CN102822960B - 柔性和/或可伸缩的衬底上的组件布局 - Google Patents

柔性和/或可伸缩的衬底上的组件布局 Download PDF

Info

Publication number
CN102822960B
CN102822960B CN201180017534.XA CN201180017534A CN102822960B CN 102822960 B CN102822960 B CN 102822960B CN 201180017534 A CN201180017534 A CN 201180017534A CN 102822960 B CN102822960 B CN 102822960B
Authority
CN
China
Prior art keywords
assembly
flexible flake
substrate
flexible
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180017534.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN102822960A (zh
Inventor
M·M·顾特瑟
H·F·M·斯赫欧
M·M·德科克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Netherlands Organization For Applied Scientific Research
Original Assignee
Netherlands Organization For Applied Scientific Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Netherlands Organization For Applied Scientific Research filed Critical Netherlands Organization For Applied Scientific Research
Publication of CN102822960A publication Critical patent/CN102822960A/zh
Application granted granted Critical
Publication of CN102822960B publication Critical patent/CN102822960B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F13/00—Bandages or dressings; Absorbent pads
    • A61F13/00987—Apparatus or processes for manufacturing non-adhesive dressings or bandages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/164—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted in or on a conformable substrate or carrier
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • A61B5/02438—Measuring pulse rate or heart rate with portable devices, e.g. worn by the patient
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue
    • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
    • A61B5/14552—Details of sensors specially adapted therefor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/44—Detecting, measuring or recording for evaluating the integumentary system, e.g. skin, hair or nails
    • A61B5/441—Skin evaluation, e.g. for skin disorder diagnosis
    • A61B5/445—Evaluating skin irritation or skin trauma, e.g. rash, eczema, wound, bed sore
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F13/00—Bandages or dressings; Absorbent pads
    • A61F13/01—Non-adhesive bandages or dressings
    • A61F13/01034—Non-adhesive bandages or dressings characterised by a property
    • A61F13/01038—Flexibility, stretchability or elasticity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1195—Delaminating from release surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Vascular Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
CN201180017534.XA 2010-02-09 2011-02-09 柔性和/或可伸缩的衬底上的组件布局 Expired - Fee Related CN102822960B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10153105.1 2010-02-09
EP10153105A EP2355144A1 (en) 2010-02-09 2010-02-09 Component placement on flexible and/or stretchable substrates
PCT/NL2011/050092 WO2011099851A1 (en) 2010-02-09 2011-02-09 Component placement on flexible and/or stretchable substrates

Publications (2)

Publication Number Publication Date
CN102822960A CN102822960A (zh) 2012-12-12
CN102822960B true CN102822960B (zh) 2015-06-10

Family

ID=42245652

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180017534.XA Expired - Fee Related CN102822960B (zh) 2010-02-09 2011-02-09 柔性和/或可伸缩的衬底上的组件布局

Country Status (5)

Country Link
US (1) US8961725B2 (https=)
EP (2) EP2355144A1 (https=)
JP (1) JP5907896B2 (https=)
CN (1) CN102822960B (https=)
WO (1) WO2011099851A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11698293B2 (en) 2016-05-31 2023-07-11 Velvetwire, Llc System and method for sensing high-frequency vibrations
US11711892B2 (en) * 2019-07-15 2023-07-25 Velvetwire Llc Method of manufacture and use of a flexible computerized sensing device

