CN102699811A - 表面高光洁度的难熔金属合金箔片零件及其制备方法 - Google Patents
表面高光洁度的难熔金属合金箔片零件及其制备方法 Download PDFInfo
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- CN102699811A CN102699811A CN2012101700007A CN201210170000A CN102699811A CN 102699811 A CN102699811 A CN 102699811A CN 2012101700007 A CN2012101700007 A CN 2012101700007A CN 201210170000 A CN201210170000 A CN 201210170000A CN 102699811 A CN102699811 A CN 102699811A
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- Prior art keywords
- polishing
- alloy
- foil part
- preparation
- polishing fluid
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- 239000011888 foil Substances 0.000 title claims abstract description 53
- 229910001092 metal group alloy Inorganic materials 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000005498 polishing Methods 0.000 claims abstract description 138
- 238000000227 grinding Methods 0.000 claims abstract description 31
- 230000003746 surface roughness Effects 0.000 claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 18
- 229910052580 B4C Inorganic materials 0.000 claims abstract description 12
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims abstract description 3
- 239000012530 fluid Substances 0.000 claims description 69
- 238000003801 milling Methods 0.000 claims description 25
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 22
- 229910052721 tungsten Inorganic materials 0.000 claims description 22
- 239000010937 tungsten Substances 0.000 claims description 22
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 20
- 229910052750 molybdenum Inorganic materials 0.000 claims description 20
- 239000011733 molybdenum Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000003870 refractory metal Substances 0.000 claims description 15
- 238000003754 machining Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 4
- 230000002950 deficient Effects 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 208000037656 Respiratory Sounds Diseases 0.000 claims description 2
- 230000007547 defect Effects 0.000 claims description 2
- 238000010892 electric spark Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 22
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000010297 mechanical methods and process Methods 0.000 abstract 1
- 230000005226 mechanical processes and functions Effects 0.000 abstract 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 42
- 229910052796 boron Inorganic materials 0.000 description 42
- 238000003672 processing method Methods 0.000 description 16
- 229910001182 Mo alloy Inorganic materials 0.000 description 8
- 239000004575 stone Substances 0.000 description 5
- BVWCRASTPPDAAK-UHFFFAOYSA-N [Mo].[W].[Cu] Chemical compound [Mo].[W].[Cu] BVWCRASTPPDAAK-UHFFFAOYSA-N 0.000 description 4
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 4
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210170000.7A CN102699811B (zh) | 2012-05-29 | 2012-05-29 | 表面高光洁度的难熔金属合金箔片零件及其制备方法 |
Applications Claiming Priority (1)
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CN201210170000.7A CN102699811B (zh) | 2012-05-29 | 2012-05-29 | 表面高光洁度的难熔金属合金箔片零件及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN102699811A true CN102699811A (zh) | 2012-10-03 |
CN102699811B CN102699811B (zh) | 2015-07-29 |
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CN201210170000.7A Withdrawn - After Issue CN102699811B (zh) | 2012-05-29 | 2012-05-29 | 表面高光洁度的难熔金属合金箔片零件及其制备方法 |
Country Status (1)
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CN (1) | CN102699811B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107030584A (zh) * | 2017-04-27 | 2017-08-11 | 安庆瑞钼特金属新材料有限公司 | 钨铜、钼铜合金薄板、箔材零件的表面处理方法 |
CN109500721A (zh) * | 2018-12-22 | 2019-03-22 | 浙江宏泰精密科技有限公司 | 一种金属抛光方法 |
CN109926907A (zh) * | 2017-12-19 | 2019-06-25 | 上海瑞钼特金属新材料有限公司 | 钨钼合金箔材的抛光方法及获得的产品 |
CN112454160A (zh) * | 2020-10-27 | 2021-03-09 | 宜兴市科兴合金材料有限公司 | 双面抛光钼基板及其制备方法和在led发光芯片中的应用 |
CN112462459A (zh) * | 2020-10-30 | 2021-03-09 | 宜兴市科兴合金材料有限公司 | 二氧化碳激光器用的钼反射镜及其制备方法 |
CN113953592A (zh) * | 2021-08-27 | 2022-01-21 | 厦门虹鹭钨钼工业有限公司 | 一种难熔金属及其合金的切割方法 |
CN114211209A (zh) * | 2021-12-27 | 2022-03-22 | 众至达精密机械科技(昆山)有限公司 | 一种高光洁度电子金属结构件表面加工工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020098701A1 (en) * | 2000-11-30 | 2002-07-25 | Jsr Corporation | Polishing method |
CN1483850A (zh) * | 2003-08-02 | 2004-03-24 | 宜兴市兴达合金材料厂 | 一种超薄高平整度钼片加工方法 |
US20050211950A1 (en) * | 2004-03-24 | 2005-09-29 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition and method for using the same |
US20060030243A1 (en) * | 2004-08-09 | 2006-02-09 | Kao Corporation | Polishing composition |
CN101158780A (zh) * | 2007-11-08 | 2008-04-09 | 韩伟东 | 制作液晶显示器背光源发光体的材料及其制造方法 |
-
2012
- 2012-05-29 CN CN201210170000.7A patent/CN102699811B/zh not_active Withdrawn - After Issue
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020098701A1 (en) * | 2000-11-30 | 2002-07-25 | Jsr Corporation | Polishing method |
CN1483850A (zh) * | 2003-08-02 | 2004-03-24 | 宜兴市兴达合金材料厂 | 一种超薄高平整度钼片加工方法 |
US20050211950A1 (en) * | 2004-03-24 | 2005-09-29 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition and method for using the same |
US20060030243A1 (en) * | 2004-08-09 | 2006-02-09 | Kao Corporation | Polishing composition |
CN101158780A (zh) * | 2007-11-08 | 2008-04-09 | 韩伟东 | 制作液晶显示器背光源发光体的材料及其制造方法 |
Non-Patent Citations (2)
Title |
---|
杜凯等: "机械研磨法制备晶体密度钼膜技术研究", 《强激光与粒子束》 * |
舒行军等: "圆薄片零件精密研磨实验研究", 《机械工程师》 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107030584A (zh) * | 2017-04-27 | 2017-08-11 | 安庆瑞钼特金属新材料有限公司 | 钨铜、钼铜合金薄板、箔材零件的表面处理方法 |
CN109926907A (zh) * | 2017-12-19 | 2019-06-25 | 上海瑞钼特金属新材料有限公司 | 钨钼合金箔材的抛光方法及获得的产品 |
CN109926907B (zh) * | 2017-12-19 | 2022-07-22 | 上海瑞钼特科技股份有限公司 | 钨钼合金箔材的抛光方法及获得的产品 |
CN109500721A (zh) * | 2018-12-22 | 2019-03-22 | 浙江宏泰精密科技有限公司 | 一种金属抛光方法 |
CN112454160A (zh) * | 2020-10-27 | 2021-03-09 | 宜兴市科兴合金材料有限公司 | 双面抛光钼基板及其制备方法和在led发光芯片中的应用 |
CN112462459A (zh) * | 2020-10-30 | 2021-03-09 | 宜兴市科兴合金材料有限公司 | 二氧化碳激光器用的钼反射镜及其制备方法 |
CN113953592A (zh) * | 2021-08-27 | 2022-01-21 | 厦门虹鹭钨钼工业有限公司 | 一种难熔金属及其合金的切割方法 |
CN114211209A (zh) * | 2021-12-27 | 2022-03-22 | 众至达精密机械科技(昆山)有限公司 | 一种高光洁度电子金属结构件表面加工工艺 |
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CN102699811B (zh) | 2015-07-29 |
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