CN102842027B - 摄像装置 - Google Patents
摄像装置 Download PDFInfo
- Publication number
- CN102842027B CN102842027B CN201210076879.9A CN201210076879A CN102842027B CN 102842027 B CN102842027 B CN 102842027B CN 201210076879 A CN201210076879 A CN 201210076879A CN 102842027 B CN102842027 B CN 102842027B
- Authority
- CN
- China
- Prior art keywords
- substrate
- lens
- light
- camera head
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 156
- 230000003287 optical effect Effects 0.000 claims abstract description 43
- NCGICGYLBXGBGN-UHFFFAOYSA-N 3-morpholin-4-yl-1-oxa-3-azonia-2-azanidacyclopent-3-en-5-imine;hydrochloride Chemical compound Cl.[N-]1OC(=N)C=[N+]1N1CCOCC1 NCGICGYLBXGBGN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000005286 illumination Methods 0.000 claims 2
- 238000003384 imaging method Methods 0.000 abstract description 36
- 210000003462 vein Anatomy 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011063926A JP5742348B2 (ja) | 2011-03-23 | 2011-03-23 | 撮像装置 |
| JP2011-063926 | 2011-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102842027A CN102842027A (zh) | 2012-12-26 |
| CN102842027B true CN102842027B (zh) | 2016-12-14 |
Family
ID=46877065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210076879.9A Expired - Fee Related CN102842027B (zh) | 2011-03-23 | 2012-03-21 | 摄像装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8665357B2 (enExample) |
| JP (1) | JP5742348B2 (enExample) |
| CN (1) | CN102842027B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6074981B2 (ja) | 2012-09-26 | 2017-02-08 | セイコーエプソン株式会社 | 撮像装置 |
| JP6044239B2 (ja) | 2012-10-01 | 2016-12-14 | セイコーエプソン株式会社 | 撮像装置および医療機器 |
| US9692251B2 (en) | 2014-07-03 | 2017-06-27 | Intel Corporation | Apparatus, system and method of wireless power transfer |
| JP2016115862A (ja) * | 2014-12-17 | 2016-06-23 | セイコーエプソン株式会社 | 画像取得装置、生体情報取得装置、電子機器 |
| CN107451518A (zh) * | 2016-05-30 | 2017-12-08 | 深圳印象认知技术有限公司 | 一种显示屏 |
| CN106022324B (zh) | 2016-08-04 | 2019-04-30 | 京东方科技集团股份有限公司 | 一种纹路识别显示装置 |
| CN108573191B (zh) * | 2017-03-07 | 2021-12-17 | 固安翌光科技有限公司 | 用作指纹识别装置光源的oled屏体及光学指纹识别装置 |
| CN106886341B (zh) * | 2017-03-28 | 2022-02-25 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
| CN106971173B (zh) * | 2017-04-13 | 2021-01-26 | 京东方科技集团股份有限公司 | 触控基板及显示面板 |
| KR102350605B1 (ko) * | 2017-04-17 | 2022-01-14 | 삼성전자주식회사 | 이미지 센서 |
| FR3075465B1 (fr) | 2017-12-15 | 2020-03-27 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
| FR3075466B1 (fr) * | 2017-12-15 | 2020-05-29 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
| SE1751613A1 (en) * | 2017-12-21 | 2019-06-22 | Fingerprint Cards Ab | Biometric imaging device and method for manufacturing the biometric imaging device |
| KR102593949B1 (ko) * | 2018-07-25 | 2023-10-27 | 삼성전자주식회사 | 이미지 센서 |
| CN109417080A (zh) * | 2018-09-26 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | 光学图像采集单元、光学图像采集装置和电子设备 |
| JP7293791B2 (ja) * | 2019-03-26 | 2023-06-20 | 富士フイルムビジネスイノベーション株式会社 | 光学装置、画像読取装置、および画像形成装置 |
| CN110471572B (zh) | 2019-06-10 | 2021-09-10 | 惠科股份有限公司 | 一种显示装置和触控器 |
