CN1971972A - Encapsulation gumming technique of organic electroluminescent display device - Google Patents
Encapsulation gumming technique of organic electroluminescent display device Download PDFInfo
- Publication number
- CN1971972A CN1971972A CN 200510101369 CN200510101369A CN1971972A CN 1971972 A CN1971972 A CN 1971972A CN 200510101369 CN200510101369 CN 200510101369 CN 200510101369 A CN200510101369 A CN 200510101369A CN 1971972 A CN1971972 A CN 1971972A
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- CN
- China
- Prior art keywords
- encapsulation
- coated
- gluing
- glass substrate
- organic elctroluminescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000034 method Methods 0.000 title claims description 24
- 238000005538 encapsulation Methods 0.000 title claims description 23
- 239000011521 glass Substances 0.000 claims abstract description 44
- 238000004026 adhesive bonding Methods 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 18
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000003848 UV Light-Curing Methods 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 21
- 238000000576 coating method Methods 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract 2
- 238000004826 seaming Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010406 cathode material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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Abstract
This invention discloses one organic light display parts sealing an glue coating process, which separately adds seaming glue along circle of the parts to make the coating speed for 5mm/s- 10mm/s, wherein, the gas voltage is set between 0.1MPa-0.5MPa; the glue needle head and glass base slice distance is set between 0.05mm to 0.15 mm with best for 0.075mm; then covering the glass cover onto glass slice for UV fixing, sealing and cutting into single organic light display parts.
Description
Technical field
The present invention relates to a kind of production technology of organic elctroluminescent device, relate in particular to the improvement of the coating technique in a kind of encapsulation process of organic elctroluminescent device.
Background technology
Organic elctroluminescent device (being called for short OLED) is widely used as the light and thin display device that can drive under low-voltage, its main production process is to have on the ITO transparent conducting glass of chromium film, carry out the chromium film respectively, the making of ITO film pattern, make insulating barrier and cathode insulated column again, pass through plasma treatment afterwards, inject transferring material by the evaporation hole, luminous organic material and cathode material, carry out the encapsulation of OLED device at last, because OLED has display element precision height, make characteristics such as precision, cost is than higher, and therefore, the packaging technology of device also is one of key element that guarantees the manufactured goods quality.
The packaging technology general process of organic elctroluminescent device is: evaporation has the device glass (ITO electro-conductive glass) of luminescent material closely to be connected by being coated with adhesive curing with glass back cover, encapsulate the accommodation space that forms between bonnet and glass substrate to prevent that extraneous air and aqueous vapor from entering, and influence the quality of display device; Whole encapsulation process comprises further that again the applying of cleaning, gluing, subsides drier, bonnet and the device glass of glass back cover, UV (ultraviolet ray) solidify several main processes, carry out technology cutting again, with in groups and put the device and the glass back cover that are arranged in together and cut into single manufactured goods.
In the coating technique of above-mentioned encapsulation process, the main technologic parameters that relates to comprises: the speed of the light intensity that UV solidifies, air pressure, gluing and be coated with the live width of tree lace and shape etc., it is 40mm/s that existing encapsulation gumming technique parameter for organic elctroluminescent device is generally selected gluing speed, air pressure remains on 0.5Mpa, that selects for use is coated with the syringe needle commonly used that needle head is generally packaged liquid crystal display spare (LCD), syringe needle is about 10mm apart from the spacing of glass baseplate surface during gluing, carries out gluing along the periphery of each light-emitting display device; According to the gluing lines of this coating technique condition gained as shown in Figure 1, through regular meeting these phenomenons appear: often have disconnected glue phenomenon at front end 11 places of gluing lines 1.; 2. the contour shape of general light-emitting display device all is square, gluing lines at square right-angle turning place 21 present bending, be difficult to reach the rectangular shaped of production engineering specifications, can influence packaging effect like this, make the encapsulation region at place, right angle not have glue, and the glue stain phenomenon occurs in normal viewing area; 3. gluing lines 31 are thick excessively, can occur the overflow of glue in to the encapsulation of glass back cover cure under pressure, and pollution displaying zone or cutting zone, also are unfavorable for the operation of subsequent technique.The direct result of these defectives is qualification rate, display quality and the useful life of having reduced manufactured goods.
