CN102738014B - Flip chip packaging method - Google Patents
Flip chip packaging method Download PDFInfo
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- CN102738014B CN102738014B CN 201110093946 CN201110093946A CN102738014B CN 102738014 B CN102738014 B CN 102738014B CN 201110093946 CN201110093946 CN 201110093946 CN 201110093946 A CN201110093946 A CN 201110093946A CN 102738014 B CN102738014 B CN 102738014B
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Abstract
The embodiment of the invention discloses a flip chip packaging method, comprising: bonding bumps of a chip with leads of a circuit substrate; and then carrying out glue coating around the chip. More specifically, the glue coating sequence is as follows: the glue coating is carried out along a clockwise direction or an anticlockwise direction of the perimeter of the chip; and at least a glue material is coated at one side of a first long edge of the chip firstly; and after the glue material oozes from the chip below, the glue material is coated at one side of a second long edge of the chip. According to the flip chip packaging method disclosed by the embodiment of the invention, the glue material is coated around the chip and the glue coating mode is controlled, so that defects of bubble occurrence, poor cladding performance and insufficient peeling strength and the like can be basically overcome. Moreover, because the glue material is coated among the bumps, the occurrence of short circuits among the bumps can be avoided. And meanwhile, the utilization of the mode of glue coating around the chip enables glue sealing efficiency to be enhanced to some extent; and it is unnecessary to wait for penetration of the glue material to the other side of the chip, thereby saving lots of time and thus shortening the glue sealing time.
Description
Technical field
The present invention relates to the integrated circuit encapsulation technology, relate in particular to a kind of crystal coated encapsulation method.
Background technology
Increase along with the integrated circuit closeness, the encapsulation technology of chip is also more and more diversified, because chip package technology (Flip Chip Interconnect Technology, abbreviation FC) has the long-pending advantages such as shortening signal transmission path that reaches of the chip packing-body of dwindling, be widely used in the chip encapsulation field at present, wherein directly attach the packaging body of forms such as encapsulation and multi-chip module encapsulation as chip size packages, chip, all can be beneficial to the purpose that the chip package technology reaches packaged chip.
The chip package technology is that naked crystalline substance (bar die) is engaged with substrate in surface mode down.Detailed process is, on the surface of chip a plurality of weld pads are set, and form projection (bump) at weld pad, afterwards chip is overturn, by technology such as hot pressings, circuit on a plurality of projections and the circuit base plate on the chip is electrically connected and mechanicalness is connected, afterwards can be by the internal wiring realization chip of circuit base plate and the electric connection of extraneous electronic installation.
In the LCD circuit encapsulation field, adopt at present more be coil type membrane of flip chip encapsulation (Chip on film, be called for short COF), this chip package technology is to adopt soft circuit base plate as the carrier of packaged chip, namely adopt soft circuit base plate as above-mentioned circuit base plate, by the hot pressing technology, the projection on the chip is engaged with the interior pin of soft circuit base plate afterwards.
Projection on the chip is with after the interior pin of soft circuit base plate is connected, for reliability consideration, also need in the gap of soft circuit base plate and chip, to insert primer, i.e. sealing, the stress that contact is suffered is dispersed to colloid, to reduce the suffered stress of contact, break thereby just can reduce contact, and suppress the extension break, to prolong the life-span of contact, be megohmite insulant owing to primer simultaneously, thereby can prevent between contact because existing impurity to cause the situation of projection short circuit.Because primer can effectively promote the reliability of joint, therefore in the chip package process, filling primer is a process of can not ignore.
The method of filling primer in the prior art is, at the one-sided gluing in the long limit of chip, rely on siphonage afterwards, namely utilize liquid formed capillary pressure of fine pore between chip and soft circuit base plate the interior pin on other limit of chip to be wrapped up, specifically as shown in Figure 1 as actuating force, but in actual production, find, owing to only at chip one side gluing, cause the zone on other three limits of chip to be risk zones, the shortcoming of the concrete risk of existence and existing method is as follows:
Fill slowly, under the driving of capillary pressure, the filling time approximately with square being directly proportional of distance, also relevant with the temperature of primer simultaneously, as a 7mm
2Chip, fill the time of primer and may not wait to dozens of minutes for several minutes, therefore, fully be penetrated into the opposite side of chip in order to make the glue material, just need enough times of penetration, this will inevitably influence the efficient of sealing;
Because the pressure of siphonage is limited; and process of osmosis is subjected to influence of various factors; as chip length and width; bump pitch; the depth of cup of projection; the permeance property of glue material and temperature; the temperature of anchor clamps (Jig); the interior external diameter of syringe needle; material and the line design of flexible circuit base board (being winding Tape); the material of the pin protective layer (SR) of flexible circuit base board etc.; under the influence of above-mentioned numerous factors; after causing filling to be finished; except chip gluing one side, be easy to occur bubble in the sealing scope on other three limits; coat phenomenons such as bad and peel strength deficiency.
