CN102771198B - 用于印刷种层的组合物以及制备导线的方法 - Google Patents
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- CN102771198B CN102771198B CN201180009446.5A CN201180009446A CN102771198B CN 102771198 B CN102771198 B CN 102771198B CN 201180009446 A CN201180009446 A CN 201180009446A CN 102771198 B CN102771198 B CN 102771198B
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- SMWWQUDLEJXCHT-UHFFFAOYSA-N propa-1,2-dienyl acetate Chemical compound CC(=O)OC=C=C SMWWQUDLEJXCHT-UHFFFAOYSA-N 0.000 description 1
- 235000018102 proteins Nutrition 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10153750 | 2010-02-16 | ||
| EP10153750.4 | 2010-02-16 | ||
| PCT/IB2011/050577 WO2011101777A1 (fr) | 2010-02-16 | 2011-02-11 | Composition pour l'impression d'une couche d'ensemencement et procédé pour la production de pistes conductrices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102771198A CN102771198A (zh) | 2012-11-07 |
| CN102771198B true CN102771198B (zh) | 2016-07-06 |
Family
ID=44482489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180009446.5A Expired - Fee Related CN102771198B (zh) | 2010-02-16 | 2011-02-11 | 用于印刷种层的组合物以及制备导线的方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2537401A1 (fr) |
| KR (1) | KR20120137481A (fr) |
| CN (1) | CN102771198B (fr) |
| WO (1) | WO2011101777A1 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517964B (zh) | 2011-05-10 | 2018-05-18 | 巴斯夫欧洲公司 | 新型颜色转换器 |
| EP2718395B1 (fr) | 2011-06-10 | 2018-02-28 | Basf Se | Nouveau dispositif d'éclairage comportant un convertisseur de couleurs |
| DE102011117573A1 (de) | 2011-10-28 | 2013-05-02 | Humboldt-Universität Zu Berlin | Verfahren und Einrichtung zum nichtinvasiven Überwachen von Schmerzstärken und zur Ermittlung von Narkosetiefen während medizinischer Eingriffe |
| US10878976B2 (en) | 2015-06-19 | 2020-12-29 | Hamilton Sundstrand Corporation | Composites and methods of making composite materials |
| KR101940238B1 (ko) * | 2015-10-01 | 2019-01-21 | 한국전자통신연구원 | 금속 스탬프 제조 방법 |
| EP4103422A1 (fr) * | 2020-02-10 | 2022-12-21 | Deiana, Roberto | Production de commandes tactiles en plastique au moyen de couches conductrices gravées au laser |
| CN112071935B (zh) * | 2020-09-04 | 2022-02-01 | 复旦大学 | 一种基于太阳能的三维集成系统及制备方法 |
| DE102020007607A1 (de) * | 2020-12-11 | 2022-06-15 | Giesecke+Devrient Currency Technology Gmbh | Leitfähige Folie, Verfahren zum Herstellen derselben und Verwendung |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5725807A (en) * | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
| CN101584258A (zh) * | 2007-01-19 | 2009-11-18 | 巴斯夫欧洲公司 | 制备结构化导电表面的方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008015167A1 (fr) * | 2006-08-03 | 2008-02-07 | Basf Se | Dispersion pour appliquer une couche métallique |
| EP2163146A2 (fr) * | 2007-05-24 | 2010-03-17 | Basf Se | Procédé de réalisation de feuilles de métal à revêtement polymère et leur utilisation |
| CN101970720B (zh) * | 2008-03-13 | 2014-10-15 | 巴斯夫欧洲公司 | 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物 |
-
2011
- 2011-02-11 KR KR1020127024135A patent/KR20120137481A/ko not_active Application Discontinuation
- 2011-02-11 WO PCT/IB2011/050577 patent/WO2011101777A1/fr active Application Filing
- 2011-02-11 EP EP11744336A patent/EP2537401A1/fr not_active Withdrawn
- 2011-02-11 CN CN201180009446.5A patent/CN102771198B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5725807A (en) * | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
| CN101584258A (zh) * | 2007-01-19 | 2009-11-18 | 巴斯夫欧洲公司 | 制备结构化导电表面的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102771198A (zh) | 2012-11-07 |
| WO2011101777A1 (fr) | 2011-08-25 |
| EP2537401A1 (fr) | 2012-12-26 |
| KR20120137481A (ko) | 2012-12-21 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20170211 |