CN102856268B - First packaged and then etched packaging structure with multiple chips normally installed and without base islands and preparation method of structure - Google Patents
First packaged and then etched packaging structure with multiple chips normally installed and without base islands and preparation method of structure Download PDFInfo
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- CN102856268B CN102856268B CN201210140778.3A CN201210140778A CN102856268B CN 102856268 B CN102856268 B CN 102856268B CN 201210140778 A CN201210140778 A CN 201210140778A CN 102856268 B CN102856268 B CN 102856268B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention relates to a first packaged and then etched packaging structure with multiple chips normally installed and base islands buried and a preparation method of the structure. The structure comprises base islands (1) and pins (2), wherein a plurality of chips (4) are arranged on the front faces of the base islands (1); the front faces of the chips (4) and the front faces of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chips (4) and the metal wires (5); small holes (7) are formed on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Description
Technical field
The present invention relates to a kind of multi-chip formal dress and first encapsulate after etching Wu Ji island encapsulating structure and manufacture method thereof.Belong to semiconductor packaging field.
Background technology
The manufacturing process flow of traditional high-density base board encapsulating structure is as follows:
Step 1, referring to Figure 26, get the substrate that a glass fiber material is made,
Step 2, referring to Figure 27, perforate on desired position on glass fibre basal plate,
Step 3, referring to Figure 28, at the back side of glass fibre basal plate coating one deck Copper Foil,
Step 4, referring to Figure 29, in the position of glass fibre basal plate punching, insert conductive materials,
Step 5, referring to Figure 30, at positive coating one deck Copper Foil of glass fibre basal plate,
Step 6, referring to Figure 31, at glass fibre basal plate covering surface photoresistance film,
Step 7, referring to Figure 32, photoresistance film is carried out to exposure imaging in the position of needs and windows,
Step 8, referring to Figure 33, by completing the part of windowing, carry out etching,
Step 9, referring to Figure 34, the photoresistance film of substrate surface is divested,
Step 10, referring to Figure 35, on the surface of copper foil circuit layer, carry out the coating of anti-welding paint (being commonly called as green paint),
Step 11, referring to Figure 36, after anti-welding paint need to carry out, window in the load of operation and the region of routing bonding,
Step 12, referring to Figure 37, electroplate in the region of windowing in step 11, relatively forms Ji Dao and pin,
Step 13, complete follow-up load, routing, seal, the concerned process steps such as cutting.
Above-mentioned traditional high-density base board encapsulating structure has the following disadvantages and defect:
1, many glass fiber materials of one deck, same also many costs of layer of glass;
2, because must use glass fibre, so with regard to many thickness space of layer of glass thickness approximately 100 ~ 150 μ m;
3, glass fibre itself is exactly a kind of foaming substance, so easily because the time of placing and environment suck moisture and moisture, directly have influence on security capabilities or the reliability step of reliability;
4, fiberglass surfacing coating the Copper Foil metal layer thickness of one deck approximately 50 ~ 100 μ m, and the etching of metal level circuit and circuit distance is also because the characteristic of etching factor can only be accomplished the etched gap (etching factor: the ability of preferably manufacturing is the thickness that etched gap is approximately equal to etched object of 50 ~ 100 μ m, referring to Figure 38), so the design of accomplishing high-density line and manufacture that cannot be real;
5, because must use Copper Foil metal level, and Copper Foil metal level is the mode that adopts high pressure stickup, so the thickness of Copper Foil is difficult to the thickness lower than 50 μ m, otherwise is just difficult to operation as out-of-flatness or Copper Foil breakage or Copper Foil extension displacement etc.;
6, also because whole baseplate material is to adopt glass fiber material, thus significantly increased thickness 100 ~ 150 μ m of glass layer, cannot be real accomplish ultra-thin encapsulation;
7, the technology that traditional glass fiber is sticked on Copper Foil, because material property difference very large (coefficient of expansion) easily causes stress deformation in the operation of adverse circumstances, directly has influence on precision and element and substrate adherence and reliability that element loads.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, provide a kind of multi-chip formal dress first to encapsulate after etching Wu Ji island encapsulating structure and preparation method thereof, its technique is simple, do not need to use glass layer, reduce cost of manufacture, improved the safety and reliability of packaging body, reduced the environmental pollution that glass fiber material brings, and metal substrate line layer adopts is electro-plating method, can really accomplish the Design and manufacture of high-density line.
