in fig. 5 and 6, when the length of the auxiliary lead 40 along the first direction x is greater than the length of the laser mark 310 along the first direction, after the laser cutting is completed, the auxiliary lead 40 located in the laser cutting area 30 will be cut off, and the auxiliary lead 40 located outside the laser cutting area 30 will remain, and the remaining portion can be used as a reference to determine the laser cutting effect when the subsequent machine performs detection.

For example, after the cutting by the laser technique, the machine station detects the laser effect according to the binarized image (fig. 6) corresponding to (b) in fig. 5, at this time, the pad 210, the test lead 220, the remaining auxiliary lead 40, and the laser mark 310 correspond to the white area in fig. 6, and the other correspond to the black area in fig. 6.

Based on this, for example, the stage detects that 80% of the pixel values in the lens range (e.g., the region P1 shown in fig. 6) are 0, and the preset condition is not satisfied (e.g., 98% of the pixel values in the binarized image are 0), so that the stage can determine that the test lead 220 is cut by laser cutting.

In an embodiment of the present invention, when the array substrate includes a plurality of auxiliary wires 40, the plurality of auxiliary wires 40 are arranged at intervals along the second direction with a second pitch, and the second pitch is equal to the first pitch.

It should be understood that the plurality of auxiliary leads 40 are arranged along the second direction at a second pitch, so that the short circuit problem during the laser process can be avoided.

It should be understood that, when the distance between the auxiliary leads 40 is the same as the distance between the test leads 220, the arrangement is more uniform, laser cutting is facilitated, and the problems of short circuit, unclean laser and the like are avoided.

In an embodiment of the present application, the width of the auxiliary lead 40 along the second direction ranges from 2.5 μm to 100 μm.

It should be understood that if the width of the auxiliary lead 40 along the second direction is too small, the subsequent machine may not detect it, and cannot determine whether the auxiliary lead is cut by the laser; if the width is too large, the laser energy required during laser is very large, the energy consumption is large, and in addition, the laser cutting is easy to be unclean, so that the width dereferencing range of the auxiliary lead 40 along the second direction preferably meets 2.5-100 micrometers.

For example, the width ds of the auxiliary lead 40 in the second direction y is 2.5 μm, or the width ds of the auxiliary lead 40 in the second direction y is 100 μm.

In an embodiment of the present application, the relationship between the reference pitch and the first pitch is: dc is more than or equal to 2 XD 1+ ds; where Dc is the reference pitch, D1 is the first pitch, and ds is the length of the auxiliary lead 40 in the second direction y.

It should be understood that when the reference pitch satisfies the formula Dc — 2 × D1+ ds, the pitch of two adjacent test leads 220 in the second direction y is equal to the reference pitch, and one auxiliary lead 40 with the width ds may be additionally disposed between the two adjacent test leads 220 to assist the detection. When the reference spacing is greater than 2 × D1+ ds, the spacing between two adjacent test leads 220 along the second direction y is greater than or equal to the reference spacing, and a plurality of auxiliary leads 40 with a width ds may be added between the two adjacent test leads 220 to assist the detection.

When the reference distance satisfies the formula Dc — 2 × D1+ ds, the distance between the test lead 220 closest to the first laser mark and the first laser mark 311 along the second direction y is equal to the reference distance, and an auxiliary lead 40 with a width ds may be added between the two to achieve the auxiliary detection effect. When the reference spacing is greater than 2 × D1+ ds, the test lead 220 closest to the first laser mark and the first laser mark 311 are separated by a distance greater than or equal to the reference spacing, and a plurality of auxiliary leads 40 with a width ds may be added between the two for assisting the detection.

Similarly, when the reference distance satisfies the formula Dc being 2 × D1+ ds, the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 along the second direction y is equal to the reference distance, and an auxiliary lead 40 with a width ds may be added between the two to achieve the auxiliary detection effect. When the reference spacing is greater than 2 × D1+ ds, the test lead 220 closest to the second laser mark 312 and the second laser mark 312 are separated by a distance greater than or equal to the reference spacing, and a plurality of auxiliary leads 40 with a width ds may be added between the two for assisting the detection.

In an embodiment of the present application, the first pitch is at least greater than or equal to 25 μm.

It is understood that short circuits may occur if the first pitch between adjacent test leads 220 is too small, and thus, the first pitch may take on a value at least greater than or equal to 25 μm.

In an embodiment of the present application, the array substrate further includes a first metal pattern layer, an insulating layer, a second metal pattern layer, and a pixel electrode layer, which are located in the display region 10 and stacked;

the auxiliary wire 40 and the first metal pattern layer, or the auxiliary wire 40 and the insulating layer, or the auxiliary wire 40 and the second metal pattern layer, or the auxiliary wire 40 and the pixel electrode layer are made of the same material.

It should be understood that when the auxiliary wire 40 and the first metal pattern layer, or the auxiliary wire 40 and the insulating layer, or the auxiliary wire 40 and the second metal pattern layer, or the auxiliary wire 40 and the pixel electrode layer are formed of the same material, the process can be simplified and the production yield can be improved.

The embodiment of the present application further provides a liquid crystal display panel, including: the liquid crystal display panel comprises a counter substrate, an array substrate and a liquid crystal layer, wherein the array substrate is arranged on the counter substrate, and the liquid crystal layer is arranged between the counter substrate and the array substrate.

The beneficial effects of the liquid crystal display panel provided by the embodiment of the application are the same as the beneficial effects corresponding to the upper array substrate, and are not repeated herein.

An embodiment of the present application further provides a liquid crystal display device, including: the liquid crystal display panel described above.

The beneficial effects of the liquid crystal display device provided by the embodiment of the application are the same as the corresponding beneficial effects of the array substrate, and are not repeated herein.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. An array substrate, comprising a substrate and a metal pattern layer, wherein the substrate and the metal pattern layer are stacked, and the array substrate further comprises: the display device comprises a display area and a binding area, wherein the binding area is positioned on at least one side outside the display area;

the length of the laser cutting area along the second direction is greater than a preset length; the test leads positioned in the laser cutting area are parallel to a first direction, the distance between every two adjacent test leads along a second direction is larger than or equal to a first distance, and the first direction is perpendicular to the second direction;

2. The array substrate of claim 1, wherein the two laser marks are a first laser mark and a second laser mark, respectively;

3. The array substrate of claim 1 or 2, wherein the auxiliary leads extend along the first direction and the length of the auxiliary leads along the first direction is greater than the length of the laser mark along the first direction.

4. The array substrate of claim 3, wherein when the array substrate comprises a plurality of auxiliary leads, the plurality of auxiliary leads are spaced at a second pitch along the second direction, the second pitch being equal to the first pitch.

5. The array substrate of claim 4, wherein the width of the auxiliary lead along the second direction ranges from 2.5 μm to 100 μm.

6. The array substrate of claim 1 or 2, wherein the relationship between the reference pitch and the first pitch is: dc is more than or equal to 2 XD 1+ ds;

where Dc is the reference pitch, D1 is the first pitch, and ds is the length of the auxiliary lead in the second direction.

7. The array substrate of claim 6, wherein the first pitch is at least greater than or equal to 25 μm.

8. The array substrate of claim 1, further comprising a first metal pattern layer, an insulating layer, a second metal pattern layer and a pixel electrode layer in the display region and stacked together;

9. A liquid crystal display panel, comprising: an opposite substrate and an array substrate as claimed in any one of claims 1 to 8, and a liquid crystal layer disposed between the opposite substrate and the array substrate.

10. A liquid crystal display device, comprising: the liquid crystal display panel according to claim 9.