CN102654705A - 一种电泳显示器组件及其制造方法 - Google Patents
一种电泳显示器组件及其制造方法 Download PDFInfo
- Publication number
- CN102654705A CN102654705A CN2011100709673A CN201110070967A CN102654705A CN 102654705 A CN102654705 A CN 102654705A CN 2011100709673 A CN2011100709673 A CN 2011100709673A CN 201110070967 A CN201110070967 A CN 201110070967A CN 102654705 A CN102654705 A CN 102654705A
- Authority
- CN
- China
- Prior art keywords
- resin bed
- line metal
- layer
- metal level
- photoresistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 86
- 229920005989 resin Polymers 0.000 claims abstract description 86
- 229910052751 metal Inorganic materials 0.000 claims abstract description 59
- 239000002184 metal Substances 0.000 claims abstract description 59
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 32
- 238000002161 passivation Methods 0.000 claims description 29
- 238000009413 insulation Methods 0.000 claims description 24
- 238000005516 engineering process Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 17
- 229910021417 amorphous silicon Inorganic materials 0.000 description 19
- 239000012528 membrane Substances 0.000 description 15
- 238000005755 formation reaction Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000001962 electrophoresis Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910000809 Alumel Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78609—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/40—Arrangements for improving the aperture ratio
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/48—Flattening arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/50—Protective arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
Abstract
本发明提供一种电泳显示器组件及其制造方法,能够降低光漏电流的产生,增强显示效果。其结构包括:基板;含有栅极的栅线金属层,形成于所述基板之上;栅绝缘层,覆盖在所述栅线金属层之上;半导体有源层,形成于所述栅绝缘层之上,且对应的位于所述栅极的上方;含有源极、漏极的数据线金属层,形成于所述栅绝缘层之上,其中,所述源极、漏极相距一定间隔地位于所述半导体有源层之上;光阻树脂层,覆盖在所述数据线金属层之上,且在所述漏极上方形成有过孔;像素电极层,形成于所述光阻树脂层之上,并通过所述过孔与所述漏极连接。本发明用于电泳显示器制造。
Description