The object of the present invention is achieved like this: a kind of multi-chip formal dress first encapsulates after etching Wu Ji island encapsulating structure, it comprises pin, described pin front is provided with a plurality of chips by conduction or non-conductive bonding material, between described a plurality of chip front side and pin front, with metal wire, be connected, region between described pin and pin, the region on pin top, the region of pin bottom and chip and metal wire are all encapsulated with plastic packaging material outward, on the plastic packaging material at the described pin back side, offer aperture, described aperture is connected with the pin back side, in described aperture, be provided with Metal Ball, described Metal Ball contacts with the pin back side.
Multi-chip formal dress first encapsulates a manufacture method for after etching Wu Ji island encapsulating structure, said method comprising the steps of:
Step 1, get metal substrate
Step 2, the pre-copper facing of metallic substrate surfaces
Step 3, the operation of subsides photoresistance film
At the front and the back side that complete the metal substrate of preplating copper material film, stick respectively the photoresistance film that can carry out exposure imaging;
Step 4, the positive part photoresistance film of removing of metal substrate
Part figure photoresistance film is carried out graph exposure, develops and removes in the metal substrate front that utilizes exposure imaging equipment that step 3 is completed to the operation of subsides photoresistance film, the regional graphics of electroplating to expose the positive follow-up needs of metal substrate;
Step 5, plating inert metal line layer
In step 4, in the region of the positive removal of metal substrate part photoresistance film, electroplate inert metal line layer;
Step 6, plated metal line layer
Multilayer or single-layer metal line layer on inert metal plated surface in step 5, metallic circuit layer forms corresponding pin top on metal substrate after having electroplated;
Step 7, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 8, coating bonding material
The pin top front face coated with conductive or the nonconducting bonding material that in step 6, form;
Step 9, load
A plurality of chips are implanted on pin top in step 8;
Step 10, routing
Between chip front side and pin front, carry out the operation of bonding metal wire;
Step 11, seal
The positive plastic packaging material that adopts of metal substrate in step 10 is carried out to plastic packaging;
Step 12, the operation of subsides photoresistance film
At the front and the back side that complete the metal substrate of plastic packaging work, stick respectively the photoresistance film that can carry out exposure imaging;
Part photoresistance film is removed at step 13, the metal substrate back side
Part figure photoresistance film is carried out graph exposure, develops and removes at the metal substrate back side that utilizes exposure imaging equipment that step 12 is completed to the operation of subsides photoresistance film, to expose the follow-up regional graphics that need to carry out chemical etching in the metal substrate back side;
Step 14, chemical etching
Chemical etching is carried out in the region that the metal substrate back side in step 13 is completed to exposure imaging;
Step 15, plated metal line layer
Multilayer or single-layer metal line layer on inert metal line layer plated surface form corresponding pin bottom on metal substrate after metal plating completes;
Step 10 six, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 10 seven, seal
Adopt plastic packaging material to carry out plastic packaging at the metal substrate back side in step 10 six;
Step 10 eight, plastic packaging material surface perforate
The surface of sealing in advance plastic packaging material at the metal substrate back side needs follow-up region of planting Metal Ball to carry out perforate, specifically at the pin back side, carries out perforate;
Step 10 nine, cleaning
At metal substrate back side plastic packaging material tapping, carry out the cleaning of oxidation material, grease material, can carry out the coating of coat of metal simultaneously;
Step 2 ten, plant ball
At the metal substrate back side, plastic-sealed body tapping is implanted into Metal Ball, and Metal Ball is contacted with the back side of pin;
Step 2 11, cutting finished product
Step 2 ten is completed to the semi-finished product of planting ball and carry out cutting operation, more than cuttings of plastic-sealed body module that script integrated in array aggregate mode and contain chip are independent, make multi-chip formal dress and first encapsulate after etching Wu Ji island encapsulating structure, can adopt conventional diamond blade and conventional cutting equipment.
Between described step 10 seven chips fronts and chip front side, also can carry out the operation of bonding metal wire.
In described step 10 nine, metal substrate back side plastic packaging material tapping is cleaned and carries out coat of metal coating simultaneously.
Between described pin and pin, cross-over connection has passive device, and described passive device is connected across between pin front and pin front or is connected across between the pin back side and the pin back side.
Described pin has multi-turn.
Described pin comprises pin top, pin bottom and intermediate barrier layers, and described pin top and pin bottom form by single or multiple lift metal plating, and described intermediate barrier layers is nickel dam or titanium layer or copper layer.