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9757109B2 (en) 2010-12-10 2017-09-12 Illumix Surgical Canada Inc. Organic light emitting diode illuminated surgical retractor
US8998622B2 (en) 2012-08-31 2015-04-07 Apple Inc. Electrical connectors with applicators for electronic devices
DE102012109138B4 (de) * 2012-09-27 2022-05-25 Osram Oled Gmbh Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelementes und optoelektronische Bauelementevorrichtung
DE102013107116B4 (de) * 2013-07-05 2022-05-25 Pictiva Displays International Limited Organische Leuchtdiode und Verfahren zum Betreiben einer organischen Leuchtdiode
WO2015152060A1 (ja) * 2014-03-31 2015-10-08 株式会社フジクラ 伸縮性基板及び回路基板
WO2016015009A1 (en) * 2014-07-24 2016-01-28 Regents Of The University Of California Reflectance based pulse oximetry systems and methods
DE102014113732B4 (de) * 2014-09-23 2022-11-24 Pictiva Displays International Limited 3D-OLED und Verfahren zum Herstellen einer 3D-OLED
US10299379B2 (en) * 2014-11-27 2019-05-21 Panasonic Intellectual Property Management Co., Ltd. Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
US10327331B2 (en) * 2015-09-25 2019-06-18 Intel Corporation Stretchable computing device
KR102488076B1 (ko) * 2016-01-21 2023-01-13 삼성디스플레이 주식회사 스트레쳐블 표시 장치
CN109069712A (zh) * 2016-05-13 2018-12-21 史密夫及内修公开有限公司 启用传感器的伤口监测和治疗装置
CN106798549B (zh) * 2017-02-27 2019-06-18 清华大学 一种基于柔性可延展衬底的血氧传感器
CN107222974B (zh) * 2017-07-01 2019-04-12 华中科技大学 一种延性电路制作方法
WO2019226692A1 (en) 2018-05-21 2019-11-28 The Regents Of The University Of California Printed all-organic reflectance oximeter array
WO2020050060A1 (ja) * 2018-09-05 2020-03-12 Ｐｈｃホールディングス株式会社 生体情報測定装置、生体情報測定システム、およびインサータ
GB201816838D0 (en) * 2018-10-16 2018-11-28 Smith & Nephew Systems and method for applying biocompatible encapsulation to sensor enabled wound monitoring and therapy dressings
US20240047261A1 (en) * 2020-12-30 2024-02-08 Vuereal Inc. Microdevice cartridge mapping and compensation
TWI835414B (zh) * 2022-11-22 2024-03-11 友達光電股份有限公司 可撓式電子裝置及其製造方法
WO2024206982A1 (en) * 2023-03-30 2024-10-03 Applied Cavitation, Inc. Apparatus for making electrical connections to flexible circuits

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
US20020134422A1 (en) * 2001-03-20 2002-09-26 The Boeing Company Solar tile and associated method for fabricating the same
US20030022403A1 (en) * 2001-07-24 2003-01-30 Seiko Epson Corporation Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and elecronic appliance
EP1746869A1 (en) * 2005-03-22 2007-01-24 Interuniversitair Microelektronica Centrum Methods for embedding conducting material and devices resulting from said methods
US20070123001A1 (en) * 2005-11-28 2007-05-31 Xci Inc. A California Corporation System and method for separating and packaging integrated circuits
CN101199249A (zh) * 2005-05-04 2008-06-11 诺基亚公司 用于制造层状盖、层状保护层和层状电子设备的方法
EP2066159A1 (en) * 2007-11-27 2009-06-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method of providing conductive structures in a multi-foil system and multi-foil system comprising same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5217550A (en) * 1990-09-28 1993-06-08 Dai Nippon Printing Co., Ltd Alignment transfer method
JP3252534B2 (ja) 1993-06-10 2002-02-04 株式会社村田製作所 基板への導電パターン形成方法
JPH07161919A (ja) 1993-12-03 1995-06-23 Seiko Instr Inc 半導体装置およびその製造方法
JP2842378B2 (ja) 1996-05-31 1999-01-06 日本電気株式会社 電子回路基板の高密度実装構造
US6210771B1 (en) 1997-09-24 2001-04-03 Massachusetts Institute Of Technology Electrically active textiles and articles made therefrom
JP2001135910A (ja) 1999-11-04 2001-05-18 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザーによる銅張多層板の孔あけ方法
US6796867B2 (en) 2000-10-27 2004-09-28 Science Applications International Corporation Use of printing and other technology for micro-component placement
AU2002330718A1 (en) 2001-09-03 2003-03-18 National Microelectronic Research Centre University College Cork - National University Of Ireland Co Integrated circuit structure and a method of making an integrated circuit structure
JP2004281738A (ja) 2003-03-17 2004-10-07 Central Glass Co Ltd レーザ走査による導電線パターンの描画方法
US7491892B2 (en) 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
JP3918776B2 (ja) 2003-05-13 2007-05-23 株式会社デンソー Ｉｃパッケージの製造方法
DE102007007269A1 (de) 2006-04-04 2007-10-11 Man Roland Druckmaschinen Ag Applikation von elektronischen Bauelementen in Druckprodukten
DE602007007201D1 (de) 2006-04-07 2010-07-29 Koninkl Philips Electronics Nv Elastisch verformbare integrierte schaltung
JP4415977B2 (ja) * 2006-07-14 2010-02-17 セイコーエプソン株式会社 半導体装置の製造方法、及び転写用の基板
JP4292424B2 (ja) 2006-11-15 2009-07-08 セイコーエプソン株式会社 配線基板およびその製造方法、並びに電子機器
DE102006055576A1 (de) 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
WO2008102866A1 (ja) * 2007-02-22 2008-08-28 Konica Minolta Holdings, Inc. 有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子
AT505688A1 (de) 2007-09-13 2009-03-15 Nanoident Technologies Ag Sensormatrix aus halbleiterbauteilen
US8904315B2 (en) 2007-12-17 2014-12-02 Nokia Corporation Circuit arrangements and associated apparatus and methods
DE102008030821A1 (de) 2008-06-30 2009-12-31 Osram Opto Semiconductors Gmbh Elektroluminieszierende Vorrichtung und Verfahren zur Herstellung einer elektroluminieszierenden Vorrichtung
EP2141973A1 (en) 2008-07-02 2010-01-06 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method of providing conductive structures in a multi-foil system and multi-foil system comprising same
EP2200412A1 (en) 2008-12-17 2010-06-23 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Flexible electronic product and method for manufacturing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
US20020134422A1 (en) * 2001-03-20 2002-09-26 The Boeing Company Solar tile and associated method for fabricating the same
US20030022403A1 (en) * 2001-07-24 2003-01-30 Seiko Epson Corporation Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and elecronic appliance
EP1746869A1 (en) * 2005-03-22 2007-01-24 Interuniversitair Microelektronica Centrum Methods for embedding conducting material and devices resulting from said methods
CN101199249A (zh) * 2005-05-04 2008-06-11 诺基亚公司 用于制造层状盖、层状保护层和层状电子设备的方法
US20070123001A1 (en) * 2005-11-28 2007-05-31 Xci Inc. A California Corporation System and method for separating and packaging integrated circuits
EP2066159A1 (en) * 2007-11-27 2009-06-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method of providing conductive structures in a multi-foil system and multi-foil system comprising same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11698293B2 (en) 2016-05-31 2023-07-11 Velvetwire, Llc System and method for sensing high-frequency vibrations
US12228447B2 (en) 2016-05-31 2025-02-18 Velvetwire, Llc System and method for sensing high-frequency vibrations
US11711892B2 (en) * 2019-07-15 2023-07-25 Velvetwire Llc Method of manufacture and use of a flexible computerized sensing device

