CN102730629A - Microlens preparation method and its product - Google Patents
Microlens preparation method and its product Download PDFInfo
- Publication number
- CN102730629A CN102730629A CN2012102071002A CN201210207100A CN102730629A CN 102730629 A CN102730629 A CN 102730629A CN 2012102071002 A CN2012102071002 A CN 2012102071002A CN 201210207100 A CN201210207100 A CN 201210207100A CN 102730629 A CN102730629 A CN 102730629A
- Authority
- CN
- China
- Prior art keywords
- substrate
- photoresist
- diameter
- lenticule
- microlens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Micromachines (AREA)
Abstract
The invention discloses a microlens preparation method and its product. The method comprises the following steps: carrying out a photoetching process on a substrate to form a boss structure with the diameter equal to the design diameter of a microlens; carrying out an etching process on the formed boss structure, and washing off a photoresist to form a boss structure formed by the substrate material; carrying out the photoetching process on the substrate and the boss structure to form a cylindrical structure on the boss structure, wherein the diameter of the cylindrical structure is less than the boss diameter; placing the obtained cylindrical structure in an acetone steam environment, and corroding the cylindrical structure through the acetone steam to form the microlens having a spherical crown structure; and transferring the microlens formed by the photoresist material through the etching process or a reverse mold process to form the finally produced microlens product. The preparation method of the invention can effectively avoid defects of insufficient contact angle and large lens spherical surface type existing in a photoresist hot melt method, and allows the prepared microlens product to have the advantages of high quality, small contact angle and large size.
Description
Technical field
The invention belongs to the micro-optic technical field, more specifically, relate to a kind of lenticular preparation method and corresponding product thereof.
Background technology
Along with the development of minute manufacturing technology, the contemporary optics device is just lighter towards quality, and the direction that volume is littler develops.Lenticule and array thereof, the micro-optical device as representative plays an important role in fields such as optical communication system, MOEMSs.So-called lenticule (microlenses) is meant that clear aperature and relief depth are micron-sized optical lens, and the array of being lined up by these lenslets is referred to as microlens array.Be used to make lenticular method at present and comprise photoresist hot melt, photosensitive glass hot-forming method, ion-exchange, photovoltaic reaction etching method, focused-ion-beam lithography and sedimentation etc.
The photoresist hot melt is one of the most frequently used lenticule preparation method.Utilize the photoresist hot melt to make lenticular principle to be: on substrate, apply certain thickness photoresist; Under the blocking of circular mask, carry out uv-exposure; Can obtain cylindrical photoresist structure after the development; Photoresist is heated to molten condition, and its surface tension makes the cylindrical structural routine be transformed into smooth spherical crown shape structure; Then, can the lenticule of photoresist material be shifted or be copied on the sheet material that silicon or glass material constitute, finally form the microlens products of silicon or glass material thus through etching technics or reverse mould technology.
The advantage of photoresist hot melt is simple; But through research, the defective below main existence the: 1, in the process that adds thermosetting spherical crown shape structure, owing to receive the restriction of angle of wetting; Usually can only make contact angle greater than 20 ° lenticule; When contact angle during less than 20 ° lenticule central authorities depression appears easily, and, limited the lenticule intended diameter because contact angle is bigger; 3, often directly the on-chip cylindrical structural that is made up of the photoresist material is carried out heating in the prior art; Like this in heating process because the evaporation of photoresist material solvent; Being in the outer field photoresist of the said cylindrical structural photoresist more inner than said cylindrical structural solidifies earlier; Before lenticule spherical crown profile formed, outer photoresist is solidification forming, caused when the bigger lenticule of manufactured size, causing easily bigger sphere face type error; 4, in heating process; Because the photoresist solvent evaporation that said cylindrical structural is inner forms bubble in the inner meeting of microlens structure, because outer photoresist solidifies earlier; Bubble is trapped in microlens structure inside and can't gets rid of; Cause photoresist unstable properties easy deformation so on the one hand, reduced the adhesiveness of photoresist and substrate on the other hand, come off easily; 5, heating causes the sex change of photoresist material, has lost the follow-up possibility of carrying out photoetching process once more.