| US11462580B2 (en) * | 2019-06-27 | 2022-10-04 | Semiconductor Components Industries, Llc | Image sensor packages and related methods |
| CN113994494A (zh) * | 2019-07-12 | 2022-01-28 | 株式会社半导体能源研究所 | 功能面板、显示装置、输入输出装置、数据处理装置 |
| US20220260760A1 (en) * | 2019-07-23 | 2022-08-18 | 3M Innovative Properties Company | Optical system including microlenses and light-blocking structures |
| JP6835920B2 (ja) * | 2019-08-23 | 2021-02-24 | 浜松ホトニクス株式会社 | 光検出装置 |
| JPWO2021069999A1 (enExample) | 2019-10-11 | 2021-04-15 | ||
| WO2021176704A1 (ja) | 2020-03-06 | 2021-09-10 | オリンパス株式会社 | 光学ユニット、光学ユニットの製造方法、および、内視鏡 |
| CN115735236A (zh) * | 2021-06-22 | 2023-03-03 | 京东方科技集团股份有限公司 | 纹路识别装置以及显示装置 |
| CN115616832A (zh) * | 2021-07-16 | 2023-01-17 | 宏碁股份有限公司 | 照明模块及电子装置 |
| CN114255673A (zh) * | 2021-12-31 | 2022-03-29 | 浙江全视通科技有限公司 | 制程优化的屏下摄像装置 |
| WO2025187218A1 (ja) * | 2024-03-04 | 2025-09-12 | Agc株式会社 | 光学素子 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101361095A (zh) * | 2006-10-12 | 2009-02-04 | 株式会社理光 | 图像输入设备、图像输入方法、个人身份验证设备以及电子设备 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09171154A (ja) * | 1995-12-19 | 1997-06-30 | Nippon Sheet Glass Co Ltd | 画像入力光学系及びこの光学系を用いた画像入力装置 |
| US6995800B2 (en) * | 2000-01-27 | 2006-02-07 | Canon Kabushiki Kaisha | Image pickup apparatus utilizing a plurality of converging lenses |
| US7068432B2 (en) * | 2004-07-27 | 2006-06-27 | Micron Technology, Inc. | Controlling lens shape in a microlens array |
| US7728902B2 (en) | 2006-08-04 | 2010-06-01 | Hitachi Maxell, Ltd. | Imaging device and biometrics authentication apparatus |
| JP5007082B2 (ja) | 2006-08-04 | 2012-08-22 | 日立マクセル株式会社 | 撮像装置および生体認証装置 |
| JP5072524B2 (ja) | 2007-10-15 | 2012-11-14 | キヤノン株式会社 | 動画像再生装置,およびその処理方法およびそのプログラム |
| US7999853B2 (en) | 2007-10-15 | 2011-08-16 | Canon Kabushiki Kaisha | Moving image reproducing apparatus and processing method therefor |
| JP2009272488A (ja) * | 2008-05-08 | 2009-11-19 | Sharp Corp | 撮像デバイスおよび撮像デバイスの製造方法 |
| JP2010094499A (ja) * | 2008-09-16 | 2010-04-30 | Hitachi Maxell Ltd | 画像取得装置及び生体情報取得装置 |
| JP2010093124A (ja) * | 2008-10-09 | 2010-04-22 | Hitachi Maxell Ltd | 光学部品、撮像装置、生体情報取得装置、及び光学部品の製造方法 |
| JP6055167B2 (ja) | 2011-04-07 | 2016-12-27 | セイコーエプソン株式会社 | 撮像装置 |
| JP5828371B2 (ja) | 2011-04-07 | 2015-12-02 | セイコーエプソン株式会社 | 画像取得装置、生体認証装置、電子機器 |
-
2011
- 2011-03-23 JP JP2011063926A patent/JP5742348B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-15 US US13/421,295 patent/US8665357B2/en active Active
- 2012-03-21 CN CN201210076879.9A patent/CN102842027B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101361095A (zh) * | 2006-10-12 | 2009-02-04 | 株式会社理光 | 图像输入设备、图像输入方法、个人身份验证设备以及电子设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012199868A (ja) | 2012-10-18 |
| CN102842027A (zh) | 2012-12-26 |
| JP5742348B2 (ja) | 2015-07-01 |
| US20120242884A1 (en) | 2012-09-27 |
| US8665357B2 (en) | 2014-03-04 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 |
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| CF01 | Termination of patent right due to non-payment of annual fee |