The reason that above-mentioned these defectives produce is more, also more complicated, needle aperture of using such as the set point of the spacing of concrete gluing speed, syringe needle and glass baseplate surface, air pressure, concrete gluing or the like, there is different influences in the capital to the gluing lines quality of last formation, and also can influence each other between these technological parameters, therefore need be optimized selection to the concrete process conditions of gluing in the above-mentioned packaging technology, to adapt to and to give full play to advantages such as OLED pixel accuracy height, image displaying quality are good.
Summary of the invention
For overcoming the defective of above-mentioned prior art, technical problem to be solved by this invention is intended to provide a kind of gluing lines more even, continuous, has the encapsulation gumming technique of the organic elctroluminescent device of lower glue overflow phenomena.
According to the present invention, a kind of encapsulation gumming technique of organic elctroluminescent device may further comprise the steps:
(1). evaporation has the device glass of luminescent material to be placed on the gluing platform;
(2). with being coated with the periphery of needle head, add being coated with the encapsulation colloid respectively along each the single organic elctroluminescent device in the described glass substrate;
(3). in the glass back cover of having cleaned, stick drier, then glass back cover is pressed together on the described glass substrate, fit;
(4). above-mentioned glass substrate of having fitted and glass back cover are carried out UV curing, encapsulation;
(5). the above-mentioned organic elctroluminescent device of arranging in groups that will encapsulate cuts into single organic elctroluminescent device;
Wherein, when carrying out above-mentioned steps (2), the speed of syringe needle gluing is limited to 5mm/s-10mm/s; Air pressure is set between the 0.1MPa-0.5Mpa; The spacing that is coated with needle head and the described glass substrate that is coated with is set between the 0.05mm-0.15mm, and preferred spacing is 0.075mm.
After adopting the technical scheme of the invention described above, owing to reduced gluing speed and gluing air pressure, shortened the distance that is coated with between needle head and the quilt glass substrate that is coated with, test proves that also the gluing line weight of gained is more even, almost disconnected glue phenomenon; Dragging the glue phenomenon also greatly to weaken, is rectangular-shaped at right-angle turning place gluing lines substantially, can avoid the viewing area glue stain phenomenon to occur, is particularly suitable for the encapsulation of the device of square contour; Gel quantity is moderate evenly, when glass substrate and glass back cover cure under pressure are packaged together, greatly reduces the overflow phenomena of glue, helps the operation of operation afterwards.
Below will be by a specific embodiment and in conjunction with the accompanying drawings to feature of the present invention, principle, the course of work and advantage and be elaborated.
Description of drawings
Fig. 1 is the structural representation of gluing lines of the coating technique gained of existing organic elctroluminescent device;
Fig. 2 is the structural representation that adopts the gluing lines of coating technique gained of the present invention
Fig. 3 is the process flow chart of coating technique of the present invention.
Embodiment
With reference to accompanying drawing 2 and Fig. 3, in the manufacturing process of organic elctroluminescent device of the present invention, according to common mode, on the ITO transparent conducting glass, carry out the making of chromium film, ITO film pattern respectively, make insulating barrier and cathode insulated column again, inject transferring material, luminous organic material and cathode material by the mode in plasma treatment and evaporation hole afterwards, carry out the encapsulation of OLED device at last.