Summary of the invention
Defective and technical need to prior art; The object of the present invention is to provide a kind of lenticular preparation method and products thereof; It carries out lenticular sphere face type forming process through the mode that mode of heating is replaced with the acetone steam corrosion, should be able to prepare high-quality, little contact angle and the bigger microlens products of size mutually.
According to one aspect of the present invention, a kind of lenticular preparation method is provided, this method comprises the following steps:
(1) on substrate, apply photoresist and adopt circular mask to carry out photoetching process, after developing, formation is by the photoresist material constitutes and its diameter equates with lenticular intended diameter boss structure on substrate;
(2) the formed boss structure of step (1) is carried out etching technics, wash photoresist then, on substrate, form boss structure thus by substrate material constitutes and its diameter equates with lenticular intended diameter;
(3) apply photoresist once more on whole substrate after handling and the said boss structure through step (2); And on said boss structure, adopt circular mask to carry out photoetching process; After developing, on said boss structure, form by the photoresist material constitute and its diameter less than the cylindrical structural of boss diameter;
(4) goods that step (3) obtained are placed in the acetone steam ambient, through the corrosion of acetone steam to said cylindrical structural, form the lenticule that possesses spherical cap structure thus;
(5) through etching technics or reverse mould technology the lenticule that the photoresist material constitutes is shifted the microlens products that corresponding formation finally makes.
Through above design; Owing to adopted acetone forms of corrosion replacement mode of heating; Like this along with the rising of acetone steam; Can constantly produce chemical reaction to the cylindrical structural that the photoresist material constitutes is corrosion process, correspondingly, can form the littler and surperficial more smooth spherical crown profile of contact angle.In addition, form lenticule, can guarantee final formed lenticular position and diameter dimension so on the one hand, random diffusion can not take place owing to adopted boss structure and carried out photoresist process above that; On the other hand with directly on substrate the mode of moulding spherical crown profile compare, control its registration error easily and be convenient to operation.
As further preferably, said substrate is silicon chip or glass substrate, when substrate is silicon chip, in step (2), adopts the inductively coupled plasma etching technics to carry out etching process; When substrate is glass substrate, in step (2), adopt reactive ion etching process to carry out etching process.
Through selecting inductively coupled plasma lithographic technique or reactive ion etching process to carry out etching process according to different substrate materials the etching technics of boss; Can adapt with the substrate material unique characteristics like this, fast and high quality ground is carried out the transfer of boss and is formed the goods of according with process requirements.
As further preferably, adopt in the process that the acetone steam corrodes said cylindrical structural in step (4), environment temperature is 20 ℃ ~ 70 ℃, corresponding etching time is 30 minutes ~ 1 minute.
Under the process conditions that adopt above number range, the acetone steam can fully be carried out the corrosion process to cylindrical structural, guarantees the moulding of lenticule spherical crown profile, is suitable for the operation under most of occasions simultaneously and working (machining) efficiency is provided.
As further preferably, adopt in the process that the acetone steam corrodes said cylindrical structural in step (4), environment temperature is 30 ℃ ~ 40 ℃, corresponding etching time is 10 minutes ~ 2 minutes.
Etching time is then too short less than 1 minute, and control accuracy is low, poor repeatability; Etching time is then oversize greater than 15 minutes, influences production efficiency.Show through more research and practice, be defined as above number range through technological parameter with acetone steam corrosion process, in practice can high efficiency, prepare satisfactory microlens products in high quality.
As further preferably; In step (4); The goods that step (3) is obtained are placed on the annular bearing part that possesses support with said cylindrical structural mode down; Then with one of which with being placed in the acetone steam ambient, through the acetone steam corrosion of cylindrical structural is formed the lenticule that possesses spherical cap structure thus.
Through above design; Because cylindrical structural places the acetone steam ambient down; Be convenient to so on the one hand and rise in the acetone steam between come in contact; Promote the carrying out of corrosiveness, on the other hand for the bigger cylindrical structural of diameter dimension, the gravity effect that the photoresist material is understood self helps the rapid shaping of spherical crown profile.In addition, can realize location and the transfer of goods in the acetone steam ambient, and be convenient to operation with simple structure.
As further preferably, said lenticular intended diameter is 10 μ m ~ 1mm, is preferably 300 μ m ~ 1mm.
