CN1028576C - 电容器及其制造方法 - Google Patents
电容器及其制造方法 Download PDFInfo
- Publication number
- CN1028576C CN1028576C CN91109172.6A CN91109172A CN1028576C CN 1028576 C CN1028576 C CN 1028576C CN 91109172 A CN91109172 A CN 91109172A CN 1028576 C CN1028576 C CN 1028576C
- Authority
- CN
- China
- Prior art keywords
- film
- metal
- capacitor
- diameter
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000002923 metal particle Substances 0.000 claims abstract description 20
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 15
- 239000000057 synthetic resin Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000001856 Ethyl cellulose Substances 0.000 claims description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229920001249 ethyl cellulose Polymers 0.000 claims description 2
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910052742 iron Inorganic materials 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- DXOFMKNITCKTIS-QXMHVHEDSA-N (z)-2-ethyloctadec-9-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCC(CC)C(O)=O DXOFMKNITCKTIS-QXMHVHEDSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052598 goethite Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- AEIXRCIKZIZYPM-UHFFFAOYSA-M hydroxy(oxo)iron Chemical compound [O][Fe]O AEIXRCIKZIZYPM-UHFFFAOYSA-M 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 230000002101 lytic effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- HHCCNQLNWSZWDH-UHFFFAOYSA-N n-hydroxymethanimine oxide Chemical compound O[N+]([O-])=C HHCCNQLNWSZWDH-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene ethanol Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Inorganic Insulating Materials (AREA)
- Engine Equipment That Uses Special Cycles (AREA)
- Filters And Equalizers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
Abstract
一种包括大量散布在合成树脂膜上的针状金属微粒的轴向与膜表面平行，并在膜的相对的每一表面上设置一个电极。该金属微粒的直径上达0.1μm，长度为直径的5至10倍，此面积为30至100m2/gr，并且在其表面包覆介电氧化物。
Description
本发明涉及电容器及其制造方法。
人们业已提出了诸如铝电解电容器，钽电容器，陶瓷电容器，有机膜电容器，及金属化有机膜电容器等等各种固定电容器，并进一步要求它们体积小而容量大。
本发明的目的是提供一种比现有的电容器体积小，容量大而成本低的电容器。
本发明的电容器包括大量针状的金属微粒，这些金属微粒散布在一个合成树脂薄膜上，并使微粒排列成使其轴向平行于薄膜表面，在该合成树脂薄膜的相对两面各设置一个电极。金属微粒的直径上达0.1μm，其长度则为直径的5至10倍，其比面积为30至100m2gr，且其表面包覆以介电氧化物。
上述这种电容器是这样制造的：将大量针状金属微粒散布在-熔化状态或熔液状态的合成树脂上，金属微粒的直径上达0.1μm，长度为其直径的5至10倍，其比面积（specifi surface area）为30至100m2/gr，并在其表面上覆以介电氧化物，将此散布了这种金属微粒的树脂形成簿膜，向树脂簿膜的各表面加上相同的极性磁场，使金属微粒的轴向平行于树脂膜表面，然而将此状态下的树脂膜加温固化，并在由此形成的薄膜的两相对表面上各设置一电极。
按本发明制造的电容器，表面覆以介电氧化物的针状金属微粒本身就构成了一个电容器。因有大量如此取向的散布在合成树脂薄膜上的金属微粒，并在薄膜的各自表面设置有电极，因此单层形式的薄膜就有许多诸如多层中那样排列的电容器，正因为这样，本发明的电容器体积小而容量大，且其成本也因所用材料廉价而降低。此外，生产电容器的过程中无需高温热处理，从而可在低廉的设备中进行，并且使能耗降低。
现结合附图详细介绍本发明。
图1示出了实施本发明的电容器的结构。
图1所示的电容器包括大量针状金属微粒1，微粒表面包覆了介电氧化物2，微粒从图中所示的取向散布在合成树脂薄膜3上，在树脂薄膜3的相对表面上设置有电极4。
针状金属微粒1的直径上达0.1μm，长度是其直径的5至10倍，其比面积为30至100m2/gr。这些微粒可以例如通过还原金属氧化物或氢氧化物的针状晶体而容易地获得。针状金属微粒1的直径、长度和比面积按上述限定，因为，如果不按上述尺寸，金属微粒便不能给出满意的电容。
