CN104507265A - Improvement process for solder masking green paint dirt of printed circuit board - Google Patents
Improvement process for solder masking green paint dirt of printed circuit board Download PDFInfo
- Publication number
- CN104507265A CN104507265A CN201410811773.8A CN201410811773A CN104507265A CN 104507265 A CN104507265 A CN 104507265A CN 201410811773 A CN201410811773 A CN 201410811773A CN 104507265 A CN104507265 A CN 104507265A
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- China
- Prior art keywords
- circuit board
- green paint
- printed circuit
- green
- pcb
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the field of PCB (Printed Circuit Board) manufacturing processes, in particular to an improvement process for solder masking green paint dirt of a printed circuit board. The improvement process comprises the following steps: etching an internal layer circuit of a multi-layer board; laminating the multi-layer board; drilling holes in the multi-layer board; plating copper in the through holes; etching an outer layer circuit; performing secondary copper plating; performing solder masking treatment; performing gold plating; spraying tin; forming; the improvement process is characterized by comprising the following solder masking treatment steps: coating a light-sensitive insulating green paint on a copper surface of the circuit board through electrostatic spraying; brushing off the overflown insulating green paint; drying and then placing in an ultraviolet exposure machine for exposure; then flatly trimming the green paint layer with a blade; finally hardening the insulating green paint. According to the process, the problems in part welding and use caused by infiltration of the green paint into the copper surface are prevented, and the green paint is flat and does not overflow by brushing off the overflown insulating green paint and flatly trimming with the blade.
Description
Technical field
The present invention relates to PCB manufacture craft field, be specifically related to the anti-welding green paint foul of a kind of printed circuit board (PCB) and improve technique.
Background technology
After printed circuit board (PCB) sprays the green paint of anti-welding insulation (a kind of insulating resin), the out-of-flatness of green paint possibility, and may overflow from copper face, there is no the correlation technique of head it off at present.
Summary of the invention
The object of the invention is to overcome the problems referred to above, provide a kind of and make the green paint of insulation smooth and the anti-welding green paint foul of printed circuit board (PCB) that is that do not overflow improves technique.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is: the anti-welding green paint foul of a kind of printed circuit board (PCB) improves technique, comprises the steps: etching multi-layer sheet internal layer circuit; Multi-layer sheet pressing; Hole on multilayer boards; Through hole copper facing; Etching outer-layer circuit; Secondary copper facing; Anti-welding process; Gold-plated, spray tin, shaping, it is characterized in that, described anti-welding treatment step is: by electrostatic spraying, green for photosensitive insulation paint is coated on circuit board copper surface, green for the insulation of spilling painting brush is removed, put into ultraviolet exposure machine after oven dry to expose, again with blade by whole for green enamelled coating Xiu Liping, finally make the sclerosis of insulation green paint.
The anti-welding green paint foul of aforesaid a kind of printed circuit board (PCB) improves technique, and described through hole copper facing refers to electroplates in the hole of formation that multi-layer sheet is holed.
The anti-welding green paint foul of aforesaid a kind of printed circuit board (PCB) improves technique, and described secondary copper facing refers to outer-layer circuit copper coating.
The anti-welding green paint foul of aforesaid a kind of printed circuit board (PCB) improves technique, and gold-plated step is specially: connect circular arc interface at the inserted terminal of circuit board, arranges 3 gold-plated points at two end points of described circular arc interface and central authorities.
The anti-welding green paint foul of aforesaid a kind of printed circuit board (PCB) improves technique, and described spray tin step adopts the mode of hand spray to carry out.
The anti-welding green paint foul of aforesaid a kind of printed circuit board (PCB) improves technique, and it is characterized in that, described multi-layer sheet is 4 layers.
The beneficial effect that the present invention reaches: adopt, by electrostatic spraying, green for photosensitive insulation paint is coated on circuit board copper surface, the green paint of insulation (formation foul) overflowed is brushed, put into ultraviolet exposure machine after oven dry to expose, again with blade by whole for green enamelled coating Xiu Liping (irregular green enamelled coating is foul), finally make the method for the green paint sclerosis of insulation, prevent green paint from penetrating into copper face and produce the problem in weld parts and use, and whole with blade Xiu Liping by the green paint of insulation that brushes spilling, make it smooth and not excessive; Adopt and connect circular arc interface at the inserted terminal of circuit board; at two end points of described circular arc interface and central authorities, 3 gold-plated points are set; the method of the remainder coating nickel dam of circular arc interface; namely protect end points and provide good circuit ON performance; reduce again the consumption of gold, reduce cost.
Embodiment
The technical scheme realized for making the present invention, technical characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the present invention further.
The anti-welding green paint foul of a kind of printed circuit board (PCB) improves technique, comprises the steps: etching multi-layer sheet internal layer circuit; Multi-layer sheet pressing; Hole on multilayer boards; Through hole copper facing; Etching outer-layer circuit; Secondary copper facing; Anti-welding process; Gold-plated, spray tin, shaping, it is characterized in that, described anti-welding treatment step is: by electrostatic spraying, green for photosensitive insulation paint is coated on circuit board copper surface, green for the insulation of spilling painting brush is removed, put into ultraviolet exposure machine after oven dry to expose, again with blade by whole for green enamelled coating Xiu Liping, finally make the sclerosis of insulation green paint.
