CN102790035B - Bump structure and process - Google Patents
Bump structure and process Download PDFInfo
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- CN102790035B CN102790035B CN201110130330.9A CN201110130330A CN102790035B CN 102790035 B CN102790035 B CN 102790035B CN 201110130330 A CN201110130330 A CN 201110130330A CN 102790035 B CN102790035 B CN 102790035B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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Abstract
The invention discloses a bump structure. The bump structure is formed on a support plate. The bump structure comprises a first polymer bump body, a second polymer bump body, a first channel, a bump lower metal layer and a bonding metal layer, wherein the first polymer bump body and the second polymer bump body are independent bump bodies, the first polymer bump body is provided with a first bonding groove, the second polymer bump body is provided with a second bonding groove, the first bonding groove and the second bonding groove are communicated with the first channel, the bump lower metal layer forms a second channel, a third bonding groove and a fourth bonding groove, the second channel, the third bonding groove and the fourth bonding groove are communicated mutually, the bonding metal layer forms a third channel, a fifth bonding groove and a sixth bonding groove, the third channel, the fifth bonding groove and the sixth bonding groove are communicated mutually, the bump lower metal layer covers a first covering region of the first polymer bump body and a second covering region of the second polymer bump body, and a first exposing region of the first polymer bump body and a second exposing region of the second polymer bump body are exposed.
Description
Technical field
The invention relates to a kind of projection cube structure and technique, relate to a kind of projection cube structure and the technique that improve eutectic reliability especially.
Background technology
Existing known golden projection cube structure 10 is formed on silicon substrate 20, this silicon substrate 20 has multiple weld pad 21 and a protective layer 22, this protective layer 22 is formed with multiple opening 23, those openings 23 manifest those weld pads 21, this projection cube structure 10 comprises Underbump metallization layer 11 and a gold medal bump layer 12, this Underbump metallization layer 11 is formed on those weld pads 21, this golden bump layer 12 is formed on this Underbump metallization layer 11, therefore when this golden projection cube structure 10 engages with contact (as connection gasket or the pin) eutectic of another electronic building brick, this golden projection cube structure 10 is also little with the contact area of this contact, relatively have impact on the eutectic reliability of this golden projection cube structure 10 and this contact, and this contact is touched be incorporated into this golden projection cube structure 10 time, this contact has the situation of skew, and cause adjacent contacts and produce the situation of short circuit, in addition because this golden projection cube structure 10 is made up of this golden bump layer 12, therefore its production cost is higher.
As can be seen here, above-mentioned existing golden projection cube structure is at method, product structure and use, and obviously still has inconvenience and defect, and is urgently further improved.Therefore how to found a kind of new projection cube structure and technique, one of current important research and development problem of real genus, also becomes the target that current industry pole need be improved.
Summary of the invention
The object of the invention is to, overcome the defect that existing golden projection cube structure exists, and a kind of new projection cube structure and technique are provided, technical problem to be solved is when making its this projection cube structure engage (eutectic bonding) with contact (as connection gasket or the pin) eutectic of another electronic building brick, touched this bonding metallic layer being incorporated into this projection cube structure of a lower surface of this contact, and a part for this contact embeds in this groove and this engaging groove, inclined-plane by those grooves can increase the contact area of this projection cube structure and this contact, to improve the bond strength of this contact and this projection cube structure, and when can avoid that this contact is touched is incorporated into this bonding metallic layer of this projection cube structure, there is the situation of skew, in addition due to this projection cube structure with this first macromolecule block and the second macromolecule block for base material, therefore plated material cost can be saved, be very suitable for practicality.