技术领域
本发明涉及电泳显示技术领域,尤其涉及一种电泳显示器组件及其制造方法。
背景技术
电泳显示是一种新型的显示技术,它同时具备纸张和电子器件特性,既符合人们的视觉习惯,又方便、快捷。电泳显示的关键技术之一的电子墨水技术,是将带电的电泳粒子悬浮在分散介质溶剂中形成悬浮体系,在电场的作用下,电泳粒子能够感应电荷朝不同的方向运动,并根据人们的设定不断改变所显示的图案和文字。
电子墨水电泳显示器是一种反射型显示装置,一般包括:具有透明电极的前盖板,电子墨水层以及薄膜晶体管(Thin Film Transistor,TFT)阵列基板。其中,TFT阵列基板中的半导体有源层一般为非晶硅层材料,基本上,非晶硅材料本身就是一种具有光导电物质,主要的缺陷,就是在光的照射之下,容易产生衰退现象,若经由电子电洞的大量产生下,使它的暗导电度及光导电度均下降,容易造成的薄膜晶体管漏电流提高,使得储存电容中的画素因为电荷作用而有所流失,导致画面质量不佳等缺点。
发明内容
本发明提供一种电泳显示器组件及其制造方法,以解决因光漏电流的产生所导致的显示效果不佳的问题。
为达到上述目的,本发明采用如下技术方案:
一方面,提供一种电泳显示器组件,包括:
基板;
含有栅极的栅线金属层,形成于所述基板之上;
栅绝缘层,覆盖在所述栅线金属层之上;
半导体有源层,形成于所述栅绝缘层之上,且对应的位于所述栅极的上方;
含有源极、漏极的数据线金属层,形成于所述栅绝缘层之上,其中,所述源极、漏极相距一定间隔地位于所述半导体有源层之上;
光阻树脂层,覆盖在所述数据线金属层之上,且在所述漏极上方形成有过孔;
像素电极层,形成于所述光阻树脂层之上,并通过所述过孔与所述漏极连接。
在所述数据线金属层和所述光阻树脂层之间还包括一钝化层,所述钝化层覆盖在所述数据线金属层之上,且在所述漏极上方、与所述光阻树脂层的过孔相对应的设有一过孔。
覆盖在所述数据线金属层之上的所述光阻树脂层的上表面水平。
所述光阻树脂层为不透光的光阻树脂层。
所述光阻树脂层为黑矩阵和/或彩色光阻构成的树脂层。
另一方面,提供一种电泳显示器组件的制造方法,包括:
在基板上形成含有栅极的栅线金属层;
在所述栅线金属层上形成栅绝缘层和半导体有源层,所述半导体有源层位于所述栅极的上方;
在所述栅绝缘层上形成含有源极、漏极的数据线金属层,其中,所述源极、漏极相距一定间隔地位于所述半导体有源层之上;
在所述数据线金属层上,涂覆光阻树脂层,通过构图工艺在所述光阻树脂层上形成与所述漏极相通的过孔;
在所述光阻树脂层上,形成像素电极层,所述像素电极层通过所述过孔与所述漏极连接。
在形成所述数据线金属层之后,涂覆所述光阻树脂层之前,所述方法还包括:在所述数据线金属层上形成钝化层,通过构图工艺在所述钝化层上形成与所述漏极相通的过孔,该过孔与所述光阻树脂层的过孔相对应。
涂覆的所述光阻树脂层的上表面水平。
涂覆的所述光阻树脂层为不透光的光阻树脂层。
涂覆的所述光阻树脂层为黑矩阵和/或彩色光阻构成的树脂层。
本发明提供的电泳显示器组件及其制造方法,在形成数据线金属层之后,涂覆了一层光阻树脂。该光阻树脂一方面可以起到保护TFT的作用,另一方面由于其不透光,能够防止TFT有源层的非晶硅受到光照,从而可以减少非晶硅产生的光漏电流,达到增强显示效果的作用。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的电泳显示器组件的制造方法的流程示意图;
图2为本发明实施例提供的电泳显示器组件制造过程中的构造示意图一;
图3为本发明实施例提供的电泳显示器组件制造过程中的构造示意图二;
图4为本发明实施例提供的电泳显示器组件制造过程中的构造示意图三;
图5为本发明实施例提供的电泳显示器组件制造过程中的构造示意图四;
图6为本发明实施例提供的电泳显示器组件制造过程中的构造示意图五;
图7为本发明另一实施例提供的电泳显示器组件制造过程中的构造示意图一;
图8为本发明另一实施例提供的电泳显示器组件制造过程中的构造示意图二;
图9为本发明另一实施例提供的电泳显示器组件制造过程中的构造示意图三。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
参照图1-图6,说明本发明实施例提供的电泳显示器组件的制造方法。其中,图1为电泳显示器组件的制造方法的流程示意图;图2-图6为电泳显示器组件制造过程中的构造示意图。
S101、在基板上形成含有栅极的栅线金属层。
