CN102668067B - 内插器上贴片组装以及由此形成的结构 - Google Patents
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Abstract
描述了形成微电子结构的方法。这些方法的实施例包括通过热压接合将贴片结构附连到内插器、在安置于所述内插器的顶部表面上的互连结构的阵列周围来形成底部填充、固化所述底部填充、以及然后将管芯附连到所述贴片结构。
Description
背景技术
集成电路通常包括已集成到经常被称为管芯的一块半导体材料中的各种有源和无源电路元件。管芯又可被封到封装中。已利用各种封装设计,诸如例如,针栅阵列(PGA)、球栅阵列(BGA)和地栅(landgrid)阵列(LGA)封装。在一些情况下,管芯封装然后可附连到诸如电路板的另一衬底。
附图说明
虽然说明书以专门指出并明确对本发明的某些实施例要求权利的权利要求而结束,但是本发明的优点能够在与附图相结合阅读时从本发明的以下描述来更容易地被查明,其中:
图1a-1e表示根据本发明一实施例的形成结构的方法;
图2a-2e表示根据本发明一实施例的形成结构的方法;
图3表示根据本发明一实施例的系统。
具体实施方式
在下面的详细描述中,对通过图示来示出其中可实践本发明的特定实施例的附图做出参照。这些实施例以足够的细节来描述以使得本领域的技术人员能够实践本发明。要理解,本发明的各种实施例尽管不同,但不一定相互排斥。例如,在不脱离本发明精神和范畴的情况下,连同一个实施例的本文中所描述的具体特征、结构或特性可在其他实施例内实现。另外要理解,在不脱离本发明精神和范畴的情况下,可修改每个公开的实施例内的各个元件的位置和布置。下面的详细描述因此未在限制的意思中做出,并且本发明的范畴仅由适当地解释的随附权利要求以及授权给权利要求的等同的全部范围一起来定义。在图中,相似的数字在若干个视图各处引用相同的或类似的功能性。
描述了形成和利用诸如封装结构的微电子结构的方法和相关联的结构。这些方法可包括通过热压接合(bonding)将贴片(patch)结构附连到内插器(interposer)、在安置于该内插器的顶部表面上的互连结构的阵列的周围形成底部填充(underfill)、固化该底部填充及然后将管芯附连到该贴片结构。各种实施例的方法可能够实现内插器上贴片衬底封装技术。
图1a-1e示出形成诸如例如内插器上贴片(PoINT)结构的微电子结构的方法的实施例。图1a示出内插器100。在一个实施例中,内插器100可包括带有堆叠激光制造的通路(via)的层压内插器设计。该堆叠的通路102可充当内插器100内的垂直互连结构,其中垂直互连结构可堆叠于彼此之上。内插器100还可包括内插器100的顶部表面105上的互连结构104。在一实施例中,互连结构104的阵列可包括中间级互连(MLI)焊球,诸如但不限于MLI球全栅阵列焊球。在一实施例中,内插器可包括母板和诸如但不限于蜂窝电话卡的小卡的至少之一。
图1b示出贴片结构106。在一实施例中,贴片结构106可包括薄芯(thincore)(例如厚度约为400微米)贴片结构106。在实施例中,贴片结构106可支持微电子装置/系统的布线(routing)(RTG)和功率输送(PD)功能。在一实施例中,贴片结构106可包括刚性构件(stiffener)108和管芯侧电容器(DSC)110。贴片结构106还可包括贴片互连结构107,其在一些实施例中可包括焊球。
在一实施例中,贴片结构106可通过中间级互连(MLI)BGA连接104而附连到内插器100以形成内插器上贴片结构113(图1c)。贴片结构106到内插器100的MLI104的附连可通过热压接合(TCB)过程112来执行。在一些实施例中,TCB过程112可包括诸如通过利用内插器上带有焊膏的像LGA的焊盘的微型球(减少直径的焊球)或表面安装技术(SMT)附连过程的至少之一。
在一实施例中,TCB过程112可包括热的局部化应用,因此限制热对整个封装的暴露并且潜在地限制翘曲(warpage)影响。在一实施例中,焊接点(solderjoint)109可将贴片结构106附连/连结到内插器100。
底部填充114可应用到内插器100MLI104区域(图1d)。底部填充114可在安置于内插器100的顶部表面105上的互连结构104的阵列的周围来形成。底部填充114然后可经受固化过程115。在一个实施例中,固化过程115可在管芯附连过程之前用来向内插器上贴片结构113提供附加的刚性。在一些情况下,由于内插器的空芯结构和贴片结构的薄芯,将MLI结构的回流用于将贴片连接到内插器的现有技术过程可体验对此类现有技术的内插器上贴片结构附加的引入的和动态的翘曲。翘曲的增加可显著地影响此类现有技术贴片的产量(yield)、第一级互连(FLI)集成及还有此类贴片到内插器的集成。
通过能够实现在低温的MLI集成和仅在底部填充固化后将内插器上贴片暴露于高温,本文中本发明的各种实施例的内插器上贴片结构趋向于表现得更像更刚硬的/基于层压芯的母板。因此,内插器上贴片结构113降低可在随后的管芯附连过程期间发生的动态翘曲,并且通过控制翘曲影响而导致改进的组装流程。在一实施例中,管芯116可附连到内插器上点结构以形成内插器上贴片封装结构116(图1e)。
在另一实施例中,被示出为包括两个内插器201、201’的内插器条(strip)200可在一些实施例中包括多于两个的内插器。在一实施例中,例如,包括内插器条200的内插器的数量可或可不取决于用于处理的承载体设计。在一个实施例中,内插器条200可包括内插器201、201’,其各自可包括带有堆叠的激光制造的通路(202、202’)的层压内插器设计。
堆叠的通路结构202、202’可充当内插器201、201’内的垂直互连结构。内插器201、201’还可包括内插器201、201的顶部表面205、205’上的互连结构204、204’。在一实施例中,互连结构204、204’可包括中间级互连(MLI)焊球,诸如但不限于MLI球栅阵列(BGA)焊球。内插器条200可包括切单(singulation)点203。
在一实施例中,至少一个贴片结构206、206’可附连到内插器条200(图2b)。在一实施例中,贴片结构206、206’可附连到内插器条200的各个内插器200、200’的至少之一。在一实施例中,贴片结构206、206’(类似于图2b的贴片结构106)可包括薄芯(例如厚度约为400微米)。在一实施例中,贴片结构206、206’可包括至少一个刚性构件208、208’和至少一个dsc210、210’。贴片结构206、206’还可包括贴片互连结构207、207’,其在一些实施例中可包括焊球。
在一实施例中,贴片结构206、206’可通过中间级(MLI)BGA连接204、204’而附连到内插器条200。贴片206、206’到内插器条200的MLI204、204’的附连可通过热压接合过程(TCB)212来执行。在一些实施例中,TCB过程212可包括诸如通过利用内插器上的带有焊膏的像LGA的焊盘的微型球(减少直径的焊球)或表面安装技术(SMT)附连过程的至少之一。在一实施例中,焊接点209(类似于图1b的焊接点109)可将贴片结构206、206’附连/连结到内插器条200。
底部填充214可被应用到内插器条200MLI204区域(图2c)。在一实施例中,底部填充214可在内插器条200的切单过程之前在至少两个相邻的内插器(例如内插器条200的内插器201、201’)的MLI区域204、204’的周围来形成。底部填充214然后可经受固化过程215(图2d)。在一个实施例中,固化过程215可在管芯附连过程之前用来向封装结构提供附加的刚性。该附加的刚性化(stiffening)可显著地降低封装结构的翘曲。管芯216可附连到封装结构(图2e)。