In concrete packaging technology, mainly adopt following steps:
(1). there is the glass substrate of luminous display material to be placed on the gluing platform above-mentioned evaporation;
(2). with being coated with the periphery of needle head, add being coated with the encapsulation colloid respectively along each the single organic elctroluminescent device in the described glass substrate;
(3). in the glass back cover of having cleaned, stick drier, then glass back cover is pressed together on the described glass substrate, fit;
(4). the glass substrate to above-mentioned gluing carries out UV curing, and purpose is to allow lower-glass combine closely, and prevents that extraneous air and aqueous vapor from entering the accommodation space that forms between encapsulation bonnet and glass substrate, and influences the quality of display device;
(5). the above-mentioned organic elctroluminescent device of arranging in groups that will encapsulate cuts into single organic elctroluminescent device;
Wherein, when carrying out above-mentioned steps (2), the present invention is especially at gluing excessive velocities in the prior art, glue trailing phenomenon in the decline process can appear easily at the right-angle turning place, the speed of syringe needle gluing is reduced, be limited between the 5mm/s-10mm/s, to avoid the making gluing lines at right-angle turning place present bending; For overcoming the too much phenomenon of glue amount that gluing speed reduces the unit distance that may occur, the present invention is simultaneously with gluing air pressure, promptly be coated with also attenuating in the lump of glue output pressure in the needle head, be set between the 0.1MPa-0.5Mpa, make gel quantity moderate, even, avoid the gluing lines thick excessively,, reduce glue overflow phenomena and the glue stain viewing area that causes thus or the possibility of cutting zone with when cure under pressure encapsulates.
At being coated with needle head and and the disconnected glue phenomenon that cause and the degree that increase the weight of drag glue excessive in the prior art by the spacing of the glass substrate that is coated with, the present invention is adjusted at this spacing within the scope of 0.05mm-0.15mm, preferred spacing is 0.075mm, can improve accuracy, continuity and the uniformity of gluing so on the one hand, can also also avoid on the other hand presenting forniciform phenomenon at the gluing lines at right-angle turning place.
Gluing effect under the existing technological parameter of paired observation and the packaging effect behind employing the present invention, the basal conditions of gluing lines respectively as depicted in figs. 1 and 2, adopt the coating technique parameter after optimizing better to control uniformity of gluing, the width of gluing lines 32 is moderate, the right-angle turning place 22 of gluing lines presents rectangular shaped, front end 12 places at the gluing lines do not have disconnected glue phenomenon substantially, thereby avoided the pollution that excessive glue phenomenon is brought in the encapsulation process and the package quality at right-angle turning place, improved the operating efficiency and the rate of finished products of whole encapsulation process.
Claims (2)
1. the encapsulation gumming technique of an organic elctroluminescent device may further comprise the steps:
(1). evaporation has the device glass of luminescent material to be placed on the gluing platform;
(2). with being coated with the periphery of needle head, add being coated with the encapsulation colloid respectively along each the single organic elctroluminescent device in the described glass substrate;
(3). in the glass back cover of having cleaned, stick drier, then glass back cover is pressed together on the described glass substrate, fit;
(4). above-mentioned glass substrate of having fitted and glass back cover are carried out UV curing, encapsulation;
(5). the above-mentioned organic elctroluminescent device of arranging in groups that will encapsulate cuts into single organic elctroluminescent device;
It is characterized in that: when carrying out above-mentioned steps (2), the speed of syringe needle gluing is limited to 5mm/s-10mm/s; Air pressure is set between the 0.1MPa-0.5Mpa; The spacing that is coated with needle head and the described glass substrate that is coated with is set between the 0.05mm-0.15mm.