Also Published As

Publication number Publication date
EP2355144A1 (en) 2011-08-10
JP2013519242A (ja) 2013-05-23
US20130133822A1 (en) 2013-05-30
EP2534680B1 (en) 2018-12-05
CN102822960A (zh) 2012-12-12
JP5907896B2 (ja) 2016-04-26
US8961725B2 (en) 2015-02-24
WO2011099851A1 (en) 2011-08-18
EP2534680A1 (en) 2012-12-19

Similar Documents

Publication Publication Date Title
CN102822960B (zh) 柔性和/或可伸缩的衬底上的组件布局
CA2959699C (en) Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same
JP2013519242A5 (https=)
US9024203B2 (en) Embedded printed circuit board and method for manufacturing same
JP2016504751A (ja) ポリマー内への薄型チップの埋込み
CN117393441A (zh) 将电子组件连接至基板
CN102113130A (zh) 使用单石模块组合技术制造的光伏打模块
GB2521619A (en) An apparatus and associated methods for flexible carrier substrates
JP5232466B2 (ja) 光電池装置
TW201438537A (zh) 配線基板的製造方法
EP2311302B1 (en) Method of providing conductive structures in a multi-foil system and multifoil system comprising same
US20150129899A1 (en) Led lead frame for laminated led circuits
JP6489713B2 (ja) 積層回路基板の形成方法及びこれにより形成された積層回路基板
CN114631183A (zh) 可变刚度模块
JP5925872B2 (ja) 基板構造およびその製造方法
US9380706B2 (en) Method of manufacturing a substrate strip with wiring
JP5902291B2 (ja) 封止シートおよびその製造方法
KR101148455B1 (ko) 층상구조 기판을 이용한 플라스틱 태양전지 제조방법, 이에 따라 제조된 플라스틱 태양전지
US9081137B2 (en) Implementing embedded hybrid electrical-optical PCB construct
KR20240167663A (ko) 다층 구조물 및 이의 제조 방법
JP2003092471A5 (https=)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150610

Termination date: 20200209