具体的,如图2所示,可以使用磁控溅射方法,在基板20上制备一层厚度在1000至7000的金属薄膜。金属材料通常可以采用钼、铝、铝镍合金、钼钨合金、铬、或铜等金属,也可以使用上述几种材料薄膜的组合结构。然后,用掩模版通过曝光、显影、刻蚀、剥离等构图工艺处理,在基板20的一定区域上形成多条横向的栅线和与栅线相连的栅极21。
S102、在栅线金属层上形成栅绝缘层和半导体有源层,该半导体有源层位于栅极的上方。
具体的,如图3所示,可以利用化学汽相沉积法在基板上连续沉积厚度为1000至6000的栅绝缘层22和厚度为1000至6000的非晶硅薄膜和n+非晶硅薄膜。栅绝缘层22的材料通常是氮化硅,也可以使用氧化硅和氮氧化硅等。用有源层的掩模版对非晶硅薄膜进行曝光,之后对该非晶硅薄膜进行干法刻蚀,在栅极21的上方形成半导体有源层23。
S103、在栅绝缘层上形成含有源极、漏极的数据线金属层,其中,该源极、漏极相距一定间隔地位于半导体有源层之上。
具体的,如图4所示,可以采用和制备栅线类似的方法,在基板20上沉积一层类似于栅金属的厚度在1000到7000金属薄膜。通过构图工艺处理在一定区域形成数据线和源极24、漏极25。源极24、漏极25通过半导体有源层23形成沟道,且和栅极21一起构成薄膜晶体管。
由于栅绝缘层22之上形成的是非晶硅薄膜和n+非晶硅薄膜,则在本步骤S103中,需对沟道上方的n+非晶硅薄膜进行刻蚀,形成沟道。
S104、在数据线金属层上,涂覆光阻树脂层,通过构图工艺在该光阻树脂层上形成与漏极相通的过孔。
具体的,如图5所示,可以以中央滴下加旋转涂布的方法涂覆光阻树脂,得到光阻树脂层26。然后通过掩模版,利用曝光显影等构图工艺处理,在漏极25位置处形成连接过孔27。
此外,如图5所示,覆盖在数据线金属层之上的光阻树脂层26的上表面水平。这样能够增大后续涂覆的像素电极层和源极、漏极之间的距离,从而增大像素电极层面积,提高开口率。
再有,该光阻树脂层26可以为不透光的光阻树脂层,例如用彩膜基板制造过程中的黑矩阵和/或彩色光阻等构成。这样一来就可以利用现有的彩膜基板的制造设备来进行光阻树脂层的涂覆,无需另外增添设备、原料等,能够减少制造成本。
S105、在光阻树脂层上,形成像素电极层,该像素电极层通过过孔与漏极连接。
具体的,如图6所示,采用与源、漏电极相类似的方法,在整个基板的光阻树脂层26上沉积一层像素电极层28。常用的像素电极为ITO(Indium Tin Oxides,铟锡氧化物)或IZO(Indium Zinc Oxide,铟锌氧化物),厚度在100至1000之间。该像素电极层28通过过孔27与漏极25连接。
本发明提供的电泳显示器组件的制造方法,在形成数据线金属层之后,涂覆了一层光阻树脂。该光阻树脂一方面可以起到保护TFT的作用,这样则省略了钝化层的形成工序;另一方面由于其不透光,还能够防止TFT半导体有源层的非晶硅受到光照,从而可以减少非晶硅产生的光漏电流,达到增强显示效果的作用。
本法明另一实施例提供的电泳显示器组件的制造方法,包括:
S201、在基板上形成含有栅极的栅线金属层。
S202、在栅线金属层上形成栅绝缘层和半导体有源层,该半导体有源层位于栅极的上方。
S203、在栅绝缘层上形成含有源极、漏极的数据线金属层,其中,该源极、漏极相距一定间隔地位于半导体有源层之上。
步骤S201~S203与上述实施例中的步骤S101~S103完全相同。
S204、在数据线金属层上形成钝化层,通过构图工艺在钝化层上形成与漏极相通的过孔。
具体的,如图7所示,采用与栅绝缘层以及半导体有源层相类似的方法,在数据线金属层上涂覆一层厚度在1000到6000的钝化层29,其材料通常是氮化硅或透明的有机树脂材料等。此时栅线、数据线上面覆盖有钝化层29。通过掩模版,利用曝光和刻蚀等构图工艺处理,在漏极25位置处形成连接过孔27′。
S205、如图8所示,在钝化层29上涂覆光阻树脂层26,并通过构图工艺在该光阻树脂层26上形成与钝化层29上过孔27′相对应、与漏极25相通的过孔27。
此外,如图8所示,覆盖在钝化层29之上的光阻树脂层26的上表面水平。这样能够增大后续涂覆的像素电极层和源极、漏极之间的距离,从而增大像素电极层面积,提高开口率。
再有,该光阻树脂层26可以为不透光的光阻树脂层,例如用彩膜基板制造过程中的黑矩阵和/或彩色光阻等构成。这样一来就可以利用现有的彩膜基板的制造设备来进行光阻树脂层的涂覆,无需另外增添设备、原料等,能够减少制造成本。
在此,由于光阻树脂层26上的过孔27与钝化层29上的过孔27′相对应,因此在使用同一性的光刻胶的情况下,可以使用同一块掩膜板进行曝光处理。
S206、如图9所示,在光阻树脂层26上,形成像素电极层28,该像素电极层28通过过孔27与漏极25连接。
