WO2011101777A1 - Composition pour l'impression d'une couche d'ensemencement et procédé pour la production de pistes conductrices - Google Patents

Composition pour l'impression d'une couche d'ensemencement et procédé pour la production de pistes conductrices Download PDF

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Publication number
WO2011101777A1
WO2011101777A1 PCT/IB2011/050577 IB2011050577W WO2011101777A1 WO 2011101777 A1 WO2011101777 A1 WO 2011101777A1 IB 2011050577 W IB2011050577 W IB 2011050577W WO 2011101777 A1 WO2011101777 A1 WO 2011101777A1
Authority
WO
WIPO (PCT)
Prior art keywords
composition
weight
seed layer
substrate
printing
Prior art date
Application number
PCT/IB2011/050577
Other languages
English (en)
Inventor
Stephan Hermes
Sorin Ivanovici
Original Assignee
Basf Se
Basf (China Company Limited)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se, Basf (China Company Limited) filed Critical Basf Se
Priority to KR1020127024135A priority Critical patent/KR20120137481A/ko
Priority to CN201180009446.5A priority patent/CN102771198B/zh
Priority to EP11744336A priority patent/EP2537401A1/fr
Publication of WO2011101777A1 publication Critical patent/WO2011101777A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/003—Presence of polyurethane in the primer coating

