CN102725804B - 用于高功率耗散的带有端子的表面安装电阻及其制造方法 - Google Patents

用于高功率耗散的带有端子的表面安装电阻及其制造方法 Download PDF

Info

Publication number
CN102725804B
CN102725804B CN201080062542.1A CN201080062542A CN102725804B CN 102725804 B CN102725804 B CN 102725804B CN 201080062542 A CN201080062542 A CN 201080062542A CN 102725804 B CN102725804 B CN 102725804B
Authority
CN
China
Prior art keywords
resistive element
thermal
terminal
terminals
thermal pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080062542.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102725804A (zh
Inventor
C·L·史密斯
T·L·怀亚特
T·L·伯奇
R·J·布龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Dale Electronics LLC
Original Assignee
Vishay Dale Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Dale Electronics LLC filed Critical Vishay Dale Electronics LLC
Publication of CN102725804A publication Critical patent/CN102725804A/zh
Application granted granted Critical
Publication of CN102725804B publication Critical patent/CN102725804B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
CN201080062542.1A 2009-12-28 2010-11-08 用于高功率耗散的带有端子的表面安装电阻及其制造方法 Expired - Fee Related CN102725804B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29042909P 2009-12-28 2009-12-28
US61/290,429 2009-12-28
PCT/US2010/055804 WO2011081714A1 (en) 2009-12-28 2010-11-08 Surface mount resistor with terminals for high-power dissipation and method for making same

Publications (2)

Publication Number Publication Date
CN102725804A CN102725804A (zh) 2012-10-10
CN102725804B true CN102725804B (zh) 2015-10-21

Family

ID=43478325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080062542.1A Expired - Fee Related CN102725804B (zh) 2009-12-28 2010-11-08 用于高功率耗散的带有端子的表面安装电阻及其制造方法

Country Status (8)

Country Link
US (2) US8325007B2 (https=)
EP (1) EP2519956B1 (https=)
JP (1) JP2013516068A (https=)
KR (1) KR20120103728A (https=)
CN (1) CN102725804B (https=)
IL (1) IL220667A (https=)
TW (1) TWI435340B (https=)
WO (1) WO2011081714A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5781877B2 (ja) * 2011-09-22 2015-09-24 日本特殊陶業株式会社 配線基板の製造方法
US8994490B2 (en) 2012-08-30 2015-03-31 Smiths Interconnect Microwave Components, Inc. Chip resistor with outrigger heat sink
US8823483B2 (en) 2012-12-21 2014-09-02 Vishay Dale Electronics, Inc. Power resistor with integrated heat spreader
US9102088B2 (en) 2013-08-20 2015-08-11 Sabritec Molded insulator
CN104051099A (zh) * 2014-06-27 2014-09-17 深圳市业展电子有限公司 大功率精密合金贴片电阻器的制作方法
JP6398749B2 (ja) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 抵抗器及び抵抗器の製造方法
US10083781B2 (en) * 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
JP6573957B2 (ja) * 2017-12-12 2019-09-11 Koa株式会社 抵抗器の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1492103A2 (en) * 2003-06-25 2004-12-29 Sony Corporation Domain wall displacement detection system magneto-optical recording medium and its manufacturing method
US6925704B1 (en) * 2003-05-20 2005-08-09 Vishay Dale Electronics, Inc. Method for making high power resistor having improved operating temperature range
CN101026028A (zh) * 2006-02-24 2007-08-29 Koa株式会社 设有电阻元件的电子器件及其制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US942156A (en) * 1909-03-29 1909-12-07 Cutler Hammer Mfg Co Grid resistance.
US4087778A (en) * 1976-04-05 1978-05-02 Trw Inc. Termination for electrical resistor and method of making the same
US4130671A (en) * 1977-09-30 1978-12-19 The United States Of America As Represented By The United States Department Of Energy Method for preparing a thick film conductor
US4801469A (en) * 1986-08-07 1989-01-31 The United States Of America As Represented By The Department Of Energy Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors
US5287083A (en) * 1992-03-30 1994-02-15 Dale Electronics, Inc. Bulk metal chip resistor
TW253088B (https=) 1992-10-02 1995-08-01 Ericsson Telefon Ab L M
DE4339551C1 (de) * 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
US5604477A (en) 1994-12-07 1997-02-18 Dale Electronics, Inc. Surface mount resistor and method for making same
JPH08222401A (ja) 1995-02-14 1996-08-30 Toshiba Corp 高周波回路装置
JPH10229001A (ja) * 1997-02-14 1998-08-25 Hokuriku Electric Ind Co Ltd 表面実装型固定抵抗器
EP1901314B1 (en) * 1997-10-02 2009-08-12 Panasonic Corporation Resistor and its manufacturing method
US5990780A (en) * 1998-02-06 1999-11-23 Caddock Electronics, Inc. Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts
JP4233776B2 (ja) * 2001-09-12 2009-03-04 株式会社村田製作所 回路形成基板
TWI253088B (en) 2001-12-26 2006-04-11 Fuh-Chyang Chern Manufacture method and structure of the metal strip resistor
AU2002324848A1 (en) * 2002-09-03 2004-03-29 Vishay Intertechnology, Inc. Flip chip resistor and its manufacturing method
DE10328870A1 (de) 2003-06-26 2005-01-20 Isabellenhütte Heusler GmbH KG Widerstandsanordnung, Herstellungsverfahren und Messschaltung
JP4452196B2 (ja) * 2004-05-20 2010-04-21 コーア株式会社 金属板抵抗器
US7190252B2 (en) 2005-02-25 2007-03-13 Vishay Dale Electronics, Inc. Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same
JP4887748B2 (ja) * 2005-11-15 2012-02-29 パナソニック株式会社 抵抗器
JP2008235523A (ja) 2007-03-20 2008-10-02 Koa Corp 抵抗素子を有する電子部品およびその製造法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6925704B1 (en) * 2003-05-20 2005-08-09 Vishay Dale Electronics, Inc. Method for making high power resistor having improved operating temperature range
EP1492103A2 (en) * 2003-06-25 2004-12-29 Sony Corporation Domain wall displacement detection system magneto-optical recording medium and its manufacturing method
CN101026028A (zh) * 2006-02-24 2007-08-29 Koa株式会社 设有电阻元件的电子器件及其制造方法