Described through hole copper facing refers to electroplates in the hole of formation that multi-layer sheet is holed.
Described secondary copper facing refers to outer-layer circuit copper coating.
Gold-plated step is specially: connect circular arc interface at the inserted terminal of circuit board, arranges 3 gold-plated points at two end points of described circular arc interface and central authorities.3 gold-plated points are connected with external circuits.
Described spray tin step adopts the mode of hand spray to carry out.
Described multi-layer sheet is 4 layers.
Adopt, by electrostatic spraying, green for photosensitive insulation paint is coated on circuit board copper surface, green for the insulation of spilling painting brush is removed, put into ultraviolet exposure machine after oven dry to expose, again with blade by whole for green enamelled coating Xiu Liping, finally make the method for the green paint sclerosis of insulation, prevent green paint from penetrating into copper face and the problem that produces weld parts and use, and whole with blade Xiu Liping by the green paint of insulation that brushes spilling, make it smooth and not excessive; Adopt and connect circular arc interface at the inserted terminal of circuit board; at two end points of described circular arc interface and central authorities, 3 gold-plated points are set; the method of the remainder coating nickel dam of circular arc interface; namely protect end points and provide good circuit ON performance; reduce again the consumption of gold, reduce cost.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. the anti-welding green paint foul of printed circuit board (PCB) improves a technique, comprises the steps: etching multi-layer sheet internal layer circuit; Multi-layer sheet pressing; Hole on multilayer boards; Through hole copper facing; Etching outer-layer circuit; Secondary copper facing; Anti-welding process; Gold-plated, spray tin, shaping, it is characterized in that, described anti-welding treatment step is: by electrostatic spraying, green for photosensitive insulation paint is coated on circuit board copper surface, green for the insulation of spilling painting brush is removed, put into ultraviolet exposure machine after oven dry to expose, again with blade by whole for green enamelled coating Xiu Liping, finally make the sclerosis of insulation green paint.
2. the anti-welding green paint foul of a kind of printed circuit board (PCB) according to claim 1 improves technique, it is characterized in that, described through hole copper facing refers to electroplates in the hole of formation that multi-layer sheet is holed.
3. the anti-welding green paint foul of a kind of printed circuit board (PCB) according to claim 1 improves technique, and it is characterized in that, described secondary copper facing refers to outer-layer circuit copper coating.
4. the anti-welding green paint foul of a kind of printed circuit board (PCB) according to claim 1 improves technique, it is characterized in that, gold-plated step is specially: connect circular arc interface at the inserted terminal of circuit board, arranges 3 gold-plated points at two end points of described circular arc interface and central authorities.
5. the anti-welding green paint foul of a kind of printed circuit board (PCB) according to claim 1 improves technique, it is characterized in that, described spray tin step adopts the mode of hand spray to carry out.
6. the anti-welding green paint foul of a kind of printed circuit board (PCB) according to claim 1 improves technique, and it is characterized in that, described multi-layer sheet is 4 layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811773.8A CN104507265A (en) | 2014-12-24 | 2014-12-24 | Improvement process for solder masking green paint dirt of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811773.8A CN104507265A (en) | 2014-12-24 | 2014-12-24 | Improvement process for solder masking green paint dirt of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104507265A true CN104507265A (en) | 2015-04-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410811773.8A Pending CN104507265A (en) | 2014-12-24 | 2014-12-24 | Improvement process for solder masking green paint dirt of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104507265A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN102446614A (en) * | 2010-10-14 | 2012-05-09 | 弘邺科技有限公司 | Inductance component structure |
| CN102811557A (en) * | 2012-03-20 | 2012-12-05 | 昆山元茂电子科技有限公司 | Improved PCB (Printed Circuit Board) manufacturing process |
| CN104117778A (en) * | 2014-08-04 | 2014-10-29 | 中山新诺科技股份有限公司 | Method for machining solder mask of circuit board through laser |
| CN104159409A (en) * | 2014-07-24 | 2014-11-19 | 深圳崇达多层线路板有限公司 | Surface treatment method for printed circuit board |
-
2014
- 2014-12-24 CN CN201410811773.8A patent/CN104507265A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN102446614A (en) * | 2010-10-14 | 2012-05-09 | 弘邺科技有限公司 | Inductance component structure |
| CN102811557A (en) * | 2012-03-20 | 2012-12-05 | 昆山元茂电子科技有限公司 | Improved PCB (Printed Circuit Board) manufacturing process |
| CN104159409A (en) * | 2014-07-24 | 2014-11-19 | 深圳崇达多层线路板有限公司 | Surface treatment method for printed circuit board |
| CN104117778A (en) * | 2014-08-04 | 2014-10-29 | 中山新诺科技股份有限公司 | Method for machining solder mask of circuit board through laser |
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| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20180209 |
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| AD01 | Patent right deemed abandoned |