上述直径上达0.1μm，长度为直径5至10倍和比面积为30至100m2/gr的金属氧化物，氢氧化物等的针状晶体可以通过将诸如硫酸铁，氯化铁或硝酸铁的金属盐水溶液与氢氧化纳的水溶液中和
反应并在中和系统中引入空气从而生成氢氧化物，由此可获得形状和大小一致的针状晶体。
可用的金属举例有：铁，钴，镍，铬和铜等。
可用的具有大介电常数氧化物2举例有：SiO2，TiO2，及PbO等。
将金属微粒浸在有机Si化合物，有机Ti化合物，有机Pb化合物或类似化合物溶液中，取出烘干微粒再将其进行高温处置，使针状金属微粒1被覆盖上具有高介电常数的介电氧化物2。
为了将由此获得的直径上达0.1μm，长度5至10倍于直径、比面积为30至100m2/gr并包覆介电氧化物2的这些针状微粒散布固定在树脂薄膜3的表面使微粒轴向与薄膜表面平行排列，可以将金属微粒1散落到熔化状态或溶液状态的合成树脂中以形成所需厚度的薄膜，并在膜固化前再施加同极性即N-N极或S-S极的磁场到薄膜的各个表面，以使微粒水平排列，最后固化该薄膜。
可形成薄膜的树脂例如：环氧树脂，聚氨基甲酸树脂，聚乙稀醇，聚乙稀醇缩丁醛，乙基纤维，丙基酸聚合物，等。可根据需要在树脂中添加溶解剂，增塑刻，分散剂等，以使树脂膜更有效地与良好散布在其中的微粒一起形成膜。可使用的溶剂有：丙酮、甲醇、醋酸、水等，可使用的增塑剂有：聚乙稀乙醇，苯二酸酯类，或类似物。分散剂可用常用的诸如甘氮酸，乙基油酸等。
通常用医用刀片将熔化状态或熔液状态的膜成型合成树脂制成薄膜。虽然在单层电容器中使用的膜的厚度以4至5μm为宜，但厚度并不限于此。
合成树脂要以合适的温度固化，通常在室温至120℃的温度内。不需要高温固化。
可用熟知的电镀或热粘贴的方法在固化后的膜的各个表面上设置电极。
下面将结合实施更详细地描述本发明，但本发明并受此限制。
实例：
将硫酸亚铁的水溶液与氢氧化钠的水溶液进行中和反应生成氢氧化铁，与此同时使空气通过中和系统，于是获得了形状和大小一致的针铁矿（FeooH）的针状晶体。将此产物用氢还原，得到直径为0.01μm，长度为0.1um和比面积为50.7m2/gr的针状铁微粒。
将此颗粒状铁在用醋乙酸酯稀释有机硅化合物（Nippon Soda公司产品ATORON NSISOO）备制的溶液中浸泡一小时，然后在600℃下烘干加热二小时，以获得覆盖了SiO2的针状铁微粒。
表1示出了这些微粒的磁特性。
表1
HC 880 oe
δS 122 emu/gr
δR 61 emu/gr
δR/δ360 0.50
将该包覆了SiO2的微粒铁被散布在液态环氧树脂中，然后用医用刀片将其制成1μm厚的膜。将N-N极磁场加到膜的各个表面，使铁微粒水平取向，同时使膜在100至120℃下固化。固化后的膜的厚度为1μm，其中的微粒在60至100层内以水平取向排列。
用一个插入在相邻层间的梳状电极将12片膜叠压在一起，包含作为电极材料的铜-镍合金的粘胶贴到叠压膜片的相对表面并烘干，并对叠压膜片在600℃下加热以形成外电极。此叠压膜片的厚度大约为1.5mm。
将上述成品切成3.2±0.2mm×1.6±0.2mm的芯片，其测得的特性如表2所示。表2示出了与此芯片同样尺寸的常规的陶瓷层压电器芯片的特征。
表2
电容量
本发明产品 100μF
常规产品 10μF
常规产品 1μF
表2说明本发明的电容器的电容量是同样尺寸的常规陶瓷叠压电容器的10至100倍。
Claims (6)
1、一种电容器，其特征在于包括大量散布在合成树脂膜中的针状金属微粒，微粒的轴向与膜的表面平行，在该合成树脂膜的相对的每个表面上设置有一电极，该金属微粒的直径上达0.1μm，长度为该直径的5至10倍，比面积为30至100m2/gr，并在其表面包覆有介电氧化物。
2、根据权利要求1所述的电容器，其特征在于其中的针状金属微粒是用还原金属氧化物或氢氧化物的针状晶体而制备。
3、根据权利要求1所述的电容器，其特征在于其中的针状金属微粒包括从Fe，Ni，Cr和Cu一组中选出来的一种金属。
4、根据权利要求1所述的电容器，其特征在于其中的合成树脂膜包括从环氧树脂，聚氨基甲酸树脂，聚乙稀醇，聚乙稀醇缩丁醛，乙基纤维，丙基酸聚合物中一组中选出的物质。
5、一种电容器，它包括散布在多个叠合的合成树脂膜的每个膜的大量针状金属微粒，金属微粒的轴向平行于膜的表面;在每一合成树脂膜相对表面设置了一个电极，该金属微粒的直径上达0.1μm，而长度为其直径的5至10倍，其比面积为30至100m2/gr并在其表面包覆了个电氧化物
6、生产一种电容器的方法，其特征在于：将大量针状金属微粒散布在熔化状态或溶液状态的合成树脂中，该金属微粒直径上达0.1μm，长度是直径的5-10倍，比面积为30至100m2/gr，并在其表面包覆以介电氧化物，将此散布有金属微粒的树脂做成薄膜，并对树脂薄膜的各个表面施以同性的磁场，以使金属微粒的轴向与树脂膜的表面平行，将此树脂膜固化，并在由此得到的膜的每相对的每一表面设置一个电极。
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2061157A JPH03284813A (ja) | 1990-03-14 | 1990-03-14 | コンデンサ |
| DE69109678T DE69109678T2 (de) | 1990-03-14 | 1991-09-11 | Kondensator und Verfahren zu seiner Herstellung. |
| CA002051045A CA2051045A1 (en) | 1990-03-14 | 1991-09-11 | Capacitor and process for producing same |
| AT91115453T ATE122497T1 (de) | 1990-03-14 | 1991-09-11 | Kondensator und verfahren zu seiner herstellung. |
| EP91115453A EP0537371B1 (en) | 1990-03-14 | 1991-09-11 | Capacitor and process for producing same |
| US07/758,061 US5144529A (en) | 1990-03-14 | 1991-09-12 | Capacitor and process for producing same |
| AU84537/91A AU646208B2 (en) | 1990-03-14 | 1991-09-17 | Capacitor and process for producing same |
| CN91109172.6A CN1028576C (zh) | 1990-03-14 | 1991-09-23 | 电容器及其制造方法 |