Compared with prior art, the present invention has following beneficial effect:
1, the present invention does not need to use glass layer, so can reduce the cost that glass layer brings;
2, the present invention does not need to use the foaming substance of glass layer, so the grade of reliability can improve again, relatively to the fail safe of packaging body, will improve;
3, the present invention does not use glass layer material, so just can reduce the environmental pollution that glass fiber material brings;
What 4, two-dimensional metallic substrate circuit layer of the present invention adopted is electro-plating method, and the gross thickness of electrodeposited coating is about 10 ~ 15 μ m, and gap between circuit and circuit can reach the gap below 25 μ m easily, so can accomplish veritably the technical capability of pin circuit tiling in high density;
5, two-dimensional metallic substrate of the present invention is metal level galvanoplastic because of what adopt, so the technique than glass fibre high pressure Copper Foil metal level is come simply, and do not have metal level because high pressure produces bad or puzzled that metal level out-of-flatness, metal level breakage and metal level extend and be shifted;
6, two-dimensional metallic substrate circuit layer of the present invention is to carry out metal plating on the surface of metal base, so material characteristic is basic identical, so the internal stress of coating circuit and metal base is basic identical, can carries out easily the rear engineering (as the surface mount work of high temperature eutectic load, high temperature tin material scolder load and high temperature passive device) of adverse circumstances and be not easy to produce stress deformation.
Accompanying drawing explanation
Fig. 1 ~ Figure 21 is each operation schematic diagram that multi-chip formal dress of the present invention first encapsulates after etching Wu Ji island encapsulating structure embodiment 1 manufacture method.
Figure 22 (A) is the structural representation that multi-chip formal dress of the present invention first encapsulates after etching Wu Ji island encapsulating structure embodiment 1.
Figure 22 (B) is the vertical view of Figure 22 (A).
Figure 23 (A) is the structural representation that multi-chip formal dress of the present invention first encapsulates after etching Wu Ji island encapsulating structure embodiment 2.
Figure 23 (B) is the vertical view of Figure 23 (A).
Figure 24 (A) is the structural representation that multi-chip formal dress of the present invention first encapsulates after etching Wu Ji island encapsulating structure embodiment 3.
Figure 24 (B) is the vertical view of Figure 24 (A).
Figure 25 (A) is the structural representation that multi-chip formal dress of the present invention first encapsulates after etching Wu Ji island encapsulating structure embodiment 4.
Figure 25 (B) is the vertical view of Figure 25 (A).
Figure 26 ~ Figure 37 is the manufacturing process flow diagram of traditional high-density base board encapsulating structure.
Figure 38 is the etching situation schematic diagram of fiberglass surfacing Copper Foil metal level.
Wherein:
Pin 1
Conduction or non-conductive bonding material 2
Chip 3
Metal wire 4
Plastic packaging material 5
Aperture 6
Coat of metal 7
Metal Ball 8
Passive device 9
Metal substrate 10
Copper material film 11
Photoresistance film 12
Inert metal line layer 13
Metallic circuit layer 14.
Embodiment
A kind of multi-chip formal dress of the present invention first encapsulate after etching Wu Ji island encapsulating structure and manufacture method as follows:
Embodiment mono-: Dan Ji island individual pen pin
See Figure 22 (A) and Figure 22 (B), Figure 22 (A) multi-chip formal dress of the present invention first encapsulates the structural representation of after etching Wu Ji island encapsulating structure embodiment 1.Figure 22 (B) is the vertical view of Figure 22 (A).By Figure 22 (A) and Figure 22 (B), can be found out, multi-chip formal dress of the present invention first encapsulates after etching Wu Ji island encapsulating structure, it comprises pin 1, described pin 1 front is provided with a plurality of chips 3 by conduction or non-conductive bonding material 2, described a plurality of chip 3 positive with pin 1 front between and between chip 3 fronts and chip 3 fronts, with metal wire 4, be connected, region between described pin 1 and pin 1, the region on pin 1 top, the outer plastic packaging material 5 that is all encapsulated with of the region of pin 1 bottom and chip 3 and metal wire 4, on the plastic packaging material 5 at described pin 1 back side, offer aperture 6, described aperture 6 is connected with pin 1 back side, in described aperture 6, be provided with Metal Ball 8, between described Metal Ball 8 and pin 1 back side, be provided with coat of metal 7, described Metal Ball 8 adopts tin or tin alloy material, described pin 2 is by pin top, intermediate barrier layers and pin bottom form, pin top and pin bottom form by single or multiple lift metal plating, intermediate barrier layers is nickel dam or titanium layer or copper layer.