Show that through test and practice preparation method of the present invention is suitable for preparing the for example lenticule of 10 μ m ~ 1mm of wider diameter scope; In addition, the lenticule of diameter about less than 300 μ m be because quality is too little, and the influence of gravity can be ignored, because the gravity effect, it is mobile to have strengthened photoresist, helps the spherical crown moulding for the lenticule of diameter about greater than 300 μ m.
As further preferably, in step (4) afterwards, can carry out annealing steps to the lenticule that constitutes by the photoresist material, further stablize the performance of photoresist thus.
Through carrying out annealing steps, photoresist solvent further evaporates, and the photoresist material becomes firmer.In addition, when said photoetching process and etching process in, the inner bubble that forms easily of photoresist.Get rid of these bubbles through carrying out annealing steps, strengthened the adhesiveness of photoresist material and substrate, reduced the sensitiveness of photoresist material environment.Correspondingly, when the lenticule that the photoresist material is constituted through etching technics or reverse mould technology shifted, especially the facial position of ball crown type was more stable and meet the microlens products of design standard can to obtain monnolithic case.
According to another aspect of the present invention, corresponding microlens products is provided, it is characterized in that the contact angle of the microlens products that finally makes is 1 ° ~ 20 °, its diameter is 10 μ m ~ 1mm.
According to lenticule preparation method of the present invention and products thereof, compared with prior art, its major advantage is:
1, finally the contact angle of prepared microlens products is little, is 1 ° ~ 20 °; In addition, this method be suitable for preparing 10 μ m ~ 1mm such one than the microlens products in the major diameter scope, be particularly suited for the lenticule that diameter is 300 μ m ~ 1mm;
2, compare with the conventional hot melt method, prepared lenticule face type error is littler, can guarantee the characteristic of its spherical crown profile; Owing in the preparation process, need not be heated to 100 ° of temperature more than the C, avoided the photoresist sex change, kept the possibility of further execution photoetching process;
3, the adhesiveness of the lenticule of photoresist material formation and substrate is good, and good stability is insensitive to environment, is not easy distortion or sex change, helps follow-up lenticule and shifts or reverse mould technology.
Description of drawings
Fig. 1 is that the present invention is used to prepare lenticular process method flow chart;
Fig. 2 is according to the prepared structures of samples sketch map of preparation method of the present invention;
Fig. 3 utilizes the acetone steam to form the sketch map of lenticular sphere profile according to the present invention;
Fig. 4 is the structural representation for the annular bearing body that is used to carry the lenticule sample;
Fig. 5 a is the sketch map according to the embodiment of the invention 1 prepared lenticule profile and sphere matched curve;
Fig. 5 b is the sketch map according to the embodiment of the invention 2 prepared lenticule profiles and sphere matched curve;
Fig. 5 c is the sketch map according to the embodiment of the invention 3 prepared lenticule profiles and sphere matched curve.
In institute's drawings attached, identical Reference numeral is used for representing components identical or structure, wherein:
1 substrate, 2 boss structures, 3 cylindrical structurals, 4 containers, 5 supports, 6 acetone
The specific embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Consider photoresist hot melt of the prior art and the existing deficiency of other lenticules preparation method, the present invention expects to propose a kind of improved preparation method, and corresponding acquisition contact angle be 1 the degree ~ 20 the degree, its diameter is the microlens products of 10 μ m ~ 1mm.
To specifically describe below according to lenticular preparation method of the present invention.
At first, on the substrate of for example silicon chip or glass substrate, apply photoresist, and adopt circular mask to carry out photoetching process.Like this after developing, on substrate, form by the photoresist material and constitute and its diameter and the lenticular intended diameter (boss structure of such as 10 μ m ~ 1mm) equate;
Then, formed boss structure is carried out etching technics, wash photoresist then, on substrate, form boss structure thus by substrate material constitutes and its diameter equates with lenticular intended diameter;
Then, on through whole substrate after the above step process and boss, apply photoresist once more, and on boss, adopt circular mask to carry out photoetching process.After developing, can obtain corresponding goods as shown in fig. 1 like this, also promptly on boss structure, form by the photoresist material constitute and its diameter less than the cylindrical structural of boss diameter;
Then; The goods that obtained are placed in the acetone steam ambient; Environment temperature is 20 ℃ ~ 70 ℃, preferred 30 ℃ ~ 40 ℃ for example; Through of the corrosion of acetone steam to said cylindrical structural, form the lenticule that possesses spherical cap structure thus, wherein corresponding etching time for example was respectively 30 minutes ~ 1 minute, 10 minutes ~ 2 minutes.