Wherein, bubble refers to occur in the glue material between chip and flexible circuit base board the phenomenon in cavity, bubble in the sealing scope is probably in follow-up heating process, cause the popcorn effect (popcorn) of sealing region, can make the phenomenon (being lamination) that occurs separating between chip circuit and the glue material, thereby sealing was lost efficacy, or when sealing region meets with stresses, stress is concentrated and is accelerated the failure, and then sealing was lost efficacy, thereby directly influence the yield of chip package, reliability of products and reduction of service life, and, because the existence of bubble, because lacking sealing, and by conductive impurity two projections are communicated with between two projections, and then make short circuit between two projections, make the chip operation exception, influence is used; Coat the bad interior pin that refers to chip and do not enveloped by the glue material fully and expose in air, peel strength refers to that the minor face of chip and flexible circuit base board peel off required power, coats the effect that bad and peel strength deficiency all can influence chip package.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of crystal coated encapsulation method, by changing the gluing path, solved prior art problems, saved the time of sealing, improved sealing efficient, and avoided to a certain extent sealing region bubble, coat bad and phenomenons such as peel strength deficiency.
For addressing the above problem, the embodiment of the invention provides following technical scheme:
A kind of crystal coated encapsulation method comprises:
With the projection of chip with after the pin of circuit base plate engages, around described chip, carry out gluing, wherein, gluing is the clockwise or counter clockwise direction along the chip girth in proper order, and at least earlier at the long limit, first road of described chip one side coating glue material, after treating that the glue material oozes out from the chip below, again at the long limit, second road of described chip one side coating glue material.
Preferably, the gluing path around the described chip is four rectangles that the drift angle place is arc.
Preferably, the distance on described gluing path and described chip four limits is 240 μ m-260 μ m.
Preferably, long limit, first road of described chip is the output of chip, and long limit, second road is the input of chip.
Preferably, long limit, the left side of described chip is the output of chip, and long limit, right side is the input of chip, and when carrying out gluing around described chip, the gluing mode is specially:
Pin under the described chip lower left corner, point glue axle drives dispensing needle head and is coated with a week clockwise along the chip girth, wherein, when the long side gluing of described chip, gluing speed is 30mm/s or 35mm/s, and when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
Preferably, long limit, the left side of described chip is the output of chip, and long limit, right side is the input of chip, and when carrying out gluing around described chip, the gluing mode is specially:
Be pin under the long edge lengths of the 1/5 chip position in distance chip lower left corner distance, point glue axle drives dispensing needle head and is applied to the described chip lower left corner earlier, be coated with a week clockwise along the chip girth afterwards, wherein, when the long side gluing of described chip, gluing speed is 30mm/s or 35mm/s, when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, and when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
Preferably, long limit, the left side of described chip is the output of chip, and long limit, right side is the input of chip, and when carrying out gluing around described chip, the gluing mode is specially:
Pin under the upper left corner of described chip, point glue axle drives dispensing needle head and is applied to the described chip lower left corner earlier, be coated with a week clockwise along the chip girth afterwards, wherein, dispensing needle head is moved in the process of the upper left corner by the described chip lower left corner, dispensing needle head is not told glue, when the long side gluing of described chip, gluing speed is 30mm/s or 35mm/s, when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, and when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
Preferably, long limit, the left side of described chip is the output of chip, and long limit, right side is the input of chip, and when carrying out gluing around described chip, the gluing mode is specially:
Pin under the lower left corner of described chip, after some glue axle drive dispensing needle head is applied to the described chip upper left corner earlier, dispensing needle head moves to the described chip lower left corner again, be coated with a week clockwise along the chip girth afterwards, wherein, dispensing needle head moves to the lower left corner by the described chip upper left corner, and afterwards by the lower left corner of described chip to the process of the mobile upper left corner, dispensing needle head is not told glue, and when the gluing of the long limit, left side of described chip, gluing speed is 10mm/s-25mm/s for the first time, when the short brink gluing of described chip, gluing speed is 15mm/s or 20mm/s, and when the gluing of the arc corner of described chip, gluing speed is 15mm/s.
Preferably, described chip feature comprises at least a in the following condition:
Described chip minor face width is greater than 1.5mm;
The spacing of per two projections of described chip is less than 30 μ m;
The inside cabling complexity of described circuit base plate;
Arrange for the tomography formula between the pin protective layer of described circuit base plate and the pin.
Preferably, the internal diameter of described dispensing needle head is 0.30mm-0.32mm.
Compared with prior art, technique scheme has the following advantages:
The technical scheme that the embodiment of the invention provides, by of the prior art the gluing mode at chip one side gluing being changed into gluing around chip, and behind the first road long side gluing of chip, need to wait for that the glue material could be at the second road long side gluing of chip after oozing out from the chip below, to get rid of the bubble of chip bottom, avoid because being eager at the second road long side gluing of chip, and cause bubble to be locked between chip and the circuit base plate, thereby the potential safety hazard of staying, and owing to all being coated with the glue material around the chip, thereby can avoid coating bad and defective such as peel strength deficiency, and owing to all scribble the glue material between the projection, thereby can avoid the short circuit between projection, the mode of gluing has also improved sealing efficient to a certain extent simultaneously, needn't waste the plenty of time in order to wait for the glue material fully to be penetrated into the chip opposite side, thereby shorten the sealing time.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is gluing path schematic diagram in the prior art;
The process schematic diagram of the crystal coated encapsulation method that Fig. 2 provides for the embodiment of the invention one;
The schematic diagram in the gluing path of the crystal coated encapsulation method that Fig. 3 provides for the embodiment of the invention one;
The schematic diagram in the gluing path of the crystal coated encapsulation method that Fig. 4 provides for the embodiment of the invention two;
The crystal coated encapsulation method that Fig. 5 provides for the embodiment of the invention two is determined the schematic diagram of each coordinate points of dispensing needle head moving direction in the gluing process;
Fig. 6 is the arrangement mode schematic diagram that the general expression of the SR layer of circuit base plate and lead interlayer is arranged;
The schematic diagram in the gluing path of the crystal coated encapsulation method that Fig. 7 provides for the embodiment of the invention three;
The crystal coated encapsulation method that Fig. 8 provides for the embodiment of the invention three is determined the schematic diagram of each coordinate points of dispensing needle head moving direction in the gluing process;
The schematic diagram in the gluing path of the crystal coated encapsulation method that Fig. 9 provides for the embodiment of the invention four;
The crystal coated encapsulation method that Figure 10 provides for the embodiment of the invention four is determined the schematic diagram of each coordinate points of dispensing needle head moving direction in the gluing process;
Figure 11 is the arrangement mode schematic diagram that the tomography formula of the SR layer of circuit base plate and lead interlayer is arranged;
The schematic diagram in the gluing path of the crystal coated encapsulation method that Figure 12 provides for the embodiment of the invention five;
The crystal coated encapsulation method that Figure 13 provides for the embodiment of the invention five is determined the schematic diagram of each coordinate points of dispensing needle head moving direction in the gluing process.
Embodiment
Just as described in the background section, in the prior art only at chip one side gluing, the gluing mode of utilizing siphonage that the pin on other limit of chip is wrapped up afterwards, exist the sealing process slow, sealing efficient is low, and occur bubble easily and coat variety of issues such as bad, thereby influence the performance of chip.The inventor discovers, occur to coat bad, peel strength is not enough, the basic reason of short circuit is between layering and projection, because only at chip one side gluing, the pressure of siphonage is very little, and the influence of various factors causes occurring easily bubble, need consider also that in actual production process sealing efficient can not be too low simultaneously, often do not have time enough to wait for that the glue material oozes out fully from the opposite side of chip, also all pins are wrapped to get rid of bubble, thereby cause occurring various defectives.
Therefore, the inventor considers, can attempt around long limit, the both sides of chip or chip, carrying out gluing, consider the working method of automatic double surface gluer, more preferably the latter so just can improve sealing efficient to a certain extent, shortens the sealing time, and suitable controls the gluing process, can also reduce defectives such as bubble as much as possible.
On the basis based on above-mentioned research, the embodiment of the invention provides, and this method comprises:
With the projection of chip with after the pin of circuit base plate engages, around described chip, carry out gluing, wherein, gluing is the clockwise or counter clockwise direction along the chip girth in proper order, and at least earlier at the long limit, first road of described chip one side coating glue material, after treating that the glue material oozes out from the chip below, again at the long limit, second road of described chip one side coating glue material.