Its manufacture method is as follows:
Step 1, get metal substrate
Referring to Fig. 1, get the metal substrate that a slice thickness is suitable, the material of metal substrate can convert according to function and the characteristic of chip, such as: copper material, iron material, ferronickel material, zinc-iron material etc.
Step 2, the pre-copper facing of metallic substrate surfaces
Referring to Fig. 2, at metallic substrate surfaces plating one deck copper material film, object is to do basis for follow-up plating.(mode of plating can adopt chemical plating or metallide).
Step 3, the operation of subsides photoresistance film
Referring to Fig. 3, at the front and the back side that complete the metal substrate of preplating copper material film, stick respectively the photoresistance film that can carry out exposure imaging, to protect follow-up electroplated metal layer process operation, photoresistance film can be that dry type photoresistance film can be also wet type photoresistance film.
Step 4, the positive part photoresistance film of removing of metal substrate
Referring to Fig. 4, part figure photoresistance film is carried out graph exposure, develops and removes in the metal substrate front that utilizes exposure imaging equipment that step 3 is completed to the operation of subsides photoresistance film, the regional graphics of electroplating to expose the positive follow-up needs of metal substrate.
Step 5, plating inert metal line layer
Referring to Fig. 5, in step 4, in the region of the positive removal of metal substrate part photoresistance film, electroplate inert metal line layer, as the barrier layer of subsequent etch work, inert metal can adopt nickel material or titanium material or copper material, and plating mode can make electroless plating or metallide mode.
Step 6, plated metal line layer
Referring to Fig. 6, multilayer or single-layer metal line layer on inert metal line layer plated surface in step 5, metallic circuit layer forms corresponding pin top on metal substrate after having electroplated, described metallic circuit layer can adopt one or more in silver, aluminium, copper, nickel gold and NiPdAu, and plating mode can be that electroless plating can be also the mode of metallide.
Step 7, removal photoresistance film
Referring to Fig. 7, remove the photoresistance film of metallic substrate surfaces, adopt chemical medicinal liquid soften and adopt the mode that high pressure water jets is removed to remove photoresistance film.
Step 8, coating bonding material
Referring to Fig. 8, the pin top front face coated with conductive or the nonconducting bonding material that in step 6, form, object be for after follow-up implanted chip with the engaging of pin.
Step 9, load
Referring to Fig. 9, on the pin top of step 8, implant a plurality of chips.
Step 10, metal wire bonding
Referring to Figure 10, between chip front side and pin front, carry out the operation of bonding metal wire, the material of described metal wire adopts gold, silver, copper, aluminium or the material of alloy, shape wiry can be thread can be also banded.
Step 11, seal
Referring to Figure 11, the positive plastic packaging material that adopts of the metal substrate in step 10 is carried out to plastic packaging, plastic packaging mode can adopt mould encapsulating mode, spraying equipment spraying method or use pad pasting mode.Described plastic packaging material can adopt packing material or without the epoxy resin of packing material.
Step 12, the operation of subsides photoresistance film
Referring to Figure 12, at the front and the back side that complete the metal substrate of plastic packaging work, stick respectively the photoresistance film that can carry out exposure imaging, photoresistance film can be that dry type photoresistance film can be also wet type photoresistance film.
Part photoresistance film is removed at step 13, the metal substrate back side
Referring to Figure 13, part figure photoresistance film is carried out graph exposure, develops and removes at the metal substrate back side that utilizes exposure imaging equipment that step 12 is completed to the operation of subsides photoresistance film, to expose the positive follow-up regional graphics that need to carry out chemical etching of metal substrate.
Step 14, chemical etching
Referring to Figure 14, chemical etching is carried out in the region that the metal substrate back side in step 13 is completed to exposure imaging, and chemical etching is until inert metal line layer, and etching solution can adopt copper chloride or iron chloride.
Step 15, plated metal line layer
Referring to Figure 15, multilayer or single-layer metal line layer on inert metal plated surface, after metal plating completes, on metal substrate, form corresponding pin bottom, coating kind can be copper nickel gold, copper nickeline, porpezite, gold or copper etc., and electro-plating method can be electroless plating or metallide.
