CN1191746C - Production process and product of film-like flexible circuit board - Google Patents
Production process and product of film-like flexible circuit board Download PDFInfo
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- CN1191746C CN1191746C CNB021188084A CN02118808A CN1191746C CN 1191746 C CN1191746 C CN 1191746C CN B021188084 A CNB021188084 A CN B021188084A CN 02118808 A CN02118808 A CN 02118808A CN 1191746 C CN1191746 C CN 1191746C
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- flexible circuit
- film
- insulating tape
- soft insulating
- circuit board
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Abstract
The present invention relates to a production method and a product for film type flexible circuit boards. A flexible insulating tape is pressed and etched to form a protective layer in the linkage type operating mode of roll wheels to roll wheels; then, chain cavities are formed by punching and the flexible insulating tape is cut along parallels arranged along the chain cavities to form multiple flexible circuit tapes with minor width to be furled to the roll wheels. Each flexible circuit tape is provided with a plurality of film type flexible circuit boards between the chain cavities at both sides. The present invention has the efficacies of producing and making the film type flexible circuit boards of various widths and reducing manufacturing cost.
Description
Technical field
The invention relates to a kind of production method of film-like flexible circuit board, particularly relevant for production method of the film-like flexible circuit board that is applied to electric connector and products thereof, as the electric connection of display driver and display floater, the electric connection between foldable bending electronic building brick, or even [as cover brilliant on glued membrane [Chip On Film] as the chip carrier of semiconductor packages, or winding carrying encapsulation [Tape CarrierPackage], be applicable to that elasticity manufactures the film-like flexible circuit board of various width.
Background technology
Flexible printed wiring board [Flexible Printed Circuit, FPC] be to have pliability and bending property, be widely used in two electric connections between electronic building brick, announce a kind of flexible printed wiring board of announcement in No. 422933 at the TaiWan, China patent gazette, be installed in a LCD [Liquid Crystal Display; LCD] module, it is as the electric connection between LCD panel and the rigid printed circuit board.
At TaiWan, China patent gazette bulletin No. 413997 and United States Patent (USP) the 6th, in 210, No. 518, then disclose the manufacture method of flexible printed wiring board, but above-mentioned manufacture method does not disclose and can supply mass-produced manufacturing process, because the manufacturing cost of flexible printed wiring board fails effectively to reduce; In addition, the above flexible printed wiring board of thickness 0.2mm has not met demand in advanced person's electronic product, and flexible circuit board how to make the film glued membrane kenel of thickness below 0.2mm in a large number is for being badly in need of the urgent problem that solves.
Summary of the invention
Main purpose of the present invention is to provide a kind of production method of film-like flexible circuit board; mode by corresponding another rolling wheel interlock of rolling wheel; on a large-area soft insulating tape, form metallic circuit and protective layer; and this soft insulating tape of parallel lines cutting of arranging along the chain cave of both sides; make it constitute the many flexible circuit adhesive tapes that width is less; and furl in rolling wheel, reach the purpose that is applicable to the film-like flexible circuit board of manufacturing various width and reduces manufacturing cost.
The object of the present invention is achieved like this: a kind of production method of film-like flexible circuit board is characterized in that: it comprises the steps:
(a) provide a soft insulating tape, it is to furl on a rolling wheel;
(b) the pressing Copper Foil reaches continuous pressing dry film on this Copper Foil on this soft insulating tape continuously, and this soft insulating tape also is set with first datum mark;
(c) with behind first datum mark location, exposure dry film and form pattern continuously;
(d) etching Copper Foil and form line pattern, and remove this dry film;
(e) fit the protection film continuously on this soft insulating tape, be formed with datum hole on this protection film, this datum hole is aimed at the second datum mark pressing location of being located on this soft insulating tape, is formed in the protective layer on this soft insulating tape;
(f) this soft insulating tape of surface treatment makes the place of appearing of metallic circuit form electrodeposited coating;
(g) carry out the punching engineering, form the chain cave of even rows at this soft insulating tape, and the parallel lines of arranging along the chain cave are with cutting or this soft insulating tape of die-cut itemize, make it constitute the many flexible circuit adhesive tapes that width is less, and furl in other rolling wheel, this each flexible circuit adhesive tape has most the film-like flexible circuit boards between two side chain caves.