The technical scheme that the embodiment of the invention provides, by around chip, carrying out gluing, and behind the first road long side gluing of chip, need to wait for that the glue material could be at the second road long side gluing of chip after oozing out from the chip below, to get rid of the bubble of chip bottom, avoid because being eager at the second road long side gluing of chip, and cause bubble to be locked between chip and the circuit base plate, thereby the potential safety hazard of staying, and owing to all being coated with the glue material around the chip, thereby can avoid coating bad and defective such as peel strength deficiency, and owing to all scribble the glue material between the projection, thus can avoid the short circuit between projection, the mode of gluing has also improved sealing efficient to a certain extent all around simultaneously, needn't waste the plenty of time in order to wait for the glue material fully to be penetrated into the chip opposite side, thereby shorten the sealing time.
It more than is the application's core concept, below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
A lot of details have been set forth in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention is not subjected to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the invention is described in detail in detail; for ease of explanation; the profile of expression device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
Embodiment one
The detailed process of the disclosed crystal coated encapsulation method of the embodiment of the invention as shown in Figure 2, be specially, with the projection of chip IC with after the pin of circuit base plate engages, around described chip, carry out gluing, wherein, gluing is the clockwise or counter clockwise direction along the chip girth in proper order, and at least earlier at the long limit, first road of described chip one side coating glue material, after treating that the glue material oozes out from the chip below, again at the long limit, second road of described chip one side coating glue material.
Need to prove, in the present embodiment so long as get final product along clockwise or counterclockwise direction gluing around the chip, do not limit the concrete order of gluing, can begin gluing from arbitrary position of chip girth, as beginning gluing from the minor face of chip, also can begin gluing from the long limit of chip, as shown in Figure 2, can center on one week of chip girth gluing clockwise according to the order of label 1 → 2 → 3 → 4, perhaps can also be according to 4 → 1 → 2 → 3,4 → 3 → 2 → 1,2 → 1 → 4 → 3 grades are in proper order around one week of chip girth gluing, here narration no longer one by one, in the present embodiment only the gluing with shown in Figure 11 → 2 → 3 → 4 be that example describes main thought of the present invention in proper order.
The inventor finds, the main source of the gas in the bubble that produces in the gluing process is exactly the gas in the gap of chip bottom and circuit base plate, therefore, for fear of producing bubble, the gap that needs employing glue material these gases to be extruded chip bottom and circuit base plate, be specially in the practical operation, behind the gluing of the long limit of glue material one side, after the glue material oozes out below the long limit from the chip opposite side, the gas that the chip below can be described has been rejected to lsafety level, this moment is again at the long limit of opposite side of chip gluing, to wrap the projection of chip opposite side, the projection that can guarantee all pin places of chip is so all wrapped by the glue material, thereby avoids coating bad, topic between short circuit etc. between projection.
The lsafety level of said chip below gas is not that the gas that refers to the chip below all is drained, perhaps the chip below is all filled up by the glue material, but chip below institute residual air body is not enough to produce big bubble, perhaps in follow-up heating process, puffed rice phenomenon that sealing region can not occur etc. influences the situation of chip performance.
In other words, in actual production process, the glue material that makes described in the present embodiment infiltrates the time that consumes from the chip below, than making the glue material infiltrate and wrap the process of the projection under the chip opposite side pin from the chip below in the prior art, the required time is short a lot, and the degree that desired glue material infiltrates from the chip below in the present embodiment also is nothing like the prior art harsh, therefore, from time of penetration, present embodiment has shortened the sealing time greatly than prior art.
Sealing speed in the present embodiment is illustrated, to be of a size of 19.108*1.324mm
2Chip be example, adopt gluing mode of the prior art to need 15s to finish the gluing process of 1 core assembly sheet (1 group of 4 chip), and adopt the method in the embodiment of the invention only to need 6s can finish the gluing process of 1 core assembly sheet.
Concrete; as shown in Figure 2; the disclosed crystal coated encapsulation method of present embodiment; only need guarantee before being coated with the 3rd road glue material; assurance glue material infiltrates from the chip below and gets final product; wherein; the infiltration direction of glue material is the direction of the arrow a among Fig. 2; it will be appreciated by those skilled in the art that; the infiltration direction of glue material and gluing direction; the permeance property of glue material and temperature; the material of flexible circuit base board and line design; the materials of the pin protective layer (SR) of flexible circuit base board etc. are relevant; but basically, the infiltration direction of glue material and gluing direction and chip length or Width form an angle.
Label is that gluing path, 2,3,4 road is responsible for the interior pin on other three limit of chip is wrapped up among Fig. 2, make between the minor face of chip and flexible circuit base board and also have enough glue materials, thereby avoided in the prior art because of the not enough peel strength defect of insufficient that causes of chip minor face glue material, saved simultaneously and waited for that the glue material from the time of this three limits pin of chip below infiltration parcel, has improved sealing efficient.