Another object of the present invention is to, overcome the defect that existing golden projection cube structure exists, and a kind of projection cube structure and technique of new structure are provided, technical problem to be solved makes its this projection cube structure can apply to Chip-on-Glass (COG) encapsulation, when this projection is pressed on a glass substrate, the anisotropy conductive film (ACF) that this groove can increase this projection and this glass substrate flows, and is gathered between adjacent projections causes short circuit to avoid the conducting particles in anisotropy conductive film.Or, this projection cube structure of the present invention can apply to Chip-on-Glass (COG) encapsulation, because this projection comprises, there is flexible macromolecule block and those grooves, therefore this projection directly can be pressed on the connection pad of a glass substrate, and do not need to use anisotropy conductive film (ACF), to reduce costs, thus be more suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of projection cube structure that the present invention proposes, wherein it is arranged on a support plate, this support plate has multiple weld pad and a protective layer, this protective layer has multiple opening, those openings manifest those weld pads, this projection cube structure and respectively this weld pad are electrically connected, this projection cube structure includes: one first macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, this the first macromolecule block has one first upper surface and recessed in the first engaging groove of this first upper surface, the definition of this first upper surface has one first area of coverage and one first to appear district, one second macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this second macromolecule block has one second upper surface and recessed in the second engaging groove of this second upper surface, and the definition of this second upper surface has one second area of coverage and one second to appear district, one first groove, it is between this first macromolecule block and this second macromolecule block, and this first groove manifests this weld pad, and this first engaging groove of this first macromolecule block and this second engaging groove of this second macromolecule block are communicated with this first groove, one Underbump metallization layer (UBM), it covers this weld pad, this first area of coverage, this first engaging groove, this second area of coverage and this second engaging groove, and manifest this first macromolecule block this first appear district and this second macromolecule block this second appear district, wherein this Underbump metallization layer is formed with one second groove, one the 3rd engaging groove and one the 4th engaging groove, 3rd engaging groove and the 4th engaging groove are communicated with this second groove, this second groove is positioned at above this first groove, 3rd engaging groove is positioned at above this first engaging groove, 4th engaging groove is positioned at above this second engaging groove, and a bonding metallic layer, it covers this Underbump metallization layer, and be formed with one the 3rd groove, one the 5th engaging groove and one the 6th engaging groove, 5th engaging groove and the 6th engaging groove are communicated with the 3rd groove, 3rd groove is positioned at above this second groove, 5th engaging groove is positioned at above the 3rd engaging groove, and the 6th engaging groove is positioned at above the 4th engaging groove.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid projection cube structure, wherein said this first appears district for " recessed " shape.
Aforesaid projection cube structure, wherein said this second appears district for " recessed " shape.
Aforesaid projection cube structure, the 3rd wherein said groove, the 5th engaging groove and the 6th engaging groove are "+" shape.
Aforesaid projection cube structure, the 3rd wherein said groove has one first width, and the 5th engaging groove has one second width, and this first width is greater than this second width.
Aforesaid projection cube structure, the 6th wherein said engaging groove has one the 3rd width, and this first width is greater than the 3rd width.
Aforesaid projection cube structure, this wherein said the first macromolecule block and this bonding metallic layer stepped.
Aforesaid projection cube structure, this wherein said the second macromolecule block and this bonding metallic layer stepped.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of bump technology that the present invention proposes, wherein comprise the following step: provide a support plate, it has multiple weld pad and a protective layer, and this protective layer has multiple opening, and those openings manifest those weld pads; This support plate is formed a macromolecule layer, and this macromolecule layer covers this protective layer and those weld pads; One first light shield is provided and carries out first time step of exposure; Remove this first light shield and carry out first time development step, multiple macromolecular convex is formed to make this macromolecule layer, and the corresponding weld pad of each macromolecular convex, respectively this macromolecular convex includes: one first macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this first macromolecule block has one first upper surface and recessed in the first engaging groove of this first upper surface, and the definition of this first upper surface has one first area of coverage and one first to appear district; One second macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this second macromolecule block has one second upper surface and recessed in the second engaging groove of this second upper surface, and the definition of this second upper surface has one second area of coverage and one second to appear district; And one first groove, it is between this first macromolecule block and this second macromolecule block, this first groove manifests this weld pad, and this first engaging groove of this first macromolecule block and this second engaging groove of this second macromolecule block are communicated with this first groove.Solidify those macromolecular convex; This support plate is formed a Underbump metallization layer (UBM), this Underbump metallization layer covers this protective layer, this weld pad, this first macromolecule block and this second macromolecule block, wherein this Underbump metallization layer is formed with one second groove, one the 3rd engaging groove and one the 4th engaging groove, 3rd engaging groove and the 4th engaging groove are communicated with this second groove, this second groove is positioned at above this first groove, 3rd engaging groove is positioned at above this first engaging groove, and the 4th engaging groove is positioned at above this second engaging groove; At upper formation one photoresist layer of this Underbump metallization layer (UBM); One second light shield is provided and carries out second time step of exposure; Remove this second light shield and carry out second development step, to make this photoresist layer be formed with multiple opening, respectively this opening correspondence respectively this macromolecular convex, and each this opening manifest this Underbump metallization layer being arranged in respectively this opening; A bonding metallic layer is formed in those openings, it covers this Underbump metallization layer appeared by those openings, wherein this bonding metallic layer is formed with one the 3rd groove, one the 5th engaging groove and one the 6th engaging groove, 5th engaging groove and the 6th engaging groove are communicated with the 3rd groove, 3rd groove is positioned at above this second groove, 5th engaging groove is positioned at above the 3rd engaging groove, and the 6th engaging groove is positioned at above the 4th engaging groove; Remove this photoresist layer, to appear not by this Underbump metallization layer that this bonding metallic layer covers; And remove not by this Underbump metallization layer that this bonding metallic layer covers, to make this Underbump metallization layer only cover this weld pad, this first area of coverage, this first engaging groove, this second area of coverage, this second engaging groove and this first groove, and manifest this first macromolecule block this first appear district and this second macromolecule block this second appear district.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid bump technology, wherein said in the step removing this Underbump metallization layer do not covered by this bonding metallic layer, this first appears district and this second appears district for " recessed " shape.