Also Published As

Publication number Publication date
JP2013516068A (ja) 2013-05-09
KR20120103728A (ko) 2012-09-19
EP2519956B1 (en) 2015-01-28
IL220667A (en) 2015-11-30
EP2519956A1 (en) 2012-11-07
US20130091696A1 (en) 2013-04-18
HK1177547A1 (zh) 2013-08-23
US20110156860A1 (en) 2011-06-30
TWI435340B (zh) 2014-04-21
TW201135758A (en) 2011-10-16
CN102725804A (zh) 2012-10-10
WO2011081714A1 (en) 2011-07-07
US8325007B2 (en) 2012-12-04

Similar Documents

Publication Publication Date Title
CN102725804B (zh) 用于高功率耗散的带有端子的表面安装电阻及其制造方法
CN101128890B (zh) 带有导热但不导电填料的表面贴装电阻器及其生产方法
EP2279648B1 (en) Thick film high temperature thermoplastic insulated heating element
US20130048342A1 (en) Circuit board
JP7300659B2 (ja) 特注の抵抗を伴う厚膜抵抗器及び製造方法
KR20150132089A (ko) 집적된 열 확산기를 구비한 파워 저항기
US20140141548A1 (en) Method of manufacturing a metal clad circuit board
CN111465999B (zh) 电阻器的制造方法
HK1177547B (en) Surface mount resistor with terminals for high-power dissipation and method for making same
CN111937499A (zh) 具有跳线的电气装置
HK1112106B (en) Surface mount electrical resistor with thermally conductive, electrically non-conductive filler and method for producing the same
CN111465998A (zh) 电阻器的制造方法和电阻器
JP2001148279A (ja) セラミックヒータ
HK1153344A (en) Thick film high temperature thermoplastic insulated heating element
HK1153344B (en) Thick film high temperature thermoplastic insulated heating element

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1177547

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1177547

Country of ref document: HK

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151021

Termination date: 20161108

CF01 Termination of patent right due to non-payment of annual fee