本发明提供的电泳显示器组件的制造方法,在形成数据线金属层、钝化层之后,涂覆了一层光阻树脂。由于该光阻树脂不透光,因此能够防止TFT半导体有源层的非晶硅受到光照,从而可以减少非晶硅产生的光漏电流,达到增强显示效果的作用。
另外,现有技术中,形成完钝化层后,由于氮化硅是亲水界面,因此需要对钝化层进行表面改性处理,以更好地与填平树脂层附着,这不仅增加了制造工序,也增加了相关设置的购置成本。而在本实施例中,采用彩膜产线工艺,用光阻形成树脂层进行涂布,无需对钝化层表面进行改性处理,节约了工序,较少了成本。
本发明实施例提供的电泳显示器组件,如图6所示,包括:
基板20;
含有栅极21的栅线金属层,形成于基板20之上;
栅绝缘层22,覆盖在栅线金属层之上;
半导体有源层23,形成于栅绝缘层之上,且对应的位于栅极21的上方;
含有源极24、漏极25的数据线金属层,形成于栅绝缘层22之上,其中,源极24、漏极25相距一定间隔地位于半导体有源层23之上;
光阻树脂层26,覆盖在数据线金属层之上,且在漏极25上方形成有过孔27;
像素电极层28,形成于光阻树脂层26之上,并通过过孔27与漏极25连接。
在本实施例中,覆盖在数据线金属层之上的光阻树脂层26的上表面水平。这样能够增大后续涂覆的像素电极层和源极、漏极之间的距离,从而增大像素电极层面积,提高开口率。
再有,该光阻树脂层26为不透光的光阻树脂层,例如用彩膜基板制造过程中的黑矩阵和/或彩色光阻等构成。这样一来就可以利用现有的彩膜基板的制造设备来进行光阻树脂层的涂覆,无需另外增添设备、原料等,能够减少制造成本。
本发明提供的电泳显示器组件,在形成数据线金属层之后,涂覆了一层光阻树脂。该光阻树脂一方面可以起到保护TFT的作用,这样则省略了钝化层的形成工序;另一方面由于其不透光,能够防止TFT半导体有源层的非晶硅受到光照,从而可以减少非晶硅产生的光漏电流,达到增强显示效果的作用。
本发明另一实施例提供的电泳显示器组件,如图9所示,包括:
基板20;
含有栅极21的栅线金属层,形成于基板20之上;
栅绝缘层22,覆盖在栅线金属层之上;
半导体有源层23,形成于栅绝缘层之上,且对应的位于栅极21的上方;
含有源极24、漏极25的数据线金属层,形成于栅绝缘层22之上,其中,源极24、漏极25相距一定间隔地位于半导体有源层23之上;
钝化层29,形成于数据线金属层之上,在漏极25的上方形成有过孔27′。
光阻树脂层26,覆盖在钝化层29之上,且在漏极25上方形成有与钝化层29的过孔27′相对应的过孔27;
像素电极层28,形成于光阻树脂层26之上,并通过过孔27与漏极25连接。
在本实施例中,覆盖在数据线金属层之上的光阻树脂层26的上表面水平。这样能够增大后续涂覆的像素电极层和源极、漏极之间的距离,从而增大像素电极层面积,提高开口率。
再有,该光阻树脂层26为不透光的光阻树脂层,例如用彩膜基板制造过程中的黑矩阵和/或彩色光阻等构成。这样一来就可以利用现有的彩膜基板的制造设备来进行光阻树脂层的涂覆,无需另外增添设备、原料等,能够减少制造成本。
本发明提供的电泳显示器组件,在数据线金属层、钝化层之上,还有一层光阻树脂。由于该光阻树脂不透光,因此能够防止TFT半导体有源层的非晶硅受到光照,从而可以减少非晶硅产生的光漏电流,达到增强显示效果的作用。
另外,现有技术中,形成完钝化层后,由于氮化硅是亲水界面,因此需要对钝化层进行表面改性处理,以更好地与填平树脂层附着,这不仅增加了制造工序,也增加了相关设置的购置成本。而在本实施例中,可以采用彩膜产线工艺,用光阻形成树脂层进行涂布,这样无需对钝化层表面进行改性处理,节约了工序,较少了成本。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。
Claims (10)
1.一种电泳显示器组件,其特征在于,包括:
基板;
含有栅极的栅线金属层,形成于所述基板之上;
栅绝缘层,覆盖在所述栅线金属层之上;
半导体有源层,形成于所述栅绝缘层之上,且对应的位于所述栅极的上方;
含有源极、漏极的数据线金属层,形成于所述栅绝缘层之上,其中,所述源极、漏极相距一定间隔地位于所述半导体有源层之上;
光阻树脂层,覆盖在所述数据线金属层之上,且在所述漏极上方形成有过孔;
像素电极层,形成于所述光阻树脂层之上,并通过所述过孔与所述漏极连接。
2.根据权利要求1所述的电泳显示器组件,其特征在于,在所述数据线金属层和所述光阻树脂层之间还包括一钝化层,所述钝化层覆盖在所述数据线金属层之上,且在所述漏极上方、与所述光阻树脂层的过孔相对应的设有一过孔。
3.根据权利要求1或2所述的电泳显示器组件,其特征在于,覆盖在所述数据线金属层之上的所述光阻树脂层的上表面水平。
