CN102729713B - 电子装置壳体及其制造方法 - Google Patents

电子装置壳体及其制造方法 Download PDF

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CN102729713B
CN102729713B CN201110080427.3A CN201110080427A CN102729713B CN 102729713 B CN102729713 B CN 102729713B CN 201110080427 A CN201110080427 A CN 201110080427A CN 102729713 B CN102729713 B CN 102729713B
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electronic device
case
matrix
depression
laser engraving
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CN102729713A (zh
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刘伟
张松
陈明明
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Shenzhen Futaihong Precision Industry Co Ltd
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
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    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
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Abstract

本发明提供一种电子装置壳体，其包括基体，所述基体表面具有通过激光雕刻的方法形成的多个凹陷，所述多个凹陷组合形成图案，所述多个凹陷在基体表面的分布由疏至密渐变或由密至疏渐变，每一凹陷的孔径为0.02-0.04mm，每一凹陷的深度在0.05-0.1mm之间，相邻二凹陷之间的间距可在0.2-2mm之间。本发明还提供了上述电子装置壳体的制造方法。

Description

电子装置壳体及其制造方法
技术领域
本发明涉及一种电子装置壳体及其制造方法。
背景技术
为了使电子装置（如手机）获得较好的外观效果，通常在其壳体上制作各种装饰性图案。现有的方法一般是通过阳极氧化、电泳涂装、喷漆等表面处理在金属壳体表面形成某种颜色的图案。其中，多次阳极氧化处理虽然可获得具有多种色彩的图案、甚至具有渐变效果的图案，但制程过于复杂。而电泳涂装与喷漆获得的装饰层的颜色缺乏变化和多样性。随着消费水平的提高，这种外观已经不能满足消费者对这些产品的外观追求。
发明内容
有鉴于此，有必要提供一种具有渐变效果图案的电子装置壳体。
另外，还有必要提供一种上述电子装置壳体的制造方法。
一种电子装置壳体，其包括基体，所述基体表面通过激光雕刻的方法形成有多个凹陷，所述多个凹陷组合形成图案，所述多个凹陷在基体表面的分布由疏至密渐变或由密至疏渐变，每一凹陷的孔径为0.02-0.04mm，每一凹陷的深度在0.05-0.1mm之间，相邻二凹陷之间的间距在0.2-2mm之间。
一种电子装置壳体的制造方法，包括如下步骤：
提供金属基体；
通过激光雕刻的方法，于该基体表面形成多个凹陷，所述多个凹陷组合形成图案，所述多个凹陷在基体表面的分布由疏至密渐变或由密至疏渐变，每一凹陷的孔径为0.02-0.04mm，每一凹陷的深度在0.05-0.1mm之间，相邻二凹陷之间的间距在0.2-2mm之间。
经上述方法制得的电子装置壳体，其表面呈现出渐变效果的图案，极大地提高了产品的外观吸引力及竞争力；且该制造方法简单。
附图说明
图1为本发明一较佳实施例电子装置壳体的剖视示意图。
主要元件符号说明
电子装置壳体 100
基体 10
凹陷 11
颜色层 12
保护层 14
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明一较佳实施方式的电子装置壳体100包括基体10及形成于该基体10上的保护层14。所述的电子装置壳体100可以是手机、PDA、笔记本电脑、MP3、MP4、GPS导航仪、蓝牙耳机及数码相机等产品的壳体。该基体10为金属基体，该金属优选为不锈钢、铝或铝合金。
该基体10表面通过激光雕刻的方法形成有多个凹陷11，该多个凹陷11密集地分布于基体10的表面，每一凹陷11的孔径为0.02-0.04mm，每一凹陷11的深度在0.05-0.1mm之间，相邻二凹陷11之间的间距可在0.2-2mm之间，且每相邻的二凹陷11之间的间距由基体10表面的一端向相对的另一端逐渐变小或增大，或者每相邻的二凹陷11之间的间距由邻近基体10表面的中心向周围逐渐变小或增大，即多个凹陷11在基体10表面的分布由疏至密渐变或由密至疏渐变，使得所述电子装置壳体100的外观呈现出渐变的图案。
该保护层14用以保护基体10表面，该保护层14为透明的聚氨酯层，其厚度可为20-30μm。
该电子装置壳体100还包括形成于基体10与保护层14之间的颜色层12，该颜色层12用以使所述渐变图案呈现出一定的色彩。为了保证所述颜色层12不影响电子装置壳体100的图案的渐变效果，该颜色层12应为浅色调或为半透明。
本发明一较佳实施例的所述电子装置壳体100的制造方法主要包括如下步骤：
提供一基体10。该基体10具有所需电子装置壳体100的结构及形状。该基体10为金属基体，该金属优选为不锈钢、铝或铝合金。
制作一模板图案。该模板图案可通过常规的制作模板图案的方式形成，且该模板图案呈现渐变效果。
以激光雕刻的方式于基体10表面形成渐变图案，其可通过如下方式实现：提供一激光雕刻机，将经上述处理后的模板图案导入激光雕刻机（图未示）的雕刻专用操作软件中，该雕刻专用操作软件通过识别所导入的模板图案不同像素点的灰度值，从而于基体10表面形成呈疏密排布的多个凹陷11。所述多个凹陷11组合形成所需的如上所述的渐变图案。
为了使形成的图案呈现出渐变效果，所述凹陷11的孔径范围在0.02-0.04mm之间，相邻两个凹陷11之间的间距范围在0.2-2mm之间。
在激光雕刻过程中，激光频率为1000-30000Hz，激光功率为5-20W，激光扫描速度为200-500mm/s，激光扫描的能量为0.2-2mJ，聚焦处激光光斑孔径为0.02-0.04mm。
于该基体10上形成透明的保护层14。该保护层14通过喷涂油漆的方式形成。用以形成保护层14的油漆可为聚氨酯漆，其具有较高的硬度，从而可起到较好的表面保护作用。该保护层14的厚度可为20-30μm。
为了使该电子装置壳体100呈现出不同的色彩，该电子装置壳体100的制造方法还包括于该基体10与保护层14之间形成颜色层12。该颜色层12可通过喷涂、油墨印刷及真空镀膜等方法形成。
经上述方法制得的电子装置壳体100，其表面呈现出具有一定色彩的渐变效果的图案，给人以一种时尚化及美的享受，极大地提高了产品的外观吸引力及竞争力；且该制造方法简单。