In addition, need to prove that decide according to the concrete shape of chip in the gluing path around the chip, generally speaking, most chips are rectangle, then the gluing path around the present embodiment chips is rectangle, and is preferred, in order to make the encapsulation outward appearance more attractive in appearance, and the sealing process is more perfect, four drift angles of rectangle are designed to curved path, and namely the gluing path around the present embodiment chips is four rectangles that the drift angle place is arc, specifically as shown in Figure 3.
The disclosed crystal coated encapsulation method of present embodiment, by around chip, being coated with the glue material, and control gluing mode, thereby stopped bubble on the substrate, coated defectives such as bad and peel strength deficiency, and owing to all scribble the glue material between the projection, thus can avoid the short circuit between projection, the mode of gluing has also improved sealing efficient to a certain extent all around simultaneously, needn't waste the plenty of time in order to wait for the glue material fully to be penetrated into the chip opposite side, shorten the sealing time.
Embodiment two
The detailed process of the disclosed crystal coated encapsulation method of present embodiment as shown in Figure 4 and Figure 5, Fig. 4 is this method gluing path schematic diagram, each label among Fig. 4 is represented gluing direction and path, Fig. 5 is the schematic diagram of determining each coordinate points of dispensing needle head moving direction in the gluing process, each coordinate points is represented in label among Fig. 5 (1)-(10), and the moving direction of dispensing needle head has been determined in the position of each coordinate points.
Need to prove, generally speaking, long limit, first road that is coated with in the gluing process is the output output of chip, long limit, second road is the input input of chip, because the pin of chip output is often many, the pin of input is less, the outputs many from pin begin gluing, can make the sealing better effects if, describe as example in the present embodiment, but be not limited in this.
As shown in Figure 4 and Figure 5, long limit, the left side of described chip is the output output of chip, and long limit, right side is the input input of chip, and when carrying out gluing around described chip, the gluing mode is specially:
The pin under (being the output lower end) in the described chip lower left corner, point glue axle drives dispensing needle head and is coated with a week clockwise along the chip girth, be that the syringe needle moving direction is 1 → 2 → 3 → 4, wherein, when long side (i.e. the 1st road and the 3rd path zone) gluing of described chip, gluing speed is 30mm/s or 35mm/s, when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, and when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
The gluing speed of above-mentioned long side, short brink and arc corner can according to the concrete length width of chip, pin what etc. situation and deciding, include but not limited to above-mentioned restriction to gluing speed.
Concrete, referring to Fig. 5, in conjunction with each coordinate points, the position of coordinate points (1) and coordinate points (2) overlaps, in practical operation, coordinate points (1) expression moves on to this position with dispensing needle head, and the height of definite dispensing needle head, for the gluing process is prepared, but do not tell glue this moment, coordinate points (2) expression begins to tell glue, and is same, coordinate points (10) expression gluing is finished, dispensing needle head is removed, between coordinate points (9) and coordinate points (10), also do not told glue, and, arc corner between coordinate points among Fig. 5 (2) and the coordinate points (9) (being between starting point and the end point) does not need to tell glue (down together), be that dispensing needle head need not move between these two coordinate points, only need wait glue material to flow and get final product, in addition, between other coordinate points, dispensing needle head is being told glue always.
In addition, in the present embodiment in order to make the sealing better effects if, shortened the distance (Gap) on gluing path and described chip four limits, the distance of the two is about 300 μ m in the prior art, and the distance of the two is 240 μ m-260 μ m in the present embodiment, be preferably 250 μ m, because the distance of the two has been dwindled, flow the required time thereby shortened the glue material, further shortened the sealing time, simultaneously, can also reduce bubble and layering odds.
And, accelerate sealing speed and improve the sealing effect for further in the present embodiment, increased the internal diameter of dispensing needle head in the embodiment of the invention, tell the glue amount with increase, the internal diameter of dispensing needle head is about 0.25mm in the prior art, the internal diameter of the dispensing needle head that adopts in the present embodiment is 0.30mm-0.32mm, is preferably 0.31mm.And, because dwindling of the distance on the increase of dispensing needle head internal diameter and gluing path and chip four limits makes present embodiment can be applicable to that size is big, the more chip of pin.