Definitions

  • composition for printing a seed layer and process for producing conductor tracks Description
  • the invention relates to a composition for printing a seed layer for electrodeposition or electroless deposition of a metal for the production of full-area or structured metallic surfaces on a substrate.
  • the invention further relates to a process for producing full- area or structured metallic surfaces on a substrate.
  • inventive composition and the process are suitable, for example, for producing conductor tracks on printed circuit boards, RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, film conductors, conductor tracks on solar cells or for LCD or plasma visual display units, 3D molded interconnect devices, integrated circuits, resistive, capacitative or inductive elements, diodes, transistors, sensors, actuators, optical components, receiver/transmitter devices, decorative or functional surfaces on products which are used for shielding of electromagnetic radiation, for conduction of heat or as packaging, thin metal foils or single- or double-sidedly laminated polymer supports.
  • the object is achieved by a composition for printing a seed layer for electrodeposition or electroless deposition of a metal for the production of full-area or structured metallic surfaces on a substrate, comprising 0.1 to 6% by weight of electrolessly and/or electrolytically coatable particles, 40 to 98.8% by weight of at least one solvent, 0 to 15% by weight of a crosslinker, 0.1 to 6% by weight of at least one dispersing additive, 0 to 5% by weight of at least one further additive and 1 to 20% by weight of at least one polymer, said at least one polymer being in the form of a dispersion.
  • the inventive composition forms a porous seed layer on the substrate to be coated, such that there is stable adhesion of the metallic surface on the seed layer. This is attributable especially to the fact that the metal of the metallic surface penetrates into the pores of the seed layer, thus resulting, in addition to the chemical adhesion, in mechanical interlinkage between seed layer and the metal of the metallic surface.
  • the electrolessly and/or electrolytically coatable particles have, in at least one direction, a dimension which differs from the dimension in the other directions.
  • the electrolessly and/or electrolytically coatable particles present in the composition are electrically conductive especially in the case of use of the composition for producing conductor tracks on printed circuit boards.
  • the electrolessly and/or electrolytically coatable particles are carbon nanotubes or graphenes.
  • the use of carbon nanotubes or graphenes gives rise to a structure of the seed layer in which the individual carbon nanotubes or graphenes are matted together, thus forming a kind of fleece structure.
  • the mechanical interlinkage of the carbon nanotubes or graphenes achieves particularly stable adhesion of seed layer and metal of the metallic surface.
  • the proportion of electrolessly and/or electrolytically coatable particles in the composition is, in accordance with the invention, in the range from 0.1 to 6% by weight.
  • the proportion of electrolessly and/or electrolytically coatable particles is preferably in the range from 0.5 to 2% by weight and especially in the range from 1 to 1 .5% by weight.
  • the at least one polymer present in the composition is not soluble in the solvent.
  • the polymer is therefore in the form of small particles dispersed in the solvent. Owing to the presence of the polymer in the form of small particles in the solvent, the drying of the seed layer after the application by printing does not give rise to a homogeneous layer, and there is instead formation of the pores needed for interlinkage with the metal of the metallic surface.
  • suitable solvents in which the at least one polymer is not soluble include water, hydrocarbons such as pentane, hexane, heptane or octane, and esters, ketones, aldehydes, alcohols or glycols, and mixtures thereof.
  • the solvent is more preferably water.
  • the proportion of solvent in the composition is in the range from 40 to 98.8% by weight.
  • the proportion of solvent is preferably in the range from 72 to 93.6% by weight and especially in the range from 83.5 to 91 .4% by weight.
  • the proportion of polymer in the composition is in the range from 1 to 20% by weight, preferably in the range from 4 to 10% by weight and especially in the range from 5 to 8% by weight.
  • suitable polymers include acrylonitrile-butadiene-styrene (ABS); acrylonitrile-styrene-acrylate (ASA); acrylated acrylates; alkyl resins; alkylvinyl acetates; alkylene-vinyl acetate copolymers, especially methylene-vinyl acetate, ethylene-vinyl acetate, butylene-vinyl acetate; alkylene-vinyl chloride copolymers; amino resins; aldehyde and ketone resins; cellulose and cellulose derivatives, in particular hydroxyalkylcellulose, cellulose esters, such as acetates, propionates, butyrates, carboxyalkylcelluloses, cellulose nitrate; epoxy acrylates; epoxy resins; modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolak resins, brominated epoxy resins, cycloaliphatic epoxy resins;
  • Particularly preferred polymers are acrylates, cellulose derivatives, methacrylates, methacrylate resins, melamine and amino resins, polyalkylenes, polyimides, epoxy resins, polyurethanes, polyesters, polyvinyl acetals, polyvinyl acetates, polystyrenes, polystyrene copolymers, polystyrene acrylates, styrene-butadiene block copolymers, alkylene-vinyl acetate and vinyl chloride copolymers, polyamides and copolymers thereof.
  • Very particularly preferred polymers are polyurethanes and polyacrylates, and copolymers thereof.
  • dispersing additives are also present in the composition.
  • the proportion of dispersing additives is in the range from 0.1 to 6% by weight, preferably in the range from 0.3 to 3% by weight and especially in the range from 0.5 to 1 % by weight.
  • dispersing additives known to those skilled in the art for use in dispersions and described in the prior art are suitable.
  • Preferred dispersing additives are surfactants or surfactants mixtures, for example anionic, cationic, amphoteric or nonionic surfactants.
  • Cationic and anionic surfactants are described, for example, in “Encyclopedia of Polymer Science and Technology”, J. Wiley & Son (1966), Vol. 5, pages 816-818, and in “Emulsion Polymerisation and Emulsion Polymers", editors P. Lovell and M. El-Aasser, Wiley & Sons publishers (1997), pages 224-226.
