CN102718182A - Large-area-friction-induced micron-scale processing equipment in multipoint contact mode - Google Patents
Large-area-friction-induced micron-scale processing equipment in multipoint contact mode Download PDFInfo
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- CN102718182A CN102718182A CN201210236729XA CN201210236729A CN102718182A CN 102718182 A CN102718182 A CN 102718182A CN 201210236729X A CN201210236729X A CN 201210236729XA CN 201210236729 A CN201210236729 A CN 201210236729A CN 102718182 A CN102718182 A CN 102718182A
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Abstract
The invention relates to large-area-friction-induced micron-scale processing equipment in a multipoint contact mode. The large-area-friction-induced micron-scale processing equipment consists of a base, a processing platform drive device, a loading mechanism and a data acquisition and control system, wherein the processing platform drive device consists of a horizontal two-dimensional electronically-controlled translation stage, a manual three-dimensional displacement stage and an L-shaped sample stage; the loading mechanism is formed in a manner that an electric angular displacement stage is arranged on the upper surface of the base, the fixed end of a force-sensitive cantilever beam is fixed on the horizontal working surface of the electric angular displacement stage, and a probe array is fixed on the lower surface of the end part of the free end of the cantilever beam; a laser displacement sensor is located right above the end part of the free end of the cantilever beam; and the horizontal two-dimensional electronically-controlled translation stage, the electric angular displacement stage and the laser displacement sensor are all electrically connected with the data acquisition and control system. The equipment has the advantages of large processing size, high processing efficiency, accuracy in load control, evenness in load distribution and evenness and consistency for processed structures.
Description
Technical field
The present invention relates to a kind of micron order process equipment, relate in particular to the large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode.
Background technology
Nanosecond science and technology have been started 21 century human lives's New Times, and its development not only will impel the revolution of human cognitive, also are the human important assurances that realizes sustainable development.Based on its vast potential for future development and to the significance of the national future economy, social development and national defense safety; Countries in the world have worldwide started the research boom of nanosecond science and technology one after another with the research and development of the nanosecond science and technology important driving force as technological innovation.And the nanometer manufacturing is to realize nanosecond science and technology by the approach of the principle of work and power to the conversion of manufacturing principle, also is to support the basis that nanosecond science and technology are moved towards application.Therefore no matter, develop novel nanoprocessing equipment, be the research realization for high accuracy, low cost and high efficiency innovation nanoprocessing method, has crucial meaning.
Friction induction micro-/ nano process technology is a kind of brand-new processing method, and this method just can directly be processed male structure at material surfaces such as monocrystalline silicon, quartz, glass through mechanical scratching.In addition, behind scored area or the nanometer male structure process KOH solution corrosion, can form darker recessed structure or higher male structure.With most important bill of materials crystal silicon in the micro-/ nano manufacturing field is example, and its surface is through after delineating, and mechanically deform and friction chemical reaction have taken place the material of friction area.In follow-up KOH solution corrosion process, friction area has the effect of anti-KOH corrosion, thereby is not corroded and forms the micro of certain altitude.This method does not rely on and adds mask plate and loaded down with trivial details work flow, does not need environmental factors such as controlled humidity, vacuum in the process.Obviously, this technology has that processing cost is low, technology is simple, be easy to advantage such as popularization, is a kind of micro-/ nano processing method that has potentiality.
At present, friction induction micro-/ nano process technology is mainly accomplished by scanning probe microscopy, and this equipment can only be worked under single probe patterns, has seriously limited its working (machining) efficiency.And process velocity is slow, and efficient is lower, and its range of work generally can not surpass 100 microns, be difficult to reach the mass production requirement, has hindered the application of friction induction micro-/ nano process technology.
Summary of the invention
The purpose of this invention is to provide the large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode, this equipment both can carry out under single probe patterns, also can under the multiprobe pattern, carry out, and processing dimension is big, and working (machining) efficiency is high; And its Load Control accurately, be evenly distributed the even structure that processes, unanimity.