The disclosed crystal coated encapsulation method of present embodiment all is suitable for for the chip of glue material viscosity big (as 3900-CX1 glue material) or viscosity less (as 8462-21 glue material), also is applicable to the chip of following type simultaneously:
Width is less than or equal to the chip of 1.5mm;
Bump pitch is more than or equal to the chip of 30 μ m;
The projection arrangement form is the chip of isosceles triangle or in line shape;
The chip of the inner no cabling of circuit base plate or less cabling, the circuit base plate in the present embodiment is preferably soft circuit base plate;
Arrange the chip of (arrangement mode as shown in Figure 6) between the pin protective layer (SR layer) of circuit base plate (being soft circuit base plate) and the pin (lead) for general expression, the disconnected limit that described general expression is arranged as the SR layer is the slope with the position that lead (circuit pin) contacts, and this arrangement mode is convenient to the glue material and is infiltrated chip bottom;
Soft circuit base plate bottom (PI layer) material is the chip of Kapton-EN, Kapton-150EN, Capton, Capton-E, Kapton, Kapton-150EN-A, S ' Perflex and Metaloyal-F, Upilex, Espanex-M, Upilex-S;
The ILB layer engages (bonding) situation for choosing the chip of high moulding height (beating Forming) and common moulding height (not beating Forming), described choosing after high moulding refers to that highly chip and soft circuit base plate engage, the pin rear end of soft circuit base plate needs perk, after described common moulding referred to that highly then chip and soft circuit base plate engage, the pin rear end of soft circuit base plate did not need perk.
That is to say, for most of size can be not excessive chip, crystal coated encapsulation method in the present embodiment all is suitable for, there is not the bubble layering basically in the chip sealing region that adopts this method to produce, coating is bad, peel strength is not enough and projection between the situation of short circuit, and the sealing time also shorten greatly.
Embodiment three
The detailed process of the disclosed crystal coated encapsulation method of present embodiment as shown in Figure 7 and Figure 8, similar with a last embodiment, Fig. 7 is this method gluing path schematic diagram, each label among Fig. 7 is represented gluing direction and path, Fig. 8 is the schematic diagram of determining each coordinate points of dispensing needle head moving direction in the gluing process, and each coordinate points is represented in the label among Fig. 8 (1)-(11).
Still beginning gluing with the output from chip in the present embodiment is example, namely long limit, the left side of figure chips is the output of chip, long limit, right side is the input of chip, and the distance on the dispensing needle head that adopts in the present embodiment and gluing path and described chip four limits is also similar with a last embodiment, repeats no more here.
Different with a last embodiment is that when carrying out gluing in the present embodiment around described chip, the gluing mode is specially:
As shown in Figure 7 and Figure 8, be the long edge lengths of 1/5 chip position (namely apart from the long edge lengths of output lower end 1/5 chip place) pin down in distance chip lower left corner distance, point glue axle drives dispensing needle head and is applied to the described chip lower left corner earlier, be coated with a week clockwise along the chip girth afterwards, be that the syringe needle moving direction is 1 → 2 → 3 → 4 → 5, wherein, when the long side gluing of described chip, gluing speed is 30mm/s or 35mm/s, when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, and when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
Similar with a last embodiment, also can not be as the restriction to the present embodiment protection range to the description of gluing speed in the present embodiment, the concrete condition that concrete gluing speed can chip and deciding.
And, coordinate points in the present embodiment (1) locates not tell glue, coordinate points (2) locates to begin to tell glue, and coordinate points (11) expression gluing is finished, and dispensing needle head is removed, do not tell glue in coordinate points (10) and coordinate points (11) yet, arc corner between coordinate points (3) and the coordinate points (10) is not told glue equally, and dispensing needle head is not mobile between these two points, in addition, between other coordinate points, dispensing needle head is being told glue always.
Same, the crystal coated encapsulation method in the present embodiment also can be applicable to the as above various chips described in the embodiment.
Embodiment four
The detailed process of the disclosed crystal coated encapsulation method of present embodiment such as Fig. 9 and shown in Figure 10, similar with a last embodiment, Fig. 9 is this method gluing path schematic diagram, each label among Fig. 9 is represented gluing direction and path, Figure 10 is the schematic diagram of determining each coordinate points of dispensing needle head moving direction in the gluing process, and each coordinate points is represented in the label among Figure 10 (1)-(11).
Other setting is identical with a last embodiment in the present embodiment, and different with a last embodiment is that when carrying out gluing in the present embodiment around described chip, the gluing mode is specially:
Pin under the upper left corner of described chip (being the output upper end), point glue axle drives dispensing needle head and is applied to the described chip lower left corner (being the output lower end) earlier, be coated with a week clockwise along the chip girth afterwards, be that the syringe needle moving direction is 1 → 2 → 3 → 4 → 5, wherein, dispensing needle head is moved in the process of the upper left corner by the described chip lower left corner, dispensing needle head is not told glue, be that coordinate points (3)-coordinate points is not told glue between (4), gluing speed can be decided according to the actual coating condition of chip, preferably, when the long side gluing of described chip, gluing speed is 30mm/s or 35mm/s, when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, and when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
Same, the description to gluing speed in the present embodiment also can not be as the restriction to the present embodiment protection range, the concrete condition that concrete gluing speed can chip and deciding.