  • crosslinker In addition to the polymer dispersion, it is also possible for a crosslinker to be present in the composition. This improves the film properties and affects adhesion, chemical resistance and mechanical strength.
  • the proportion of crosslinker in the dispersion is, for example, from 0 to 15% by weight, preferably in the range from 1 .5 to 10% by weight and especially in the range from 2 to 5% by weight.
  • suitable crosslinkers include (poly)isocyanates, (poly)aziridines, carbodiimides, MF (melamine-formaldehyde) resins, MF crosslinkers, metal complexes and adipic bishydrazides. Particular preference is given to MF crosslinkers.
  • further additives are present in the composition.
  • the proportion of further additives is in the range from 0 to 5% by weight, preferably in the range from 0.1 to 3% by weight and especially in the range from 0.1 to 1 % by weight.
  • an additive present may be a filler component.
  • This may consist of one or more fillers.
  • the filler component of the composition may comprise fibrous, layered or particulate fillers or mixtures thereof. They are preferably commercially available products, for example mineral fillers.
  • fillers or reinforcers such as glass powder, mineral fibers, whiskers, aluminum hydroxide, metal oxides such as aluminum oxide or iron oxide, mica, quartz flour, calcium carbonate, barium sulfate, titanium dioxide or wollastonite.
  • thixotropic agents such as silica, silicates, for example Aerosils or bentonites, or organic thixotropic agents and thickeners, for example polyacrylic acid, polyurethanes, hydrogenated castor oil, dyes, fatty acids, fatty acid amides, plasticizers, wetting agents, defoamers, lubricants, desiccants, photoinitiators, complexing agents, waxes, pigments or conductive polymer particles.
  • Further additives present in the composition may also be processing aids and stabilizers, such as UV stabilizers, lubricants, corrosion inhibiters and flame retardants.
  • the proportions by mass of the individual components present in the composition are each based on the total mass of the composition.
  • the object is also achieved by a process for producing full-area or structured metallic surfaces on a substrate, which comprises the following steps: (a) printing the above-described composition onto the substrate according to a given pattern,
  • Suitable substrates to which the electrically conductive surface is applied are rigid or flexible substrates.
  • the substrate is preferably not electrically conductive. This means that the specific resistivity is more than 10 9 ohm ⁇ cm.
  • Suitable substrates are, for example, reinforced or unreinforced polymers as typically used for printed circuit boards.
  • Suitable polymers are epoxy resins, or modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, aramide-reinforced or glass fiber-reinforced or paper-reinforced epoxy resins (for example FR4), glass fiber-reinforced polymers, liquid crystal polymers (LCP), polyphenylene sulfides (PPS), polyoxymethylenes (POM), polyaryl ether ketones (PAEK), polyether ether ketones (PEEK), polyamides (PA), polycarbonates (PC), polybutylene terephthalates (PBT), polyethylene terephthalates (PET), polyimides (PI), polyimide resins, cyanate esters, bismaleimide- triazine resins, nylon, vinyl ester resins, polyesters, polyester resins, polyanilines, phenol resins, polypyrrols, polyethylene naphthalate (PEN), polymethyl methacrylate, poly
  • the substrates used may also be all polymers which are present in the composition and have been listed above. Also suitable are other substrates likewise customary in the printed circuit board industry.
  • suitable substrates are composite materials, foam-type polymers, Styropor ® , Styrodur ® , polyurethanes (PU), ceramic surfaces, textiles, paperboard, cardboard, paper, polymer-coated paper, wood, mineral materials, silicon, glass, plant tissue and animal tissue.
  • the above-described composition is printed onto the substrate according to a given pattern.
  • the composition can be printed on by any desired printing process known to those skilled in the art. Suitable printing process are, for example, offset printing processes, laser printing processes, flexographic printing processes, gravure printing processes, screen printing processes, pad printing processes and inkjet printing processes. Particular preference is given to printing the composition on by screen printing processes and gravure printing processes.
  • the composition is dried and/or cured to form a seed layer.
  • the composition can be dried and/or cured under ambient conditions or else at elevated temperature.
  • the composition is preferably dried and/or cured at elevated temperatures.
  • the temperature at which the composition is dried and/or cured is preferably in the range from 30 to 200°C, preferably in the range from 50 to 160°C, more preferably in the range from 60 to 120°C.
  • an elevated temperature at which the composition is dried to form the seed layer it is also possible to partly cure the composition.
  • this is accomplished, for example, by reaction of heat, light, for example UV radiation or visible light, and/or radiation, for example infrared radiation, electron beams, gamma radiation, X-radiation or microwaves.
  • light for example UV radiation or visible light
  • radiation for example infrared radiation, electron beams, gamma radiation, X-radiation or microwaves.
  • a suitable activator for example by combination of UV radiation and heat.
  • the combination of the curing processes may be performed simultaneously or successively.
  • the UV radiation can at first only partly cure the composition to form the seed layer, such that the structures formed are not destroyed by free flow. Thereafter, thermal action can cure the seed layer. The thermal action may directly follow the UV curing and/or the electrolytic metallization.
  • the primer may be applied over the whole substrate.
  • the primer it is preferred when the primer is applied to the surface of the substrate with the same structure with which the composition is also printed onto the surface. In this way, the primer is printed onto the substrate only at the sites which are also printed with the composition.