Aforesaid bump technology, wherein said is formed in the step of this bonding metallic layer in those openings, and the 3rd groove, the 5th engaging groove and the 6th engaging groove are "+" shape.
Aforesaid bump technology, wherein said is formed in the step of this bonding metallic layer in those openings, and the 3rd groove has one first width, and the 5th engaging groove has one second width, and this first width is greater than this second width.
Aforesaid bump technology, wherein said is formed in the step of this bonding metallic layer in those openings, and the 6th engaging groove has one the 3rd width, and this first width is greater than the 3rd width.
Aforesaid bump technology, wherein said in the step removing this Underbump metallization layer do not covered by this bonding metallic layer, this first macromolecule block and this bonding metallic layer stepped.
Aforesaid bump technology, wherein said in the step removing this Underbump metallization layer do not covered by this bonding metallic layer, this second macromolecule block and this bonding metallic layer stepped.
The present invention compared with prior art has obvious advantage and beneficial effect.From above technical scheme, main technical content of the present invention is as follows: be to provide a kind of projection cube structure, it is arranged on a support plate, this support plate has multiple weld pad and a protective layer, this protective layer has multiple opening, those openings manifest those weld pads, this projection cube structure and respectively this weld pad are electrically connected, this projection cube structure includes one first macromolecule block, one second macromolecule block, one first groove, one Underbump metallization layer and a bonding metallic layer, wherein this first macromolecule block and the second macromolecule block are respectively an independently block, this first groove is between this first macromolecule block and this second macromolecule block, this first groove manifests this weld pad, this the first macromolecule block and the second macromolecule block its be arranged on this weld pad and this protective layer, this the first macromolecule block has one first upper surface and recessed in the first engaging groove of this first upper surface, the definition of this first upper surface has one first area of coverage and one first to appear district, this the second macromolecule block has one second upper surface and recessed in the second engaging groove of this second upper surface, the definition of this second upper surface has one second area of coverage and one second to appear district, wherein this first engaging groove of this first macromolecule block and this second engaging groove of this second macromolecule block are communicated with this first groove, this Underbump metallization layer (UBM) covers this weld pad, this first area of coverage, this first engaging groove, this second area of coverage and this second engaging groove, and manifest this first macromolecule block this first appear district and this second macromolecule block this second appear district, wherein this Underbump metallization layer is formed with one second groove, one the 3rd engaging groove and one the 4th engaging groove, 3rd engaging groove and the 4th engaging groove are communicated with this second groove, this second groove is positioned at above this first groove, 3rd engaging groove is positioned at above this first engaging groove, 4th engaging groove is positioned at above this second engaging groove, this bonding metallic layer covers this Underbump metallization layer, and be formed with one the 3rd groove, one the 5th engaging groove and one the 6th engaging groove, 5th engaging groove and the 6th engaging groove are communicated with the 3rd groove, 3rd groove is positioned at above this second groove, 5th engaging groove is positioned at above the 3rd engaging groove, 6th engaging groove is positioned at above the 4th engaging groove.Separately provide a kind of bump technology, comprise the following step, first, provide a support plate, it has multiple weld pad and a protective layer, and this protective layer has multiple opening, and those openings manifest those weld pads.Afterwards, this support plate forms a macromolecule layer, this macromolecule layer covers this protective layer and those weld pads.Then, one first light shield is provided and carries out first time step of exposure.Afterwards, remove this first light shield and carry out first time development step, multiple macromolecular convex is formed to make this macromolecule layer, and the corresponding weld pad of each macromolecular convex, respectively this macromolecular convex includes one first macromolecule block, one second macromolecule block and one first groove, this the first macromolecule block and this second macromolecule block, be respectively an independently block, it lays respectively at two sides of this first groove, this first groove manifests this weld pad, and this first macromolecule block and this second macromolecule block are arranged on this weld pad and this protective layer, this the first macromolecule block has one first upper surface and recessed in the first engaging groove of this first upper surface, the definition of this first upper surface has one first area of coverage and one first to appear district, this the second macromolecule block has one second upper surface and recessed in the second engaging groove of this second upper surface, the definition of this second upper surface has one second area of coverage and one second to appear district, wherein this first engaging groove of this first macromolecule block and this second engaging groove of this second macromolecule block are communicated with this first groove.Then, those macromolecular convex are solidified.Afterwards; this support plate is formed a Underbump metallization layer (UBM); this Underbump metallization