4.根据权利要求1或2所述的电泳显示器组件,其特征在于,所述光阻树脂层为不透光的光阻树脂层。
5.根据权利要求4所述的电泳显示器组件,其特征在于,所述光阻树脂层为黑矩阵和/或彩色光阻构成的树脂层。
6.一种电泳显示器组件的制造方法,其特征在于,包括:
在基板上形成含有栅极的栅线金属层;
在所述栅线金属层上形成栅绝缘层和半导体有源层,所述半导体有源层位于所述栅极的上方;
在所述栅绝缘层上形成含有源极、漏极的数据线金属层,其中,所述源极、漏极相距一定间隔地位于所述半导体有源层之上;
在所述数据线金属层上,涂覆光阻树脂层,通过构图工艺在所述光阻树脂层上形成与所述漏极相通的过孔;
在所述光阻树脂层上,形成像素电极层,所述像素电极层通过所述过孔与所述漏极连接。
7.根据权利要求6所述的方法,其特征在于,在形成所述数据线金属层之后,涂覆所述光阻树脂层之前,所述方法还包括:
在所述数据线金属层上形成钝化层,通过构图工艺在所述钝化层上形成与所述漏极相通的过孔,该过孔与所述光阻树脂层的过孔相对应。
8.根据权利要求6或7所述的方法,其特征在于,涂覆的所述光阻树脂层的上表面水平。
9.根据权利要求6或7所述的方法,其特征在于,涂覆的所述光阻树脂层为不透光的光阻树脂层。
10.根据权利要求9所述的方法,其特征在于,涂覆的所述光阻树脂层为黑矩阵和/或彩色光阻构成的树脂层。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011100709673A CN102654705A (zh) | 2011-03-23 | 2011-03-23 | 一种电泳显示器组件及其制造方法 |
US13/426,866 US20120241746A1 (en) | 2011-03-23 | 2012-03-22 | Electrophoresis display and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011100709673A CN102654705A (zh) | 2011-03-23 | 2011-03-23 | 一种电泳显示器组件及其制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102654705A true CN102654705A (zh) | 2012-09-05 |
Family
ID=46730344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011100709673A Pending CN102654705A (zh) | 2011-03-23 | 2011-03-23 | 一种电泳显示器组件及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120241746A1 (zh) |
CN (1) | CN102654705A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9664973B2 (en) | 2013-06-28 | 2017-05-30 | Beijing Boe Optoelectronics Technology Co., Ltd. | Array substrate and manufacturing method thereof, and display device |
CN106842685A (zh) * | 2017-03-16 | 2017-06-13 | 惠科股份有限公司 | 一种显示面板及制造方法和显示装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103149763B (zh) * | 2013-02-28 | 2016-04-13 | 京东方科技集团股份有限公司 | Tft-lcd阵列基板、显示面板及其制作方法 |
KR102094847B1 (ko) * | 2013-07-03 | 2020-03-31 | 삼성디스플레이 주식회사 | 박막 트랜지스터를 포함하는 표시 기판 및 이의 제조 방법 |
CN104701328B (zh) * | 2015-03-25 | 2017-10-13 | 京东方科技集团股份有限公司 | 一种阵列基板及其制造方法、显示装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101131523A (zh) * | 2006-08-25 | 2008-02-27 | 元太科技工业股份有限公司 | 电子墨水显示面板 |
US20080165121A1 (en) * | 2007-01-09 | 2008-07-10 | Samsung Sdi Co., Ltd. | Electrophoretic display apparatus and manufacturing method thereof |
CN101339923A (zh) * | 2007-10-17 | 2009-01-07 | 友达光电股份有限公司 | 形成薄膜晶体管阵列面板的方法及薄膜晶体管阵列面板 |
CN101644866A (zh) * | 2009-09-03 | 2010-02-10 | 上海广电光电子有限公司 | 薄膜晶体管阵列基板 |
CN101750821A (zh) * | 2008-12-03 | 2010-06-23 | 株式会社半导体能源研究所 | 液晶显示器 |
CN101825802A (zh) * | 2009-03-06 | 2010-09-08 | 北京京东方光电科技有限公司 | 彩膜基板及其制造方法 |
WO2010147398A2 (ko) * | 2009-06-17 | 2010-12-23 | 한양대학교 산학협력단 | 터치스크린 내장형 전자영동 표시장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0764110A (ja) * | 1993-08-30 | 1995-03-10 | Kyocera Corp | アクティブマトリックス基板 |
JP4417072B2 (ja) * | 2003-03-28 | 2010-02-17 | シャープ株式会社 | 液晶表示装置用基板及びそれを用いた液晶表示装置 |
US8059329B2 (en) * | 2006-10-04 | 2011-11-15 | Samsung Electronics Co., Ltd. | Display substrate and method of manufacturing the same |
KR101256023B1 (ko) * | 2006-10-31 | 2013-04-18 | 삼성디스플레이 주식회사 | 전기 영동 표시 장치 및 그 제조 방법 |
TW201031985A (en) * | 2009-02-26 | 2010-09-01 | Wintek Corp | Electrophoretic display |
TWI617029B (zh) * | 2009-03-27 | 2018-03-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
TWI400545B (zh) * | 2009-07-09 | 2013-07-01 | Prime View Int Co Ltd | 顯示面板 |
WO2011068106A1 (en) * | 2009-12-04 | 2011-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
-
2011
- 2011-03-23 CN CN2011100709673A patent/CN102654705A/zh active Pending
-
2012
- 2012-03-22 US US13/426,866 patent/US20120241746A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101131523A (zh) * | 2006-08-25 | 2008-02-27 | 元太科技工业股份有限公司 | 电子墨水显示面板 |
US20080165121A1 (en) * | 2007-01-09 | 2008-07-10 | Samsung Sdi Co., Ltd. | Electrophoretic display apparatus and manufacturing method thereof |
CN101339923A (zh) * | 2007-10-17 | 2009-01-07 | 友达光电股份有限公司 | 形成薄膜晶体管阵列面板的方法及薄膜晶体管阵列面板 |
CN101750821A (zh) * | 2008-12-03 | 2010-06-23 | 株式会社半导体能源研究所 | 液晶显示器 |