  • a primer can likewise be applied by a printing process, for example the same printing process with which the composition is also printed on to form the seed layer. If the primer has been applied over the whole surface, however, any desired coating process is also possible, examples being curtain coating, dipping processes or brush application of the primer.
  • Suitable primers are all systems known to those skilled in the art, which should be matched to the particular substrate. Examples are polyurethanes, PVC, (poly)isocyanates, PVA, polyesters, PVB and copolymers thereof, and mixtures of these types.
  • the metal which is applied to the seed layer by electroless and/or electrolytic deposition is preferably copper, silver, gold, nickel, palladium, platinum, tin or chromium.
  • the thicknesses of the layer applied by the electroless and/or electrolytic deposition of the metal are within customary ranges known to those skilled in the art.
  • Suitable electrolyte solutions which can be used for application of the metal layer by electroless and/or electrolytic deposition are known to those skilled in the art, for example, from Werner Jillek, Gustl Keller, Handbuch der Porterplattentechnik [Handbook of Printed Circuit Board Technology], Eugen G. Leuze Verlag, 2003, Vol. 4, pages 332-352.
  • electroless and/or electrolytic deposition of the metal to the seed layer to produce the full-area or structured metallic surface it is possible to use any desired suitable process known to those skilled in the art for electroless deposition or for electrolytic deposition of a metal.
  • the process according to the invention is suitable, for example, for production of conductor tracks on printed circuit boards.
  • printed circuit boards are, for example, those with multilayer inner and outer layers, micro-via chips on board and flexible and rigid printed circuit boards. These are incorporated, for example, into products such as computers, telephones, televisions, electrical automobile components, keyboards, radios, video, CD, CD-ROM and DVD players, games consoles, measurement and regulating instruments, sensors, electrical kitchen appliances, electric toys, etc.
  • the process according to the invention can also produce electrically conductive structures on flexible circuit carriers.
  • Such flexible circuit carriers are, for example, polymer films of the materials mentioned above for the substrate, on which electrically conductive structures have been applied.
  • the process according to the invention is also suitable for production of RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, film conductors, conductor tracks in solar cells or LCD or plasma visual display units, capacitors, film capacitors, resistors, convectors, electrical fuses, or for production of electrolytically coated products in any desired form, for example single- or double-sidedly metal-laminated polymer carriers with defined layer thickness, or else for production of decorative or functional surfaces on products which are used, for example, for shielding electromagnetic radiation, for conduction of heat or as packaging.
  • the process according to the invention can equally produce integrated circuits, resistive, capacitative or inductive elements, diodes, transistors, sensors, actuators, optical components and receiver/transmitter devices.
  • antennas with contacts for organic electronic components and coatings on surfaces consisting of electrically nonconductive materials for electromagnetic screening. Use is additionally possible in the sector of flow fields of bipolar plates for use in fuel cells.
  • the fields of use of the process according to the invention and of the inventive composition enable stable production of metallized substrates which are themselves nonconductive, especially for use as switches and sensors, gas barriers or decorative parts, especially decorative parts for the motor vehicle, sanitary, toy, domestic and office sector, and also packaging and foils/films.
  • the invention may also find use in the field of security printing for banknotes, credit cards, identification papers, etc.
  • Textiles can be functionalized electrically and magnetically with the aid of the process according to the invention, for example by application of antennas, transmitters, RFID and transponder antennas, sensors, heating elements, antistatic systems (on plastics), shields, etc.
  • Preferred uses of the inventive composition and of the metallic surfaces produced by the inventive composition are those in which the products are used as a printed circuit board, RFID antenna, transponder antenna, seat heater, flat cable, contactless chip card, thin metal foil or single- or double-sidedly laminated polymer carriers, film conductors, conductor tracks on solar cells or in LCD or plasma visual display units, as integrated circuits, resistive, capacitative or inductive elements, diodes, transistors, sensors, actuators, optical components, receiver/transmitter devices, or in decorative applications, for example for packaging materials.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne une composition pour l'impression d'une couche d'ensemencement pour le dépôt électrolytique ou le dépôt autocatalytique d'un métal pour la production de surfaces métalliques à surface pleine ou structurées sur un substrat. La composition comporte entre 0,1 et 6% en poids de particules aptes à un revêtement autocatalytique et/ou électrolytique, entre 40 et 98,8% en poids d'au moins un solvant, entre 0 et 15% en poids d'un agent de réticulation, entre 0,1 et 6% en poids d'au moins un additif de dispersion, entre 0 et 5% en poids d'au moins un autre additif et entre 1 et 20% en poids d'au moins un polymère, ledit au moins un polymère étant sous la forme d'une dispersion. L'invention concerne également un procédé pour la production de surfaces métalliques à surface pleine ou structurées sur un substrat.
PCT/IB2011/050577 2010-02-16 2011-02-11 Composition pour l'impression d'une couche d'ensemencement et procédé pour la production de pistes conductrices WO2011101777A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127024135A KR20120137481A (ko) 2010-02-16 2011-02-11 시드 층을 인쇄하기 위한 조성물 및 전도체 트랙을 제조하기 위한 방법
CN201180009446.5A CN102771198B (zh) 2010-02-16 2011-02-11 用于印刷种层的组合物以及制备导线的方法
EP11744336A EP2537401A1 (fr) 2010-02-16 2011-02-11 Composition pour l'impression d'une couche d'ensemencement et procédé pour la production de pistes conductrices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10153750 2010-02-16
EP10153750.4 2010-02-16

