CN100562221C - The manufacture method of soft-hard composite board - Google Patents
The manufacture method of soft-hard composite board Download PDFInfo
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- CN100562221C CN100562221C CNB2007101477376A CN200710147737A CN100562221C CN 100562221 C CN100562221 C CN 100562221C CN B2007101477376 A CNB2007101477376 A CN B2007101477376A CN 200710147737 A CN200710147737 A CN 200710147737A CN 100562221 C CN100562221 C CN 100562221C
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- soft
- hardboard
- manufacture method
- hard composite
- composite board
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Abstract
The invention provides a kind of manufacture method of soft-hard composite board of improvement, particularly the method for improving at the mode that removes of unnecessary hardboard directly over the predetermined soft board bending district.Present invention be primarily characterized in that and finish after each layer hardboard circuit, etch groove in hardboard with predetermined soft board bending district intersection with laser earlier, carry out mechanical-moulded then, then etch away the copper foil layer that is positioned at channel bottom with the copper etching method again, remove the unnecessary hardboard directly over the predetermined soft board bending district at last.
Description
Technical field
The invention relates to the printed-board technology field, particularly relevant for the manufacture method of a kind of flexible-rigid compound circuit board (rigid-flex circuit board).
Background technology
Flexible-rigid compound circuit board (hereinafter to be referred as soft-hard composite board) has been widely used in mobile communication, medical treatment, industrial instrumentation and the consumption electronic products owing to have the characteristic that can destroy or force to yield.
As be familiar with this technology personnel knew, the making of soft-hard composite board is a core with a soft circuit board (hereinafter to be referred as soft board) earlier usually, utilize rigid multilayer circuit board (hereinafter to be referred as hardboard) technology again, as Layer increasing method, perhaps, on soft board, form one or more layers circuit in the mode of core lamination.At last, need to remove by the unnecessary hardboard of external form process technology again with predetermined top, soft board bending district.
Yet, utilize mechanical external form process technology to remove the practice of unnecessary hardboard, particularly soft, when the intersection of hardboard cuts the hardboard of a desired depth, have and be difficult for accurately controlling the difficulty of depth of cut and the risk that may damage soft board, and the external form process technology that removes technology need be used expensive smelting tool or fixture mostly, cause when a small amount of various production, significantly increasing cost, smelting tool or Mould design and making can cause time and pecuniary consume in addition, cause throughput rate to reduce, the phenomenon that total cost increases, therefore, this technical field still needs a kind of manufacture craft of soft-hard composite board of improvement, to improve the shortcoming of prior art.
Summary of the invention
Main purpose of the present invention promptly in the manufacture method of the soft-hard composite board that a kind of improvement is provided, is particularly improved at the mode that removes of unnecessary hardboard directly over the predetermined soft board bending district, to solve aforementioned prior art problems.
In order to reach aforesaid goal of the invention, the invention provides a kind of manufacture method of soft-hard composite board, this method includes: soft board is provided, comprises a middle base layer and two copper wire layer, wherein this copper wire layer is formed at the upper and lower surface of this centre base layer respectively; On this copper wire layer, form the protection film; Cover preforming dielectric material on this protection film, this preforming dielectric material has one or more preforming openings, to define the predetermined soft board bending district between the hardboard district; On the protection film that covers preforming dielectric material, cover copper foil layer; Form the hardboard line construction in the hardboard district, directly over predetermined soft board bending district, cover one deck dielectric material at least simultaneously; Carry out first cutting technique, remove the dielectric material of predetermined soft board bending district and hardboard district intersection, form first groove that exposes described copper foil layer; Carry out second cutting technique, will be scheduled to soft board bending district's additional hardboard of dual-side and soft board and remove moulding; Carry out the copper etch process, the copper foil layer ablation with described first channel bottom is exposed forms second groove that is connected with described preforming opening, forms unnecessary hardboard structure above described predetermined soft board bending district; And remove this unnecessary hardboard structure.
According to specific embodiments of the present invention, described middle base layer can be made up of polyimides (polyimide) resin, polyester (polyester) or liquid crystal polymer (Liquid crystal polymer).Described protection film is made of resin material (for example polyimide resin).
In the manufacture method of the present invention, when carrying out second cutting technique, can around described predetermined soft board bending district, form at least one break edge.Can form at least one explosionproof hole around the described break edge, cause the damage of hardboard or rigid-flex intersection when avoiding removing unnecessary hardboard structure.
