CN102811557A - Improved PCB (Printed Circuit Board) manufacturing process - Google Patents
Improved PCB (Printed Circuit Board) manufacturing process Download PDFInfo
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- CN102811557A CN102811557A CN2012100734561A CN201210073456A CN102811557A CN 102811557 A CN102811557 A CN 102811557A CN 2012100734561 A CN2012100734561 A CN 2012100734561A CN 201210073456 A CN201210073456 A CN 201210073456A CN 102811557 A CN102811557 A CN 102811557A
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- pcb board
- welding
- forming
- hole
- etching
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Abstract
The invention relates to the field of a preparation process of a printed circuit board and particularly relates to a PCB manufacturing process which can effectively improve the anti-welding hole plugging rate. The PCB manufacturing process comprises the following steps of: cutting a board; forming an inner layer; pressing; drilling; electroplating; forming an outer layer and etching a line; anti-welding; forming words; molding; testing; and carrying out surface treatment. The method is characterized in that the step of anti-welding is divided into two steps of plugging a hole and printing a surface, wherein a hole plugging step is carried out before the step of forming the outer layer and etching the line, and comprises steps of plugging the hole by rubber and brushing overflowed glue; and a surface printing step is located between the step of forming the outer layer and etching the line and the step of forming the words. The PCB manufacturing process disclosed by the invention has the beneficial effects that the rubber is used for plugging the hole and a flow of brushing the overflowed glue is increased at the same time, so that the non-uniformity of the hole plugging rate is improved, air bubbles and cracks are not generated, the hole plugging rate is close to 100%, and the anti-welding effect is improved.
Description
Technical field
The present invention relates to the pcb board manufacture craft that printed circuit board (PCB) preparation technology Ling Yu , relates in particular to the anti-welding consent rate of a kind of effective lifting.
Background technology
In the anti-welding technology of printed wiring board (being PCB); The pcb board consent rate Bu Jun Yun ﹐ that uses the common ink consent to make is easy to generate cavity and Lie Wen ﹐ has influenced anti-welding effect; Therefore be necessary to design a kind of novel PCB plate manufacture craft; Especially should improve the anti-welding technology of pcb board, make the consent rate of pcb board evenly and not produce cavity and crackle.
Summary of the invention
The objective of the invention is to overcome the problems referred to above, a kind of manufacture craft of improved pcb board be provided, this technology can make anti-welding consent evenly, flawless or cavity, the consent rate is near 100%.
For solving the problems of the technologies described above, the technical scheme that the present invention adopted is: a kind of improved pcb board manufacture craft comprises the steps: to cut out plate; Internal layer; Pressing; Boring; Electroplate; Outer also circuit etching; Anti-welding; Literal; Moulding; Test; Surface treatment is characterized in that: described anti-welding consent and surperficial two steps of seal of being divided into, before wherein the consent step is positioned at outer and etching step, comprise the excessive glue of filling holes with resin and brush, and print surperficial step between skin and circuit etching and literal step.
Aforesaid a kind of improved pcb board manufacture craft, the copper electroplating layer minimum thickness is 1.7mil, average thickness is 2.0 mil.
Aforesaid a kind of improved pcb board manufacture craft, in the filling holes with resin step, speed 2-3 lattice, squeegee pressure 4 ± 1kg/cm
2, cover black pressure 3 ± 1kg/cm
2, scraper angle 5-20 degree, blade thickness 20mm.
Aforesaid a kind of improved pcb board manufacture craft, the excessive glue step of described brush is specially through the sand ribbon grinds the polish-brush resin, and it is level and smooth with surface grinding to re-use 450 order adhesive-bonded fabric brush wheels.
The beneficial effect that the present invention reached: adopt filling holes with resin, increase simultaneously brush overflow the Liu Cheng ﹐ of glue improve the Bu Jun Yun ﹐ of consent rate and do not produce cavity and Lie Wen ﹐ to reach the consent rate nearly 100%, improved anti-welding effect.
Description of drawings
Fig. 1 is the section photo of filling holes with resin of the present invention;
Fig. 2 is the section photo of the common ink consent of prior art;
Embodiment
For technical scheme, technical characterictic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with embodiment, further set forth the present invention.
A kind of improved pcb board manufacture craft comprises the steps: to cut out plate; Internal layer; Pressing; Boring; Electroplate; Outer also circuit etching; Anti-welding; Literal; Moulding; Test; Surface treatment is characterized in that: described anti-welding consent and surperficial two steps of seal of being divided into, before wherein the consent step is positioned at outer and etching step, comprise the excessive glue of filling holes with resin and brush, and print surperficial step between skin and circuit etching and literal step.