Step 10 six, removal photoresistance film
Referring to Figure 16, remove the photoresistance film of metallic substrate surfaces, adopt chemical medicinal liquid soften and adopt the mode that high pressure water jets is removed to remove photoresistance film.
Step 10 seven, seal
Referring to Figure 17, adopt plastic packaging material to carry out plastic packaging at the metal substrate back side in step 10 six, plastic packaging mode can adopt the spraying method of mould encapsulating mode, spraying equipment or use pad pasting mode.Described plastic packaging material can adopt packing material or without the epoxy resin of packing material.
Step 10 eight, plastic packaging material surface perforate
Referring to Figure 18, the surface of sealing in advance plastic packaging material at the metal substrate back side needs follow-up region of planting Metal Ball to carry out perforate, specifically at the pin back side, carries out perforate, can adopt dry laser sintering or the method for wet chemistry corrosion to carry out perforate.
Step 10 nine, cleaning
Referring to Figure 19, at metal substrate back side plastic packaging material tapping, carry out the cleaning of oxidation material, grease material, can carry out the coating of coat of metal simultaneously, coat of metal adopts oxidation-resistant material.
Step 2 ten, plant ball
Referring to Figure 20, at the metal substrate back side, plastic-sealed body tapping is implanted into Metal Ball, Metal Ball is contacted with the back side of pin, can adopt conventional ball attachment machine or adopt metal paste printing after high-temperature digestion, can form orbicule again, the material of Metal Ball can be pure tin or ashbury metal.
Step 2 11, cutting finished product
Referring to Figure 21, step 2 ten is completed to the semi-finished product of planting ball and carry out cutting operation, more than cuttings of plastic-sealed body module that script integrated in array aggregate mode and contain chip are independent, make multi-chip formal dress and first encapsulate after etching Wu Ji island encapsulating structure, can adopt conventional diamond blade and conventional cutting equipment.
Embodiment 2: Wu Ji island individual pen pin passive device
Referring to Figure 23 (A) and Figure 23 (B), Figure 23 (A) multi-chip formal dress of the present invention first encapsulates the structural representation of after etching Wu Ji island encapsulating structure embodiment 3.Figure 23 (B) is the vertical view of Figure 23 (A).By Figure 23 (A) and Figure 23 (B), can be found out, the difference of embodiment 2 and embodiment 1 is only: between described pin 1 and pin 1, pass through conduction bonding material cross-over connection passive device 9, described passive device 9 can be connected across between pin 1 front and pin 1 front, also can be connected across between pin 1 back side and pin 1 back side.
Embodiment 3: Dan Ji island multi-circle pin
Referring to Figure 24 (A) and Figure 24 (B), Figure 24 (A) multi-chip formal dress of the present invention first encapsulates the structural representation of the base island embedded encapsulating structure embodiment 3 of after etching.Figure 24 (B) is the vertical view of Figure 24 (A).By Figure 24 (A) and Figure 24 (B), can be found out, embodiment 3 is only with the difference of embodiment 1: described pin 1 has multi-turn.
Embodiment 4: Dan Ji island multi-circle pin passive device
Referring to Figure 25 (A) and Figure 25 (B), Figure 25 (A) multi-chip formal dress of the present invention first encapsulates the structural representation of after etching Wu Ji island encapsulating structure embodiment 4.Figure 25 (B) is the vertical view of Figure 25 (A).By Figure 25 (A) and Figure 25 (B), can be found out, embodiment 4 is only with the difference of embodiment 2: described pin 1 has multi-turn.