layer covers this protective layer, this weld pad, this first macromolecule block and this second macromolecule block; wherein this Underbump metallization layer is formed with one second groove, one the 3rd engaging groove and one the 4th engaging groove; 3rd engaging groove and the 4th engaging groove are communicated with this second groove; this second groove is positioned at above this first groove; 3rd engaging groove is positioned at above this first engaging groove, and the 4th engaging groove is positioned at above this second engaging groove.Then, at upper formation one photoresist layer of this Underbump metallization layer (UBM).Afterwards, one second light shield is provided and carries out second time step of exposure.Then, remove this second light shield and carry out second development step, to make this photoresist layer be formed with multiple opening, respectively this opening correspondence respectively this macromolecular convex, and each this opening manifest this Underbump metallization layer being arranged in respectively this opening.Afterwards, a bonding metallic layer is formed in those openings, this bonding metallic layer covers this Underbump metallization layer appeared by those openings, wherein this bonding metallic layer is formed with one the 3rd groove, one the 5th engaging groove and one the 6th engaging groove, 5th engaging groove and the 6th engaging groove are communicated with the 3rd groove, 3rd groove is positioned at above this second groove, and the 5th engaging groove is positioned at above the 3rd engaging groove, and the 6th engaging groove is positioned at above the 4th engaging groove.Then, this photoresist layer is removed, to appear not by this Underbump metallization layer that this bonding metallic layer covers.Finally, remove not by this Underbump metallization layer that this bonding metallic layer covers, to make this Underbump metallization layer only cover this weld pad, this first area of coverage, this first engaging groove, this second area of coverage, this second engaging groove and this first groove, and manifest this first macromolecule block this first appear district and this second macromolecule block this second appear district.
By technique scheme, projection cube structure of the present invention and technique at least have following advantages and beneficial effect: the inclined-plane by those grooves can increase the contact area of this projection cube structure and this contact, to improve the bond strength of this contact and this projection cube structure, and when can avoid that this contact is touched is incorporated into this bonding metallic layer of this projection cube structure, there is the situation of skew, in addition due to this projection cube structure with this first macromolecule block and the second macromolecule block for base material, therefore can save plated material cost.
When this projection is pressed on a glass substrate, the anisotropy conductive film (ACF) that this groove can increase this projection and this glass substrate flows, and is gathered between adjacent projections causes short circuit to avoid the conducting particles in anisotropy conductive film.Or, this projection cube structure of the present invention can apply to Chip-on-Glass (COG) encapsulation, because this projection comprises, there is flexible macromolecule block and those grooves, therefore this projection directly can be pressed on the connection pad of a glass substrate, and do not need to use anisotropy conductive film (ACF), to reduce costs.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to technological means of the present invention can be better understood, and can be implemented according to the content of specification, and can become apparent to allow above and other objects of the present invention, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of existing known projection cube structure.
Fig. 2 is according to a preferred embodiment of the present invention, a kind of stereogram of projection cube structure.
Fig. 3 is the three-dimensional exploded view according to this projection cube structure of the present invention.
Fig. 4 A to Fig. 4 L is according to a preferred embodiment of the present invention, a kind of three-dimensional cutaway view of bump technology.
Fig. 5 A to Fig. 5 L is according to a preferred embodiment of the present invention, the schematic cross-section of this bump technology.
Fig. 6 is that contact is engaged in the end view of this projection cube structure according to a preferred embodiment of the present invention.
10: golden projection cube structure
11: Underbump metallization layer 12: golden bump layer
20: silicon substrate 21: weld pad
22: protective layer 23: opening
100: projection cube structure
110: the first macromolecule block 111: the first upper surfaces
111a: the first area of coverage 111b: the first appears district
112: the first engaging grooves
120: the second macromolecule block 121: the second upper surfaces
121a: the second area of coverage 121b: the second appears district
122: the second engaging grooves
130: the first grooves
140: Underbump metallization layer 141: the second groove
142: the three engaging groove 143: the four engaging grooves
150: bonding metallic layer 151: the three groove
152: the five engaging groove 153: the six engaging grooves
200: support plate 210: weld pad
220: protective layer 221: opening
300: macromolecule layer 310: macromolecular convex
400: the first light shields
500: photoresist layer 510: opening
600: the second light shields
700: contact 710: lower surface
W1: the first width W 2: the second width
W3: the three width
Embodiment
For further setting forth the present invention for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to the projection cube structure proposed according to the present invention and its embodiment of technique, method, step, structure, feature and effect thereof, be described in detail as follows.