Copper electroplating layer thickness changes to min 1.7mil by min 1.4mil, ave1.6 mil, and ave2.0 mil guarantees that enough copper is ground; It is the sun that the present invention changes to resin plug hole ﹐ resin producer with ink plugging, and model is THP-100DRT, and parameter is: speed 2-3 lattice, squeegee pressure 4 ± 1kg/cm
2, cover black pressure 3 ± 1kg/cm
2, scraper angle 5-20 °, blade thickness 20mm; In brush overflow the solation journey, it was level and smooth with surface grinding through the sand ribbon grinding resin polish-brush Diao ﹐ to be re-used 450 order adhesive-bonded fabric brush wheels.
Fig. 1 is the section photo of filling holes with resin of the present invention; Fig. 2 is the section photo of the common ink consent of prior art; Five samples number consecutively 1,2,3,4,5 from left to right simultaneously from top to bottom among Fig. 1; Can be known that by Fig. 1 the pcb board consent rate that adopts the common ink consent to make is low and produce cavity and crackle, experimental data shows that the consent rate of five samples is followed successively by 40%, 50%, 70%, 50%, 10%.Can know by Fig. 2, adopt the pcb board consent rate that makes behind the excessive glue of filling holes with resin and brush near 100%, and do not produce cavity and crackle.The present invention promotes consent rate to 100% through the change of consent material and flow process.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (4)
1. an improved pcb board manufacture craft comprises the steps: to cut out plate; Internal layer; Pressing; Boring; Electroplate; Outer also circuit etching; Anti-welding; Literal; Moulding; Test; Surface treatment is characterized in that: described anti-welding consent and surperficial two steps of seal of being divided into, before wherein the consent step is positioned at outer and etching step, comprise the excessive glue of filling holes with resin and brush, and print surperficial step between skin and circuit etching and literal step.
2. a kind of improved pcb board manufacture craft according to claim 1, it is characterized in that: the copper electroplating layer minimum thickness of pcb board is 1.7mil, average thickness is 2.0 mil.
3. a kind of improved pcb board manufacture craft according to claim 1 is characterized in that: in the filling holes with resin step, and speed 2-3 lattice, squeegee pressure 4 ± 1kg/cm
2, cover black pressure 3 ± 1kg/cm
2, scraper angle 5-20 degree, blade thickness 20mm.
4. a kind of improved pcb board manufacture craft according to claim 1 is characterized in that: the excessive glue step of described brush is specially through the sand ribbon grinds the polish-brush resin, and it is level and smooth with surface grinding to re-use 450 order adhesive-bonded fabric brush wheels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100734561A CN102811557A (en) | 2012-03-20 | 2012-03-20 | Improved PCB (Printed Circuit Board) manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100734561A CN102811557A (en) | 2012-03-20 | 2012-03-20 | Improved PCB (Printed Circuit Board) manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102811557A true CN102811557A (en) | 2012-12-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100734561A Pending CN102811557A (en) | 2012-03-20 | 2012-03-20 | Improved PCB (Printed Circuit Board) manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102811557A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507265A (en) * | 2014-12-24 | 2015-04-08 | 昆山元茂电子科技有限公司 | Improvement process for solder masking green paint dirt of printed circuit board |
| CN112188732A (en) * | 2019-07-03 | 2021-01-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of medical instrument detection plate |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN113286431A (en) * | 2021-04-02 | 2021-08-20 | 竞陆电子(昆山)有限公司 | Manufacturing process of Mini LED PCB module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060332A (en) * | 2001-08-10 | 2003-02-28 | Ibiden Co Ltd | Method of manufacturing wiring board |
| CN101868122A (en) * | 2010-06-24 | 2010-10-20 | 深南电路有限公司 | PCB manufacturing process and hole plugging process thereof |
| CN102364998A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of high-precision circuit board |
-
2012
- 2012-03-20 CN CN2012100734561A patent/CN102811557A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060332A (en) * | 2001-08-10 | 2003-02-28 | Ibiden Co Ltd | Method of manufacturing wiring board |
| CN101868122A (en) * | 2010-06-24 | 2010-10-20 | 深南电路有限公司 | PCB manufacturing process and hole plugging process thereof |
| CN102364998A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of high-precision circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507265A (en) * | 2014-12-24 | 2015-04-08 | 昆山元茂电子科技有限公司 | Improvement process for solder masking green paint dirt of printed circuit board |
| CN112188732A (en) * | 2019-07-03 | 2021-01-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of medical instrument detection plate |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112423476B (en) * | 2020-10-26 | 2022-04-15 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN113286431A (en) * | 2021-04-02 | 2021-08-20 | 竞陆电子(昆山)有限公司 | Manufacturing process of Mini LED PCB module |
| CN113286431B (en) * | 2021-04-02 | 2023-11-21 | 竞陆电子(昆山)有限公司 | Manufacturing process of Mini LED PCB module |
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Application publication date: 20121205 |