At last, through etching technics or reverse mould technology the lenticule that the photoresist material constitutes is shifted the microlens products that corresponding formation finally makes.
Through said method, through measuring, its contact angle of the microlens products that finally makes is 1 degree ~ 20 degree, and its diameter is 10 μ m ~ 1mm.
In a preferred implementation, as improvements of the present invention, can also on boss structure, form by the photoresist material constitute and the cylindrical structural of its diameter less than the boss diameter after, it is carried out annealing steps.Through carrying out annealing steps, photoresist solvent further evaporates, and the photoresist material becomes firmer.On the other hand, when said photoetching process and etching process in, the inner bubble that forms easily of photoresist.Get rid of these bubbles through carrying out annealing steps, strengthened the adhesiveness of photoresist material and substrate, reduced the sensitiveness of photoresist material environment.
In the another one preferred implementation, can adopt specific structure to carry out the acetone steam corrosion process of cylindrical structural.As shown in Figure 3, be used to carry the lenticule sample annular bearing body structure top for example ringwise, its underpart for example has three supports.When utilizing the acetone steam cylindrical structural to be carried out in the corrosion, can be placed on the annular bearing part that possesses support with goods that preceding step obtained with cylindrical structural mode down, then with one of which with being placed in the acetone steam ambient.Be convenient to so on the one hand with rise in the acetone steam between come in contact, the carrying out of promotion corrosiveness, on the other hand for the cylindrical structural of diameter dimension greater than 300 μ m, the gravity effect that the photoresist material is understood self helps the rapid shaping of spherical crown profile.
Be concrete embodiment more of the present invention below.
The first step, cleaning are the substrate 1 of silicon materials, and spin coating thickness is about the photoresist of 1 μ m on substrate 1, process the round boss that the photoresist material constitutes, its diameter equals lenticule intended diameter 1mm through photoetching process then.
Second step, employing inductively coupled plasma lithographic technique etch silicon substrate 1 form the boss structure 2 that silicon materials constitute thus on silicon chip, wash the photoresist material with acetone and ethanol then.The diameter of the boss structure of corresponding formation is 1mm, highly about 1 μ m.
The 3rd step, on whole silicon chip and boss structure 2 the spin coating photoresist, through photoetching process produce with boss structure concentric, constitute and diameter is about the cylindrical structural 3 of 600 μ m by the photoresist material.In this process, the thick about 33.5 μ m of the photoresist glue of institute's spin coating.
The 4th step, for example being plastic annular and the bearing part that has support 5 for example for placing one in the container 4 of beaker, pour acetone 6 into, make acetone 6 liquid levels be lower than the upper surface of bearing part slightly.Then, will be positioned on the bearing part, the column photoresist of sample surfaces fully is exposed in the acetone steam through the prepared sample face down ground of above step (also promptly with cylindrical structural 3 mode down).Under 30C ° of environment,, can be made into the lenticule that the photoresist material constitutes through 10 minutes acetone steam corrosions.
The 5th step, the lenticule after the moulding is placed in the air, slowly is heated to 160 ° of C with the speed of 2 ° of C/min.Under 160 ° of C environment, kept 20 minutes.Naturally cool to 25 ° of C then.Accomplish annealing steps.
The 6th goes on foot, through the inductively coupled plasma lithographic technique lenticule that the photoresist material constitutes is transferred on the silicon chip, forms the microlens products that silicon materials constitute.Through measuring, the diameter of this lenticule finished product is 1mm, and contact angle is about 6.2 °.
The substrate 1 of the first step, glass cleaning material, spin coating thickness is about 1 μ m photoresist on glass substrate 1, processes the round boss by the photoresist material constitutes, its diameter equals lenticule intended diameter 150 μ m through photoetching process then.
Second step, employing reactive ion etching process etching substrate 1 form the boss structure 2 that glass material constitutes on glass substrate, wash the photoresist material with acetone and ethanol then.The diameter of the boss structure of corresponding formation is 150 μ m, highly about 1 μ m.