Refer to Fig. 2 and Fig. 3, it is a preferred embodiment of the present invention, a kind of projection cube structure 100 its be arranged on a support plate 200, this support plate 200 has multiple weld pad 210 and a protective layer 220, this protective layer 220 has multiple opening 221, those openings 221 manifest those weld pads 210, this projection cube structure 100 and respectively this weld pad 210 are electrically connected, this projection cube structure 100 includes one first macromolecule block 110, one second macromolecule block 120, one first groove 130, one Underbump metallization layer 140 and a bonding metallic layer 150, wherein this first macromolecule block 110 and the second macromolecule block 120 are respectively an independently block, this first groove 130 is between this first macromolecule block 110 and this second macromolecule block 120, and this first groove 130 manifests this weld pad 210, this the first macromolecule block 110 and the second macromolecule block 120 lay respectively at two sides of this first groove 130, refer to Fig. 3 and Fig. 5 E, this the first macromolecule block 110 and the second macromolecule block 120 are arranged on this weld pad 210 and this protective layer 220, it is recessed in the first engaging groove 112 of this first upper surface 111 that this first macromolecule block 110 has one first upper surface 111 and, the definition of this first upper surface 111 has one first area of coverage 111a and 1 first to appear district 111b, in an embodiment, this first appears district 111b for " recessed " shape, it is recessed in the second engaging groove 122 of this second upper surface 121 that this second macromolecule block 120 has one second upper surface 121 and, the definition of this second upper surface 121 has one second area of coverage 121a and 1 second to appear district 121b, in an embodiment, this second appears district 121b for " recessed " shape, wherein this first engaging groove 112 of this first macromolecule block 110 and this second engaging groove 122 of this second macromolecule block 120 are communicated with this first groove 130, this Underbump metallization layer 140 (UBM) covers this weld pad 210, this first area of coverage 111a, this first engaging groove 112, this second area of coverage 121a and this second engaging groove 122, and manifest this first macromolecule block 110 this first appear district 111b and this second macromolecule block 120 this second appear district 121b, wherein this Underbump metallization layer 140 is formed with one second groove 141, one the 3rd engaging groove 142 and one the 4th engaging groove 143, 3rd engaging groove 142 and the 4th engaging groove 143 are communicated with this second groove 141, this second groove 141 is positioned at above this first groove 130, 3rd engaging groove 142 is positioned at above this first engaging groove 112, 4th engaging groove 143 is positioned at above this second engaging groove 122, the material of this Underbump metallization layer 140 can be titanizing tungsten/gold (TiW/Au), this bonding metallic layer 150 covers this Underbump metallization layer 140, the material of this bonding metallic layer 150 can be gold (Au), wherein this first macromolecule block 110 is stepped with this bonding metallic layer 150, and this second macromolecule block 120 is also stepped with this bonding metallic layer 150, this bonding metallic layer 150 is also formed with one the 3rd groove 151, one the 5th engaging groove 152 and one the 6th engaging groove 153, 5th engaging groove 152 and the 6th engaging groove 153 are communicated with the 3rd groove 151, in the present embodiment, 3rd groove 151, 5th engaging groove 152 and the 6th engaging groove 153 form one "+" connected in star, wherein, 3rd groove 151 is positioned at above this second groove 141, 5th engaging groove 152 is positioned at above the 3rd engaging groove 142, 6th engaging groove 153 is positioned at above the 4th engaging groove 143, 3rd groove 151 has one first width W 1, 5th engaging groove 152 has one second width W 2, 6th engaging groove 152 has one the 3rd width W 3, this first width W 1 is greater than this second width W 2, and this first width W 1 is greater than the 3rd width W 3.