Dispensing needle head mobile but process of not telling glue between coordinate points (3)-coordinate points (4) in the present embodiment, being equivalent to increases a pressure for the glue material, be convenient to other lateral location that the glue material penetrates into chip faster, accelerate the flowing velocity of glue material, also be equivalent to simultaneously a process of waiting for the infiltration of glue material, in this process, the quickening that the translational speed of dispensing needle head can be suitable specifically can be decided according to actual gluing situation.
Similar with a last embodiment, between coordinate points (3) and the coordinate points (10), also do not tell glue between coordinate points (10) and the coordinate points (11), and dispensing needle head can't move between coordinate points (3) and coordinate points (10).
Different with last two embodiment is, the method in the present embodiment is not only applicable to the chip kind described in the embodiment two, and, pin more chip bigger for size also is suitable for, and described chip feature comprises at least a in the following condition:
Described chip minor face width is greater than 1.5mm;
The spacing of per two projections of described chip is less than 30 μ m;
The inside cabling complexity of described circuit base plate (soft circuit base plate), concrete, the circuit of soft circuit base plate protrudes from primer, if the circuit at sealing region is " returning " font or approximate " returning " font, the glue material is difficult to flow to this part circuit zone, the circuit zone also just forms bubble easily in this section, and gluing mode of the prior art is difficult to address this problem, but adopts the method in the present embodiment just to stop the bubble in this part circuit zone basically;
Arrange for the tomography formula between the pin protective layer (SR layer) of described circuit base plate (being soft circuit base plate) and the pin (lead); arrangement mode as shown in figure 11; described tomography formula is arranged as the position that the disconnected limit of SR layer contacts with lead and is the right-angle side perpendicular to the lead layer, and this arrangement mode is unfavorable for that the glue material infiltrates chip bottom.
Because the size of chip is more big, the weight of needed glue material is more big, pin of chip quantity is more many, required time of penetration is just more long, the sealing process is the easier phenomenons such as bubble layering that occur also, and the layering position easier situation about being short-circuited between projection that can make exactly, more than listed several chips compared to common chip, equal easier defectives such as bubble layering that occur, method of the prior art is to the sealing process intractable of said chip, but the method in the present embodiment is because the dispensing needle head after adopting the internal diameter increase, increased the glue amount of telling, and reduced Gap, shortened the mobile required time of glue material to a certain extent, and, in conjunction with the gluing mode in the present embodiment, difficult problem is handled in the sealing that has solved said chip, and is bigger to size, pin is more, the chip that SR layer and lead layer are arranged for the tomography formula is more suitable, has avoided phenomenons such as bubble layering basically.
Embodiment five
The detailed process of the disclosed crystal coated encapsulation method of present embodiment such as Figure 12 and shown in Figure 13, similar with a last embodiment, Figure 12 is this method gluing path schematic diagram, each label among Figure 12 is represented gluing direction and path, Figure 13 is the schematic diagram of determining each coordinate points of dispensing needle head moving direction in the gluing process, and each coordinate points is represented in the label among Figure 13 (1)-(12).
Other setting is identical with a last embodiment in the present embodiment, and different with a last embodiment is that when carrying out gluing in the present embodiment around described chip, the gluing mode is specially:
Pin under in the lower left corner of described chip (being the output lower end), after some glue axle drive dispensing needle head is applied to the described chip upper left corner (being the output upper end) earlier, dispensing needle head moves to the described chip lower left corner (being the output lower end) again, be coated with a week clockwise along the chip girth afterwards, be that the syringe needle moving direction is 1 → 2 → 3 → 4 → 5 → 6, wherein, dispensing needle head moves to the lower left corner by the described chip upper left corner, and afterwards by the lower left corner of described chip to the process of the mobile upper left corner, dispensing needle head is not told glue, it is coordinate points (3)-coordinate points (4), coordinate points (4)-coordinate points is not told glue between (5), for the first time when the gluing of the long limit, left side of described chip, it is the process of coordinate points (2)-coordinate points (3), gluing speed is 10mm/s-25mm/s, and when the short brink gluing of described chip, gluing speed is 15mm/s or 20mm/s, when the gluing of the arc corner of described chip, gluing speed is 15mm/s.