| PT99045A PT99045B (pt) | 1990-03-14 | 1991-09-25 | Condensador electrico e processo para a sua fabricacao |
| BR919105224A BR9105224A (pt) | 1990-03-14 | 1991-12-02 | Capacitor e processo para sua producao |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2061157A JPH03284813A (ja) | 1990-03-14 | 1990-03-14 | コンデンサ |
| AU84537/91A AU646208B2 (en) | 1990-03-14 | 1991-09-17 | Capacitor and process for producing same |
| CN91109172.6A CN1028576C (zh) | 1990-03-14 | 1991-09-23 | 电容器及其制造方法 |
| PT99045A PT99045B (pt) | 1990-03-14 | 1991-09-25 | Condensador electrico e processo para a sua fabricacao |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1071276A CN1071276A (zh) | 1993-04-21 |
| CN1028576C true CN1028576C (zh) | 1995-05-24 |
Family
ID=27423972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN91109172.6A Expired - Fee Related CN1028576C (zh) | 1990-03-14 | 1991-09-23 | 电容器及其制造方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US5144529A (zh) |
| EP (1) | EP0537371B1 (zh) |
| JP (1) | JPH03284813A (zh) |
| CN (1) | CN1028576C (zh) |
| AT (1) | ATE122497T1 (zh) |
| AU (1) | AU646208B2 (zh) |
| BR (1) | BR9105224A (zh) |
| CA (1) | CA2051045A1 (zh) |
| DE (1) | DE69109678T2 (zh) |
| PT (1) | PT99045B (zh) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69401826T2 (de) * | 1993-03-25 | 1997-06-12 | Matsushita Electric Ind Co Ltd | Dünnschichtkondensator und Verfahren zu seiner Herstellung |
| TW272294B (zh) * | 1993-03-29 | 1996-03-11 | Takahashi Yasunori | |
| JPH08250371A (ja) * | 1995-03-14 | 1996-09-27 | Shinko Electric Ind Co Ltd | コンデンサ及びその製造方法並びに誘電体の製造方法 |
| JP3368350B2 (ja) * | 1995-03-15 | 2003-01-20 | オムロン株式会社 | 薄膜コンデンサおよびその製造方法並びに混成回路基板およびその実装方法 |
| US6835576B2 (en) * | 2000-05-02 | 2004-12-28 | Fuji Electric Co., Ltd. | Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device |
| EP1231637A3 (en) | 2001-02-08 | 2004-08-25 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
| JP4505823B2 (ja) * | 2003-06-30 | 2010-07-21 | 富士電機ホールディングス株式会社 | コンデンサ |
| US20070001936A1 (en) * | 2003-08-19 | 2007-01-04 | Fuji Electric Holdings Co., Ltd. | Display device and method of forming and driving the same |
| US20060074166A1 (en) * | 2003-12-19 | 2006-04-06 | Tpl, Inc. Title And Interest In An Application | Moldable high dielectric constant nano-composites |
| US20060074164A1 (en) * | 2003-12-19 | 2006-04-06 | Tpl, Inc. | Structured composite dielectrics |
| US20080128961A1 (en) * | 2003-12-19 | 2008-06-05 | Tpl, Inc. | Moldable high dielectric constant nano-composites |
| KR20080031252A (ko) * | 2005-06-03 | 2008-04-08 | 프레자코르, 인크. | 원소 금속을 포함하는 조성물 및 그의 용도 |
| DE102005044739B3 (de) * | 2005-09-19 | 2006-12-07 | Polymer-Chemie Gmbh | Druckstück und Verfahren zu dessen Herstellung |
| US8432663B2 (en) | 2007-10-05 | 2013-04-30 | Carver Scientific, Inc. | High permittivity low leakage capacitor and energy storing device and method for forming the same |