The 3rd step, spin coating thickness is about the photoresist of 11 μ m on boss structure, produces the cylindrical structural 3 that the photoresist material constitutes through photoetching process, and the diameter of this cylindrical structural 3 is about 140 μ m.
The 4th step, for example be plastic annular and the bearing part that has support 5 for example, pouring the upper surface that liquid level that acetone 6 makes acetone 6 is lower than bearing part slightly into for placing one in the container 4 of beaker.To be positioned on the bearing part through the prepared sample face down of above step, the column photoresist of sample surfaces fully is exposed in the acetone steam.Under 40 degrees centigrade of environment,, process the lenticule that the photoresist material constitutes through 2 minutes acetone steam corrosions.
The 5th step, the lenticule after the moulding is placed in the air, slowly is heated to 160 ° of C with the speed of 2 ° of C/min.Under 160 ° of C environment, kept 20 minutes.Naturally cool to 25 ℃ then.
The 6th goes on foot, through reactive ion etching process the lenticule that the photoresist material constitutes is transferred on the substrate 1 of glass, forms the microlens products that glass material constitutes thus.Through measuring, the diameter of this lenticule finished product is 150 μ m, and contact angle is 15 °.
The substrate 1 of the first step, cleaning silicon materials, spin coating thickness is about 1 μ m photoresist on substrate 1, processes the round boss that the photoresist material constitutes through photoetching process then.
Second step, employing inductively coupled plasma lithographic technique etching substrate 1 form the boss structure 2 that silicon materials constitute on substrate, wash the photoresist material with acetone and ethanol then.The boss structure diameter that is obtained thus is 630 μ m, highly is about 1 μ m.
The 3rd the step, spin coating thickness is about the photoresist of 33.5 μ m on boss structure 2, through photoetching process produce with boss structure concentric, by the cylindrical structural 3 that the photoresist material constitutes, wherein the diameter of cylindrical structural is about 500 μ m.
The 4th step, for example being plastic annular and the bearing part that has support 5 for example for placing one in the container 4 of beaker, pour acetone 6 into, make acetone 7 liquid levels be lower than support 6 upper surfaces slightly.The sample face down is positioned on the support 6, the column photoresist of sample surfaces fully is exposed in the acetone steam.Under 35C ° of environment,, process the lenticule that the photoresist material constitutes through 3 minutes 30 seconds acetone steam corrosion.
The 5th step, the lenticule after the moulding is placed in the air, slowly is heated to 160 ° of C with the speed of 2 ° of C/min.Under 160 ° of C environment, kept 20 minutes.Naturally cool to 25 ℃ then.
The 6th step, the dimethyl silicone polymer after lenticule surface-coated one deck application of vacuum that the photoresist material constitutes; Baking dimethyl silicone polymer 1 hour solidifies realizing under the condition of 70 ° of C; Then take dimethyl silicone polymer off; Can obtain diameter is 630 μ m, and contact angle is 18.5 ° a lenticular reversing mould.Be that baking SU8 type photoresist was then poured the SU8 type photoresist of molten condition into to molten condition in 1 hour under the condition of 120 ° of C in the dimethyl silicone polymer reversing mould at baking temperature, be placed on ventilation wait SU8 type photoresist and solidify.At last, take poly dimethyl silane reversing mould off, obtain thus constituting by the SU8 material, diameter is that 630 μ m and contact angle are 18.5 ° lenticule finished product.
Respectively referring to Fig. 4 a, 4b and 4c, shown according to prepared lenticule profile of the present invention and the relation between the sphere matched curve.Can find out from these figure,, can prepare high-quality, little contact angle and the bigger microlens products of size through lenticule preparation method of the present invention.
Those skilled in the art will readily understand; The above is merely preferred embodiment of the present invention; Not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. lenticular preparation method, this method comprises the following steps:
(1) on substrate, apply photoresist and adopt circular mask to carry out photoetching process, after developing, formation is by the photoresist material constitutes and its diameter equates with lenticular intended diameter boss structure on substrate;
(2) the formed boss structure of step (1) is carried out etching technics, wash photoresist then, on substrate, form boss structure thus by substrate material constitutes and its diameter equates with lenticular intended diameter;
(3) apply photoresist once more on whole substrate after handling and the said boss structure through step (2); And on said boss structure, adopt circular mask to carry out photoetching process; After developing, on said boss structure, form by the photoresist material constitute and its diameter less than the cylindrical structural of boss diameter;
(4) goods that step (3) obtained are placed in the acetone steam ambient, through the corrosion of acetone steam to said cylindrical structural, form the lenticule that possesses spherical cap structure thus;
(5) through etching technics or reverse mould technology the lenticule that the photoresist material constitutes is shifted the microlens products that corresponding formation finally makes.