Similar with a last embodiment, dispensing needle head mobile but process of not telling glue between coordinate points (3)-coordinate points (4) and coordinate points (4)-coordinate points (5), being equivalent to increases a pressure for the glue material, be convenient to other lateral location that the glue material penetrates into chip faster, accelerate the flowing velocity of glue material, also be equivalent to a process of waiting for the infiltration of glue material simultaneously, in this process, the translational speed of dispensing needle head can be suitable quickening, specifically can decide according to actual gluing situation.
And between coordinate points (2) and the coordinate points (11), also do not tell glue between coordinate points (11) and the coordinate points (12), and dispensing needle head can't move between coordinate points (2) and coordinate points (11).
Accordingly, method in the present embodiment also is the chip kind that is not only applicable to described in the embodiment two, and, pin more chip bigger for size listed among the embodiment four also is suitable for, and further perfect sealing effect, and the bigger chip of size also is suitable for.
Can draw in conjunction with above-described embodiment; more than the disclosed gluing mode of each embodiment can not be used for limit protection scope of the present invention;, pin more chip bigger for size; can adopt the cycle-index of suitable increase dispensing needle head when the gluing of the long limit (i.e. output side among the figure) of first side of chip; or the suitable gluing speed that reduces in this side; or further increase the modes such as internal diameter of dispensing needle head, to guarantee the sealing effect.
Various piece adopts the mode of going forward one by one to describe in this specification, and what each part stressed is and the difference of other parts that identical similar part is mutually referring to getting final product between the various piece.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments herein.Therefore, the present invention will can not be restricted to embodiment illustrated herein, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (2)
1. a crystal coated encapsulation method is characterized in that, comprising:
With the projection of chip with after the pin of circuit base plate engages, around described chip, carry out gluing, wherein, gluing is the clockwise or counter clockwise direction along the chip girth in proper order, and at least earlier at the long limit, first road of described chip one side coating glue material, after treating that the glue material oozes out from the chip below, again at the long limit, second road of described chip one side coating glue material;
Gluing path around the described chip is four rectangles that the drift angle place is arc;
The distance on described gluing path and described chip four limits is 240 μ m-260 μ m;
Long limit, first road of described chip is the output of chip, and long limit, second road is the input of chip;
Long limit, the left side of described chip is the output of chip, and long limit, right side is the input of chip, and when carrying out gluing around described chip, the gluing mode is specially:
Pin under the described chip lower left corner, point glue axle drives dispensing needle head and is coated with a week clockwise along the chip girth, wherein, when the long side gluing of described chip, gluing speed is 30mm/s or 35mm/s, and when the short brink gluing of described chip, gluing speed is 20mm/s or 25mm/s, when the gluing of the arc corner of described chip, gluing speed is 25mm/s.
2. method according to claim 1 is characterized in that, the internal diameter of described dispensing needle head is 0.30mm-0.32mm.
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| CN103779242B (en) * | 2014-02-18 | 2017-02-08 | 无锡江南计算技术研究所 | Glue control method of step package substrate |
| CN106094271A (en) * | 2016-06-22 | 2016-11-09 | 深圳市华星光电技术有限公司 | A kind of display floater cutting method |
| CN108260292A (en) * | 2017-12-08 | 2018-07-06 | 江西合力泰科技有限公司 | Increase the method for underfill coverage rate after a kind of SMT |
| CN111001534B (en) * | 2019-12-13 | 2021-05-04 | 青岛歌尔智能传感器有限公司 | Dispensing method and dispensing device |
| CN111370322B (en) * | 2020-03-24 | 2022-04-01 | 江苏海莱新创医疗科技有限公司 | Method for hermetically fixing sheet-like or plate-like electronic component to substrate |
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| JP3730166B2 (en) * | 2001-12-07 | 2005-12-21 | セイコーインスツル株式会社 | Semiconductor element mounting method and display device manufacturing method |
| CN1862792A (en) * | 2005-02-02 | 2006-11-15 | 夏普株式会社 | Semiconductor device and manufacturing method thereof |
| CN1971972A (en) * | 2005-11-22 | 2007-05-30 | 深圳市创欧科技有限公司 | Encapsulation gumming technique of organic electroluminescent display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3730166B2 (en) * | 2001-12-07 | 2005-12-21 | セイコーインスツル株式会社 | Semiconductor element mounting method and display device manufacturing method |
| CN1862792A (en) * | 2005-02-02 | 2006-11-15 | 夏普株式会社 | Semiconductor device and manufacturing method thereof |
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