2. the encapsulation gumming technique of a kind of organic elctroluminescent device as claimed in claim 1, it is characterized in that: the described spacing that is coated with needle head and the described glass substrate that is coated with is preferably 0.075mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510101369A CN100589260C (en) | 2005-11-22 | 2005-11-22 | Encapsulation gumming technique of organic electroluminescent display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510101369A CN100589260C (en) | 2005-11-22 | 2005-11-22 | Encapsulation gumming technique of organic electroluminescent display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1971972A true CN1971972A (en) | 2007-05-30 |
| CN100589260C CN100589260C (en) | 2010-02-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510101369A Expired - Fee Related CN100589260C (en) | 2005-11-22 | 2005-11-22 | Encapsulation gumming technique of organic electroluminescent display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100589260C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738014A (en) * | 2011-04-14 | 2012-10-17 | 颀中科技（苏州）有限公司 | Flip chip packaging method |
| CN106571309A (en) * | 2016-10-27 | 2017-04-19 | 江西沃格光电股份有限公司 | Flat panel display (FPD) processing method |
| CN107450216A (en) * | 2017-08-31 | 2017-12-08 | 河源中光电通讯技术有限公司 | A kind of processing method of ON CELL faces fitting module |
| CN107658391A (en) * | 2017-09-01 | 2018-02-02 | 信利半导体有限公司 | A kind of method for packing of narrow frame PMOLED devices |
| WO2018196402A1 (en) * | 2017-04-28 | 2018-11-01 | 京东方科技集团股份有限公司 | Encapsulating apparatus and display panel encapsulating method |
| CN115555220A (en) * | 2022-03-30 | 2023-01-03 | 四川英诺维新材料科技有限公司 | Secondary sealing protection method for vacuum glass |
-
2005
- 2005-11-22 CN CN200510101369A patent/CN100589260C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738014A (en) * | 2011-04-14 | 2012-10-17 | 颀中科技（苏州）有限公司 | Flip chip packaging method |
| CN102738014B (en) * | 2011-04-14 | 2013-08-28 | 颀中科技（苏州）有限公司 | Flip chip packaging method |
| CN106571309A (en) * | 2016-10-27 | 2017-04-19 | 江西沃格光电股份有限公司 | Flat panel display (FPD) processing method |
| CN106571309B (en) * | 2016-10-27 | 2019-11-05 | 江西沃格光电股份有限公司 | Flat-panel monitor processing method |
| WO2018196402A1 (en) * | 2017-04-28 | 2018-11-01 | 京东方科技集团股份有限公司 | Encapsulating apparatus and display panel encapsulating method |
| US11101452B2 (en) | 2017-04-28 | 2021-08-24 | Boe Technology Group Co., Ltd. | Packaging device and display panel packaging method |
| CN107450216A (en) * | 2017-08-31 | 2017-12-08 | 河源中光电通讯技术有限公司 | A kind of processing method of ON CELL faces fitting module |
| CN107658391A (en) * | 2017-09-01 | 2018-02-02 | 信利半导体有限公司 | A kind of method for packing of narrow frame PMOLED devices |
| CN107658391B (en) * | 2017-09-01 | 2019-12-31 | 信利半导体有限公司 | Packaging method of narrow-frame PMOLED device |
| CN115555220A (en) * | 2022-03-30 | 2023-01-03 | 四川英诺维新材料科技有限公司 | Secondary sealing protection method for vacuum glass |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100589260C (en) | 2010-02-10 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20081212 Address after: Beishan Industrial Zone in Yantian District of Shenzhen city of Guangdong province building 6 layer 1-5 Applicant after: Shenzhen China Display Technology Co.,Ltd. Address before: Room 8, building 805, technical center building, Bagualing District, Shenzhen, Guangdong, Futian District Applicant before: CHUANG OU SCI TECH Co.,Ltd. SHEN |
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Owner name: ZHONGXIANWEI ELECTRONICS CO., LTD., SHENZHEN CITY Free format text: FORMER OWNER: SHENZHEN CITY CHUANGOU TECHNOLOGY CO., LTD. Effective date: 20081212 |
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Owner name: HUANGSHAN CHINA DISPLAY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHINA SHENZHEN DISPLAY TECHNOLOGY CO., LTD. Effective date: 20111216 |
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Free format text: CORRECT: ADDRESS; FROM: 518083 SHENZHEN, GUANGDONG PROVINCE TO: 245400 HUANGSHAN, ANHUI PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20111216 Address after: 245400 Anhui Province, Huangshan City Industrial Park and Xiuning County Economic Development Zone Patentee after: HUANGSHAN ZHONGXIAN MICRO-ELECTRONICS CO.,LTD. Address before: 518083 1-5 floors, Beishan Industrial Zone, Yantian District, Guangdong, Shenzhen, 6 Patentee before: Shenzhen China Display Technology Co.,Ltd. |
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Effective date of registration: 20211229 Address after: 245000 hi tech electronic information Pioneer Park, Xintang Road, Xiuning Economic Development Zone, Huangshan City, Anhui Province Patentee after: Xiuning Qiyun Urban Construction Investment Co.,Ltd. Address before: 245400 Yaoshun Industrial Park, Xiuning Economic Development Zone, Huangshan City, Anhui Province Patentee before: HUANGSHAN ZHONGXIAN MICRO-ELECTRONICS CO.,LTD. |
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Granted publication date: 20100210 |
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