2. preparation method as claimed in claim 1 is characterized in that, said substrate is silicon chip or glass substrate, when substrate is silicon chip, in step (2), adopts the inductively coupled plasma etching technics to carry out etching process; When substrate is glass substrate, in step (2), adopt reactive ion etching process to carry out etching process.
3. according to claim 1 or claim 2 preparation method is characterized in that, adopts in the process that the acetone steam corrodes said cylindrical structural in step (4), and environment temperature is 20 ℃ ~ 70 ℃, and corresponding etching time is 30 minutes ~ 1 minute.
4. preparation method as claimed in claim 3 is characterized in that, in the process that step (4) employing acetone steam corrodes said cylindrical structural, environment temperature is 30 ℃ ~ 40 ℃, and corresponding etching time is 10 minutes ~ 2 minutes.
5. like any described preparation method of claim 1-4; It is characterized in that; In step (4); The goods that step (3) is obtained are placed into said cylindrical structural mode down on the annular bearing part that possesses support, then with one of which with being placed in the acetone steam ambient, through the acetone steam corrosion of cylindrical structural is formed the lenticule that possesses spherical cap structure thus.
6. like any described preparation method of claim 1-5, it is characterized in that said lenticular intended diameter is 10 μ m ~ 1mm, be preferably 300 μ m ~ 1mm.
7. preparation method as claimed in claim 1 is characterized in that, in step (4) afterwards, can carry out annealing steps to the lenticule that is made up of the photoresist material, further stablizes the performance of photoresist thus.
8. one kind is passed through to it is characterized in that like claim 6 or the prepared microlens products of 7 described methods the contact angle of the microlens products that finally makes is 1 ° ~ 20 °, and its diameter is 10 μ m ~ 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210207100.2A CN102730629B (en) | 2012-06-21 | 2012-06-21 | Microlens preparation method and its product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210207100.2A CN102730629B (en) | 2012-06-21 | 2012-06-21 | Microlens preparation method and its product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102730629A true CN102730629A (en) | 2012-10-17 |
| CN102730629B CN102730629B (en) | 2015-01-28 |
Family
ID=46987038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210207100.2A Expired - Fee Related CN102730629B (en) | 2012-06-21 | 2012-06-21 | Microlens preparation method and its product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102730629B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103774A (en) * | 2013-04-10 | 2014-10-15 | 江苏稳润光电有限公司 | Integration method of flexible microlens array and OLED array, and product thereof |
| CN104591077A (en) * | 2013-10-31 | 2015-05-06 | 中国科学院物理研究所 | Manufacturing method of lens for collecting color center single photons |
| CN105974745A (en) * | 2016-05-25 | 2016-09-28 | 王宏兴 | Micro lens and preparation method therefor, and experimental facility |
| CN112034541A (en) * | 2020-10-15 | 2020-12-04 | 苏州苏纳光电有限公司 | Method and system for preparing silicon microlens product by photoresist hot melting method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5286338A (en) * | 1993-03-01 | 1994-02-15 | At&T Bell Laboratories | Methods for making microlens arrays |
| US20040251233A1 (en) * | 2001-07-24 | 2004-12-16 | Frank Singer | Method for the production of a lens |
| US20050191784A1 (en) * | 2004-02-27 | 2005-09-01 | Fuji Photo Film Co., Ltd. | Method of and apparatus for producing micro lens and micro lens |
| JP2005321710A (en) * | 2004-05-11 | 2005-11-17 | Nikon Corp | Manufacturing method of photoresist lens, manufacturing method of lens, manufacturing method of die, optical device and projection exposure system |
| CN101144978A (en) * | 2007-10-17 | 2008-03-19 | 中国科学院光电技术研究所 | Method for forming microlens array structure |
| CN101336381A (en) * | 2005-11-28 | 2008-12-31 | 光州科学技术院 | Method for fabricating micro-lens and micro-lens integrated optoelectronic devices using selective etch of compound semiconductor |
