CN102694007B - 半导体结构及其制造方法 - Google Patents
半导体结构及其制造方法 Download PDFInfo
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- CN102694007B CN102694007B CN201110068078.3A CN201110068078A CN102694007B CN 102694007 B CN102694007 B CN 102694007B CN 201110068078 A CN201110068078 A CN 201110068078A CN 102694007 B CN102694007 B CN 102694007B
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CN201110068078.3A CN102694007B (zh) | 2011-03-22 | 2011-03-22 | 半导体结构及其制造方法 |
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CN201110068078.3A CN102694007B (zh) | 2011-03-22 | 2011-03-22 | 半导体结构及其制造方法 |
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CN102694007A CN102694007A (zh) | 2012-09-26 |
CN102694007B true CN102694007B (zh) | 2014-11-19 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103383962B (zh) * | 2012-05-03 | 2016-06-29 | 中国科学院微电子研究所 | 半导体结构及其制造方法 |
CN104064465B (zh) * | 2013-03-21 | 2017-07-14 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的形成方法 |
CN104064468B (zh) * | 2013-03-21 | 2017-07-14 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
CN105097521B (zh) * | 2014-05-04 | 2018-03-30 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的形成方法 |
KR102426666B1 (ko) * | 2015-03-25 | 2022-07-28 | 삼성전자주식회사 | 집적회로 장치 및 이의 제조 방법 |
US10546937B2 (en) | 2017-11-21 | 2020-01-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structures and methods for noise isolation in semiconductor devices |
US10886165B2 (en) * | 2018-06-15 | 2021-01-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming negatively sloped isolation structures |
CN116157912A (zh) * | 2021-01-27 | 2023-05-23 | 中芯北方集成电路制造(北京)有限公司 | 半导体结构及其形成方法 |
Citations (2)
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TW200711036A (en) * | 2005-09-09 | 2007-03-16 | Infineon Technologies Ag | Isolation for semiconductor devices |
CN101221901A (zh) * | 2007-01-11 | 2008-07-16 | 国际商业机器公司 | 应力绝缘体上硅场效应晶体管及其制作方法 |
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US7045468B2 (en) * | 1999-04-09 | 2006-05-16 | Intel Corporation | Isolated junction structure and method of manufacture |
US7902597B2 (en) * | 2006-03-22 | 2011-03-08 | Samsung Electronics Co., Ltd. | Transistors with laterally extended active regions and methods of fabricating same |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200711036A (en) * | 2005-09-09 | 2007-03-16 | Infineon Technologies Ag | Isolation for semiconductor devices |
CN101221901A (zh) * | 2007-01-11 | 2008-07-16 | 国际商业机器公司 | 应力绝缘体上硅场效应晶体管及其制作方法 |
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Address after: 100029 No. 3 Beitucheng West Road, Chaoyang District, Beijing Co-patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Patentee after: Institute of Microelectronics, Chinese Academy of Sciences Address before: 100029 No. 3 Beitucheng West Road, Chaoyang District, Beijing Co-patentee before: BEIJING NMC Co.,Ltd. Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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Effective date of registration: 20190306 Address after: 100176 No. 8 Wenchang Avenue, Daxing District, Beijing Economic and Technological Development Zone Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100029 No. 3 Beitucheng West Road, Chaoyang District, Beijing Co-patentee before: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |