CN102856482A - LED (Light Emitting Diode) packaging structure - Google Patents
LED (Light Emitting Diode) packaging structure Download PDFInfo
- Publication number
- CN102856482A CN102856482A CN2011101787434A CN201110178743A CN102856482A CN 102856482 A CN102856482 A CN 102856482A CN 2011101787434 A CN2011101787434 A CN 2011101787434A CN 201110178743 A CN201110178743 A CN 201110178743A CN 102856482 A CN102856482 A CN 102856482A
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- CN
- China
- Prior art keywords
- led
- encapsulating structure
- pcb
- recessed cup
- pcb board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention provides an LED (Light Emitting Diode) packaging structure, belongs to the technical field of LED packaging structures, and solves the problems in the prior art that the LED packaging structure has a relatively complex manufacture technology. The LED packaging structure comprises a sealing gel layer, a PCB (Printed circuit board), a radiating substrate and a base gel layer which are sequentially and integrally connected from top to bottom, wherein a large concave cup or a plurality of small concave cups are designed in the sealing gel layer, an LED chip is arranged on the PCB in each large concave cup or each small concave cup, and is in routing on a PCB circuit to generate a lighting circuit; a fluorescent powder layer is arranged on the internal wall of the large concave cup or each small concave cup; the large concave cup or the plurality of small concave cups which are of a sealing gel type and have light collecting functions are made from aluminum, copper, ceramics or high polymer materials and the like; and the high polymer materials are PVC (Poly Vinyl Chloride), PMMA (polymethyl methacrylate), and PPA (phenyl-propanolamine) or ABS (Acrylonitrile Butadiene Styrene) and the like. The LED packaging structure provided by the invention is simple in manufacture process, good in lighting efficiency, high in production efficiency, reliable in product quality, and simultaneously has the capacity of solving the problems of high heat conduction and high-pressure exposure.
Description
Technical field
The present invention relates to LED encapsulating structure technical field, particularly relate to for solving the exposed a kind of LED encapsulating structure of the high heat conduction of LED and high pressure.
Background technology
LED be a kind of can be the semiconductor lighting equipment of visible light with electric energy conversion.The LED illumination is the new industry that grows up recent years.In the last few years, along with the decline of manufacturing cost and the breakthrough of the technical bottlenecks such as luminous efficiency, light decay, the LED Lighting Industry of China had entered the stage of developing rapidly, the application market rapid growth, and this has caused the LED encapsulating products that huge market has been arranged.Traditional LED encapsulating structure has multiple, be to have proposed a kind of LED encapsulating structure in 200910018662.0 the Chinese invention patent application such as application number, its principle is to use metal frame body, the outer circumference surface of frame body is provided with for fixing screw thread is installed, the top of frame body is provided with the pit of built-in wafer, the hole wall of pit consists of reflecting surface, the inside of frame body is fixed with the electrode of tape insulation layer, electrode upper end connecting wafer, it is outer as lead-in wire that the lower end is positioned at frame body, and this encapsulating structure all adopts metal to finish the LED encapsulation.Then, use the metal frame support body to go between, and at the metal framework circumferential periphery fixed screw is installed, though played the installation fixation, still, the traditional LED packaging manufacturing process of this kind is complicated, and cost is higher.And for example the patent No. is to have proposed a kind of LED encapsulating structure in 200820004069.1 the Chinese utility model patent, its technical essential is that a plurality of led modules are set in structure, then, on the filled plastics of led module gap, establish electrode, electrode is electrically connected by gold thread with led chip PN interpolar, the led module top is provided with a transparent shell, be filled with transparent colloid between transparent shell and the led module, although this kind compact conformation, radiating effect is good,, in structure, be provided with a plurality of led modules, its complex production process is not suitable for batch production, is difficult to enhance productivity.Along with development and the science and technology of society are constantly upgraded, the LED encapsulating structure is also constantly updating.People wish that urgently a kind of production process is simple, light efficiency good, production efficiency is high, very reliably LED encapsulating structure appearance of product quality.
Summary of the invention
Technical problem to be solved by this invention is, the defective that the LED encapsulating structure manufacture craft that overcomes above-mentioned prior art is complicated, be not suitable for batch production and be difficult to enhance productivity, provide that a kind of production process is simple, light efficiency good, production efficiency is high, the very reliable LED encapsulating structure of product quality, and solved simultaneously high heat conduction and the exposed problem of high pressure.