-
2012
- 2012-06-21 CN CN201210207100.2A patent/CN102730629B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5286338A (en) * | 1993-03-01 | 1994-02-15 | At&T Bell Laboratories | Methods for making microlens arrays |
| US20040251233A1 (en) * | 2001-07-24 | 2004-12-16 | Frank Singer | Method for the production of a lens |
| US20050191784A1 (en) * | 2004-02-27 | 2005-09-01 | Fuji Photo Film Co., Ltd. | Method of and apparatus for producing micro lens and micro lens |
| JP2005321710A (en) * | 2004-05-11 | 2005-11-17 | Nikon Corp | Manufacturing method of photoresist lens, manufacturing method of lens, manufacturing method of die, optical device and projection exposure system |
| CN101336381A (en) * | 2005-11-28 | 2008-12-31 | 光州科学技术院 | Method for fabricating micro-lens and micro-lens integrated optoelectronic devices using selective etch of compound semiconductor |
| CN101144978A (en) * | 2007-10-17 | 2008-03-19 | 中国科学院光电技术研究所 | Method for forming microlens array structure |
Non-Patent Citations (1)
| Title |
|---|
| 许乔等: ""扩展微透镜数值孔径范围的阶梯光刻热熔法研究"", 《光学学报》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103774A (en) * | 2013-04-10 | 2014-10-15 | 江苏稳润光电有限公司 | Integration method of flexible microlens array and OLED array, and product thereof |
| CN104591077A (en) * | 2013-10-31 | 2015-05-06 | 中国科学院物理研究所 | Manufacturing method of lens for collecting color center single photons |
| CN104591077B (en) * | 2013-10-31 | 2016-09-28 | 中国科学院物理研究所 | Preparation method for the lens that colour center single photon is collected |
| CN105974745A (en) * | 2016-05-25 | 2016-09-28 | 王宏兴 | Micro lens and preparation method therefor, and experimental facility |
| CN112034541A (en) * | 2020-10-15 | 2020-12-04 | 苏州苏纳光电有限公司 | Method and system for preparing silicon microlens product by photoresist hot melting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102730629B (en) | 2015-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101339364B (en) | Method for manufacturing microlens array by soft mode impressing | |
| CN102730629A (en) | Microlens preparation method and its product | |
| CN101870151A (en) | Manufacturing method of optical element and impressing mould | |
| CN101481079A (en) | Preparation of micro-nano lens array | |
| SG183819A1 (en) | Method and device for producing a micro-lens | |
| CN103913784A (en) | Method for preparing polymer micro lens array | |
| US20150131034A1 (en) | Apparatus and method for manufacturing micro lens array, and micro lens array manufactured using the same | |
| CN103955014B (en) | A kind of method for making of microlens array | |
| CN104199130B (en) | A kind of manufacture method of PDMS lens | |
| CN103064137A (en) | Electric field induction imprinting method of aspheric surface micro-lens array | |
| CN103217874B (en) | Maskless lithography system based on colloid micro ball nano lens | |
| TWI289683B (en) | Method for fabricating microlens arrays | |
| CN113126188A (en) | Curved fly-eye lens and preparation method thereof | |
| CN110568530A (en) | Curved surface bionic compound eye processing method based on die forming | |
| US20090278269A1 (en) | Method for manufacturing mold | |
| CN103995305A (en) | Micro lens manufacturing method | |
| CN110596905A (en) | Random micro-lens array structure for light beam homogenization and manufacturing method thereof | |
| CN114527525A (en) | Method for making artificial compound eye | |
| CN105449011A (en) | Solar cell micro-lens array film and fabrication method thereof | |
| CN102096125A (en) | Manufacturing method and device of light-focusing Fresnel lens | |
| CN103197362B (en) | Electric field induction rheology forming method of paraboloid-like microlens array | |
| JP2005527459A (en) | Method for making a product having a structured surface | |
| Xia et al. | Fabrication of polymer compound microlens by lens-on-lens microstructures | |
| Dai et al. | Rapid fabrication of mini droplet lens array with tunable focal length | |
| Li et al. | Fabrication method of low f-number microlens arrays by using surface coating and epoxy dispensing technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20170621 |