Publications (1)

Publication Number Publication Date
WO2011101777A1 true WO2011101777A1 (fr) 2011-08-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/050577 WO2011101777A1 (fr) 2010-02-16 2011-02-11 Composition pour l'impression d'une couche d'ensemencement et procédé pour la production de pistes conductrices

Country Status (4)

Country Link
EP (1) EP2537401A1 (fr)
KR (1) KR20120137481A (fr)
CN (1) CN102771198B (fr)
WO (1) WO2011101777A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013060322A1 (fr) 2011-10-28 2013-05-02 Technische Universität Dresden Procédé et dispositif de surveillance non invasive et de détermination de l'intensité de la douleur et de la profondeur de l'anesthésie
US9406848B2 (en) 2011-06-10 2016-08-02 Basf Se Color converter
US9711665B2 (en) 2011-05-10 2017-07-18 Basf Se Color converters
CN112071935A (zh) * 2020-09-04 2020-12-11 复旦大学 一种基于太阳能的三维集成系统及制备方法
US10878976B2 (en) 2015-06-19 2020-12-29 Hamilton Sundstrand Corporation Composites and methods of making composite materials
WO2021161295A1 (fr) * 2020-02-10 2021-08-19 Deiana Roberto Production de commandes tactiles en plastique au moyen de couches conductrices gravées au laser
CN114630456A (zh) * 2020-12-11 2022-06-14 捷德货币技术有限责任公司 传导膜、其制造方法和用途

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101940238B1 (ko) * 2015-10-01 2019-01-21 한국전자통신연구원 금속 스탬프 제조 방법

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US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
WO2008015167A1 (fr) * 2006-08-03 2008-02-07 Basf Se Dispersion pour appliquer une couche métallique
WO2008142070A2 (fr) * 2007-05-24 2008-11-27 Basf Se Procédé de réalisation de feuilles de métal à revêtement polymère et leur utilisation
WO2009112573A2 (fr) * 2008-03-13 2009-09-17 Basf Se Procédé et dispersion pour l'application d'une couche métallique sur un substrat, et matière thermoplastique pour moulage métallisable
CN101584258A (zh) * 2007-01-19 2009-11-18 巴斯夫欧洲公司 制备结构化导电表面的方法

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
WO2008015167A1 (fr) * 2006-08-03 2008-02-07 Basf Se Dispersion pour appliquer une couche métallique
CN101584258A (zh) * 2007-01-19 2009-11-18 巴斯夫欧洲公司 制备结构化导电表面的方法
WO2008142070A2 (fr) * 2007-05-24 2008-11-27 Basf Se Procédé de réalisation de feuilles de métal à revêtement polymère et leur utilisation
WO2009112573A2 (fr) * 2008-03-13 2009-09-17 Basf Se Procédé et dispersion pour l'application d'une couche métallique sur un substrat, et matière thermoplastique pour moulage métallisable

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9711665B2 (en) 2011-05-10 2017-07-18 Basf Se Color converters
US9406848B2 (en) 2011-06-10 2016-08-02 Basf Se Color converter
US10230023B2 (en) 2011-06-10 2019-03-12 Basf Se Color converter
WO2013060322A1 (fr) 2011-10-28 2013-05-02 Technische Universität Dresden Procédé et dispositif de surveillance non invasive et de détermination de l'intensité de la douleur et de la profondeur de l'anesthésie
US10878976B2 (en) 2015-06-19 2020-12-29 Hamilton Sundstrand Corporation Composites and methods of making composite materials
US11657925B2 (en) 2015-06-19 2023-05-23 Hamilton Sundstrand Corporation Composites and methods of making composite materials
WO2021161295A1 (fr) * 2020-02-10 2021-08-19 Deiana Roberto Production de commandes tactiles en plastique au moyen de couches conductrices gravées au laser
CN112071935A (zh) * 2020-09-04 2020-12-11 复旦大学 一种基于太阳能的三维集成系统及制备方法
CN114630456A (zh) * 2020-12-11 2022-06-14 捷德货币技术有限责任公司 传导膜、其制造方法和用途
EP4013188A1 (fr) * 2020-12-11 2022-06-15 Giesecke+Devrient Currency Technology GmbH Feuille conductrice, son procédé de fabrication et utilisation

Also Published As

Publication number Publication date
CN102771198A (zh) 2012-11-07
CN102771198B (zh) 2016-07-06
EP2537401A1 (fr) 2012-12-26
KR20120137481A (ko) 2012-12-21

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