Repeat this (b) to (f) step, be formed at this soft insulating tape up to the metallic circuit that the suitable number of plies is arranged.After this punching cutting step, other includes the electric checking step, with detection flexible circuit adhesive tape, and the position of sign defective products.This soft insulating tape is to be selected from one of them of pi, polyester, poly-adhesive tape to naphthalenedicarboxylic acid second diester, liquid crystal polymer or Teflon.This protection film is to be selected from one of them of pi or polyester.After this etching step, it includes in addition: set second datum mark in this soft insulating tape, for the location of protection film.
The present invention also provides the production method of another kind of film-like flexible circuit board, and it comprises the steps:
(a) provide a soft insulating tape, its surface is formed with Copper Foil, and furls in a rolling wheel;
(b) continuous pressing dry film is on this soft insulating tape;
(c) continuous exposure dry film;
(d) etching Copper Foil and form line pattern, and remove this dry film;
(e) form protective layer on this soft insulating tape;
(f) this soft insulating tape of surface treatment;
(g) carry out the punching engineering, form the chain cave of even rows at this soft insulating tape, and the parallel lines of arranging along the chain cave are with cutting or this soft insulating tape of die-cut itemize, make it constitute the many flexible circuit adhesive tapes that width is less, and furl in other rolling wheel, this each flexible circuit adhesive tape has most the film-like flexible circuit boards between two side chain caves.
Repeat this (b) to (f) step, be formed on this soft insulating tape up to the metallic circuit that the suitable number of plies is arranged.Be somebody's turn to do after (g) punching cutting step, other includes the electric checking step, with detection flexible circuit adhesive tape, and the position of sign defective products.Should (e) form the step of protective layer for being selected from the applying of protection film, green lacquer print brush or the spraying of green lacquer.This soft insulating tape is to be selected from one of them of pi, polyester, poly-adhesive tape to naphthalenedicarboxylic acid second diester, liquid crystal polymer or Teflon.This protective layer is to be selected from one of them of pi, polyester or the green lacquer of light sensitive anti-solder.
The present invention also provides a kind of film-like flexible circuit board, it is characterized in that: it includes soft insulating barrier; A most metallic circuit are formed on this soft insulating barrier; Protective layer is formed on this soft insulating barrier, and this protective layer has the hollow out place, so that the link of metallic circuit exposes; At each film-like flexible circuit board in upright arrangement is to be formed with the chain cave that is positioned at both sides.
The thickness of this soft insulating barrier is 10-75 μ m.The thickness of this majority metallic circuit is 5-40 μ m.This protective layer is to be selected from one of them of pi, polyester or the green lacquer of light sensitive anti-solder; The thickness of this protective layer is 10-75 μ m.The link that exposes of this metallic circuit is to be formed with electrodeposited coating or projection electrode.
Describe in detail below in conjunction with preferred embodiment and accompanying drawing.
Description of drawings
Fig. 1 is the process block diagram of production method of the present invention;
Fig. 2 is the schematic perspective view of the soft insulating tape of the rolling wheel that provides of production method of the present invention;
Fig. 3 is the schematic side view of the continuous pressing Copper Foil of soft insulating tape of the present invention;
Fig. 4 is the schematic side view of the continuous pressing dry film of soft insulating tape of the present invention;
Fig. 5 is the schematic side view of soft insulating tape of the present invention in the exposure step;
Fig. 6 is the schematic side view of soft insulating tape of the present invention at etching step;
Fig. 7 is the schematic side view of soft insulating tape of the present invention in the applying step;
Fig. 8 is the schematic side view of soft insulating tape of the present invention in surface treatment step:
Fig. 9 is that soft insulating tape of the present invention is looked schematic diagram the master of punching cutting step;
Figure 10 is the generalized section of the film-like flexible circuit board that makes of production method of the present invention.
Embodiment
Consult shown in Figure 1ly, the production method of film-like flexible circuit board of the present invention comprises the steps:
A, provide soft insulating tape;
B, continuous pressing Copper Foil and continuous pressing dry film;
C, exposure dry film;
D, etching Copper Foil;
E, the continuous protection film of fitting;
F, surface treatment;
G, punching form the chain cave, and cut soft insulating tape;
H, electric checking.
