CN102867890A - 一种蓝宝石图形衬底的制备方法 - Google Patents
一种蓝宝石图形衬底的制备方法 Download PDFInfo
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- CN102867890A CN102867890A CN2011101897970A CN201110189797A CN102867890A CN 102867890 A CN102867890 A CN 102867890A CN 2011101897970 A CN2011101897970 A CN 2011101897970A CN 201110189797 A CN201110189797 A CN 201110189797A CN 102867890 A CN102867890 A CN 102867890A
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CN102867890A true CN102867890A (zh) | 2013-01-09 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103151436A (zh) * | 2013-02-20 | 2013-06-12 | 华中科技大学 | 一种孔状GaN基光子晶体LED的制备方法 |
CN103219437A (zh) * | 2013-04-22 | 2013-07-24 | 中国科学院半导体研究所 | 蓝宝石图形衬底的制备方法 |
CN103337566A (zh) * | 2013-06-19 | 2013-10-02 | 上海大学 | 一种图形化衬底制作方法 |
CN103943730A (zh) * | 2013-01-23 | 2014-07-23 | 同方光电科技有限公司 | 一种适用于发光二极管的剥离方法 |
CN104078541A (zh) * | 2014-06-23 | 2014-10-01 | 华南理工大学 | 高性能的led图形优化衬底及led芯片 |
CN105297139A (zh) * | 2015-12-01 | 2016-02-03 | 苏州安洁科技股份有限公司 | 一种增加蓝宝石表面能的方法 |
CN105336824A (zh) * | 2015-10-26 | 2016-02-17 | 华灿光电(苏州)有限公司 | 一种图形化衬底的制备方法及图形化衬底 |
CN106711354A (zh) * | 2016-12-02 | 2017-05-24 | 武汉华星光电技术有限公司 | 有机半导体器件的封装方法 |
CN112864004A (zh) * | 2021-01-04 | 2021-05-28 | 湘潭大学 | 解决光刻工艺镀膜过程中存在毛刺及去胶残留的方法 |
CN115172554A (zh) * | 2022-09-02 | 2022-10-11 | 元旭半导体科技股份有限公司 | 一种高亮度的纳米图形衬底结构及其制备方法 |
Citations (6)
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WO2005015648A1 (en) * | 2003-08-12 | 2005-02-17 | Epivalley Co., Ltd. | Method of forming grating on substrate and iii-nitride semiconductor light emitting device using the substrate |
CN101330002A (zh) * | 2007-06-20 | 2008-12-24 | 中国科学院半导体研究所 | 用于氮化物外延生长的图形蓝宝石衬底的制作方法 |
CN101471404A (zh) * | 2007-12-27 | 2009-07-01 | 深圳市方大国科光电技术有限公司 | 提高芯片出光效率的方法及蓝宝石图形衬底的制备方法 |
CN101582479A (zh) * | 2009-06-10 | 2009-11-18 | 上海蓝光科技有限公司 | 发光二极管芯片结构及其制造方法 |
CN101867001A (zh) * | 2010-05-27 | 2010-10-20 | 上海蓝光科技有限公司 | 自对准工艺制作凸形图形衬底的方法 |
CN101924173A (zh) * | 2010-05-28 | 2010-12-22 | 孙文红 | 高光效图形衬底及其制造方法 |
-
2011
- 2011-07-07 CN CN201110189797.0A patent/CN102867890B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2005015648A1 (en) * | 2003-08-12 | 2005-02-17 | Epivalley Co., Ltd. | Method of forming grating on substrate and iii-nitride semiconductor light emitting device using the substrate |
CN101330002A (zh) * | 2007-06-20 | 2008-12-24 | 中国科学院半导体研究所 | 用于氮化物外延生长的图形蓝宝石衬底的制作方法 |
CN101471404A (zh) * | 2007-12-27 | 2009-07-01 | 深圳市方大国科光电技术有限公司 | 提高芯片出光效率的方法及蓝宝石图形衬底的制备方法 |
CN101582479A (zh) * | 2009-06-10 | 2009-11-18 | 上海蓝光科技有限公司 | 发光二极管芯片结构及其制造方法 |
CN101867001A (zh) * | 2010-05-27 | 2010-10-20 | 上海蓝光科技有限公司 | 自对准工艺制作凸形图形衬底的方法 |
CN101924173A (zh) * | 2010-05-28 | 2010-12-22 | 孙文红 | 高光效图形衬底及其制造方法 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103943730A (zh) * | 2013-01-23 | 2014-07-23 | 同方光电科技有限公司 | 一种适用于发光二极管的剥离方法 |
CN103151436B (zh) * | 2013-02-20 | 2015-12-09 | 华中科技大学 | 一种孔状GaN基光子晶体LED的制备方法 |
CN103151436A (zh) * | 2013-02-20 | 2013-06-12 | 华中科技大学 | 一种孔状GaN基光子晶体LED的制备方法 |
CN103219437A (zh) * | 2013-04-22 | 2013-07-24 | 中国科学院半导体研究所 | 蓝宝石图形衬底的制备方法 |
CN103337566A (zh) * | 2013-06-19 | 2013-10-02 | 上海大学 | 一种图形化衬底制作方法 |
CN104078541A (zh) * | 2014-06-23 | 2014-10-01 | 华南理工大学 | 高性能的led图形优化衬底及led芯片 |
CN105336824B (zh) * | 2015-10-26 | 2018-03-06 | 华灿光电(苏州)有限公司 | 一种图形化衬底的制备方法及图形化衬底 |
CN105336824A (zh) * | 2015-10-26 | 2016-02-17 | 华灿光电(苏州)有限公司 | 一种图形化衬底的制备方法及图形化衬底 |
CN105297139A (zh) * | 2015-12-01 | 2016-02-03 | 苏州安洁科技股份有限公司 | 一种增加蓝宝石表面能的方法 |
CN106711354A (zh) * | 2016-12-02 | 2017-05-24 | 武汉华星光电技术有限公司 | 有机半导体器件的封装方法 |
WO2018098875A1 (zh) * | 2016-12-02 | 2018-06-07 | 武汉华星光电技术有限公司 | 有机半导体器件的封装方法 |
US10205123B2 (en) | 2016-12-02 | 2019-02-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Packaging method for organic semiconductor device |
KR20190089058A (ko) * | 2016-12-02 | 2019-07-29 | 우한 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 | 유기 반도체 디바이스의 패키징 방법 |
KR102262850B1 (ko) * | 2016-12-02 | 2021-06-08 | 우한 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 | 유기 반도체 디바이스의 패키징 방법 |
CN112864004A (zh) * | 2021-01-04 | 2021-05-28 | 湘潭大学 | 解决光刻工艺镀膜过程中存在毛刺及去胶残留的方法 |
CN115172554A (zh) * | 2022-09-02 | 2022-10-11 | 元旭半导体科技股份有限公司 | 一种高亮度的纳米图形衬底结构及其制备方法 |
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