Manufacture method of the present invention after removing described unnecessary hardboard structure, also can include following steps in addition: selectively the protection film of part in the described predetermined soft board bending district is removed, to expose first copper wire layer on soft board top.Then, carry out surface treatment on the first copper wire layer surface that can continue in predetermined soft board bending district, to be exposed, use for assembling.
In sum, the invention provides a kind of manufacture method of soft-hard composite board of improvement, mainly be after finishing each layer hardboard circuit, etch groove prior to hardboard with predetermined soft board bending district intersection, it is for example mechanical-moulded to carry out cutting technique then, then etch away the copper foil layer that is positioned at channel bottom with the copper etching method again, remove the unnecessary hardboard directly over the predetermined soft board bending district at last.The method that method of the present invention is particularly improved at the mode that removes of unnecessary hardboard directly over the predetermined soft board bending district is not damaged soft board, can solve the problems of the prior art.
Description of drawings
Fig. 1 to Fig. 7 illustrates is the schematic diagram of manufacture method of the soft-hard composite board of the preferred embodiment of the present invention.
Main symbol description among the figure:
Second of first 10b of 10 soft board 10a
24 adhesive layer, 26 protection films, 28 dielectric materials
30 copper foil layers, 32 copper wire layer 32a copper wire layer surfaces
34 adhesive layer, 36 protection films, 38 dielectric materials
40 copper foil layers, 100 102 hardboard districts, predetermined soft board bending district
104 hardboard districts, 128 preforming openings, 138 preforming openings
232 hardboard line constructions, 242 hardboard line constructions, 262 dielectric materials
304 break edges, 264 dielectric materials, 302 open areas
306 explosionproof holes, 321 copper wire layer, 322 copper wire layer
323 green enamelled coating 362 grooves 364 grooves
422 copper wire layer, 423 green enamelled coating 462 unnecessary hardboard structures
464 unnecessary hardboard structure 520 conductive through holes 521 laser blind holes
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, hereinafter the spy enumerates preferred implementation and conjunction with figs. elaborates.Yet following preferred implementation and accompanying drawing are only for reference and the usefulness of explanation, are not to be used for the present invention is limited.
See also Fig. 1 to Fig. 7, it illustrates is the schematic diagram of manufacture method of the soft-hard composite board of the preferred embodiment of the present invention.
As shown in Figure 1, at first provide a soft board 10, base layer (intermediate baselayer) 12, one copper wire layer (copper circuit pattern layer) 22 and one copper wire layer 32 in the middle of it comprises.Wherein, middle base layer 12 can be made of the dielectric material, and the material of this dielectric material can be polyimide resin, polyester (polyester) or liquid crystal polymer (Liquid crystal polymer) etc., but is not limited thereto.
Then; on first 10a of soft board 10 and second 10b, cover one deck protection film (protective cover layer) 26 and 36 respectively; this protection film material is a polyimide resin; but be not limited thereto; make the copper wire layer 22 and 32 of its below of protection that this protection film 26 and 36 can be complete; make it can avoid being corroded the copper wire layer 22 and 32 of its below, live this copper wire layer 22 and 32 in the hope of complete protection by outer etching solution.
In addition, this protection film 26 can utilize an adhesive layer 24 to combine with first 10a of soft board 10 by the pressing mode, and protection film 36 also can utilize an adhesive layer 34 to combine with second 10b of soft board 10 by the pressing mode.
Then, on protection film 26 and 36, cover the dielectric material 28 and 38 of one deck moulding in advance respectively, for example, preimpregnation material (low-flow Prepreg) layer.Wherein, Prepreg is the abbreviation of pre-impregnated, means glass fibre or other fiber and soaks resinously, and through the partially polymerized and person of making, but is not limited thereto.
Wherein, dielectric material 28 and 38 has preforming opening 128 and 138 respectively, and its position and size are done design according to the position and the size in predetermined soft board bending district 100.In other words, only on hardboard district 102 and 104, cover dielectric material 28 and 38 with one or more preforming openings 128 and 138.Then, on this dielectric material 28 and 38, cover a copper foil layer 30 and 40 respectively.
Subsequently, as shown in Figure 2, on copper foil layer 30 and 40 surfaces, do not limit increasing layer, boring, plating, circuit making and being coated with green lacquer intermediate fabrication technologies such as (solder resist) of the number of plies respectively, in hardboard district 102 and 104 form hardboard line constructions 232 and 242, and the conductive through hole (plated through hole) 520 and laser blind hole (blind via) 521 that link each layer line road (comprising soft board), wherein when increasing layer process, the space of 100 tops, predetermined soft board bending district will be filled up by dielectric material 262 and 264.
In the preferred embodiment, hardboard line construction 232 comprises a copper wire layer 321, a copper wire layer 322 and a green enamelled coating 323, hardboard line construction 242 comprises a copper wire layer 421, a copper wire layer 422 and a green enamelled coating 423, but hardboard line construction 232, the 242 circuit numbers of plies can be one to several layers, but are not limited to this.
At this moment, in predetermined soft board bending district 100, copper foil layer 30 and 40 tops are filled up by dielectric material 262 and 264 covering scopes respectively.
As shown in Figure 3, then carry out first cutting technique, this technology can use the laser beam with a predetermined power and wavelength to carry out cutting action, this technology can remove being scheduled to soft board bending district 100 and hardboard district 102 intersections and predetermined soft board bending district 100 dielectric material 262 and 264 covering scopes with hardboard district 104 intersections respectively, forms groove 362 and groove 364.
Wherein, groove 362 and groove 364 expose the copper foil layer 30 and 40 of a part respectively.And owing to have copper foil layer 30 and 40 to stop, so this laser cutting parameter can't injure soft board 10.
Then, as shown in Figure 4, carry out second cutting technique, it can utilize modes such as mechanical-moulded (routing) or laser formation, to be scheduled to soft board bending district's additional part hardboard of 100 dual-sides and soft board and remove moulding, and be scheduled to the open area 302 that the 100 both sides formation of soft board bending district runs through hardboard and soft board, and this open area 302 needs join with groove 362 and groove 364.
In Fig. 4, represent through the result after second cutting technique with top view especially.Wherein, according to a preferred embodiment of the invention, can reserve break edge 304, its enlarged drawing show can be in the break edge end of 304 form or need not form at least one explosionproof hole 306 according to design requirement.When can avoiding removing unnecessary hardboard structure, being provided with of explosionproof hole 306 cause the damage of hardboard or rigid-flex intersection.
As shown in Figure 5, then carry out the copper etch process, the copper foil layer 30 and 40 ablations that will be exposed in the bottom of groove 362 and groove 364, form groove 362a and the 364a that is connected with preforming opening 128 and 138 respectively, and above predetermined soft board bending district 100, form unnecessary hardboard structure 462 and 464 to be removed.
In addition, the production of described second cutting technique and copper etch process order can be exchanged according to technique initialization, is not limited to of the present invention.Process sequence is exchanged the elasticity that can increase in the design, and first etching aftershaping also can be exempted the step that manually removes unnecessary hardboard.
Wherein, unnecessary hardboard structure 462 comprises dielectric material 262 and copper foil layer 30, and unnecessary hardboard structure 464 comprises dielectric material 264 and copper foil layer 40.
It should be noted that when carrying out aforesaid copper etch process because still protected film 26 of internal layer circuit on the soft board 10 and 36 complete protections are lived, therefore can avoid the erosion of etching liquid medicine, this is one of major technique feature of the present invention.
As shown in Figure 6, then, can utilize artificial recessed folding or other physics mode, the aforesaid break edge 304 that fractures removes so as to the unnecessary hardboard structure 462 and 464 that will be scheduled to 100 tops, soft board bending district, exposes predetermined soft board bending district 100.
At last; as shown in Figure 7, can utilize laser according to requirement of client; selectively will be scheduled to the protection film 26,36 and the adhesive layer 24,34 of part in the soft board bending district 100 and remove, expose the copper wire layer surface 22a and the copper wire layer surface 32a on soft board 10 tops.Then, can continue to carry out surface treatment on the copper wire layer surface 22a that in predetermined soft board bending district 100, is exposed and the 32a, use for assembling.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to content of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (11)
1. the manufacture method of a soft-hard composite board, this method includes:
Soft board is provided, comprises a middle base layer and two copper wire layer, wherein this copper wire layer is formed at the upper and lower surface of this centre base layer respectively;
On this copper wire layer, form the protection film;
Cover preforming dielectric material on this protection film, this preforming dielectric material has one or more preforming openings, to define the predetermined soft board bending district between the hardboard district;
On the protection film that covers preforming dielectric material, cover copper foil layer;
Form the hardboard line construction in the hardboard district, directly over predetermined soft board bending district, cover one deck dielectric material at least simultaneously;
Carry out first cutting technique, remove the dielectric material of predetermined soft board bending district and hardboard district intersection, form first groove that exposes described copper foil layer;
Carry out second cutting technique, will be scheduled to soft board bending district's additional hardboard of dual-side and soft board and remove moulding;
Carry out the copper etch process, the copper foil layer ablation with described first channel bottom is exposed forms second groove that is connected with described preforming opening, forms unnecessary hardboard structure above described predetermined soft board bending district; And
Remove this unnecessary hardboard structure.
2. the manufacture method of soft-hard composite board as claimed in claim 1, wherein said in the middle of base layer formed by polyimide resin, polyester or liquid crystal polymer.
3. the manufacture method of soft-hard composite board as claimed in claim 1, wherein said protection film is made of resin material.
4. the manufacture method of soft-hard composite board as claimed in claim 3, wherein said resin material is a polyimide resin.
5. the manufacture method of soft-hard composite board as claimed in claim 1, wherein said preforming dielectric material is the preimpregnation material.
6. the manufacture method of soft-hard composite board as claimed in claim 1 wherein when carrying out second cutting technique, forms at least one break edge around described predetermined soft board bending district.
7. form at least one explosionproof hole around the manufacture method of soft-hard composite board as claimed in claim 6, wherein said break edge, cause the damage of hardboard or rigid-flex intersection when avoiding removing unnecessary hardboard structure.
8. the manufacture method of soft-hard composite board as claimed in claim 1, wherein after removing described unnecessary hardboard structure, other includes following steps:
The protection film of part in the described predetermined soft board bending district is removed, to expose first copper wire layer on soft board top.
9. the manufacture method of soft-hard composite board as claimed in claim 1, wherein said first cutting technique is a laser cutting.
10. the manufacture method of soft-hard composite board as claimed in claim 1, wherein said second cutting technique is mechanical-moulded or laser formation.
11. the manufacture method of soft-hard composite board as claimed in claim 10, wherein said second cutting technique is mechanical-moulded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101477376A CN100562221C (en) | 2007-08-27 | 2007-08-27 | The manufacture method of soft-hard composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101477376A CN100562221C (en) | 2007-08-27 | 2007-08-27 | The manufacture method of soft-hard composite board |
Publications (2)
| Publication Number | Publication Date |
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| CN101378625A CN101378625A (en) | 2009-03-04 |
| CN100562221C true CN100562221C (en) | 2009-11-18 |
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| CNB2007101477376A Expired - Fee Related CN100562221C (en) | 2007-08-27 | 2007-08-27 | The manufacture method of soft-hard composite board |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820729B (en) * | 2010-04-20 | 2012-03-28 | 深南电路有限公司 | PCB depth-control machining method and device thereof |
| CN102264193B (en) * | 2010-05-24 | 2013-06-26 | 健鼎（无锡）电子有限公司 | Method for manufacturing rigid-flex circuit board |
| CN102387662A (en) * | 2010-09-06 | 2012-03-21 | 上海贺鸿电子有限公司 | Rigid-flexibility circuit board and manufacturing method thereof |
| CN102271469B (en) * | 2011-07-08 | 2013-04-24 | 深圳市精诚达电路科技股份有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
| CN103384444B (en) * | 2013-07-30 | 2016-04-20 | 博敏电子股份有限公司 | A kind ofly protect rigid-flex combined board of internal layer windowed regions and preparation method thereof |
| CN110012622A (en) * | 2019-04-11 | 2019-07-12 | 信丰迅捷兴电路科技有限公司 | A kind of Rigid Flex production method of flexible board area pad laser windowing |
| CN110248502A (en) * | 2019-07-02 | 2019-09-17 | 高德（无锡）电子有限公司 | A kind of processing technology of the Rigid Flex of multilayer soft board |
| CN111836481A (en) * | 2020-06-02 | 2020-10-27 | 江西一诺新材料有限公司 | Manufacturing method of rigid-flex board |
| CN114641142A (en) * | 2020-12-16 | 2022-06-17 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of rigid-flexible circuit board |
| CN113179595B (en) * | 2021-03-25 | 2022-11-08 | 江西红板科技股份有限公司 | One-time plate milling and forming processing technology for soft and hard combined plate |
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2007
- 2007-08-27 CN CNB2007101477376A patent/CN100562221C/en not_active Expired - Fee Related
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| CN101378625A (en) | 2009-03-04 |
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