The technical solution adopted for the present invention to solve the technical problems is: a kind of LED encapsulating structure, formed by the adhesive layer that sequentially links together from top to bottom, pcb board, heat-radiating substrate and primer layer, in adhesive layer, be designed with a large recessed cup or a plurality of little recessed cup, all be designed with a led chip on the pcb board in large recessed cup or each little recessed cup, be provided with a phosphor powder layer at large recessed cup or inwall that each is little recessed glass.
In technique scheme, described adhesive layer, pcb board, heat-radiating substrate and primer layer are integrated by mode and the external radiator global formation of pressing or applying, or the mode and the external radiator that connect with screw are assembled together.
The material that the manufacturing heat-radiating substrate is selected is the materials such as aluminium, copper, iron or pottery.
Described pcb board is single-sided circuit board or double-sided PCB, and pcb board can high heat conduction or low heat conduction, and the led chip routing forms system's illuminating circuit at the PCB circuit.
The material that the manufacturing primer layer is selected is heat-conducting glue or pressure-sensing glue.
Large recessed cup or a plurality of little recessed glass of material of selecting that manufacturing has sealing moulding and receipts light function are aluminium, copper, pottery or macromolecular material etc.Described macromolecular material is the materials such as PVC, PMMA, PPA or ABS.
The invention has the beneficial effects as follows: 1, because the material that the manufacturing heat-radiating substrate is selected is the materials such as aluminium, copper, iron or pottery, and these materials are common heat sink material, packaging cost is cheap, and manufacture craft is very mature and stable.2, above the led chip light-emitting zone, establish a large recessed cup or a plurality of little recessed cup, solved the exposed problem of high pressure; 3, this kind encapsulating structure also has installation function, and the light that led chip is set out is interference-free, has improved light efficiency; 4, this kind encapsulating structure also has waterproof, protection against the tide, high voltage bearing function; Only led chip directly need be placed on the pcb board when 5, making this encapsulating structure to encapsulate, cost is low, and manufacture craft is simple.6, owing to the inwall at large recessed cup or each little recessed cup is provided with a phosphor powder layer, therefore, the light that is sent by led chip is very soft, can not injure eyes.Therefore, this LED encapsulating structure operation is simple, light efficiency good, production efficiency is high, product quality is very reliable, and has solved simultaneously high heat conduction and the exposed problem of high pressure.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is structural representation cutaway view of the present invention.
Among the figure, 1, adhesive layer; 2, led chip; 3, little recessed cup; 4, heat-radiating substrate; 5, pcb board; 6, primer layer; 7, phosphor powder layer.
Embodiment
Referring to Fig. 1, Fig. 1 is the structural representation cutaway view of the described a kind of LED encapsulating structure of the present embodiment, this LED encapsulating structure is comprised of the adhesive layer 1 that sequentially links together from top to bottom, pcb board 5, heat-radiating substrate 4 and primer layer 6, in adhesive layer 1, be designed with a plurality of little recessed cups 3, all be designed with a led chip 2 on the pcb board 5 in each little recessed cup 3, be provided with a phosphor powder layer 7 at each little recessed glass 3 inwall.Described adhesive layer 1, pcb board 5, heat-radiating substrate 4 and primer layer 6 are integrated by mode and the external radiator global formation of pressing or applying, or the mode and the external radiator that connect with screw are assembled together.The material that manufacturing heat-radiating substrate 4 is selected is the materials such as aluminium, copper, iron or pottery.Described pcb board 5 is single-sided circuit board or double-sided PCB, and pcb board 5 can high heat conduction or low heat conduction, and led chip 2 routings form system's illuminating circuit at the PCB circuit.The material that manufacturing primer layer 6 is selected is heat-conducting glue or pressure-sensing glue.Primer layer 6(heat-conducting glue or pressure-sensing glue) bond together with external radiator.A plurality of little recessed cup 3 materials of selecting that manufacturing has sealing moulding and receipts light function are aluminium, copper, pottery or macromolecular material etc.Described macromolecular material is the materials such as PVC, PMMA, PPA or ABS.
When processing this LED encapsulating structure, use first aluminium, copper, or the pottery etc. material make heat-radiating substrate 4, adhere to traditional pcb board 5 at heat-radiating substrate 4, bonding led chip 2 on pcb board 5, led chip 2 directly placed on the pcb board 5 encapsulate, led chip 2 routings are on the PCB circuit, then, above the LED light-emitting zone, establish a large recessed cup or a plurality of little recessed cup 3, it is primer layer 6 below the heat-radiating substrate 4, primer layer 6 can be heat-conducting glue or pressure-sensing glue, and this layer is bonding with external radiator, and this LED encapsulating structure is by pressing or applying or together fixed-type with mode and the external radiator of screw connection.
The above describes a specific embodiment of the present invention in detail.But should be appreciated that embodiments of the present invention are not limited in above-described embodiment, the description of this embodiment only is used for helping to understand spirit of the present invention.Under disclosed spirit, the various variation examples to the present invention has done all should be included in protection scope of the present invention.
Claims (7)
1. LED encapsulating structure, it is characterized in that: formed by the adhesive layer that sequentially links together from top to bottom, pcb board, heat-radiating substrate and primer layer, in adhesive layer, be designed with a large recessed cup or a plurality of little recessed cup, all be designed with a led chip on the pcb board in large recessed cup or each little recessed cup, be provided with a phosphor powder layer at large recessed cup or inwall that each is little recessed glass.
2. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described adhesive layer, pcb board, heat-radiating substrate and primer layer are integrated by mode and the external radiator global formation of pressing or applying, or the mode and the external radiator that connect with screw are assembled together.
3. a kind of LED encapsulating structure according to claim 1 is characterized in that: making the material that heat-radiating substrate selects is aluminium, copper, iron or ceramic material.
4. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described pcb board is single-sided circuit board or double-sided PCB, and pcb board can high heat conduction or low heat conduction, and the led chip routing forms system's illuminating circuit at the PCB circuit.
5. a kind of LED encapsulating structure according to claim 1 is characterized in that: making the material that primer layer selects is heat-conducting glue or pressure-sensing glue.
6. a kind of LED encapsulating structure according to claim 1 is characterized in that: make and have the sealing moulding and receive the large recessed cup of light function or material that a plurality of little recessed cup is selected is aluminium, copper, pottery or macromolecular material.
7. a kind of LED encapsulating structure according to claim 6, it is characterized in that: described macromolecular material is PVC, PMMA, PPA or ABS material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101787434A CN102856482A (en) | 2011-06-29 | 2011-06-29 | LED (Light Emitting Diode) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101787434A CN102856482A (en) | 2011-06-29 | 2011-06-29 | LED (Light Emitting Diode) packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN102856482A true CN102856482A (en) | 2013-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101787434A Pending CN102856482A (en) | 2011-06-29 | 2011-06-29 | LED (Light Emitting Diode) packaging structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103227266A (en) * | 2013-04-28 | 2013-07-31 | 杭州龙尚光电有限公司 | Led packaging structure |
| CN103367612A (en) * | 2013-07-03 | 2013-10-23 | 深圳雷曼光电科技股份有限公司 | LED (Light Emitting Diode) packaging structure and process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295084A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Package structure of light emitting diode |
| CN1856884A (en) * | 2003-09-19 | 2006-11-01 | 松下电器产业株式会社 | Illuminating device |
| CN101185174A (en) * | 2005-05-31 | 2008-05-21 | 昭和电工株式会社 | Substrate for LED and LED package |
| CN201149225Y (en) * | 2007-08-02 | 2008-11-12 | 煤炭科学研究总院南京研究所 | LED explosion suppression bracket lighting lamp for coal mine |
-
2011
- 2011-06-29 CN CN2011101787434A patent/CN102856482A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1856884A (en) * | 2003-09-19 | 2006-11-01 | 松下电器产业株式会社 | Illuminating device |
| JP2006295084A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Package structure of light emitting diode |
| CN101185174A (en) * | 2005-05-31 | 2008-05-21 | 昭和电工株式会社 | Substrate for LED and LED package |
| CN201149225Y (en) * | 2007-08-02 | 2008-11-12 | 煤炭科学研究总院南京研究所 | LED explosion suppression bracket lighting lamp for coal mine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103227266A (en) * | 2013-04-28 | 2013-07-31 | 杭州龙尚光电有限公司 | Led packaging structure |
| CN103227266B (en) * | 2013-04-28 | 2016-08-31 | 杭州龙尚光电有限公司 | LED encapsulation structure |
| CN103367612A (en) * | 2013-07-03 | 2013-10-23 | 深圳雷曼光电科技股份有限公司 | LED (Light Emitting Diode) packaging structure and process |
| CN103367612B (en) * | 2013-07-03 | 2016-04-13 | 深圳雷曼光电科技股份有限公司 | LED encapsulation structure and technique |
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Application publication date: 20130102 |