图3示出根据本发明一实施例的计算机系统。系统300包括处理器310、存储器装置320、存储器控制器330、图形控制器340、输入和输出(I/O)控制器350、显示器352、键盘354、指点装置356和外围装置358,在一些实施例中,所有的这些装置可通过总线360在通信上耦合到彼此。处理器310可以是通用处理器或专用集成电路(ASIC)。I/O控制器350可包括用于有线或无线通信的通信模块。存储器装置320可以是动态随机存取存储器(DRAM)装置、静态随机存取存储器(SRAM)装置、闪速存储器装置或这些存储器装置的组合。因此,在一些实施例中,系统300中的存储器装置320不必包括DRAM装置。
系统300中示出的一个或多个组件可被包括在诸如例如图1e的封装结构118的一个或多个集成电路封装中/和或可包括所述一个或多个集成电路封装。例如,处理器310、或存储器装置320、或I/O控制器350的至少一部分、或这些组件的组合可被包括在集成电路封装中,该集成电路封装包括各种实施例中所描述的结构的至少一个实施例。
这些元件执行本领域中公知的其常规功能。具体而言,存储器装置320可用于在一些情况下为根据本发明实施例的用于形成封装的结构的方法的可运行指令提供长期存储,并且在其他实施例中可用于在处理器310的运行期间在较短期的基础上存储根据本发明实施例的用于形成封装结构的方法的可运行指令。另外,指令可被存储在或以其他方式关联于与系统在通信上耦合的机器可访问媒体,诸如例如紧致盘只读存储器(CD-ROM)、数字多功能盘(DVD)和软盘、载波或/或其他传播信号。在一个实施例中,存储器装置320可为处理器310提供用于运行的可运行指令。
系统300可包括计算机(例如,台式计算机、膝上型计算机、手持计算机、服务器、Web设施、路由器等等)、无线通信装置(例如,蜂窝电话、无绳电话、寻呼机、个人数字助理等等)、与计算机有关的外围设备(例如,打印机、扫描仪、监视器等等)、娱乐装置(例如,电视机、收音机、立体声系统、磁带和紧致盘播放器、盒式录像录像机、摄录像机(camcorder)、数字摄像机、MP3(运动图像专家组,音频层3)播放器、视频游戏、手表等等)、以及诸如此类。
本文中所包括的实施例的好处包括能够实现内插器上贴片衬底封装技术。通过热压接合来形成内插器MLI结构和贴片结构之间的接点,然后底部填充,并且在完成管芯附连之前固化贴片和内插器,从而增加了结构的刚性,因此防止翘曲。在一些实施例中,在一些情况下可包括有机衬底的内插器和贴片衬底与可包括硅的管芯之间存在显著的CTE差别。翘曲改进可通过在附连可包括硅的管芯之前将贴片附连到可具有类似的温度系数(CTE)的内插器来实现。另外,各种实施例允许抑制机制被集成到内插器条承载体中。
通过TCB处理使得能够实现在低温的MLI集成并且内插器上贴片结构仅在底部填充固化后才暴露于高温。因此,内插器上贴片结构展示更刚硬的/像基于层压芯的衬底。在一实施例中,服务器封装可通过用于MLI的TCB由能够实现多连接的内插器条设计而以降低的翘曲来组装,其中,贴片结构可在底部填充内插器上贴片结构之前被SMT安装。管芯附连处理之前在内插器上组装贴片避免了有机衬底和硅管芯之间显著的CTE差别。
虽然前面的描述已规定可用于本发明方法中的某些步骤和材料,但本领域的技术人员将领会,可做出许多修改和替换。因此,意在所有此类修改、变更、替换和添加被认为落在随附权利要求所定义的本发明的精神和范畴内。另外,要领会,诸如封装结构的各种微电子结构是本领域中公知的。因此,本文所提供的图仅示出与本发明的实践相关的示范微电子结构的部分。因此,本发明不限于本文中所描述的结构。
Claims (30)
1.一种用于形成微电子结构的方法,包括:
通过热压接合将贴片结构附连到内插器;
在安置于所述内插器的顶部表面上的互连结构的阵列周围形成底部填充;
固化所述底部填充;以及
将管芯附连到所述贴片结构,
其中,所述贴片结构包括至少一个刚性构件和至少一个管芯侧电容器。
2.如权利要求1所述的方法,还包括其中,所述贴片结构附连到安置于所述内插器的顶部表面上的MLI。