The technical solution adopted for the present invention to solve the technical problems is: the large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode; Form by the processing platform drive unit on pedestal, the pedestal, load maintainer and data acquisition and control system on the pedestal, wherein:
The formation of described processing platform drive unit is: the horizontal two-dimension electronic control translation stage is by the upper surface of bolt in pedestal, and manually the base plate of three-D displacement platform is fixed in the upper surface of horizontal two-dimension electronic control translation stage through connecting plate; Manually the riser of three-D displacement platform is fixedly connected with the riser of the sample stage of " L " type;
The formation of described load maintainer is: electronic angular displacement platform is fixed in the upper surface of pedestal through boss; The stiff end screw thread of the cantilever beam of force sensitive is fixed on the tiltable horizontal operation face of electronic angular displacement platform, and probe array is fixed in the lower surface of cantilever beam free end end; Laser displacement sensor is connected on the pedestal through support, laser displacement sensor be positioned at cantilever beam free end end directly over; The transverse slat of the sample stage of " L " type of the end of cantilever beam and processing platform drive unit is relative;
Described horizontal two-dimension electronic control translation stage, electronic angular displacement platform, laser displacement sensor all are electrically connected with data acquisition and control system.
The course of work of the present invention and principle are following:
Monocrystalline silicon, quartz or the glass flake material of need processing are fixed on the transverse slat of sample stage; Move on horizontal plane through data acquisition and control system control horizontal two-dimension electronic control translation stage, make thin slice to be processed be positioned at the below of the probe array on the cantilever beam; The manual three-D displacement platform of manual adjustment makes thin slice to be processed accurately aim at the probe array on the cantilever beam again; Control the angle of the downward-sloping setting of automatically controlled angular displacement platform through data acquisition and control system; The manual three-D displacement platform of manual adjustment; Make processed sheet surface contact probe sequence produce interaction force; And detect the deformation of cantilever beam through laser displacement sensor; By the size of data acquisition and control system-computed slice and probe sequence interaction force, when reaching setting load, accomplish initial work.After this by data acquisition and control system control horizontal two-dimension electronic control translation stage, move, realize accurate FEEDBACK CONTROL, accomplish the large tracts of land friction induction micron order scanning processing under the multiple spot contact mode load by the graphics track of setting.
Thin slice after again scanning being machined corrodes, and can be processed into the thin slice with specific micron order male structure.
Compared with prior art, the invention has the beneficial effects as follows:
One, probe sequence of the present invention can be made up of single probe, more can be made up of multiprobe, so this equipment can be worked under single probe (single-point contact) pattern and multiprobe (multiple spot contacts) pattern.The contact friction that single motion scan process is promptly accomplished the repeatedly motion scan process under the single-point contact mode under the multiple spot contact mode is induced, and working (machining) efficiency improves greatly, and processing cost is low; And can regulate needle point number, size, the spacing of probe sequence quickly and easily according to process requirements, to adapt to different processing dimensions, required precision; The moving range maximum of horizontal two-dimension electronic control translation stage can reach 50mm, and translational speed can reach 10mm/s, is much higher than the moving range of scanning probe microscopy 0.1mm and the translational speed of 0.1mm/s.
Two, cantilever beam is fixed on the electronic angular displacement platform; According to the processing magnitude of load; It is downward-sloping to regulate cantilever beam in advance, can guarantee to offset the upwards deformation of cantilever beam after stressed, make the needle point sequence in the delineation process all the time with thin slice keeping parallelism state to be processed; Thereby guarantee that probe sequence is stressed evenly, the feasible thin slice male structure uniformity that processes.
Three, in the initialization loading procedure; The laser beam vertical irradiation of laser displacement sensor posts on the highly sensitive cantilever beam of probe array below; Measure the deformation of cantilever beam, and then extrapolate the accurate control of the interaction force realization of probe sequence and thin slice to be processed load; Its Load Control precision can be up to 7mN.
Four, in carrying out the friction induction process by the real-time test load value of laser displacement sensor, if load value surpasses preset safety value, the acquisition and control system control appliance shuts down automatically.Must be adjusted to normal condition by operating personnel and just can work on, thereby prevent that critical component is damaged, improve the operational reliability of equipment.
Five, this equipment is processed the influence that does not receive extraneous factors such as ambient humidity, temperature to micron order, does not more need severe rugged environments such as high vacuum, has significantly reduced operation easier and processing cost.And do not rely on the electric conductivity of material and probe array, significantly widened the scope of application of equipment.
Above-mentioned horizontal two-dimension electronic control translation stage is by two overlapping connecting and composing of orthogonal electronic control translation stage.
This two-dimentional electronic control translation stage is simple in structure, and control is accurately convenient, and the least displacement step-length can reach 0.625 μ m, and the maximum displacement scope can reach 50mm, the maximum 10kg that carries, and maximum translational speed can reach 10mm/s.
Above-mentioned laser displacement sensor through the concrete mode that support is connected on the pedestal is: the bottom of support is fixed on the Magnetic gauge stand of belt switch, and Magnetic gauge stand places on the pedestal.
Through Magnetic gauge stand and support, the position that laser displacement sensor is fixed on setting that both can be firm, the switch of cutting out Magnetic gauge stand simultaneously can take off laser displacement sensor and support thereof and move from pedestal easily again.
The concrete formation of the cantilever beam of above-mentioned force sensitive is: the free end of cantilever beam is the quadrilateral structure of two cantilevers; The zone line of upper and lower cantilever hollows out; And the longitudinal middle part at position hollows out near the left and right end; The place of not hollowing out, front and back fluting, the thinnest part thickness of fluting is 0.10-0.20mm; Lower cantalever is also paid the thin slice that forms 8-15mm * 8-15mm size, and probe array is fixed in the lower surface of this thin slice.
This structure makes that the coefficient of elasticity of cantilever beam is low, and is responsive to power, cooperates laser displacement sensor to reflect and is low to moderate the 7mN load change, guaranteed that load of the present invention applies precision.
Below in conjunction with accompanying drawing and concrete embodiment the present invention is done further detailed description.
Description of drawings
Fig. 1 is the main TV structure sketch map of the embodiment of the invention.
Fig. 2 A be the embodiment of the invention cantilever beam 6 overlook the structure for amplifying sketch map.
Fig. 2 B is the A-A cutaway view of Fig. 2.
Fig. 3 A is that the process equipment of the embodiment of the invention carries out the partial 3-D shape appearance figure that face scans the gained nanostructured to silicon (100) single-chip under the single-point contact mode.
Fig. 3 B is the section profile figure of Fig. 3 A.
Fig. 4 A is that the process equipment of the embodiment of the invention carries out the partial 3-D shape appearance figure that face scans the gained nanostructured to silicon (100) single-chip under two probe patterns.
Fig. 4 B is the section profile figure of Fig. 4 A.
Fig. 5 A is that the process equipment of the embodiment of the invention carries out the line sweep gained to silicon (100) single-chip and intersects the partial 3-D shape appearance figure of nano thread structure under single probe patterns,
Fig. 5 B is the section profile figure of Fig. 5 A.
The specific embodiment
Embodiment
Fig. 1 illustrates; A kind of specific embodiment of the present invention is; Large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode is made up of the processing platform drive unit on pedestal 12, the pedestal 12, load maintainer and data acquisition and control system on the pedestal 12, wherein:
The formation of described processing platform drive unit is: horizontal two-dimension electronic control translation stage 1 is by the upper surface of bolt in pedestal 12, and manually the base plate of three-D displacement platform 3 is fixed in the upper surface of horizontal two-dimension electronic control translation stage 1 through connecting plate 2; Manually the riser of three-D displacement platform 3 is fixedly connected with the riser of the sample stage 4 of " L " type;
The formation of described load maintainer is: electronic angular displacement platform 9 is fixed in the upper surface of pedestal 12 through boss 10; The stiff end screw thread of the cantilever beam 6 of force sensitive is fixed on the tiltable horizontal operation face of electronic angular displacement platform 9, and probe array 11 is fixed in the lower surface of cantilever beam 6 free end ends; Laser displacement sensor 5 is connected on the pedestal 12 through support 7, laser displacement sensor 5 be positioned at cantilever beam 6 free end ends directly over; The transverse slat of the sample stage 4 of " L " type of the end of cantilever beam 6 and processing platform drive unit is relative;
Described horizontal two-dimension electronic control translation stage 1, electronic angular displacement platform 9, laser displacement sensor 5 all are electrically connected with data acquisition and control system.
This routine horizontal two-dimension electronic control translation stage 1 is by two overlapping connecting and composing of orthogonal electronic control translation stage.
This routine laser displacement sensor 5 through the concrete mode that support 7 is connected on the pedestal 12 is: the bottom of support 7 is fixed on the Magnetic gauge stand 8 of belt switch, and Magnetic gauge stand 8 places on the pedestal 12.
The electronic control translation stage that the present invention adopts can be the electronic control translation stage of existing various micron precision, is the TSA50-C electronic control translation stage like Beijing model that Chinese light company produces of standing upright; The manual three-D displacement platform that adopts can be the various manual three-D displacement platform of existing micron precision, is TSMW25R-XYZ-1AL monoblock type multiaxis displacement platform like Beijing model that Chinese light company produces of standing upright; The automatically controlled angular displacement platform that adopts can be the automatically controlled angular displacement platform of existing various micron precision equally, is the automatically controlled angular displacement platform of TSAG10-W like Beijing model that Chinese light company produces of standing upright.
Fig. 2 A, Fig. 2 B illustrate; The concrete formation of the cantilever beam 6 of the force sensitive that this is routine is: the free end of cantilever beam 6 is the quadrilateral structure of two cantilevers; The zone line 6D of upper and lower cantilever hollows out; And the longitudinal middle part 6C at position hollows out near the left and right end, the place of not hollowing out, front and back fluting, and the thinnest part 6A thickness of fluting is 0.10-0.20mm; Lower cantalever is also paid the thin slice that forms 8-15mm * 8-15mm size, and probe array 11 is fixed in the lower surface of this thin slice 6B.
The probe array 11 that the present invention adopts is that 500nm～250 μ m, material are the microballoon probe composition of steel, pottery, silicon nitride for fixing a plurality of radius of curvature in the substrate.
Three concrete results that process that adopt above this routine equipment to carry out are following:
Fig. 3 A is that the process equipment of the embodiment of the invention carries out the partial 3-D shape appearance figure that face scans the gained nanostructured to silicon (100) single-chip under single probe patterns, and Fig. 3 B is the section profile figure of institute's processing structure.The radius of curvature of the needle point of its processing experiment is 200 μ m, and test parameters is: load F
n=250mN, rotational angle theta=0 °, delineation speed v=300 μ m/s, number of times are for once, and scanning area is 400 μ m * 400 μ m.
Can know that by Fig. 3 A, Fig. 3 B the size of face structure is 400 μ m * 400 μ m, highly be 60nm, sets with test parameters to conform to.
Fig. 4 A is that the process equipment of the embodiment of the invention carries out the partial 3-D shape appearance figure that face scans the gained nanostructured to silicon (100) single-chip under two probe patterns, and Fig. 4 B is the section profile figure of institute's processing structure.The needle point radius of curvature of this test is 200 μ m, and test parameters is: load F
n=600mN, rotational angle theta=90 °, delineation speed v=300 μ m/s, number of times are for once, and scanning area is 250 μ m * 300 μ m.
Can know that by Fig. 4 A, Fig. 4 B machining area has formed two face ridge structure, two face projecting shape consistent size highly all are 130nm, and length is 300 μ m, and width is 250 μ m.This explains in the delineation process, multiprobe array and silicon face keeping parallelism, so the contact pressure approximately equal of each probe and silicon face, the face bump height that finally obtains is also consistent, sets with test parameters to conform to, and equipment has reached multiple spot contact processing effect.
Fig. 5 A is that the process equipment of the embodiment of the invention carries out the line sweep gained to silicon (100) single-chip and intersects the partial 3-D shape appearance figure of nano thread structure under single probe patterns, and Fig. 5 B is the section profile figure of institute's processing structure.The needle point radius of curvature of this test is 300 μ m, and test parameters is: load F
n=300mN, delineation speed v=300 μ m/s, number of times is for once, and distance between centers of tracks is 100 μ m.
But the width of being pitched nano thread structure by Fig. 5 A, Fig. 5 B bosom friend is 40 μ m, and centre-to-centre spacing is 100 μ m, highly is 130nm, sets with test parameters to conform to.
Above-mentioned processing experiment shows that the present invention can carry out the large tracts of land friction induction micron order processing under single-point and the multiple spot contact mode, through accurate control load, sweep limits, scan mode, can process various micron order structures at material surfaces such as monocrystalline silicon.
Claims (4)
1. the large tracts of land friction induction micron order process equipment under the multiple spot contact mode is made up of the processing platform drive unit on pedestal (12), the pedestal (12), load maintainer and data acquisition and control system on the pedestal (12), wherein:
The formation of described processing platform drive unit is: horizontal two-dimension electronic control translation stage (1) is by the upper surface of bolt in pedestal (12), and manually the base plate of three-D displacement platform (3) is fixed in the upper surface of horizontal two-dimension electronic control translation stage (1) through connecting plate (2); Manually the riser of three-D displacement platform (3) is fixedly connected with the riser of the sample stage (4) of " L " type;
The formation of described load maintainer is: electronic angular displacement platform (9) is fixed in the upper surface of pedestal (12) through boss (10); The stiff end screw thread of the cantilever beam of force sensitive (6) is fixed on the tiltable horizontal operation face of electronic angular displacement platform (9), and probe array (11) is fixed in the lower surface of cantilever beam (6) free end end; Laser displacement sensor (5) is connected on the pedestal (12) through support (7), laser displacement sensor (5) be positioned at cantilever beam (6) free end end directly over; The transverse slat of the sample stage (4) of " L " type of the end of cantilever beam (6) and processing platform drive unit is relative;
Described horizontal two-dimension electronic control translation stage (1), electronic angular displacement platform (9), laser displacement sensor (5) all are electrically connected with data acquisition and control system.
2. the large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode according to claim 1 is characterized in that: described horizontal two-dimension electronic control translation stage (1) is by two overlapping connecting and composing of orthogonal electronic control translation stage.
3. the large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode according to claim 1; It is characterized in that: described laser displacement sensor (5) through the concrete mode that support (7) is connected on the pedestal (12) is: the bottom of support (7) is fixed on the Magnetic gauge stand (8) of belt switch, and Magnetic gauge stand (8) places on the pedestal (12).
4. the large tracts of land friction induction micron order process equipment under a kind of multiple spot contact mode according to claim 1; It is characterized in that: the concrete formation of the cantilever beam of described force sensitive (6) is: the free end of cantilever beam (6) is the quadrilateral structure of two cantilevers; The zone line of upper and lower cantilever (6D) hollows out; And the longitudinal middle part (6C) at position hollows out near the left and right end, the place of not hollowing out, front and back fluting, and the thinnest part of fluting (6A) thickness is 0.10-0.20mm; Lower cantalever is also paid the thin slice that forms 8-15mm * 8-15mm size, and probe array (11) is fixed in the lower surface of this thin slice (6B).
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| CN104075987A (en) * | 2014-07-22 | 2014-10-01 | 华北电力大学（保定） | Electrochemistry test probe |
| CN104965105A (en) * | 2015-07-06 | 2015-10-07 | 中国科学院半导体研究所 | AFM probe array integrated with ultrasonic energy transducers |
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| CN109406386A (en) * | 2017-10-30 | 2019-03-01 | 西南交通大学 | The design of profiled cross-section micro-cantilever beam probe and processing method applied to the measurement of nanoscale single-contact ultralow friction coefficient |
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| CN115535960A (en) * | 2022-09-05 | 2022-12-30 | 南方科技大学 | Device and method for processing two-dimensional material nanostructure array |
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| CN104965105A (en) * | 2015-07-06 | 2015-10-07 | 中国科学院半导体研究所 | AFM probe array integrated with ultrasonic energy transducers |
| CN104965105B (en) * | 2015-07-06 | 2018-03-23 | 中国科学院半导体研究所 | The AFM probe array of integrated ultrasonic transducer |
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| CN111122198A (en) * | 2019-12-29 | 2020-05-08 | 北京理工大学 | Test device and method for measuring self-cleaning performance of bionic adhesion functional surface |
| CN111122198B (en) * | 2019-12-29 | 2021-04-02 | 北京理工大学 | Test device and method for measuring self-cleaning performance of bionic adhesion functional surface |
| CN115535960A (en) * | 2022-09-05 | 2022-12-30 | 南方科技大学 | Device and method for processing two-dimensional material nanostructure array |
| CN115535960B (en) * | 2022-09-05 | 2023-11-10 | 南方科技大学 | Device and method for processing two-dimensional material nanostructure array |
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| C06 | Publication | ||
| PB01 | Publication | ||
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