Refer to Fig. 4 A to Fig. 4 L and Fig. 5 A to Fig. 5 L; its technique being this projection cube structure 100 of the present invention; comprise the following step; first; refer to Fig. 4 A and Fig. 5 A, provide a support plate 200, it has multiple weld pad 210 and a protective layer 220; this protective layer 220 has multiple opening 221, and those openings 221 manifest those weld pads 210.Afterwards, refer to Fig. 4 B and Fig. 5 B, this support plate 200 is formed a macromolecule layer 300, this macromolecule layer 300 covers this protective layer 220 and those weld pads 210.Then, refer to Fig. 4 C and Fig. 5 C, one first light shield 400 is provided and carries out first time step of exposure.Afterwards, refer to Fig. 4 D and Fig. 5 D, remove this first light shield 400 and carry out first time development step, multiple macromolecular convex 310 is formed to make this macromolecule layer 300, and the corresponding weld pad 210 of each macromolecular convex 310, respectively this macromolecular convex 310 includes one first macromolecule block 110, one second macromolecule block 120 and one first groove 130, this the first macromolecule block 110 and this second macromolecule block 120 are respectively an independently block, it lays respectively at two sides of this first groove 130, this first groove 130 manifests this weld pad 210, and this first macromolecule block 110 and this second macromolecule block 120 are arranged on this weld pad 210 and this protective layer 220, refer to Fig. 4, it is recessed in the first engaging groove 112 of this first upper surface 111 that this first macromolecule block 110 has one first upper surface 111 and, the definition of this first upper surface 111 has one first area of coverage 111a and 1 first to appear district 111b, in an embodiment, this first appears district 111b for " recessed " shape, it is recessed in the second engaging groove 122 of this second upper surface 121 that this second macromolecule block 120 has one second upper surface 121 and, the definition of this second upper surface has one second area of coverage 121a and 1 second to appear district 121b, in an embodiment, this second appears district 121b for " recessed " shape, wherein this first engaging groove 112 of this first macromolecule block 110 and this second engaging groove 122 of this second macromolecule block 120 are communicated with this first groove 130.Then, refer to Fig. 4 E and Fig. 5 E, solidify those macromolecular convex 310.Afterwards, refer to Fig. 4 F and Fig. 5 F, this support plate 200 is formed a Underbump metallization layer 140 (UBM), this Underbump metallization layer 140 covers this protective layer 220, this weld pad 210, this the first macromolecule block 110 and this second macromolecule block 120, refer to Fig. 4 D and Fig. 4 F, wherein this Underbump metallization layer 140 is formed with one second groove 141, one the 3rd engaging groove 142 and one the 4th engaging groove 143, 3rd engaging groove 142 and the 4th engaging groove 143 are communicated with this second groove 141, this second groove 141 is positioned at above this first groove 130, 3rd engaging groove 142 is positioned at above this first engaging groove 112, 4th engaging groove 143 is positioned at above this second engaging groove 122.Then, refer to Fig. 4 G and Fig. 5 G, this Underbump metallization layer is formed a photoresist layer 500.Afterwards, refer to Fig. 4 H and Fig. 5 H, one second light shield 600 is provided and carries out second time step of exposure.Then, refer to Fig. 4 I and Fig. 5 I, remove this second light shield 600 and carry out second development step, multiple opening 510 is formed to make this photoresist layer 500, respectively this opening 510 correspondence respectively this macromolecular convex 310, and each this opening 510 manifest this Underbump metallization layer 140 being arranged in respectively this opening 510.Afterwards, refer to Fig. 4 J and Fig. 5 J, a bonding metallic layer 150 is formed in those openings 510, this bonding metallic layer 150 covers this Underbump metallization layer 140 appeared by those openings 510, wherein this bonding metallic layer 150 is formed with one the 3rd groove 151, one the 5th engaging groove 152 and one the 6th engaging groove 153, 5th engaging groove 152 and the 6th engaging groove 153 are communicated with the 3rd groove 151, refer to Fig. 3, 3rd groove 151 is positioned at above this second groove 141, 5th engaging groove 152 is positioned at above the 3rd engaging groove 142, 6th engaging groove 153 is positioned at above the 4th engaging groove 143.Then, refer to Fig. 4 K and Fig. 5 K, remove this photoresist layer 500, to appear not by this Underbump metallization layer 140 that this bonding metallic layer 150 covers.Finally, refer to Fig. 4 L, Fig. 5 L and Fig. 3, remove not by this Underbump metallization layer 140 that this bonding metallic layer 150 covers, this weld pad 210 is only covered to make this Underbump metallization layer 140, this first area of coverage 111a, this first engaging groove 112, this second area of coverage 121a, this second engaging groove 122 and this first groove 130, and manifest this first macromolecule block 110 this first appear district 111b and this second macromolecule block 120 this second appear district 121b, in an embodiment, this first appears district 111b and this second appears district 121b for " recessed " shape, and this first macromolecule block 110, this the second macromolecule block 120 is stepped with this bonding metallic layer 150.
Refer to Fig. 6, when this projection cube structure 100 of the present invention engages (eutectic bonding) with contact 700 (as connection gasket or the pin) eutectic of another electronic building brick, touched this bonding metallic layer 140 being incorporated into this projection cube structure 100 of a lower surface 710 of this contact 700, and a part for this contact 700 embeds the 3rd groove 151 of this bonding metallic layer 150, in 5th engaging groove 152 and the 6th engaging groove 153, it can increase the contact area of this projection cube structure 100 and this contact 700, and the eutectic reliability of this contact 700 and this projection cube structure 100 can be improved, and the part due to this contact 700 embeds in this bonding metallic layer 150 the 5th engaging groove 152 and the 6th engaging groove 153, therefore can avoid this contact 700 that the situation of skew occurs, in addition due to this projection cube structure 100 with this first macromolecule block 110 and the second macromolecule block 120 for base material, therefore plated material cost can be saved.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (15)
1. a projection cube structure, it is characterized in that it is arranged on a support plate, this support plate has multiple weld pad and a protective layer; this protective layer has multiple opening; those openings manifest those weld pads, and this projection cube structure and respectively this weld pad are electrically connected, and this projection cube structure includes:
One first macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this first macromolecule block has one first upper surface and recessed in the first engaging groove of this first upper surface, and the definition of this first upper surface has one first area of coverage and one first to appear district;
One second macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this second macromolecule block has one second upper surface and recessed in the second engaging groove of this second upper surface, and the definition of this second upper surface has one second area of coverage and one second to appear district;
One first groove, it is between this first macromolecule block and this second macromolecule block, and this first groove manifests this weld pad, and this first engaging groove of this first macromolecule block and this second engaging groove of this second macromolecule block are communicated with this first groove;
One Underbump metallization layer, it covers this weld pad, this first area of coverage, this first engaging groove, this second area of coverage and this second engaging groove, and manifest this first macromolecule block this first appear district and this second macromolecule block this second appear district, wherein this Underbump metallization layer is formed with one second groove, one the 3rd engaging groove and one the 4th engaging groove, 3rd engaging groove and the 4th engaging groove are communicated with this second groove, this second groove is positioned at above this first groove, 3rd engaging groove is positioned at above this first engaging groove, 4th engaging groove is positioned at above this second engaging groove, and
One bonding metallic layer, it covers this Underbump metallization layer, and be formed with one the 3rd groove, one the 5th engaging groove and one the 6th engaging groove, 5th engaging groove and the 6th engaging groove are communicated with the 3rd groove, 3rd groove is positioned at above this second groove, 5th engaging groove is positioned at above the 3rd engaging groove, and the 6th engaging groove is positioned at above the 4th engaging groove.
2. projection cube structure as claimed in claim 1, is characterized in that this first appears district for " recessed " shape.
3. projection cube structure as claimed in claim 2, is characterized in that this second appears district for " recessed " shape.
4. projection cube structure as claimed in claim 1, is characterized in that the 3rd groove, the 5th engaging groove and the 6th engaging groove are "+" shape.
5. projection cube structure as claimed in claim 4, it is characterized in that the 3rd groove has one first width, the 5th engaging groove has one second width, and this first width is greater than this second width.
6. projection cube structure as claimed in claim 5, it is characterized in that the 6th engaging groove has one the 3rd width, this first width is greater than the 3rd width.
7. projection cube structure as claimed in claim 1, it is characterized in that this first macromolecule block and this bonding metallic layer stepped.
8. projection cube structure as claimed in claim 7, it is characterized in that this second macromolecule block and this bonding metallic layer stepped.