3.如权利要求2所述的方法,还包括其中,所述热压接合在所述底部填充之前被执行。
4.如权利要求2所述的方法,还包括其中,所述底部填充在MLI结构的周围被形成。
5.如权利要求1所述的方法,其中,所述底部填充在管芯附连过程之前被固化。
6.如权利要求1所述的方法,其中,在管芯附连之前固化所述底部填充刚性化所述内插器上贴片结构。
7.如权利要求1所述的方法,还包括其中,所述贴片结构包括薄芯,所述薄芯包括小于400微米。
8.如权利要求1所述的方法,其中,所述内插器包括还包含堆叠的激光互连结构的层压封装设计。
9.如权利要求1所述的方法,还包括其中,所述贴片结构能够支持装置的布线和功率输送功能。
10.如权利要求1所述的方法,其中,焊接点将所述贴片结构附连到所述内插器。
11.一种用于形成微电子结构的方法,包括:
通过热压接合将贴片结构附连到内插器条的单独内插器的至少一个,其中,所述内插器条包括至少两个单独内插器;
在安置于所述单独内插器的所述至少一个上的互连结构的阵列周围形成底部填充;
固化所述底部填充;以及
将管芯附连到所述贴片结构,
其中,所述贴片结构包括至少一个刚性构件和至少一个管芯侧电容器。
12.如权利要求11所述的方法,其中,所述内插器条包括多连接的内插器条设计。
13.如权利要求11所述的方法,其中,所述底部填充在切单过程之前在所述内插器条的至少两个相邻的内插器的MLI区域周围被形成。
14.如权利要求11所述的方法,其中,至少一个贴片附连到所述内插器条的单独内插器的MLI。
15.如权利要求11所述的方法,还包括其中,至少一个贴片结构在所述底部填充步骤之前被附连到所述内插器条。
16.一种微电子结构,包括:
贴片结构,被安置于内插器的互连阵列上,其中,所述内插器包括堆叠的互连结构;
焊接点,将所述贴片结构附连到所述内插器;
底部填充,被安置于所述互连阵列周围;以及
管芯,被附连到所述贴片,
其中,所述贴片结构包括至少一个刚性构件和至少一个管芯侧电容器。
17.如权利要求16所述的微电子结构,其中,所述互连阵列包括中间级互连球栅阵列。
18.如权利要求16所述的微电子结构,其中,所述堆叠的互连结构包括堆叠的激光创建的通路。
19.如权利要求17所述的微电子结构,其中,所述贴片结构包括厚度小于400微米。
20.如权利要求16所述的微电子结构,其中,所述焊接点包括通过热压接合所形成的焊接点。
21.如权利要求16所述的微电子结构,其中,所述贴片结构能够支持布线和功率输送功能。
22.如权利要求21所述的微电子结构,其中,所述贴片结构包括安置于所述贴片结构的顶部表面上的至少一个刚性构件。
23.如权利要求16所述的微电子结构,其中,所述内插器包括母板和小卡的至少之一。
24.一种微电子结构,包括:
至少一个贴片结构,被安置于内插器条的单独内插器上,其中,所述内插器条包括至少两个单独内插器;
底部填充,被安置在互连结构的阵列周围,所述互连结构的阵列被安置于单独内插器的顶部表面上;以及
管芯,被附连到所述至少一个贴片结构,
其中,所述贴片结构包括至少一个刚性构件和至少一个管芯侧电容器。
25.如权利要求24所述的微电子结构,还包括一种系统,所述系统包括:
总线,在通信上耦合到所述结构;以及
DRAM,在通信上耦合到所述总线。
26.如权利要求24所述的微电子结构,其中,所述底部填充被安置于相邻的多个单独内插器之下。
27.如权利要求24所述的微电子结构,其中,所述内插器条包括多连接的内插器条设计。
28.如权利要求24所述的微电子结构,还包括将所述至少一个贴片结构附连到所述单独内插器的焊接点。
29.如权利要求24所述的微电子结构,其中,所述贴片结构包括薄贴片结构。
30.如权利要求24所述的微电子结构,还包括其中,所述结构包括服务器封装的一部分。
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