As shown in Figure 2, provide in the step of soft insulating tape at (a), prepare a soft insulating tape 20, its be pliability furl in a rolling wheel 11, this soft insulating tape 20 is selected from pi [polyimide, PI], polyethylene terephthalate [Polyethylene Terephalate, be commonly called as (polyester " polyester; PET)]; poly-to naphthalenedicarboxylic acid second diester [Polyethylene naphthalate; PEN]; liquid crystal polymer [Liquid Crystal Polymer; LCP] or Teflon [Teflon, PTFE] material, in the present embodiment, this soft insulating tape 20 is the pi adhesive tape, its thickness is about 10-75 μ m, and its thickness is about 25 μ m usually.
As shown in Figure 3, in the step of (b) continuous pressing Copper Foil and continuous pressing dry film, at first be that soft insulating tape 20 is rolled out by a rolling wheel 11, and furl in another rolling wheel 11 ', and Copper Foil 30[copper foil] also by another rolling wheel 11 " roll out; between two rolling wheels 11,11 ' is to be a pressing roller bearing 12[laminator]; make Copper Foil 30 be pressed on this soft insulating tape 20; and to furl; wherein the thickness of this Copper Foil 30 is between the 5-40 μ m, usually its thickness at 18 μ m in another rolling wheel 11 '.
As shown in Figure 4, afterwards, this soft insulating tape 20 with Copper Foil 30 is rolled out by a rolling wheel 11 again, and with a dry film 40[dry film in 12 pressings of pressing roller bearing], wherein this dry film 40 is a kind of revolving property of sense film, as positive photoresistance or negative photoresistance, after the continuity pressing, the soft insulating tape 20 that will have Copper Foil 30 and dry film 40 furls in rolling wheel 11, preferably, after pressing, set first datum mark 21 of constant spacing, as dashing modes such as establishing location hole, for the location of exposure dry film step;
In other embodiment, the soft insulating tape 20 that can directly provide pressing that Copper Foil 30 is arranged by supplier only needs in b, pressing step that dry film 40 gets final product in the pressing.
As shown in Figure 5, in the step of (c) exposure dry film, be with soft insulating tape 20 scrollings one suitable length and after locating according to first datum mark 21, carry out exposure video picture (developing), make dry film 40 form the dry film 41 of patterning, by the location of first datum mark 21, soft insulating tape 20 each exposure zone are to have fixing spacing distance with adjacent exposure zone, and each exposure zone is the consistent proper alignment in continuity ground, does not have biased phenomenon of moving.
As shown in Figure 6, in the step of (d) etching Copper Foil, it is that the soft insulating tape 20 that will have patterning dry film 41 rolls out, and carry out etching, for example, be not patterned the position that dry film 41 covers, make Copper Foil 30 form the metallic circuit 31 of patterning with etching off with the copper chloride etching solution; Afterwards, and, remove the dry film 41 of this patterning, make metallic circuit 31 manifest, furl to rolling wheel 11 in oven dry and after setting second datum mark 22 with the alkali lye cleaning way.
As shown in Figure 7, in the step of (e) the continuous protection film of fitting, it is that the soft insulating tape 20 that will be formed with metallic circuit 31 rolls out, and with the hot pressing mode fit continuously the protection film 50, protection film 50 is for being selected from pi [polyimide, PI], polyester (polyester, PET), poly-to naphthalenedicarboxylic acid second diester [Polyethylene naphthalate, PEN] or liquid crystal polymer [Liquid CrystalPolymer, LCP] etc. insulating material, its thickness is about 10-75 μ m, usually its thickness is about 25 μ m, this protection film 50 is to be pre-formed hollow-out parts 53 and datum hole 52, when the protection film 50 datum hole 52 in alignment with second datum mark, 22 pressings of soft insulating tape 20 on the protection film 50, make it be formed in protective layer 51[cover layer on the soft insulating tape 20], with protection metallic circuit 31, and make the link of metallic circuit 31 expose; Perhaps, this protective layer 51 can also be green the lacquer print brush [printingj or green lacquer spraying [Spray] mode form, and green lacquer is the green lacquer of liquid photosensitive welding resistant (Liquid Photomagible SolderMask; LPSM) abbreviation; after green lacquer formed, the side carries out exposure developed, to form hollow-out parts 53.