9. a bump technology, is characterized in that comprising the following step:
There is provided a support plate, it has multiple weld pad and a protective layer, and this protective layer has multiple opening, and those openings manifest those weld pads;
This support plate is formed a macromolecule layer, and this macromolecule layer covers this protective layer and those weld pads;
One first light shield is provided and carries out first time step of exposure;
Remove this first light shield and carry out first time development step, to make this macromolecule layer be formed with multiple macromolecular convex, and the corresponding weld pad of each macromolecular convex, respectively this macromolecular convex includes:
One first macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this first macromolecule block has one first upper surface and recessed in the first engaging groove of this first upper surface, and the definition of this first upper surface has one first area of coverage and one first to appear district;
One second macromolecule block, it is an independently block, it is arranged on this weld pad and this protective layer, and this second macromolecule block has one second upper surface and recessed in the second engaging groove of this second upper surface, and the definition of this second upper surface has one second area of coverage and one second to appear district; And
One first groove, it is between this first macromolecule block and this second macromolecule block, and this first groove manifests this weld pad, and this first engaging groove of this first macromolecule block and this second engaging groove of this second macromolecule block are communicated with this first groove;
Solidify those macromolecular convex;
This support plate is formed a Underbump metallization layer, this Underbump metallization layer covers this protective layer, this weld pad, this first macromolecule block and this second macromolecule block, wherein this Underbump metallization layer is formed with one second groove, one the 3rd engaging groove and one the 4th engaging groove, 3rd engaging groove and the 4th engaging groove are communicated with this second groove, this second groove is positioned at above this first groove, 3rd engaging groove is positioned at above this first engaging groove, and the 4th engaging groove is positioned at above this second engaging groove;
This Underbump metallization layer forms a photoresist layer;
One second light shield is provided and carries out second time step of exposure;
Remove this second light shield and carry out second development step, to make this photoresist layer be formed with multiple opening, respectively this opening correspondence respectively this macromolecular convex, and each this opening manifest this Underbump metallization layer being arranged in respectively this opening;
A bonding metallic layer is formed in those openings, it covers this Underbump metallization layer appeared by those openings, wherein this bonding metallic layer is formed with one the 3rd groove, one the 5th engaging groove and one the 6th engaging groove, 5th engaging groove and the 6th engaging groove are communicated with the 3rd groove, 3rd groove is positioned at above this second groove, 5th engaging groove is positioned at above the 3rd engaging groove, and the 6th engaging groove is positioned at above the 4th engaging groove;
Remove this photoresist layer, to appear not by this Underbump metallization layer that this bonding metallic layer covers; And
Remove not by this Underbump metallization layer that this bonding metallic layer covers, to make this Underbump metallization layer only cover this weld pad, this first area of coverage, this first engaging groove, this second area of coverage, this second engaging groove and this first groove, and manifest this first macromolecule block this first appear district and this second macromolecule block this second appear district.
10. bump technology as claimed in claim 9, is characterized in that in the step removing this Underbump metallization layer do not covered by this bonding metallic layer, and this first appears district and this second appears district for " recessed " shape.
11. bump technology as claimed in claim 9, is characterized in that being formed in the step of this bonding metallic layer in those openings, and the 3rd groove, the 5th engaging groove and the 6th engaging groove are "+" shape.
12. bump technology as claimed in claim 9, it is characterized in that being formed in the step of this bonding metallic layer in those openings, the 3rd groove has one first width, and the 5th engaging groove has one second width, and this first width is greater than this second width.
13. bump technology as claimed in claim 12, is characterized in that being formed in the step of this bonding metallic layer in those openings, and the 6th engaging groove has one the 3rd width, and this first width is greater than the 3rd width.
14. bump technology as claimed in claim 9, is characterized in that in the step removing this Underbump metallization layer do not covered by this bonding metallic layer, this first macromolecule block and this bonding metallic layer stepped.
15. bump technology as claimed in claim 14, is characterized in that in the step removing this Underbump metallization layer do not covered by this bonding metallic layer, this second macromolecule block and this bonding metallic layer stepped.
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| CN201110130330.9A CN102790035B (en) | 2011-05-17 | 2011-05-17 | Bump structure and process |
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| CN201110130330.9A CN102790035B (en) | 2011-05-17 | 2011-05-17 | Bump structure and process |
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Citations (4)
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|---|---|---|---|---|
| JP2001085560A (en) * | 1999-09-13 | 2001-03-30 | Sharp Corp | Semiconductor device and manufacture thereof |
| CN1585122A (en) * | 2004-06-04 | 2005-02-23 | 友达光电股份有限公司 | Composite scab structure and producing method thereof |
| CN101266936A (en) * | 2008-04-30 | 2008-09-17 | 日月光半导体制造股份有限公司 | Making process for protruding block |
| CN101567348A (en) * | 2008-04-21 | 2009-10-28 | 南茂科技股份有限公司 | Wafer structure with convex lumps and forming method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW498510B (en) * | 2001-06-05 | 2002-08-11 | Chipbond Technology Corp | Metallized surface wafer level package structure |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085560A (en) * | 1999-09-13 | 2001-03-30 | Sharp Corp | Semiconductor device and manufacture thereof |
| CN1585122A (en) * | 2004-06-04 | 2005-02-23 | 友达光电股份有限公司 | Composite scab structure and producing method thereof |
| CN101567348A (en) * | 2008-04-21 | 2009-10-28 | 南茂科技股份有限公司 | Wafer structure with convex lumps and forming method thereof |
| CN101266936A (en) * | 2008-04-30 | 2008-09-17 | 日月光半导体制造股份有限公司 | Making process for protruding block |
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