Claims (10)

1.一种电子装置壳体，其包括基体，所述基体表面通过激光雕刻的方法形成有多个凹陷，所述多个凹陷组合形成图案，其特征在于：所述多个凹陷在基体表面的分布由疏至密渐变或由密至疏渐变，每一凹陷的孔径为0.02-0.04mm，每一凹陷的深度在0.05-0.1mm之间，相邻二凹陷之间的间距在0.2-2mm之间。
2.如权利要求1所述的电子装置壳体，其特征在于：所述电子装置壳体还包括形成于基体上的保护层。
3.如权利要求2所述的电子装置壳体，其特征在于：所述保护层为透明的聚氨酯层。
4.如权利要求2所述的电子装置壳体，其特征在于：所述电子装置壳体还包括形成于基体与保护层之间的颜色层。
5.如权利要求4所述的电子装置壳体，其特征在于：该颜色层的色彩为浅色调或半透明。
6.如权利要求5所述的电子装置壳体，其特征在于：所述颜色层通过喷涂、油墨印刷及真空镀膜中的一种方式形成。
7.如权利要求1所述的电子装置壳体，其特征在于：所述基体为金属基体。
8.一种电子装置壳体的制造方法，包括如下步骤：
提供金属基体；
通过激光雕刻的方法，于该基体表面形成多个凹陷，所述多个凹陷组合形成图案，所述多个凹陷在基体表面的分布由疏至密渐变或由密至疏渐变，每一凹陷的孔径为0.02-0.04mm，每一凹陷的深度在0.05-0.1mm之间，相邻二凹陷之间的间距在0.2-2mm之间。
9.如权利要求8所述的电子装置壳体的制造方法，其特征在于：激光雕刻形成所述多个凹陷的工艺参数为：激光雕刻频率为1000-30000Hz，激光雕刻功率为5-20W，激光扫描速度为200-500mm/s，扫描能量为0.2-2mJ，聚焦处激光光斑孔径为0.02-0.04mm。
10.如权利要求8所述的电子装置壳体的制造方法，其特征在于：该电子装置壳体的制造方法还包括激光雕刻后依次于基体表面形成颜色层及保护层的步骤。
CN201110080427.3A 2011-03-31 2011-03-31 电子装置壳体及其制造方法 Expired - Fee Related CN102729713B (zh)

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