Claims (5)
1. multi-chip formal dress first encapsulates a manufacture method for after etching Wu Ji island encapsulating structure, it is characterized in that said method comprising the steps of:
Step 1, get metal substrate
Step 2, the pre-copper facing of metallic substrate surfaces
Step 3, the operation of subsides photoresistance film
At the front and the back side that complete the metal substrate of preplating copper material film, stick respectively the photoresistance film that can carry out exposure imaging;
Step 4, the positive part photoresistance film of removing of metal substrate
Part figure photoresistance film is carried out graph exposure, develops and removes in the metal substrate front that utilizes exposure imaging equipment that step 3 is completed to the operation of subsides photoresistance film, the regional graphics of electroplating to expose the positive follow-up needs of metal substrate;
Step 5, plating inert metal line layer
In step 4, in the region of the positive removal of metal substrate part photoresistance film, electroplate inert metal line layer;
Step 6, plated metal line layer
Multilayer or single-layer metal line layer on inert metal line layer plated surface in step 5, metallic circuit layer forms corresponding pin top on metal substrate after having electroplated;
Step 7, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 8, coating bonding material
The pin top front face coated with conductive or the nonconducting bonding material that in step 6, form;
Step 9, load
A plurality of chips are implanted on pin top in step 8;
Step 10, routing
Between chip front side and pin front, carry out the operation of bonding metal wire;
Step 11, seal
The positive plastic packaging material that adopts of metal substrate in step 10 is carried out to plastic packaging;
Step 12, the operation of subsides photoresistance film
At the front and the back side that complete the metal substrate of plastic packaging work, stick respectively the photoresistance film that can carry out exposure imaging;
Part photoresistance film is removed at step 13, the metal substrate back side
Part figure photoresistance film is carried out graph exposure, develops and removes at the metal substrate back side that utilizes exposure imaging equipment that step 12 is completed to the operation of subsides photoresistance film, to expose the follow-up regional graphics that need to carry out chemical etching in the metal substrate back side;
Step 14, chemical etching
Chemical etching is carried out in the region that the metal substrate back side in step 13 is completed to exposure imaging;
Step 15, plated metal line layer
Multilayer or single-layer metal line layer on inert metal plated surface form corresponding pin bottom on metal substrate after metal plating completes;
Step 10 six, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 10 seven, seal
Adopt plastic packaging material to carry out plastic packaging at the metal substrate back side in step 10 six;
Step 10 eight, plastic packaging material surface perforate
The surface of sealing in advance plastic packaging material at the metal substrate back side needs follow-up region of planting Metal Ball to carry out perforate, specifically at the pin back side, carries out perforate;
Step 10 nine, cleaning
At metal substrate back side plastic packaging material tapping, carry out the cleaning of oxidation material, grease material;
Step 2 ten, plant ball
At the metal substrate back side, plastic-sealed body tapping is implanted into Metal Ball, and Metal Ball is contacted with the back side of pin;
Step 2 11, cutting finished product
Step 2 ten is completed to the semi-finished product of planting ball and carry out cutting operation, make more than cuttings of plastic-sealed body module of originally integrating in array aggregate mode and containing chip independent, make multi-chip formal dress and first encapsulate after etching Wu Ji island encapsulating structure.
2. a kind of multi-chip formal dress according to claim 1 first encapsulates the manufacture method of after etching Wu Ji island encapsulating structure, it is characterized in that: between described pin (1) and pin (1), cross-over connection has passive device (9), described passive device (9) is connected across between pin (1) front and pin (1) front or is connected across between pin (1) back side and pin (1) back side.
3. according to claim 1 ~ 2, a kind of multi-chip formal dress described in one of them first encapsulates the manufacture method of after etching Wu Ji island encapsulating structure, it is characterized in that described pin (1) has multi-turn.
4. a kind of multi-chip formal dress according to claim 1 first encapsulates the manufacture method of after etching Wu Ji island encapsulating structure, it is characterized in that: in described step 10, between chip (3) front and chip (3) front, carry out the operation of bonding metal wire.
5. a kind of multi-chip formal dress according to claim 1 first encapsulates the manufacture method of after etching Wu Ji island encapsulating structure, it is characterized in that: nine pairs of metal substrate back side plastic packaging material tappings of described step 10 clean and carry out coat of metal coating simultaneously.
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| CN201210140778.3A CN102856268B (en) | 2012-05-09 | 2012-05-09 | First packaged and then etched packaging structure with multiple chips normally installed and without base islands and preparation method of structure |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200939421A (en) * | 2008-03-11 | 2009-09-16 | Powertech Technology Inc | Multi-window ball grid array package |
| CN102376672A (en) * | 2011-11-30 | 2012-03-14 | 江苏长电科技股份有限公司 | Foundation island-free ball grid array packaging structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200814275A (en) * | 2006-09-06 | 2008-03-16 | Advanced Semiconductor Eng | Chip carrier with a signal collection tape and manufacturing method thereof |
| KR101204092B1 (en) * | 2008-05-16 | 2012-11-22 | 삼성테크윈 주식회사 | Lead frame and semiconductor package and the manufacturing method for the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200939421A (en) * | 2008-03-11 | 2009-09-16 | Powertech Technology Inc | Multi-window ball grid array package |
| CN102376672A (en) * | 2011-11-30 | 2012-03-14 | 江苏长电科技股份有限公司 | Foundation island-free ball grid array packaging structure and manufacturing method thereof |
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