| US8940850B2 (en) | 2012-08-30 | 2015-01-27 | Carver Scientific, Inc. | Energy storage device |
| US9011627B2 (en) * | 2007-10-05 | 2015-04-21 | Carver Scientific, Inc. | Method of manufacturing high permittivity low leakage capacitor and energy storing device |
| JP5245611B2 (ja) * | 2008-07-28 | 2013-07-24 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
| US8697516B2 (en) * | 2008-08-26 | 2014-04-15 | Nxp, B.V. | Capacitor and a method of manufacturing the same |
| US20120241085A1 (en) * | 2011-03-22 | 2012-09-27 | David Carver | Creation of very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices and methods for forming the same |
| US9214280B2 (en) * | 2008-10-03 | 2015-12-15 | Carver Scientific, Inc. | Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices |
| US9214281B2 (en) | 2008-10-03 | 2015-12-15 | Carver Scientific, Inc. | Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices |
| US10227432B2 (en) | 2011-08-31 | 2019-03-12 | Carver Scientific, Inc. | Formation of xylylene type copolymers, block polymers, and mixed composition materials |
| US10199165B2 (en) | 2012-08-30 | 2019-02-05 | Carver Scientific, Inc. | Energy storage device |
| US9899846B2 (en) | 2012-08-30 | 2018-02-20 | Carver Scientific, Inc. | Entropic energy transfer methods and circuits |
| US9805869B2 (en) | 2012-11-07 | 2017-10-31 | Carver Scientific, Inc. | High energy density electrostatic capacitor |
| US10905894B2 (en) | 2013-03-15 | 2021-02-02 | Prezacor, Inc. | Therapeutic bioelectromagnetic fields, pain relief devices, and related methods |
| US20140295101A1 (en) * | 2013-03-29 | 2014-10-02 | Carver Scientific, Inc. | High permittivity low leakage capacitor and energy storing device |
| KR101548797B1 (ko) * | 2013-04-08 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
| JP6869239B2 (ja) | 2015-11-06 | 2021-05-12 | カーバー サイエンティフィック インコーポレイテッドＣａｒｖｅｒ Ｓｃｉｅｎｔｉｆｉｃ， Ｉｎｃ． | 電子エントロピー・メモリデバイス |
| CN107722557A (zh) * | 2016-08-12 | 2018-02-23 | 深圳先进技术研究院 | 一种超薄电容材料及其制备方法 |
| CN110431647B (zh) | 2016-12-02 | 2022-06-28 | 卡弗科学有限公司 | 存储设备和电容储能设备 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR611667A (fr) * | 1926-02-24 | 1926-10-08 | Condensateurs Ind | Perfectionnements aux condensateurs électriques |
| US2892139A (en) * | 1946-04-08 | 1959-06-23 | Salzberg Bernard | Dielectric material and condenser |
| DE934535C (de) * | 1952-12-07 | 1955-10-27 | Siemens Ag | Dielektrikum hoher Dielektrizitaetskonstante |
| GB1044444A (en) * | 1964-01-31 | 1966-09-28 | Standard Telephones Cables Ltd | Improvements relating to capacitors |
| US3535602A (en) * | 1969-05-07 | 1970-10-20 | Nasa | Capacitor and method of making same |
| US3679440A (en) * | 1971-01-18 | 1972-07-25 | Owens Illinois Inc | High k dielectric materials |
| US4853827A (en) * | 1988-08-01 | 1989-08-01 | Rogers Corporation | High dielectric multilayer capacitor |