CN101825802A (zh) * | 2009-03-06 | 2010-09-08 | 北京京东方光电科技有限公司 | 彩膜基板及其制造方法 |
WO2010147398A2 (ko) * | 2009-06-17 | 2010-12-23 | 한양대학교 산학협력단 | 터치스크린 내장형 전자영동 표시장치 |
CN101644866A (zh) * | 2009-09-03 | 2010-02-10 | 上海广电光电子有限公司 | 薄膜晶体管阵列基板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9664973B2 (en) | 2013-06-28 | 2017-05-30 | Beijing Boe Optoelectronics Technology Co., Ltd. | Array substrate and manufacturing method thereof, and display device |
CN106842685A (zh) * | 2017-03-16 | 2017-06-13 | 惠科股份有限公司 | 一种显示面板及制造方法和显示装置 |
WO2018171022A1 (zh) * | 2017-03-16 | 2018-09-27 | 惠科股份有限公司 | 一种显示面板及制造方法和显示装置 |
US10725357B2 (en) | 2017-03-16 | 2020-07-28 | HKC Corporation Limited | Display panel, method for manufacturing the display panel and display apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20120241746A1 (en) | 2012-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104298040B (zh) | 一种coa基板及其制作方法和显示装置 | |
CN100388104C (zh) | 薄膜晶体管阵列基板及其制造方法 | |
CN104317097A (zh) | 一种coa基板及其制作方法和显示装置 | |
CN103985717A (zh) | 一种阵列基板及其制备方法、显示装置 | |
CN1734337A (zh) | 掩模 | |
CN105652541B (zh) | 阵列基板的制作方法及液晶显示面板 | |
CN202473925U (zh) | 一种顶栅型tft阵列基板及显示装置 | |
CN1637557A (zh) | 液晶显示器及其制造方法 | |
CN104950541A (zh) | Boa型液晶显示面板及其制作方法 | |
CN103728797B (zh) | 显示面板及其制作方法和显示装置 | |
CN102723269A (zh) | 阵列基板及其制作方法、显示装置 | |
CN103149760A (zh) | 薄膜晶体管阵列基板、制造方法及显示装置 | |
CN101424839A (zh) | 液晶显示装置 | |
CN102487043A (zh) | 阵列基板及其制造方法和电子纸显示器 | |
CN102654705A (zh) | 一种电泳显示器组件及其制造方法 | |
CN100593748C (zh) | 彩膜基板的制造方法 | |
CN101900898B (zh) | 光电池整合液晶显示器及光电池整合平面显示器 | |
CN102468231B (zh) | 阵列基板及其制造方法和有源显示器 | |
CN104733456A (zh) | 一种阵列基板及其制备方法、显示装置 | |
CN102487041A (zh) | 阵列基板及其制造方法和电子纸显示器 | |
CN102916051A (zh) | 一种薄膜晶体管及其制作方法、阵列基板和显示装置 | |
CN204129400U (zh) | 一种coa基板和显示装置 | |
CN102468243B (zh) | Tft阵列基板、制造方法及液晶显示装置 | |
CN104779203B (zh) | 一种阵列基板及其制造方法、显示装置 | |
US10503034B2 (en) | Manufacturing method of a TFT substrate and structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120905 |