As shown in Figure 8; in (f) surface-treated step; its be with the soft insulating tape 20 with protective layer 51 electroplate, paste solder printing and heat-resisting antirust treatment project; make and form combined type electrodeposited coating 32 or projection electrode etc. at the bared end of metallic circuit 31; wherein the formation of electrodeposited coating 32 can be selected from methods such as electroless plating, gold plating or the plumbous plating of tin; and furl to a rolling wheel 11; preferably; repeat (b)-(f) step, be formed at this soft insulating tape 20 up to the metallic circuit that the suitable number of plies is arranged.
As shown in Figure 9, form the chain cave in (g) punching, and cut in the step of soft insulating tape, be that surface treated soft insulating tape 20 is rolled out, and punching forms the chain cave 61 of even rows opposing parallel, for example, in the present embodiment, the width of soft insulating tape 20 is enough to arrange the film-like flexible circuit board 62 of triplex row, then establish chain cave 61 at 62 liang of side blows of film-like flexible circuit board of each row, and the cutting parallel lines 23 of 61 arrangements along the chain cave, with this soft insulating tape 20 of cutting [cutting] or die-cut [punching] mode itemize, make it constitute the many flexible circuit adhesive tapes 60 that width is less, and furl, and each flexible circuit adhesive tape 60 has most the film-like flexible circuit boards 62 between two side chain caves 61 in rolling wheel 13;
After forming flexible circuit adhesive tape 60, be to carry out an electric checking step, in order to detect flexible circuit adhesive tape 60, and indicate bad film-like flexible circuit board 62, normally dash and establish through hole at bad film-like flexible circuit board 62, do not need to separate or cut out and remove defective products, and the defective products of good product and tool mark is furled in rolling wheel 13.
Consult shown in Figure 10, production method according to above-mentioned film-like flexible circuit board is the flexible circuit adhesive tape 60 that can prepare many individual layer circuit simultaneously, the cross-sectional configuration of its film-like flexible circuit board 62 is as shown in figure 10, not only has mass-produced advantage, and can make the film-like flexible circuit board (35mm for example of different in width specification with same set of production equipment, 48mm, the wide metric lattice of 70mm], in the time will making broad or narrower film-like flexible circuit board 62, be to carry out the leading portion step as (b) pressing Copper Foil and continuous pressing dry film continuously with the about 250mm of the width adhesive tape that is electrically insulated; (c) exposure dry film; (d) etching Copper Foil; (e) film is protected in applying continuously; (f) surface treatment etc., only need and cut in the step of soft insulating tape in (g) punching formation chain cave, the cutting path of change cutting tool, can form the flexible circuit adhesive tape of proper width, for example with the adhesive tape manufacturing that is electrically insulated of 250mm width, can cut itemize and become three volume 70mm width, the flexible circuit adhesive tape 60 of four volume 48mm width or five volume 35mm width, so the present invention is to use same set of production equipment, a large amount of film-like flexible circuit boards of making various different in width specification, has the effect that a large amount of productions and elasticity are made, and the flexible circuit adhesive tape 60 that makes is to furl in rolling wheel 13, not only packing cost is low, and can offer the client and carry out automation assembling.
As shown in figure 10; production method according to above-mentioned film-like flexible circuit board; the film-like flexible circuit board 62 that makes is to include a soft insulating barrier 64; its material is selected from pi [polyimide; PI]; polyester (polyester; PET); poly-to naphthalenedicarboxylic acid second diester [Polyethylene naphthalate; PEN]; liquid crystal polymer [Liquid Crystal Polymer; LCP] or Teflon [Teflon; PTFE] etc. insulating material; the thickness of soft insulating barrier 64 is at 10-75 μ m; on soft insulating barrier 64, be formed with most metallic circuits 31 and a protective layer 51; for example in viscose glue 63 bonding pressing Copper Foil modes; the mode of perhaps soft insulating barrier 64 direct pressing Copper Foil before uncured; the thickness of metallic circuit 31 is at 5-40 μ m; the thickness of protective layer 51 is at 10-75 μ m; so the integral thickness of film-like flexible circuit board 62 is to be thinner than 0.2mm; and metallic circuit 31 is to be formed with electrodeposited coating 32 or projection electrode in the hollow-out parts 53 of protective layer 51; therefore; this mass producible film-like flexible circuit board 62; the utmost point is suitable as the electric connector of display pannel and printed circuit board (PCB); be widely used in LCD display; notebook computer; palmtop computer (PDA) and mobile phone or the like, even can be used as the chip carrier of semiconductor packages.
The production method of film-like flexible circuit board of the present invention also can repeat above-mentioned (b) pressing Copper Foil and continuous pressing dry film continuously; (c) exposure dry film; (d) etching Copper Foil; (e) applying protection film and (f) surface-treated step continuously are formed at this soft insulating tape 20 up to the metallic circuit that the suitable number of plies is arranged;
Afterwards, carry out (g) punching formation chain cave and cut soft insulating tape reaching (h) electric checking step, can prepare many flexible circuit adhesive tapes 60 with multilayer circuit structure.
The present invention is only with preferred embodiment explanation, anyly knows this skill person, and variation of being done and modification without departing from the spirit and scope of the present invention all belongs to protection scope of the present invention.
Claims (5)
1, a kind of production method of film-like flexible circuit board, it is characterized in that: it comprises the steps:
(a) provide a soft insulating tape, it is to furl on a rolling wheel;
(b) the pressing Copper Foil reaches continuous pressing dry film on this Copper Foil on this soft insulating tape continuously, and this soft insulating tape also is set with first datum mark;
(c) with behind first datum mark location, exposure dry film and form pattern continuously;
(d) etching Copper Foil and form line pattern, and remove this dry film;
(e) fit the protection film continuously on this soft insulating tape, be formed with datum hole on this protection film, this datum hole is aimed at the second datum mark pressing location of being located on this soft insulating tape, is formed in the protective layer on this soft insulating tape;
(f) this soft insulating tape of surface treatment makes the place of appearing of metallic circuit form electrodeposited coating;
(g) carry out the punching engineering, form the chain cave of even rows at this soft insulating tape, and the parallel lines of arranging along the chain cave are with cutting or this soft insulating tape of die-cut itemize, make it constitute the many flexible circuit adhesive tapes that width is less, and furl in other rolling wheel, this each flexible circuit adhesive tape has most the film-like flexible circuit boards between two side chain caves.
2, the production method of film-like flexible circuit board according to claim 1 is characterized in that: repeat this (b) to (f) step, be formed at this soft insulating tape up to the metallic circuit that the suitable number of plies is arranged.
3, the production method of film-like flexible circuit board according to claim 1 is characterized in that: after this punching cutting step, other includes the electric checking step, with detection flexible circuit adhesive tape, and the position of sign defective products.
4, the production method of film-like flexible circuit board according to claim 1 is characterized in that: this soft insulating tape is to be selected from one of them of pi, polyester, poly-adhesive tape to naphthalenedicarboxylic acid second diester, liquid crystal polymer or Teflon.
5, the production method of film-like flexible circuit board according to claim 1 is characterized in that: this protection film is to be selected from one of them of pi or polyester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021188084A CN1191746C (en) | 2002-04-28 | 2002-04-28 | Production process and product of film-like flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021188084A CN1191746C (en) | 2002-04-28 | 2002-04-28 | Production process and product of film-like flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1454041A CN1454041A (en) | 2003-11-05 |
| CN1191746C true CN1191746C (en) | 2005-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021188084A Expired - Fee Related CN1191746C (en) | 2002-04-28 | 2002-04-28 | Production process and product of film-like flexible circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN1191746C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108024453B (en) * | 2016-10-31 | 2020-10-23 | 宏启胜精密电子(秦皇岛)有限公司 | Hollow circuit board and manufacturing method thereof |
| CN110933846B (en) * | 2019-11-29 | 2021-01-05 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
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2002
- 2002-04-28 CN CNB021188084A patent/CN1191746C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1454041A (en) | 2003-11-05 |
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Granted publication date: 20050302 Termination date: 20170428 |