-
1990
- 1990-03-14 JP JP2061157A patent/JPH03284813A/ja active Pending
-
1991
- 1991-09-11 EP EP91115453A patent/EP0537371B1/en not_active Expired - Lifetime
- 1991-09-11 AT AT91115453T patent/ATE122497T1/de active
- 1991-09-11 DE DE69109678T patent/DE69109678T2/de not_active Expired - Fee Related
- 1991-09-11 CA CA002051045A patent/CA2051045A1/en not_active Abandoned
- 1991-09-12 US US07/758,061 patent/US5144529A/en not_active Expired - Fee Related
- 1991-09-17 AU AU84537/91A patent/AU646208B2/en not_active Ceased
- 1991-09-23 CN CN91109172.6A patent/CN1028576C/zh not_active Expired - Fee Related
- 1991-09-25 PT PT99045A patent/PT99045B/pt not_active IP Right Cessation
- 1991-12-02 BR BR919105224A patent/BR9105224A/pt not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0537371B1 (en) | 1995-05-10 |
| BR9105224A (pt) | 1993-06-08 |
| PT99045A (pt) | 1993-10-29 |
| PT99045B (pt) | 1999-02-26 |
| DE69109678D1 (de) | 1995-06-14 |
| CN1071276A (zh) | 1993-04-21 |
| AU8453791A (en) | 1993-03-25 |
| ATE122497T1 (de) | 1995-05-15 |
| EP0537371A1 (en) | 1993-04-21 |
| US5144529A (en) | 1992-09-01 |
| CA2051045A1 (en) | 1993-03-12 |
| JPH03284813A (ja) | 1991-12-16 |
| DE69109678T2 (de) | 1995-10-26 |
| AU646208B2 (en) | 1994-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1028576C (zh) | 电容器及其制造方法 | |
| US4477296A (en) | Method for activating metal particles | |
| WO1998018741A2 (en) | Passive electronic components prepared from suspensions of nanoscale ceramic powders | |
| US20110141654A1 (en) | Nickel powder or alloy powder comprising nickel as main component, method for producing the same, conductive paste and laminated ceramic capacitor | |
| CN1182206C (zh) | 低频电磁波磁屏蔽复合涂料及其制备方法 | |
| US20100216928A1 (en) | Polymer particle composite having high fidelity order, size, and shape particles | |
| KR101729455B1 (ko) | 표면 처리된 금속 분말, 및 그 제조 방법 | |
| JP2010520626A (ja) | 金属性ナノ粒子組成物による遮蔽およびそれに関連する装置および方法 | |
| CN110341205B (zh) | 一种多层聚合物纳米复合材料及其制备方法 | |
| JP3742153B2 (ja) | 被覆粉体固結物およびその製造方法 | |
| CN1416986A (zh) | 耐高温抗氧化贱金属粉组合物及其生产方法 | |
| CN1653566A (zh) | 具有高能量密度的电容器 | |
| CN112876789B (zh) | 一种导电粒子填充聚合物层状复合介电材料及其制备方法 | |
| JPS61289200A (ja) | 金属繊維シ−トの製造方法 | |
| JP2015056392A (ja) | 導電性ペースト材料の製造と製造方法 | |
| CN1302496C (zh) | 电介质陶瓷粉末、陶瓷生片和层压陶瓷电容器及其制造方法 | |
| JP4198603B2 (ja) | 複合金属粉体、その製法及び導電性ペースト | |
| JP4653647B2 (ja) | セラミックコンデンサ、セラミックコンデンサの製造方法及びセラミックグリーンシート | |
| JPH09186044A (ja) | 積層電子部品用内部電極材料ペースト、積層電子部品及びその製造方法 | |
| JP2014093142A (ja) | 導電性ペースト、導電性ペーストの製造方法およびセラミック積層電子部品 | |
| JP4705232B2 (ja) | 金属コロイド溶液およびその金属コロイド溶液の製造方法 | |
| JPH0645183A (ja) | パラジウムペーストおよび積層チップコンデンサの製造方法 | |
| PL165342B1 (pl) | Sposób wytwarzania kondensatora i kondensator | |
| KR20090093565A (ko) | 탄소나노튜브 투명 필름 및 이의 제조 방법 | |
| CN116922915A (zh) | 一种薄膜电容器用耐高温聚丙烯薄膜及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |